Search

Roy Karl Potter

Examiner (ID: 13991, Phone: (571)272-1842 , Office: P/2822 )

Most Active Art Unit
2822
Art Unit(s)
2822, 2508, 2811, 3621
Total Applications
2584
Issued Applications
2409
Pending Applications
46
Abandoned Applications
141

Applications

Application numberTitle of the applicationFiling DateStatus
Array ( [id] => 4691191 [patent_doc_number] => 20080083961 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2008-04-10 [patent_title] => 'SEMICONDUCTOR MICROPHONE UNIT' [patent_app_type] => utility [patent_app_number] => 11/848837 [patent_app_country] => US [patent_app_date] => 2007-08-31 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 3 [patent_figures_cnt] => 3 [patent_no_of_words] => 5096 [patent_no_of_claims] => 12 [patent_no_of_ind_claims] => 3 [patent_words_short_claim] => 0 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] => publications/A1/0083/20080083961.pdf [firstpage_image] =>[orig_patent_app_number] => 11848837 [rel_patent_id] =>[rel_patent_doc_number] =>)
11/848837
Semiconductor microphone unit Aug 30, 2007 Issued
Array ( [id] => 363866 [patent_doc_number] => 07482681 [patent_country] => US [patent_kind] => B2 [patent_issue_date] => 2009-01-27 [patent_title] => 'Semiconductor device package utilizing proud interconnect material' [patent_app_type] => utility [patent_app_number] => 11/893237 [patent_app_country] => US [patent_app_date] => 2007-08-15 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 8 [patent_figures_cnt] => 19 [patent_no_of_words] => 6141 [patent_no_of_claims] => 27 [patent_no_of_ind_claims] => 2 [patent_words_short_claim] => 128 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/07/482/07482681.pdf [firstpage_image] =>[orig_patent_app_number] => 11893237 [rel_patent_id] =>[rel_patent_doc_number] =>)
11/893237
Semiconductor device package utilizing proud interconnect material Aug 14, 2007 Issued
Array ( [id] => 4930418 [patent_doc_number] => 20080001193 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2008-01-03 [patent_title] => 'Image-sensing apparatus' [patent_app_type] => utility [patent_app_number] => 11/890216 [patent_app_country] => US [patent_app_date] => 2007-08-03 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 65 [patent_figures_cnt] => 65 [patent_no_of_words] => 33088 [patent_no_of_claims] => 25 [patent_no_of_ind_claims] => 8 [patent_words_short_claim] => 0 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] => publications/A1/0001/20080001193.pdf [firstpage_image] =>[orig_patent_app_number] => 11890216 [rel_patent_id] =>[rel_patent_doc_number] =>)
11/890216
Image-sensing apparatus Aug 2, 2007 Issued
Array ( [id] => 4462427 [patent_doc_number] => 07880292 [patent_country] => US [patent_kind] => B2 [patent_issue_date] => 2011-02-01 [patent_title] => 'Semiconductor device and fabricating method thereof' [patent_app_type] => utility [patent_app_number] => 11/831515 [patent_app_country] => US [patent_app_date] => 2007-07-31 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 5 [patent_figures_cnt] => 7 [patent_no_of_words] => 1933 [patent_no_of_claims] => 18 [patent_no_of_ind_claims] => 2 [patent_words_short_claim] => 57 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/07/880/07880292.pdf [firstpage_image] =>[orig_patent_app_number] => 11831515 [rel_patent_id] =>[rel_patent_doc_number] =>)
11/831515
Semiconductor device and fabricating method thereof Jul 30, 2007 Issued
Array ( [id] => 4587116 [patent_doc_number] => 07851921 [patent_country] => US [patent_kind] => B2 [patent_issue_date] => 2010-12-14 [patent_title] => 'Device mounting board having multiple circuit substrates, and semiconductor module with the device mounting board' [patent_app_type] => utility [patent_app_number] => 11/830505 [patent_app_country] => US [patent_app_date] => 2007-07-30 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 10 [patent_figures_cnt] => 16 [patent_no_of_words] => 11130 [patent_no_of_claims] => 9 [patent_no_of_ind_claims] => 3 [patent_words_short_claim] => 34 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/07/851/07851921.pdf [firstpage_image] =>[orig_patent_app_number] => 11830505 [rel_patent_id] =>[rel_patent_doc_number] =>)
