
Roy Karl Potter
Examiner (ID: 13991, Phone: (571)272-1842 , Office: P/2822 )
| Most Active Art Unit | 2822 |
| Art Unit(s) | 2822, 2508, 2811, 3621 |
| Total Applications | 2584 |
| Issued Applications | 2409 |
| Pending Applications | 46 |
| Abandoned Applications | 141 |
Applications
| Application number | Title of the application | Filing Date | Status |
|---|---|---|---|
Array
(
[id] => 10047524
[patent_doc_number] => 09087930
[patent_country] => US
[patent_kind] => B2
[patent_issue_date] => 2015-07-21
[patent_title] => 'Semiconductor device and method of forming insulating layer disposed over the semiconductor die for stress relief'
[patent_app_type] => utility
[patent_app_number] => 14/274599
[patent_app_country] => US
[patent_app_date] => 2014-05-09
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 28
[patent_figures_cnt] => 78
[patent_no_of_words] => 14477
[patent_no_of_claims] => 25
[patent_no_of_ind_claims] => 4
[patent_words_short_claim] => 35
[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => patent
[pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 14274599
[rel_patent_id] =>[rel_patent_doc_number] =>) 14/274599 | Semiconductor device and method of forming insulating layer disposed over the semiconductor die for stress relief | May 8, 2014 | Issued |
Array
(
[id] => 10053498
[patent_doc_number] => 09093383
[patent_country] => US
[patent_kind] => B1
[patent_issue_date] => 2015-07-28
[patent_title] => 'Encapsulant for a semiconductor device'
[patent_app_type] => utility
[patent_app_number] => 14/268420
[patent_app_country] => US
[patent_app_date] => 2014-05-02
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 3
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[patent_no_of_words] => 6793
[patent_no_of_claims] => 20
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[patent_maintenance] => 1
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[patent_current_assignee] =>[type] => patent
[pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 14268420
[rel_patent_id] =>[rel_patent_doc_number] =>) 14/268420 | Encapsulant for a semiconductor device | May 1, 2014 | Issued |
Array
(
[id] => 9944150
[patent_doc_number] => 08993450
[patent_country] => US
[patent_kind] => B2
[patent_issue_date] => 2015-03-31
[patent_title] => 'Device package and methods for the fabrication and testing thereof'
[patent_app_type] => utility
[patent_app_number] => 14/258358
[patent_app_country] => US
[patent_app_date] => 2014-04-22
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 26
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[patent_no_of_words] => 23005
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[patent_current_assignee] =>[type] => patent
[pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 14258358
[rel_patent_id] =>[rel_patent_doc_number] =>) 14/258358 | Device package and methods for the fabrication and testing thereof | Apr 21, 2014 | Issued |
Array
(
[id] => 10858226
[patent_doc_number] => 08884430
[patent_country] => US
[patent_kind] => B2
[patent_issue_date] => 2014-11-11
[patent_title] => 'Semiconductor device and method of confining conductive bump material during reflow with solder mask patch'
[patent_app_type] => utility
[patent_app_number] => 14/258300
[patent_app_country] => US
[patent_app_date] => 2014-04-22
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 7
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[patent_no_of_words] => 5576
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[pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 14258300
[rel_patent_id] =>[rel_patent_doc_number] =>) 14/258300 | Semiconductor device and method of confining conductive bump material during reflow with solder mask patch | Apr 21, 2014 | Issued |
Array
(
[id] => 10916522
[patent_doc_number] => 20140319541
[patent_country] => US
[patent_kind] => A1
[patent_issue_date] => 2014-10-30
[patent_title] => 'VOIDLESSLY ENCAPSULATED SEMICONDUCTOR DIE PACKAGE'
[patent_app_type] => utility
[patent_app_number] => 14/258775
[patent_app_country] => US
[patent_app_date] => 2014-04-22
