Search

Roy Karl Potter

Examiner (ID: 13991, Phone: (571)272-1842 , Office: P/2822 )

Most Active Art Unit
2822
Art Unit(s)
2822, 2508, 2811, 3621
Total Applications
2584
Issued Applications
2409
Pending Applications
46
Abandoned Applications
141

Applications

Application numberTitle of the applicationFiling DateStatus
Array ( [id] => 4930431 [patent_doc_number] => 20080001206 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2008-01-03 [patent_title] => 'SEMICONDUCTOR STORAGE DEVICE COMPRISING MIS TRANSISTOR INCLUDING CHARGE STORAGE LAYER' [patent_app_type] => utility [patent_app_number] => 11/770415 [patent_app_country] => US [patent_app_date] => 2007-06-28 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 19 [patent_figures_cnt] => 19 [patent_no_of_words] => 9912 [patent_no_of_claims] => 11 [patent_no_of_ind_claims] => 2 [patent_words_short_claim] => 0 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] => publications/A1/0001/20080001206.pdf [firstpage_image] =>[orig_patent_app_number] => 11770415 [rel_patent_id] =>[rel_patent_doc_number] =>)
11/770415
Semiconductor storage device comprising MIS transistor including charge storage layer Jun 27, 2007 Issued
Array ( [id] => 4930463 [patent_doc_number] => 20080001238 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2008-01-03 [patent_title] => 'SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME' [patent_app_type] => utility [patent_app_number] => 11/770306 [patent_app_country] => US [patent_app_date] => 2007-06-28 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 11 [patent_figures_cnt] => 11 [patent_no_of_words] => 5824 [patent_no_of_claims] => 6 [patent_no_of_ind_claims] => 2 [patent_words_short_claim] => 0 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] => publications/A1/0001/20080001238.pdf [firstpage_image] =>[orig_patent_app_number] => 11770306 [rel_patent_id] =>[rel_patent_doc_number] =>)
11/770306
Semiconductor device and method of manufacturing the same Jun 27, 2007 Issued
Array ( [id] => 4795253 [patent_doc_number] => 20080006839 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2008-01-10 [patent_title] => 'LIGHT EMITTING DEVICE AND METHOD FOR MANUFACTURING THE SAME' [patent_app_type] => utility [patent_app_number] => 11/768396 [patent_app_country] => US [patent_app_date] => 2007-06-26 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 7 [patent_figures_cnt] => 7 [patent_no_of_words] => 2781 [patent_no_of_claims] => 20 [patent_no_of_ind_claims] => 3 [patent_words_short_claim] => 0 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] => publications/A1/0006/20080006839.pdf [firstpage_image] =>[orig_patent_app_number] => 11768396 [rel_patent_id] =>[rel_patent_doc_number] =>)
11/768396
LIGHT EMITTING DEVICE AND METHOD FOR MANUFACTURING THE SAME Jun 25, 2007 Abandoned
Array ( [id] => 5346207 [patent_doc_number] => 20090001568 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2009-01-01 [patent_title] => 'Wafer-level solder bumps' [patent_app_type] => utility [patent_app_number] => 11/821867 [patent_app_country] => US [patent_app_date] => 2007-06-26 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 4 [patent_figures_cnt] => 4 [patent_no_of_words] => 1925 [patent_no_of_claims] => 8 [patent_no_of_ind_claims] => 2 [patent_words_short_claim] => 0 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] => publications/A1/0001/20090001568.pdf [firstpage_image] =>[orig_patent_app_number] => 11821867 [rel_patent_id] =>[rel_patent_doc_number] =>)
11/821867
Wafer-level solder bumps Jun 25, 2007 Issued
Array ( [id] => 5210496 [patent_doc_number] => 20070249080 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2007-10-25 [patent_title] => 'Magnetic field sensing device and a fabricating method of the same' [patent_app_type] => utility [patent_app_number] => 11/819051 [patent_app_country] => US [patent_app_date] => 2007-06-25 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 9 [patent_figures_cnt] => 9 [patent_no_of_words] => 4502 [patent_no_of_claims] => 13 [patent_no_of_ind_claims] => 2 [patent_words_short_claim] => 0 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] => publications/A1/0249/20070249080.pdf [firstpage_image] =>[orig_patent_app_number] => 11819051 [rel_patent_id] =>[rel_patent_doc_number] =>)
11/819051
Magnetic field sensing device and a fabricating method of the same Jun 24, 2007 Issued
Array ( [id] => 4849631 [patent_doc_number] => 20080315373 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2008-12-25 [patent_title] => 'METHOD OF ENABLING ALIGNMENT OF WAFER IN EXPOSURE STEP OF IC PROCESS AFTER UV-BLOCKING METAL LAYER IS FORMED OVER THE WHOLE WAFER' [patent_app_type] => utility [patent_app_number] => 11/768007 [patent_app_country] => US [patent_app_date] => 2007-06-25 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 3 [patent_figures_cnt] => 3 [patent_no_of_words] => 2724 [patent_no_of_claims] => 24 [patent_no_of_ind_claims] => 3 [patent_words_short_claim] => 0 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] => publications/A1/0315/20080315373.pdf [firstpage_image] =>[orig_patent_app_number] => 11768007 [rel_patent_id] =>[rel_patent_doc_number] =>)
11/768007
Method of enabling alignment of wafer in exposure step of IC process after UV-blocking metal layer is formed over the whole wafer Jun 24, 2007 Issued
Array ( [id] => 4800539 [patent_doc_number] => 20080012126 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2008-01-17 [patent_title] => 'Paper including semiconductor device and manufacturing method thereof' [patent_app_type] => utility [patent_app_number] => 11/819157 [patent_app_country] => US [patent_app_date] => 2007-06-25 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 20 [patent_figures_cnt] => 20 [patent_no_of_words] => 15265 [patent_no_of_claims] => 25 [patent_no_of_ind_claims] => 9 [patent_words_short_claim] => 0 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] => publications/A1/0012/20080012126.pdf [firstpage_image] =>[orig_patent_app_number] => 11819157 [rel_patent_id] =>[rel_patent_doc_number] =>)
