Roy Karl Potter

Array ( [id] => 4531973 [patent_doc_number] => 07923739 [patent_country] => US [patent_kind] => B2 [patent_issue_date] => 2011-04-12 [patent_title] => 'Solid state lighting device' [patent_app_type] => utility [patent_app_number] => 12/479318 [patent_app_country] => US [patent_app_date] => 2009-06-05 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 9 [patent_figures_cnt] => 18 [patent_no_of_words] => 5566 [patent_no_of_claims] => 20 [patent_no_of_ind_claims] => 3 [patent_words_short_claim] => 113 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/07/923/07923739.pdf [firstpage_image] =>[orig_patent_app_number] => 12479318 [rel_patent_id] =>[rel_patent_doc_number] =>)

Array ( [id] => 5364873 [patent_doc_number] => 20090302432 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2009-12-10 [patent_title] => 'SILICON EPITAXIAL WAFER AND THE PRODUCTION METHOD THEREOF' [patent_app_type] => utility [patent_app_number] => 12/477207 [patent_app_country] => US [patent_app_date] => 2009-06-03 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 2 [patent_figures_cnt] => 2 [patent_no_of_words] => 4393 [patent_no_of_claims] => 8 [patent_no_of_ind_claims] => 2 [patent_words_short_claim] => 0 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] => publications/A1/0302/20090302432.pdf [firstpage_image] =>[orig_patent_app_number] => 12477207 [rel_patent_id] =>[rel_patent_doc_number] =>)

Array ( [id] => 5300288 [patent_doc_number] => 20090294940 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2009-12-03 [patent_title] => 'SEMICONDUCTOR LIGHT EMITTING DEVICE' [patent_app_type] => utility [patent_app_number] => 12/473944 [patent_app_country] => US [patent_app_date] => 2009-05-28 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 5 [patent_figures_cnt] => 5 [patent_no_of_words] => 4232 [patent_no_of_claims] => 11 [patent_no_of_ind_claims] => 1 [patent_words_short_claim] => 0 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] => publications/A1/0294/20090294940.pdf [firstpage_image] =>[orig_patent_app_number] => 12473944 [rel_patent_id] =>[rel_patent_doc_number] =>)

Array ( [id] => 6375974 [patent_doc_number] => 20100301463 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2010-12-02 [patent_title] => 'REDUCED SOFT ERROR RATE THROUGH METAL FILL AND PLACEMENT' [patent_app_type] => utility [patent_app_number] => 12/473435 [patent_app_country] => US [patent_app_date] => 2009-05-28 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 6 [patent_figures_cnt] => 6 [patent_no_of_words] => 2113 [patent_no_of_claims] => 25 [patent_no_of_ind_claims] => 4 [patent_words_short_claim] => 0 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] => publications/A1/0301/20100301463.pdf [firstpage_image] =>[orig_patent_app_number] => 12473435 [rel_patent_id] =>[rel_patent_doc_number] =>)

Array ( [id] => 6549776 [patent_doc_number] => 20100127381 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2010-05-27 [patent_title] => 'Integrated Circuit Devices Having Printed Circuit Boards Therein With Staggered Bond Fingers That Support Improved Electrical Isolation' [patent_app_type] => utility [patent_app_number] => 12/472725 [patent_app_country] => US [patent_app_date] => 2009-05-27 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 14 [patent_figures_cnt] => 14 [patent_no_of_words] => 3172 [patent_no_of_claims] => 15 [patent_no_of_ind_claims] => 3 [patent_words_short_claim] => 0 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] => publications/A1/0127/20100127381.pdf [firstpage_image] =>[orig_patent_app_number] => 12472725 [rel_patent_id] =>[rel_patent_doc_number] =>)

Array ( [id] => 6375957 [patent_doc_number] => 20100301461 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2010-12-02 [patent_title] => 'RELIABLE INTERCONNECTION' [patent_app_type] => utility [patent_app_number] => 12/473232 [patent_app_country] => US [patent_app_date] => 2009-05-27 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 8 [patent_figures_cnt] => 8 [patent_no_of_words] => 4287 [patent_no_of_claims] => 20 [patent_no_of_ind_claims] => 3 [patent_words_short_claim] => 0 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] => publications/A1/0301/20100301461.pdf [firstpage_image] =>[orig_patent_app_number] => 12473232 [rel_patent_id] =>[rel_patent_doc_number] =>)

Array ( [id] => 7740394 [patent_doc_number] => 08105943 [patent_country] => US [patent_kind] => B2 [patent_issue_date] => 2012-01-31 [patent_title] => 'Enhancing structural integrity and defining critical dimensions of metallization systems of semiconductor devices by using ALD techniques' [patent_app_type] => utility [patent_app_number] => 12/472824 [patent_app_country] => US [patent_app_date] => 2009-05-27 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 6 [patent_figures_cnt] => 13 [patent_no_of_words] => 6904 [patent_no_of_claims] => 20 [patent_no_of_ind_claims] => 2 [patent_words_short_claim] => 57 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/08/105/08105943.pdf [firstpage_image] =>[orig_patent_app_number] => 12472824 [rel_patent_id] =>[rel_patent_doc_number] =>)