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 12
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[pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 14258775
[rel_patent_id] =>[rel_patent_doc_number] =>) 14/258775 | Voidlessly encapsulated semiconductor die package | Apr 21, 2014 | Issued |
Array
(
[id] => 10876960
[patent_doc_number] => 08901750
[patent_country] => US
[patent_kind] => B2
[patent_issue_date] => 2014-12-02
[patent_title] => 'Semiconductor package including multiple chips and separate groups of leads'
[patent_app_type] => utility
[patent_app_number] => 14/250934
[patent_app_country] => US
[patent_app_date] => 2014-04-11
[patent_effective_date] => 0000-00-00
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[rel_patent_id] =>[rel_patent_doc_number] =>) 14/250934 | Semiconductor package including multiple chips and separate groups of leads | Apr 10, 2014 | Issued |
Array
(
[id] => 9796652
[patent_doc_number] => 20150008596
[patent_country] => US
[patent_kind] => A1
[patent_issue_date] => 2015-01-08
[patent_title] => 'SEMICONDUCTOR DEVICE'
[patent_app_type] => utility
[patent_app_number] => 14/222723
[patent_app_country] => US
[patent_app_date] => 2014-03-24
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 3
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[patent_no_of_words] => 1438
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[pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 14222723
[rel_patent_id] =>[rel_patent_doc_number] =>) 14/222723 | Semiconductor device | Mar 23, 2014 | Issued |
Array
(
[id] => 10041995
[patent_doc_number] => 09082709
[patent_country] => US
[patent_kind] => B2
[patent_issue_date] => 2015-07-14
[patent_title] => 'Hardening resin composition, sealing material, and electronic device using the sealing material'
[patent_app_type] => utility
[patent_app_number] => 14/208009
[patent_app_country] => US
[patent_app_date] => 2014-03-13
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 3
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[patent_no_of_words] => 5999
[patent_no_of_claims] => 6
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[patent_current_assignee] =>[type] => patent
[pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 14208009
[rel_patent_id] =>[rel_patent_doc_number] =>) 14/208009 | Hardening resin composition, sealing material, and electronic device using the sealing material | Mar 12, 2014 | Abandoned |
Array
(
[id] => 9729248
[patent_doc_number] => 20140264955
[patent_country] => US
[patent_kind] => A1
[patent_issue_date] => 2014-09-18
[patent_title] => 'ELECTRONIC DEVICE WITH AN INTERLOCKING MOLD PACKAGE'
[patent_app_type] => utility
[patent_app_number] => 14/203012
[patent_app_country] => US
[patent_app_date] => 2014-03-10
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 4
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[pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 14203012
[rel_patent_id] =>[rel_patent_doc_number] =>) 14/203012 | Electronic device with an interlocking mold package | Mar 9, 2014 | Issued |
Array
(
[id] => 9809845
[patent_doc_number] => 20150021790
[patent_country] => US
[patent_kind] => A1
[patent_issue_date] => 2015-01-22
[patent_title] => 'SEMICONDUCTOR DEVICE'
[patent_app_type] => utility
[patent_app_number] => 14/200819
[patent_app_country] => US
[patent_app_date] => 2014-03-07
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 39
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[patent_no_of_words] => 9987
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[pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 14200819
[rel_patent_id] =>[rel_patent_doc_number] =>) 14/200819 | SEMICONDUCTOR DEVICE | Mar 6, 2014 | Abandoned |
Array
(
[id] => 9965431
[patent_doc_number] => 09013048
[patent_country] => US
[patent_kind] => B2
[patent_issue_date] => 2015-04-21
[patent_title] => 'Semiconductor device manufacturing method and semiconductor device'
[patent_app_type] => utility
[patent_app_number] => 14/193128
[patent_app_country] => US
