
Roy Karl Potter
Examiner (ID: 13991, Phone: (571)272-1842 , Office: P/2822 )
| Most Active Art Unit | 2822 |
| Art Unit(s) | 2822, 2508, 2811, 3621 |
| Total Applications | 2584 |
| Issued Applications | 2409 |
| Pending Applications | 46 |
| Abandoned Applications | 141 |
Applications
| Application number | Title of the application | Filing Date | Status |
|---|---|---|---|
Array
(
[id] => 9530521
[patent_doc_number] => 08754395
[patent_country] => US
[patent_kind] => B1
[patent_issue_date] => 2014-06-17
[patent_title] => 'Semiconductor device and method of manufacturing the same'
[patent_app_type] => utility
[patent_app_number] => 13/830721
[patent_app_country] => US
[patent_app_date] => 2013-03-14
[patent_effective_date] => 0000-00-00
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[patent_no_of_words] => 5975
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[pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 13830721
[rel_patent_id] =>[rel_patent_doc_number] =>) 13/830721 | Semiconductor device and method of manufacturing the same | Mar 13, 2013 | Issued |
Array
(
[id] => 9277962
[patent_doc_number] => 20140027930
[patent_country] => US
[patent_kind] => A1
[patent_issue_date] => 2014-01-30
[patent_title] => 'SEMICONDUCTOR DEVICE INCLUDING SEMICONDUCTOR PACKAGE'
[patent_app_type] => utility
[patent_app_number] => 13/830778
[patent_app_country] => US
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[rel_patent_id] =>[rel_patent_doc_number] =>) 13/830778 | Semiconductor device including semiconductor package | Mar 13, 2013 | Issued |
Array
(
[id] => 8947629
[patent_doc_number] => 20130193409
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[patent_kind] => A1
[patent_issue_date] => 2013-08-01
[patent_title] => 'Deep Ultraviolet Light Emitting Diode'
[patent_app_type] => utility
[patent_app_number] => 13/803681
[patent_app_country] => US
[patent_app_date] => 2013-03-14
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[rel_patent_id] =>[rel_patent_doc_number] =>) 13/803681 | Deep ultraviolet light emitting diode | Mar 13, 2013 | Issued |
Array
(
[id] => 8925587
[patent_doc_number] => 20130181347
[patent_country] => US
[patent_kind] => A1
[patent_issue_date] => 2013-07-18
[patent_title] => 'Bump Pad Structure'
[patent_app_type] => utility
[patent_app_number] => 13/786045
[patent_app_country] => US
[patent_app_date] => 2013-03-05
[patent_effective_date] => 0000-00-00
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[rel_patent_id] =>[rel_patent_doc_number] =>) 13/786045 | Bump pad structure | Mar 4, 2013 | Issued |
Array
(
[id] => 9552109
[patent_doc_number] => 08759155
[patent_country] => US
[patent_kind] => B2
[patent_issue_date] => 2014-06-24
[patent_title] => 'Semiconductor device and method of forming insulating layer disposed over the semiconductor die for stress relief'
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[rel_patent_id] =>[rel_patent_doc_number] =>) 13/782618 | Semiconductor device and method of forming insulating layer disposed over the semiconductor die for stress relief | Feb 28, 2013 | Issued |
Array
(
[id] => 10923997
[patent_doc_number] => 20140327018
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[patent_issue_date] => 2014-11-06
[patent_title] => 'POWER SEMICONDUCTOR DEVICE, METHOD OF MANUFACTURING THE DEVICE AND BONDING WIRE'
[patent_app_type] => utility
[patent_app_number] => 14/364555
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[rel_patent_id] =>[rel_patent_doc_number] =>) 14/364555 | Power semiconductor device, method of manufacturing the device and bonding wire | Feb 21, 2013 | Issued |
Array
(
[id] => 9375684
[patent_doc_number] => 08679948
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[patent_issue_date] => 2014-03-25
[patent_title] => 'Method and apparatus for laser singulation of brittle materials'
[patent_app_type] => utility
[patent_app_number] => 13/774244
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[rel_patent_id] =>[rel_patent_doc_number] =>) 13/774244 | Method and apparatus for laser singulation of brittle materials | Feb 21, 2013 | Issued |
Array
(
[id] => 8880847
[patent_doc_number] => 20130154031
[patent_country] => US
[patent_kind] => A1
[patent_issue_date] => 2013-06-20
[patent_title] => 'INTEGRALLY MOLDED DIE AND BEZEL STRUCTURE FOR FINGERPRINT SENSORS AND THE LIKE'
[patent_app_type] => utility
[patent_app_number] => 13/767141
[patent_app_country] => US
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[rel_patent_id] =>[rel_patent_doc_number] =>) 13/767141 | Integrally molded die and bezel structure for fingerprint sensors and the like | Feb 13, 2013 | Issued |
Array
(
[id] => 9277762
[patent_doc_number] => 20140027730
[patent_country] => US
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[patent_issue_date] => 2014-01-30
[patent_title] => 'Microelectronic Device with Integrated Energy Source'
[patent_app_type] => utility
[patent_app_number] => 13/764432
[patent_app_country] => US
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[rel_patent_id] =>[rel_patent_doc_number] =>) 13/764432 | Microelectronic device with integrated energy source | Feb 10, 2013 | Issued |
Array
(
[id] => 9046741
[patent_doc_number] => 08541295
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[patent_issue_date] => 2013-09-24
[patent_title] => 'Pad-less gate-all around semiconductor nanowire FETs on bulk semiconductor wafers'
[patent_app_type] => utility
[patent_app_number] => 13/759641
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[rel_patent_id] =>[rel_patent_doc_number] =>) 13/759641 | Pad-less gate-all around semiconductor nanowire FETs on bulk semiconductor wafers | Feb 4, 2013 | Issued |
Array
(
[id] => 10480783
[patent_doc_number] => 20150365800
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[patent_kind] => A1
[patent_issue_date] => 2015-12-17
[patent_title] => 'Determining Response Similarity Neighborhoods'
[patent_app_type] => utility
[patent_app_number] => 14/763640
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[rel_patent_id] =>[rel_patent_doc_number] =>) 14/763640 | Determining Response Similarity Neighborhoods | Jan 29, 2013 | Abandoned |
Array
(
[id] => 8825977
[patent_doc_number] => 20130127022
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[patent_issue_date] => 2013-05-23
[patent_title] => 'ELECTRONIC DEVICE PACKAGE AND METHOD FOR FORMING THE SAME'
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Array
(
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Array
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Array
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[patent_title] => 'Solder mask shape for BOT laminate packages'
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Array
(
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[patent_title] => 'Interface Structure for Copper-Copper Peeling Integrity'
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[rel_patent_id] =>[rel_patent_doc_number] =>) 13/728833 | Interface structure for copper-copper peeling integrity | Dec 26, 2012 | Issued |
Array
(
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Array
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Array
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Array
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[rel_patent_id] =>[rel_patent_doc_number] =>) 14/003816 | Semiconductor package, method and mold for producing same, input and output terminals of semiconductor package | Oct 23, 2012 | Issued |