
Roy Karl Potter
Examiner (ID: 13991, Phone: (571)272-1842 , Office: P/2822 )
| Most Active Art Unit | 2822 |
| Art Unit(s) | 2822, 2508, 2811, 3621 |
| Total Applications | 2584 |
| Issued Applications | 2409 |
| Pending Applications | 46 |
| Abandoned Applications | 141 |
Applications
| Application number | Title of the application | Filing Date | Status |
|---|---|---|---|
Array
(
[id] => 5477714
[patent_doc_number] => 20090200671
[patent_country] => US
[patent_kind] => A1
[patent_issue_date] => 2009-08-13
[patent_title] => 'SIP SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING THE SAME'
[patent_app_type] => utility
[patent_app_number] => 12/424003
[patent_app_country] => US
[patent_app_date] => 2009-04-15
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 6
[patent_figures_cnt] => 6
[patent_no_of_words] => 2287
[patent_no_of_claims] => 11
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[patent_current_assignee] =>[type] => publication
[pdf_file] => publications/A1/0200/20090200671.pdf
[firstpage_image] =>[orig_patent_app_number] => 12424003
[rel_patent_id] =>[rel_patent_doc_number] =>) 12/424003 | SIP semiconductor device and method for manufacturing the same | Apr 14, 2009 | Issued |
Array
(
[id] => 4576882
[patent_doc_number] => 07829981
[patent_country] => US
[patent_kind] => B2
[patent_issue_date] => 2010-11-09
[patent_title] => 'Semiconductor device packages with electromagnetic interference shielding'
[patent_app_type] => utility
[patent_app_number] => 12/423607
[patent_app_country] => US
[patent_app_date] => 2009-04-14
[patent_effective_date] => 0000-00-00
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[pdf_file] => patents/07/829/07829981.pdf
[firstpage_image] =>[orig_patent_app_number] => 12423607
[rel_patent_id] =>[rel_patent_doc_number] =>) 12/423607 | Semiconductor device packages with electromagnetic interference shielding | Apr 13, 2009 | Issued |
Array
(
[id] => 5525890
[patent_doc_number] => 20090195967
[patent_country] => US
[patent_kind] => A1
[patent_issue_date] => 2009-08-06
[patent_title] => 'Constructions Comprising Hafnium Oxide And/Or Zirconium Oxide'
[patent_app_type] => utility
[patent_app_number] => 12/422788
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[patent_app_date] => 2009-04-13
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 9
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[pdf_file] => publications/A1/0195/20090195967.pdf
[firstpage_image] =>[orig_patent_app_number] => 12422788
[rel_patent_id] =>[rel_patent_doc_number] =>) 12/422788 | Constructions comprising hafnium oxide and/or zirconium oxide | Apr 12, 2009 | Issued |
Array
(
[id] => 4553308
[patent_doc_number] => 07960827
[patent_country] => US
[patent_kind] => B1
[patent_issue_date] => 2011-06-14
[patent_title] => 'Thermal via heat spreader package and method'
[patent_app_type] => utility
[patent_app_number] => 12/421118
[patent_app_country] => US
[patent_app_date] => 2009-04-09
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 9
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[patent_no_of_words] => 8171
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[firstpage_image] =>[orig_patent_app_number] => 12421118
[rel_patent_id] =>[rel_patent_doc_number] =>) 12/421118 | Thermal via heat spreader package and method | Apr 8, 2009 | Issued |
Array
(
[id] => 5567367
[patent_doc_number] => 20090250745
[patent_country] => US
[patent_kind] => A1
[patent_issue_date] => 2009-10-08
[patent_title] => 'Memory devices and methods of forming and operating the same'
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[patent_app_country] => US
[patent_app_date] => 2009-04-06
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[rel_patent_id] =>[rel_patent_doc_number] =>) 12/385347 | Memory devices and methods of forming and operating the same | Apr 5, 2009 | Issued |
Array
(
[id] => 4583299
[patent_doc_number] => 07834446
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[patent_kind] => B2
[patent_issue_date] => 2010-11-16
[patent_title] => 'Electronic device and method for coping with electrostatic discharge'
[patent_app_type] => utility
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[patent_app_country] => US
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[pdf_file] => patents/07/834/07834446.pdf
[firstpage_image] =>[orig_patent_app_number] => 12415657
[rel_patent_id] =>[rel_patent_doc_number] =>) 12/415657 | Electronic device and method for coping with electrostatic discharge | Mar 30, 2009 | Issued |
Array
(
[id] => 5567423
[patent_doc_number] => 20090250801
[patent_country] => US