11/830505
Device mounting board having multiple circuit substrates, and semiconductor module with the device mounting board Jul 29, 2007 Issued
Array ( [id] => 4654845 [patent_doc_number] => 20080023705 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2008-01-31 [patent_title] => 'THIN-FILM TRANSISTOR SUBSTRATE, METHOD OF MANUFACTURING THE SAME AND DISPLAY PANEL HAVING THE SAME' [patent_app_type] => utility [patent_app_number] => 11/829332 [patent_app_country] => US [patent_app_date] => 2007-07-27 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 25 [patent_figures_cnt] => 25 [patent_no_of_words] => 7598 [patent_no_of_claims] => 26 [patent_no_of_ind_claims] => 4 [patent_words_short_claim] => 0 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] => publications/A1/0023/20080023705.pdf [firstpage_image] =>[orig_patent_app_number] => 11829332 [rel_patent_id] =>[rel_patent_doc_number] =>)
11/829332
Thin-film transistor substrate, method of manufacturing the same and display panel having the same Jul 26, 2007 Issued
Array ( [id] => 285396 [patent_doc_number] => 07550322 [patent_country] => US [patent_kind] => B2 [patent_issue_date] => 2009-06-23 [patent_title] => 'Manufacturing method for resin sealed semiconductor device' [patent_app_type] => utility [patent_app_number] => 11/880978 [patent_app_country] => US [patent_app_date] => 2007-07-25 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 5 [patent_figures_cnt] => 12 [patent_no_of_words] => 2395 [patent_no_of_claims] => 12 [patent_no_of_ind_claims] => 2 [patent_words_short_claim] => 194 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/07/550/07550322.pdf [firstpage_image] =>[orig_patent_app_number] => 11880978 [rel_patent_id] =>[rel_patent_doc_number] =>)
11/880978
Manufacturing method for resin sealed semiconductor device Jul 24, 2007 Issued
Array ( [id] => 4503612 [patent_doc_number] => 07919839 [patent_country] => US [patent_kind] => B2 [patent_issue_date] => 2011-04-05 [patent_title] => 'Support structures for on-wafer testing of wafer-level packages and multiple wafer stacked structures' [patent_app_type] => utility [patent_app_number] => 11/782497 [patent_app_country] => US [patent_app_date] => 2007-07-24 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 3 [patent_figures_cnt] => 5 [patent_no_of_words] => 2054 [patent_no_of_claims] => 20 [patent_no_of_ind_claims] => 3 [patent_words_short_claim] => 149 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/07/919/07919839.pdf [firstpage_image] =>[orig_patent_app_number] => 11782497 [rel_patent_id] =>[rel_patent_doc_number] =>)
11/782497
Support structures for on-wafer testing of wafer-level packages and multiple wafer stacked structures Jul 23, 2007 Issued
Array ( [id] => 307385 [patent_doc_number] => 07531451 [patent_country] => US [patent_kind] => B2 [patent_issue_date] => 2009-05-12 [patent_title] => 'SIP semiconductor device and method for manufacturing the same' [patent_app_type] => utility [patent_app_number] => 11/781547 [patent_app_country] => US [patent_app_date] => 2007-07-23 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 5 [patent_figures_cnt] => 10 [patent_no_of_words] => 2287 [patent_no_of_claims] => 10 [patent_no_of_ind_claims] => 1 [patent_words_short_claim] => 44 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/07/531/07531451.pdf [firstpage_image] =>[orig_patent_app_number] => 11781547 [rel_patent_id] =>[rel_patent_doc_number] =>)
11/781547
SIP semiconductor device and method for manufacturing the same Jul 22, 2007 Issued
Array ( [id] => 338334 [patent_doc_number] => 07504679 [patent_country] => US [patent_kind] => B2 [patent_issue_date] => 2009-03-17 [patent_title] => 'Enhancement mode GaN FET with piezoelectric gate' [patent_app_type] => utility [patent_app_number] => 11/780737 [patent_app_country] => US [patent_app_date] => 2007-07-20 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 3 [patent_figures_cnt] => 4 [patent_no_of_words] => 1022 [patent_no_of_claims] => 15 [patent_no_of_ind_claims] => 2 [patent_words_short_claim] => 52 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/07/504/07504679.pdf [firstpage_image] =>[orig_patent_app_number] => 11780737 [rel_patent_id] =>[rel_patent_doc_number] =>)