Array ( [id] => 5396303 [patent_doc_number] => 20090316366 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2009-12-24 [patent_title] => 'System and Method for Dissipating Heat From A Semiconductor Module' [patent_app_type] => utility [patent_app_number] => 12/472340 [patent_app_country] => US [patent_app_date] => 2009-05-26 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 12 [patent_figures_cnt] => 12 [patent_no_of_words] => 4317 [patent_no_of_claims] => 19 [patent_no_of_ind_claims] => 5 [patent_words_short_claim] => 0 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] => publications/A1/0316/20090316366.pdf [firstpage_image] =>[orig_patent_app_number] => 12472340 [rel_patent_id] =>[rel_patent_doc_number] =>)

Array ( [id] => 6421962 [patent_doc_number] => 20100102293 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2010-04-29 [patent_title] => 'III/V-SEMICONDUCTOR' [patent_app_type] => utility [patent_app_number] => 12/472224 [patent_app_country] => US [patent_app_date] => 2009-05-26 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 6 [patent_figures_cnt] => 6 [patent_no_of_words] => 5777 [patent_no_of_claims] => 39 [patent_no_of_ind_claims] => 2 [patent_words_short_claim] => 0 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] => publications/A1/0102/20100102293.pdf [firstpage_image] =>[orig_patent_app_number] => 12472224 [rel_patent_id] =>[rel_patent_doc_number] =>)

Array ( [id] => 6402990 [patent_doc_number] => 20100139767 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2010-06-10 [patent_title] => 'CHIP PACKAGE STRUCTURE AND METHOD OF FABRICATING THE SAME' [patent_app_type] => utility [patent_app_number] => 12/472359 [patent_app_country] => US [patent_app_date] => 2009-05-26 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 14 [patent_figures_cnt] => 14 [patent_no_of_words] => 4266 [patent_no_of_claims] => 28 [patent_no_of_ind_claims] => 2 [patent_words_short_claim] => 0 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] => publications/A1/0139/20100139767.pdf [firstpage_image] =>[orig_patent_app_number] => 12472359 [rel_patent_id] =>[rel_patent_doc_number] =>)

Array ( [id] => 5300301 [patent_doc_number] => 20090294953 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2009-12-03 [patent_title] => 'INTEGRATED CIRCUIT PACKAGE MODULE AND METHOD OF THE SAME' [patent_app_type] => utility [patent_app_number] => 12/471712 [patent_app_country] => US [patent_app_date] => 2009-05-26 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 7 [patent_figures_cnt] => 7 [patent_no_of_words] => 3059 [patent_no_of_claims] => 34 [patent_no_of_ind_claims] => 3 [patent_words_short_claim] => 0 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] => publications/A1/0294/20090294953.pdf [firstpage_image] =>[orig_patent_app_number] => 12471712 [rel_patent_id] =>[rel_patent_doc_number] =>)

Array ( [id] => 5488281 [patent_doc_number] => 20090289352 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2009-11-26 [patent_title] => 'SEMICONDUCTOR DEVICE AND A METHOD FOR MANUFACTURING THE SEMICONDUCTOR DEVICE' [patent_app_type] => utility [patent_app_number] => 12/470703 [patent_app_country] => US [patent_app_date] => 2009-05-22 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 10 [patent_figures_cnt] => 10 [patent_no_of_words] => 5342 [patent_no_of_claims] => 8 [patent_no_of_ind_claims] => 2 [patent_words_short_claim] => 0 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] => publications/A1/0289/20090289352.pdf [firstpage_image] =>[orig_patent_app_number] => 12470703 [rel_patent_id] =>[rel_patent_doc_number] =>)

Array ( [id] => 5488290 [patent_doc_number] => 20090289361 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2009-11-26 [patent_title] => 'SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING A SEMICONDUCTOR DEVICE' [patent_app_type] => utility [patent_app_number] => 12/470809 [patent_app_country] => US [patent_app_date] => 2009-05-22 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 11 [patent_figures_cnt] => 11 [patent_no_of_words] => 6000 [patent_no_of_claims] => 16 [patent_no_of_ind_claims] => 3 [patent_words_short_claim] => 0 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] => publications/A1/0289/20090289361.pdf [firstpage_image] =>[orig_patent_app_number] => 12470809 [rel_patent_id] =>[rel_patent_doc_number] =>)