[patent_app_date] => 2014-02-28
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[patent_current_assignee] =>[type] => patent
[pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 14193128
[rel_patent_id] =>[rel_patent_doc_number] =>) 14/193128 | Semiconductor device manufacturing method and semiconductor device | Feb 27, 2014 | Issued |
Array
(
[id] => 9914429
[patent_doc_number] => 20150069633
[patent_country] => US
[patent_kind] => A1
[patent_issue_date] => 2015-03-12
[patent_title] => 'SEMICONDUCTOR DEVICE AND MEMORY DEVICE'
[patent_app_type] => utility
[patent_app_number] => 14/194398
[patent_app_country] => US
[patent_app_date] => 2014-02-28
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[rel_patent_id] =>[rel_patent_doc_number] =>) 14/194398 | Semiconductor device and memory device | Feb 27, 2014 | Issued |
Array
(
[id] => 9534508
[patent_doc_number] => 20140159155
[patent_country] => US
[patent_kind] => A1
[patent_issue_date] => 2014-06-12
[patent_title] => 'HIGH VOLTAGE METAL-OXIDE-SEMICONDUCTOR TRANSISTOR DEVICE AND LAYOUT PATTERN THEREOF'
[patent_app_type] => utility
[patent_app_number] => 14/181733
[patent_app_country] => US
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[patent_effective_date] => 0000-00-00
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[rel_patent_id] =>[rel_patent_doc_number] =>) 14/181733 | High voltage metal-oxide-semiconductor transistor device and layout pattern thereof | Feb 16, 2014 | Issued |
Array
(
[id] => 9542640
[patent_doc_number] => 20140167287
[patent_country] => US
[patent_kind] => A1
[patent_issue_date] => 2014-06-19
[patent_title] => 'MICROELECTRONIC PACKAGE WITH TERMINALS ON DIELECTRIC MASS'
[patent_app_type] => utility
[patent_app_number] => 14/176344
[patent_app_country] => US
[patent_app_date] => 2014-02-10
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[pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 14176344
[rel_patent_id] =>[rel_patent_doc_number] =>) 14/176344 | Microelectronic package with terminals on dielectric mass | Feb 9, 2014 | Issued |
Array
(
[id] => 9639324
[patent_doc_number] => 20140217434
[patent_country] => US
[patent_kind] => A1
[patent_issue_date] => 2014-08-07
[patent_title] => 'LIGHT EMITTING DEVICES AND METHODS'
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[rel_patent_id] =>[rel_patent_doc_number] =>) 14/174559 | LIGHT EMITTING DEVICES AND METHODS | Feb 5, 2014 | Abandoned |
Array
(
[id] => 9778659
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[patent_issue_date] => 2014-10-07
[patent_title] => 'Encapsulant for a semiconductor device'
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[rel_patent_id] =>[rel_patent_doc_number] =>) 14/170067 | Encapsulant for a semiconductor device | Jan 30, 2014 | Issued |
Array
(
[id] => 10851639
[patent_doc_number] => 08878324
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[patent_issue_date] => 2014-11-04
[patent_title] => 'Magnetoresistive element and magnetic memory'
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[rel_patent_id] =>[rel_patent_doc_number] =>) 14/168627 | Magnetoresistive element and magnetic memory | Jan 29, 2014 | Issued |
Array
(
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[patent_title] => 'STACK PACKAGE AND METHOD OF MANUFACTURING STACK PACKAGE'
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[rel_patent_id] =>[rel_patent_doc_number] =>) 14/167989 | Stack package and method of manufacturing stack package | Jan 28, 2014 | Issued |
Array
(
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[patent_issue_date] => 2014-10-30
[patent_title] => 'FLEXIBLE SEMICONDUCTOR DEVICES BASED ON FLEXIBLE FREESTANDING EPITAXIAL ELEMENTS'
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[rel_patent_id] =>[rel_patent_doc_number] =>) 14/159430 | Flexible semiconductor devices based on flexible freestanding epitaxial elements | Jan 19, 2014 | Issued |
Array
(
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[rel_patent_id] =>[rel_patent_doc_number] =>) 14/155719 | SEMICONDUCTOR DEVICE | Jan 14, 2014 | Abandoned |