
Roy Karl Potter
Examiner (ID: 13991, Phone: (571)272-1842 , Office: P/2822 )
| Most Active Art Unit | 2822 |
| Art Unit(s) | 2822, 2508, 2811, 3621 |
| Total Applications | 2584 |
| Issued Applications | 2409 |
| Pending Applications | 46 |
| Abandoned Applications | 141 |
Applications
| Application number | Title of the application | Filing Date | Status |
|---|---|---|---|
Array
(
[id] => 4691191
[patent_doc_number] => 20080083961
[patent_country] => US
[patent_kind] => A1
[patent_issue_date] => 2008-04-10
[patent_title] => 'SEMICONDUCTOR MICROPHONE UNIT'
[patent_app_type] => utility
[patent_app_number] => 11/848837
[patent_app_country] => US
[patent_app_date] => 2007-08-31
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 3
[patent_figures_cnt] => 3
[patent_no_of_words] => 5096
[patent_no_of_claims] => 12
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[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => publication
[pdf_file] => publications/A1/0083/20080083961.pdf
[firstpage_image] =>[orig_patent_app_number] => 11848837
[rel_patent_id] =>[rel_patent_doc_number] =>) 11/848837 | Semiconductor microphone unit | Aug 30, 2007 | Issued |
Array
(
[id] => 363866
[patent_doc_number] => 07482681
[patent_country] => US
[patent_kind] => B2
[patent_issue_date] => 2009-01-27
[patent_title] => 'Semiconductor device package utilizing proud interconnect material'
[patent_app_type] => utility
[patent_app_number] => 11/893237
[patent_app_country] => US
[patent_app_date] => 2007-08-15
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 8
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[patent_no_of_words] => 6141
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[patent_current_assignee] =>[type] => patent
[pdf_file] => patents/07/482/07482681.pdf
[firstpage_image] =>[orig_patent_app_number] => 11893237
[rel_patent_id] =>[rel_patent_doc_number] =>) 11/893237 | Semiconductor device package utilizing proud interconnect material | Aug 14, 2007 | Issued |
Array
(
[id] => 4930418
[patent_doc_number] => 20080001193
[patent_country] => US
[patent_kind] => A1
[patent_issue_date] => 2008-01-03
[patent_title] => 'Image-sensing apparatus'
[patent_app_type] => utility
[patent_app_number] => 11/890216
[patent_app_country] => US
[patent_app_date] => 2007-08-03
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 65
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[pdf_file] => publications/A1/0001/20080001193.pdf
[firstpage_image] =>[orig_patent_app_number] => 11890216
[rel_patent_id] =>[rel_patent_doc_number] =>) 11/890216 | Image-sensing apparatus | Aug 2, 2007 | Issued |
Array
(
[id] => 4462427
[patent_doc_number] => 07880292
[patent_country] => US
[patent_kind] => B2
[patent_issue_date] => 2011-02-01
[patent_title] => 'Semiconductor device and fabricating method thereof'
[patent_app_type] => utility
[patent_app_number] => 11/831515
[patent_app_country] => US
[patent_app_date] => 2007-07-31
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 5
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[patent_no_of_words] => 1933
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[pdf_file] => patents/07/880/07880292.pdf
[firstpage_image] =>[orig_patent_app_number] => 11831515
[rel_patent_id] =>[rel_patent_doc_number] =>) 11/831515 | Semiconductor device and fabricating method thereof | Jul 30, 2007 | Issued |
Array
(
[id] => 4587116
[patent_doc_number] => 07851921
[patent_country] => US
[patent_kind] => B2
[patent_issue_date] => 2010-12-14
[patent_title] => 'Device mounting board having multiple circuit substrates, and semiconductor module with the device mounting board'
[patent_app_type] => utility
[patent_app_number] => 11/830505
[patent_app_country] => US
[patent_app_date] => 2007-07-30
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[pdf_file] => patents/07/851/07851921.pdf
[firstpage_image] =>[orig_patent_app_number] => 11830505
[rel_patent_id] =>[rel_patent_doc_number] =>) 11/830505 | Device mounting board having multiple circuit substrates, and semiconductor module with the device mounting board | Jul 29, 2007 | Issued |
Array
(
[id] => 4654845
[patent_doc_number] => 20080023705
[patent_country] => US
[patent_kind] => A1
[patent_issue_date] => 2008-01-31
[patent_title] => 'THIN-FILM TRANSISTOR SUBSTRATE, METHOD OF MANUFACTURING THE SAME AND DISPLAY PANEL HAVING THE SAME'
[patent_app_type] => utility
[patent_app_number] => 11/829332
[patent_app_country] => US
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[patent_effective_date] => 0000-00-00
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[rel_patent_id] =>[rel_patent_doc_number] =>) 11/829332 | Thin-film transistor substrate, method of manufacturing the same and display panel having the same | Jul 26, 2007 | Issued |
Array
(
[id] => 285396
[patent_doc_number] => 07550322
[patent_country] => US
[patent_kind] => B2
[patent_issue_date] => 2009-06-23
[patent_title] => 'Manufacturing method for resin sealed semiconductor device'
[patent_app_type] => utility
[patent_app_number] => 11/880978
[patent_app_country] => US
[patent_app_date] => 2007-07-25
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 5
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[patent_no_of_words] => 2395
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[pdf_file] => patents/07/550/07550322.pdf
[firstpage_image] =>[orig_patent_app_number] => 11880978
[rel_patent_id] =>[rel_patent_doc_number] =>) 11/880978 | Manufacturing method for resin sealed semiconductor device | Jul 24, 2007 | Issued |