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[patent_issue_date] => 2009-10-08
[patent_title] => 'Semiconductor device'
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[patent_app_number] => 12/385138
[patent_app_country] => US
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[patent_effective_date] => 0000-00-00
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[pdf_file] => publications/A1/0250/20090250801.pdf
[firstpage_image] =>[orig_patent_app_number] => 12385138
[rel_patent_id] =>[rel_patent_doc_number] =>) 12/385138 | Semiconductor device | Mar 30, 2009 | Abandoned |
Array
(
[id] => 5469862
[patent_doc_number] => 20090243028
[patent_country] => US
[patent_kind] => A1
[patent_issue_date] => 2009-10-01
[patent_title] => 'CAPACITIVE ISOLATION CIRCUITRY WITH IMPROVED COMMON MODE DETECTOR'
[patent_app_type] => utility
[patent_app_number] => 12/414387
[patent_app_country] => US
[patent_app_date] => 2009-03-30
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 22
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[pdf_file] => publications/A1/0243/20090243028.pdf
[firstpage_image] =>[orig_patent_app_number] => 12414387
[rel_patent_id] =>[rel_patent_doc_number] =>) 12/414387 | Capacitive isolation circuitry with improved common mode detector | Mar 29, 2009 | Issued |
Array
(
[id] => 4613008
[patent_doc_number] => 07989356
[patent_country] => US
[patent_kind] => B2
[patent_issue_date] => 2011-08-02
[patent_title] => 'Semiconductor device and method of forming enhanced UBM structure for improving solder joint reliability'
[patent_app_type] => utility
[patent_app_number] => 12/410260
[patent_app_country] => US
[patent_app_date] => 2009-03-24
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[pdf_file] => patents/07/989/07989356.pdf
[firstpage_image] =>[orig_patent_app_number] => 12410260
[rel_patent_id] =>[rel_patent_doc_number] =>) 12/410260 | Semiconductor device and method of forming enhanced UBM structure for improving solder joint reliability | Mar 23, 2009 | Issued |
Array
(
[id] => 4527112
[patent_doc_number] => 07952208
[patent_country] => US
[patent_kind] => B2
[patent_issue_date] => 2011-05-31
[patent_title] => 'Substrate, manufacturing method thereof, method for manufacturing semiconductor device'
[patent_app_type] => utility
[patent_app_number] => 12/409226
[patent_app_country] => US
[patent_app_date] => 2009-03-23
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[patent_drawing_sheets_cnt] => 28
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[pdf_file] => patents/07/952/07952208.pdf
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[rel_patent_id] =>[rel_patent_doc_number] =>) 12/409226 | Substrate, manufacturing method thereof, method for manufacturing semiconductor device | Mar 22, 2009 | Issued |
Array
(
[id] => 5340661
[patent_doc_number] => 20090179311
[patent_country] => US
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[patent_issue_date] => 2009-07-16
[patent_title] => 'SEMICONDUCTOR COMPONENT AND METHOD FOR PRODUCING THE SAME'
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[patent_app_number] => 12/408162
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[rel_patent_id] =>[rel_patent_doc_number] =>) 12/408162 | Semiconductor component and method for producing the same | Mar 19, 2009 | Issued |
Array
(
[id] => 4532652
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[patent_title] => 'Semiconductor device and method for fabricating semiconductor device'
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Array
(
[id] => 4605054
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[patent_title] => 'Multilayer wiring substrate, semiconductor package, and method of manufacturing semiconductor package'
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Array
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[id] => 7527384
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[patent_title] => 'Adhesion to copper and copper electromigration resistance'
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Array
(
[id] => 4503635
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Array
(
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Array
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Array
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Array
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Array
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[rel_patent_id] =>[rel_patent_doc_number] =>) 12/397661 | Method of reducing erosion of a metal cap layer during via patterning in semiconductor devices | Mar 3, 2009 | Issued |