11/780737
Enhancement mode GaN FET with piezoelectric gate Jul 19, 2007 Issued
Array ( [id] => 113867 [patent_doc_number] => 07714416 [patent_country] => US [patent_kind] => B2 [patent_issue_date] => 2010-05-11 [patent_title] => 'Electronic circuit in a package-in-package configuration and production method' [patent_app_type] => utility [patent_app_number] => 11/780767 [patent_app_country] => US [patent_app_date] => 2007-07-20 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 2 [patent_figures_cnt] => 5 [patent_no_of_words] => 3816 [patent_no_of_claims] => 19 [patent_no_of_ind_claims] => 6 [patent_words_short_claim] => 71 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/07/714/07714416.pdf [firstpage_image] =>[orig_patent_app_number] => 11780767 [rel_patent_id] =>[rel_patent_doc_number] =>)
11/780767
Electronic circuit in a package-in-package configuration and production method Jul 19, 2007 Issued
Array ( [id] => 4800532 [patent_doc_number] => 20080012119 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2008-01-17 [patent_title] => 'SEMICONDUCTOR COMPONENT AND METHOD FOR PRODUCING THE SAME' [patent_app_type] => utility [patent_app_number] => 11/778887 [patent_app_country] => US [patent_app_date] => 2007-07-17 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 10 [patent_figures_cnt] => 10 [patent_no_of_words] => 6360 [patent_no_of_claims] => 28 [patent_no_of_ind_claims] => 5 [patent_words_short_claim] => 0 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] => publications/A1/0012/20080012119.pdf [firstpage_image] =>[orig_patent_app_number] => 11778887 [rel_patent_id] =>[rel_patent_doc_number] =>)
11/778887
Semiconductor component and method for producing the same Jul 16, 2007 Issued
Array ( [id] => 587801 [patent_doc_number] => 07446420 [patent_country] => US [patent_kind] => B1 [patent_issue_date] => 2008-11-04 [patent_title] => 'Through silicon via chip stack package capable of facilitating chip selection during device operation' [patent_app_type] => utility [patent_app_number] => 11/777357 [patent_app_country] => US [patent_app_date] => 2007-07-13 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 5 [patent_figures_cnt] => 7 [patent_no_of_words] => 4051 [patent_no_of_claims] => 11 [patent_no_of_ind_claims] => 1 [patent_words_short_claim] => 141 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/07/446/07446420.pdf [firstpage_image] =>[orig_patent_app_number] => 11777357 [rel_patent_id] =>[rel_patent_doc_number] =>)
11/777357
Through silicon via chip stack package capable of facilitating chip selection during device operation Jul 12, 2007 Issued
Array ( [id] => 5014144 [patent_doc_number] => 20070257352 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2007-11-08 [patent_title] => 'TEST PADS ON FLASH MEMORY CARDS' [patent_app_type] => utility [patent_app_number] => 11/777027 [patent_app_country] => US [patent_app_date] => 2007-07-12 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 5 [patent_figures_cnt] => 5 [patent_no_of_words] => 3648 [patent_no_of_claims] => 9 [patent_no_of_ind_claims] => 1 [patent_words_short_claim] => 0 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] => publications/A1/0257/20070257352.pdf [firstpage_image] =>[orig_patent_app_number] => 11777027 [rel_patent_id] =>[rel_patent_doc_number] =>)
11/777027
Test pads on flash memory cards Jul 11, 2007 Issued
Array ( [id] => 4936379 [patent_doc_number] => 20080073693 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2008-03-27 [patent_title] => 'SEMICONDUCTOR DEVICES HAVING TUNNEL AND GATE INSULATING LAYERS AND METHODS OF FORMING THE SAME' [patent_app_type] => utility [patent_app_number] => 11/776297 [patent_app_country] => US [patent_app_date] => 2007-07-11 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 10 [patent_figures_cnt] => 10 [patent_no_of_words] => 7112 [patent_no_of_claims] => 22 [patent_no_of_ind_claims] => 4 [patent_words_short_claim] => 0 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] => publications/A1/0073/20080073693.pdf [firstpage_image] =>[orig_patent_app_number] => 11776297 [rel_patent_id] =>[rel_patent_doc_number] =>)