Array ( [id] => 4614357 [patent_doc_number] => 07989936 [patent_country] => US [patent_kind] => B2 [patent_issue_date] => 2011-08-02 [patent_title] => 'Microelectronic device with integrated energy source' [patent_app_type] => utility [patent_app_number] => 12/467703 [patent_app_country] => US [patent_app_date] => 2009-05-18 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 19 [patent_figures_cnt] => 37 [patent_no_of_words] => 19592 [patent_no_of_claims] => 24 [patent_no_of_ind_claims] => 3 [patent_words_short_claim] => 104 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/07/989/07989936.pdf [firstpage_image] =>[orig_patent_app_number] => 12467703 [rel_patent_id] =>[rel_patent_doc_number] =>)

Array ( [id] => 5512106 [patent_doc_number] => 20090212410 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2009-08-27 [patent_title] => 'STACK DIE PACKAGES' [patent_app_type] => utility [patent_app_number] => 12/434264 [patent_app_country] => US [patent_app_date] => 2009-05-01 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 5 [patent_figures_cnt] => 5 [patent_no_of_words] => 2714 [patent_no_of_claims] => 20 [patent_no_of_ind_claims] => 4 [patent_words_short_claim] => 0 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] => publications/A1/0212/20090212410.pdf [firstpage_image] =>[orig_patent_app_number] => 12434264 [rel_patent_id] =>[rel_patent_doc_number] =>)

Array ( [id] => 5313655 [patent_doc_number] => 20090278253 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2009-11-12 [patent_title] => 'Semi-finished package and method for making a package' [patent_app_type] => utility [patent_app_number] => 12/387266 [patent_app_country] => US [patent_app_date] => 2009-04-30 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 13 [patent_figures_cnt] => 13 [patent_no_of_words] => 3514 [patent_no_of_claims] => 20 [patent_no_of_ind_claims] => 2 [patent_words_short_claim] => 0 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] => publications/A1/0278/20090278253.pdf [firstpage_image] =>[orig_patent_app_number] => 12387266 [rel_patent_id] =>[rel_patent_doc_number] =>)

Array ( [id] => 6417346 [patent_doc_number] => 20100276796 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2010-11-04 [patent_title] => 'REWORKABLE ELECTRONIC DEVICE ASSEMBLY AND METHOD' [patent_app_type] => utility [patent_app_number] => 12/431827 [patent_app_country] => US [patent_app_date] => 2009-04-29 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 9 [patent_figures_cnt] => 9 [patent_no_of_words] => 4985 [patent_no_of_claims] => 20 [patent_no_of_ind_claims] => 3 [patent_words_short_claim] => 0 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] => publications/A1/0276/20100276796.pdf [firstpage_image] =>[orig_patent_app_number] => 12431827 [rel_patent_id] =>[rel_patent_doc_number] =>)

Array ( [id] => 5477720 [patent_doc_number] => 20090200677 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2009-08-13 [patent_title] => 'SEMICONDUCTOR DEVICE' [patent_app_type] => utility [patent_app_number] => 12/430439 [patent_app_country] => US [patent_app_date] => 2009-04-27 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 14 [patent_figures_cnt] => 14 [patent_no_of_words] => 8170 [patent_no_of_claims] => 18 [patent_no_of_ind_claims] => 2 [patent_words_short_claim] => 0 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] => publications/A1/0200/20090200677.pdf [firstpage_image] =>[orig_patent_app_number] => 12430439 [rel_patent_id] =>[rel_patent_doc_number] =>)

Array ( [id] => 4457616 [patent_doc_number] => 07893482 [patent_country] => US [patent_kind] => B2 [patent_issue_date] => 2011-02-22 [patent_title] => 'Semiconductor devices having tunnel and gate insulating layers' [patent_app_type] => utility [patent_app_number] => 12/428078 [patent_app_country] => US [patent_app_date] => 2009-04-22 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 9 [patent_figures_cnt] => 18 [patent_no_of_words] => 7142 [patent_no_of_claims] => 10 [patent_no_of_ind_claims] => 2 [patent_words_short_claim] => 76 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/07/893/07893482.pdf [firstpage_image] =>[orig_patent_app_number] => 12428078 [rel_patent_id] =>[rel_patent_doc_number] =>)

Array ( [id] => 5483311 [patent_doc_number] => 20090273076 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2009-11-05 [patent_title] => 'Tape for heat dissipating member, chip on film type semiconductor package including heat dissipating member, and elctronic apparatus including the same' [patent_app_type] => utility [patent_app_number] => 12/385731 [patent_app_country] => US [patent_app_date] => 2009-04-17 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 10 [patent_figures_cnt] => 10 [patent_no_of_words] => 5116 [patent_no_of_claims] => 20 [patent_no_of_ind_claims] => 1 [patent_words_short_claim] => 0 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] => publications/A1/0273/20090273076.pdf [firstpage_image] =>[orig_patent_app_number] => 12385731 [rel_patent_id] =>[rel_patent_doc_number] =>)