Array
(
[id] => 4503612
[patent_doc_number] => 07919839
[patent_country] => US
[patent_kind] => B2
[patent_issue_date] => 2011-04-05
[patent_title] => 'Support structures for on-wafer testing of wafer-level packages and multiple wafer stacked structures'
[patent_app_type] => utility
[patent_app_number] => 11/782497
[patent_app_country] => US
[patent_app_date] => 2007-07-24
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 3
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[pdf_file] => patents/07/919/07919839.pdf
[firstpage_image] =>[orig_patent_app_number] => 11782497
[rel_patent_id] =>[rel_patent_doc_number] =>) 11/782497 | Support structures for on-wafer testing of wafer-level packages and multiple wafer stacked structures | Jul 23, 2007 | Issued |
Array
(
[id] => 307385
[patent_doc_number] => 07531451
[patent_country] => US
[patent_kind] => B2
[patent_issue_date] => 2009-05-12
[patent_title] => 'SIP semiconductor device and method for manufacturing the same'
[patent_app_type] => utility
[patent_app_number] => 11/781547
[patent_app_country] => US
[patent_app_date] => 2007-07-23
[patent_effective_date] => 0000-00-00
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[pdf_file] => patents/07/531/07531451.pdf
[firstpage_image] =>[orig_patent_app_number] => 11781547
[rel_patent_id] =>[rel_patent_doc_number] =>) 11/781547 | SIP semiconductor device and method for manufacturing the same | Jul 22, 2007 | Issued |
Array
(
[id] => 338334
[patent_doc_number] => 07504679
[patent_country] => US
[patent_kind] => B2
[patent_issue_date] => 2009-03-17
[patent_title] => 'Enhancement mode GaN FET with piezoelectric gate'
[patent_app_type] => utility
[patent_app_number] => 11/780737
[patent_app_country] => US
[patent_app_date] => 2007-07-20
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 3
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[pdf_file] => patents/07/504/07504679.pdf
[firstpage_image] =>[orig_patent_app_number] => 11780737
[rel_patent_id] =>[rel_patent_doc_number] =>) 11/780737 | Enhancement mode GaN FET with piezoelectric gate | Jul 19, 2007 | Issued |
Array
(
[id] => 113867
[patent_doc_number] => 07714416
[patent_country] => US
[patent_kind] => B2
[patent_issue_date] => 2010-05-11
[patent_title] => 'Electronic circuit in a package-in-package configuration and production method'
[patent_app_type] => utility
[patent_app_number] => 11/780767
[patent_app_country] => US
[patent_app_date] => 2007-07-20
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[rel_patent_id] =>[rel_patent_doc_number] =>) 11/780767 | Electronic circuit in a package-in-package configuration and production method | Jul 19, 2007 | Issued |
Array
(
[id] => 4800532
[patent_doc_number] => 20080012119
[patent_country] => US
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[patent_issue_date] => 2008-01-17
[patent_title] => 'SEMICONDUCTOR COMPONENT AND METHOD FOR PRODUCING THE SAME'
[patent_app_type] => utility
[patent_app_number] => 11/778887
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[rel_patent_id] =>[rel_patent_doc_number] =>) 11/778887 | Semiconductor component and method for producing the same | Jul 16, 2007 | Issued |
Array
(
[id] => 587801
[patent_doc_number] => 07446420
[patent_country] => US
[patent_kind] => B1
[patent_issue_date] => 2008-11-04
[patent_title] => 'Through silicon via chip stack package capable of facilitating chip selection during device operation'
[patent_app_type] => utility
[patent_app_number] => 11/777357
[patent_app_country] => US
[patent_app_date] => 2007-07-13
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Array
(
[id] => 5014144
[patent_doc_number] => 20070257352
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[patent_issue_date] => 2007-11-08
[patent_title] => 'TEST PADS ON FLASH MEMORY CARDS'
[patent_app_type] => utility
[patent_app_number] => 11/777027
[patent_app_country] => US
[patent_app_date] => 2007-07-12
[patent_effective_date] => 0000-00-00
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[rel_patent_id] =>[rel_patent_doc_number] =>) 11/777027 | Test pads on flash memory cards | Jul 11, 2007 | Issued |
Array
(
[id] => 4936379
[patent_doc_number] => 20080073693
[patent_country] => US
[patent_kind] => A1
[patent_issue_date] => 2008-03-27
[patent_title] => 'SEMICONDUCTOR DEVICES HAVING TUNNEL AND GATE INSULATING LAYERS AND METHODS OF FORMING THE SAME'
[patent_app_type] => utility
[patent_app_number] => 11/776297
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[firstpage_image] =>[orig_patent_app_number] => 11776297
[rel_patent_id] =>[rel_patent_doc_number] =>) 11/776297 | Methods of forming semiconductor devices having tunnel and gate insulating layers | Jul 10, 2007 | Issued |
Array
(
[id] => 367021
[patent_doc_number] => 07479706
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[patent_title] => 'Chip package structure'
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Array
(
[id] => 367018
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[patent_issue_date] => 2009-01-20
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Array
(
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Array
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Array
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[firstpage_image] =>[orig_patent_app_number] => 11769937
[rel_patent_id] =>[rel_patent_doc_number] =>) 11/769937 | Semiconductor die having a distribution layer | Jun 27, 2007 | Issued |