11/776297
Methods of forming semiconductor devices having tunnel and gate insulating layers Jul 10, 2007 Issued
Array ( [id] => 367021 [patent_doc_number] => 07479706 [patent_country] => US [patent_kind] => B2 [patent_issue_date] => 2009-01-20 [patent_title] => 'Chip package structure' [patent_app_type] => utility [patent_app_number] => 11/773437 [patent_app_country] => US [patent_app_date] => 2007-07-05 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 4 [patent_figures_cnt] => 6 [patent_no_of_words] => 2620 [patent_no_of_claims] => 10 [patent_no_of_ind_claims] => 1 [patent_words_short_claim] => 194 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/07/479/07479706.pdf [firstpage_image] =>[orig_patent_app_number] => 11773437 [rel_patent_id] =>[rel_patent_doc_number] =>)
11/773437
Chip package structure Jul 4, 2007 Issued
Array ( [id] => 367018 [patent_doc_number] => 07479703 [patent_country] => US [patent_kind] => B1 [patent_issue_date] => 2009-01-20 [patent_title] => 'Integrated circuit package with sputtered heat sink for improved thermal performance' [patent_app_type] => utility [patent_app_number] => 11/772267 [patent_app_country] => US [patent_app_date] => 2007-07-02 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 2 [patent_figures_cnt] => 4 [patent_no_of_words] => 1621 [patent_no_of_claims] => 11 [patent_no_of_ind_claims] => 8 [patent_words_short_claim] => 36 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/07/479/07479703.pdf [firstpage_image] =>[orig_patent_app_number] => 11772267 [rel_patent_id] =>[rel_patent_doc_number] =>)
11/772267
Integrated circuit package with sputtered heat sink for improved thermal performance Jul 1, 2007 Issued
Array ( [id] => 4870755 [patent_doc_number] => 20080197489 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2008-08-21 [patent_title] => 'Packaging conductive structure and method for manufacturing the same' [patent_app_type] => utility [patent_app_number] => 11/822096 [patent_app_country] => US [patent_app_date] => 2007-07-02 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 5 [patent_figures_cnt] => 5 [patent_no_of_words] => 1436 [patent_no_of_claims] => 16 [patent_no_of_ind_claims] => 2 [patent_words_short_claim] => 0 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] => publications/A1/0197/20080197489.pdf [firstpage_image] =>[orig_patent_app_number] => 11822096 [rel_patent_id] =>[rel_patent_doc_number] =>)
11/822096
Packaging conductive structure and method for manufacturing the same Jul 1, 2007 Issued
Array ( [id] => 4551940 [patent_doc_number] => 07820548 [patent_country] => US [patent_kind] => B2 [patent_issue_date] => 2010-10-26 [patent_title] => 'Semiconductor device and manufacturing method thereof' [patent_app_type] => utility [patent_app_number] => 11/822122 [patent_app_country] => US [patent_app_date] => 2007-07-02 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 6 [patent_figures_cnt] => 12 [patent_no_of_words] => 3048 [patent_no_of_claims] => 9 [patent_no_of_ind_claims] => 1 [patent_words_short_claim] => 84 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/07/820/07820548.pdf [firstpage_image] =>[orig_patent_app_number] => 11822122 [rel_patent_id] =>[rel_patent_doc_number] =>)
11/822122
Semiconductor device and manufacturing method thereof Jul 1, 2007 Issued
Array ( [id] => 63691 [patent_doc_number] => 07763980 [patent_country] => US [patent_kind] => B2 [patent_issue_date] => 2010-07-27 [patent_title] => 'Semiconductor die having a distribution layer' [patent_app_type] => utility [patent_app_number] => 11/769937 [patent_app_country] => US [patent_app_date] => 2007-06-28 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 4 [patent_figures_cnt] => 12 [patent_no_of_words] => 3883 [patent_no_of_claims] => 10 [patent_no_of_ind_claims] => 2 [patent_words_short_claim] => 75 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/07/763/07763980.pdf [firstpage_image] =>[orig_patent_app_number] => 11769937 [rel_patent_id] =>[rel_patent_doc_number] =>)
11/769937
Semiconductor die having a distribution layer Jun 27, 2007 Issued
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