11/819157
Paper including semiconductor device and manufacturing method thereof Jun 24, 2007 Issued
Array ( [id] => 879719 [patent_doc_number] => 07354796 [patent_country] => US [patent_kind] => B2 [patent_issue_date] => 2008-04-08 [patent_title] => 'Method for fabricating semiconductor package free of substrate' [patent_app_type] => utility [patent_app_number] => 11/821269 [patent_app_country] => US [patent_app_date] => 2007-06-22 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 11 [patent_figures_cnt] => 27 [patent_no_of_words] => 4712 [patent_no_of_claims] => 14 [patent_no_of_ind_claims] => 1 [patent_words_short_claim] => 156 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/07/354/07354796.pdf [firstpage_image] =>[orig_patent_app_number] => 11821269 [rel_patent_id] =>[rel_patent_doc_number] =>)
11/821269
Method for fabricating semiconductor package free of substrate Jun 21, 2007 Issued
Array ( [id] => 285911 [patent_doc_number] => 07550840 [patent_country] => US [patent_kind] => B2 [patent_issue_date] => 2009-06-23 [patent_title] => 'Apparatus for effecting reliable heat transfer of bare die microelectronic device and method thereof' [patent_app_type] => utility [patent_app_number] => 11/766997 [patent_app_country] => US [patent_app_date] => 2007-06-22 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 3 [patent_figures_cnt] => 3 [patent_no_of_words] => 3028 [patent_no_of_claims] => 11 [patent_no_of_ind_claims] => 3 [patent_words_short_claim] => 65 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/07/550/07550840.pdf [firstpage_image] =>[orig_patent_app_number] => 11766997 [rel_patent_id] =>[rel_patent_doc_number] =>)
11/766997
Apparatus for effecting reliable heat transfer of bare die microelectronic device and method thereof Jun 21, 2007 Issued
Array ( [id] => 4648824 [patent_doc_number] => 20080036079 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2008-02-14 [patent_title] => 'Conductive connection structure formed on the surface of circuit board and manufacturing method thereof' [patent_app_type] => utility [patent_app_number] => 11/812407 [patent_app_country] => US [patent_app_date] => 2007-06-19 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 3 [patent_figures_cnt] => 3 [patent_no_of_words] => 1974 [patent_no_of_claims] => 10 [patent_no_of_ind_claims] => 2 [patent_words_short_claim] => 0 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] => publications/A1/0036/20080036079.pdf [firstpage_image] =>[orig_patent_app_number] => 11812407 [rel_patent_id] =>[rel_patent_doc_number] =>)
11/812407
Conductive connection structure formed on the surface of circuit board and manufacturing method thereof Jun 18, 2007 Abandoned
Array ( [id] => 4443761 [patent_doc_number] => 07928567 [patent_country] => US [patent_kind] => B2 [patent_issue_date] => 2011-04-19 [patent_title] => 'Power supply network' [patent_app_type] => utility [patent_app_number] => 12/306898 [patent_app_country] => US [patent_app_date] => 2007-06-19 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 6 [patent_figures_cnt] => 9 [patent_no_of_words] => 5782 [patent_no_of_claims] => 21 [patent_no_of_ind_claims] => 3 [patent_words_short_claim] => 107 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/07/928/07928567.pdf [firstpage_image] =>[orig_patent_app_number] => 12306898 [rel_patent_id] =>[rel_patent_doc_number] =>)
12/306898
Power supply network Jun 18, 2007 Issued
Array ( [id] => 4795355 [patent_doc_number] => 20080006941 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2008-01-10 [patent_title] => 'Semiconductor package and method of manufacturing the same' [patent_app_type] => utility [patent_app_number] => 11/812307 [patent_app_country] => US [patent_app_date] => 2007-06-18 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 6 [patent_figures_cnt] => 6 [patent_no_of_words] => 2461 [patent_no_of_claims] => 18 [patent_no_of_ind_claims] => 2 [patent_words_short_claim] => 0 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] => publications/A1/0006/20080006941.pdf [firstpage_image] =>[orig_patent_app_number] => 11812307 [rel_patent_id] =>[rel_patent_doc_number] =>)
11/812307
Semiconductor package and method of manufacturing the same Jun 17, 2007 Issued
Array ( [id] => 5245175 [patent_doc_number] => 20070241409 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2007-10-18 [patent_title] => 'SEMICONDUCTOR STRUCTURES FOR LATCH-UP SUPPRESSION AND METHODS OF FORMING SUCH SEMICONDUCTOR STRUCTURES' [patent_app_type] => utility [patent_app_number] => 11/764571 [patent_app_country] => US [patent_app_date] => 2007-06-18 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 11 [patent_figures_cnt] => 11 [patent_no_of_words] => 8891 [patent_no_of_claims] => 26 [patent_no_of_ind_claims] => 5 [patent_words_short_claim] => 0 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] => publications/A1/0241/20070241409.pdf [firstpage_image] =>[orig_patent_app_number] => 11764571 [rel_patent_id] =>[rel_patent_doc_number] =>)
11/764571
Semiconductor structures for latch-up suppression and methods of forming such semiconductor structures Jun 17, 2007 Issued
Array ( [id] => 4795353 [patent_doc_number] => 20080006939 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2008-01-10 [patent_title] => 'Packaging of hybrib integrated circuits' [patent_app_type] => utility [patent_app_number] => 11/820237 [patent_app_country] => US [patent_app_date] => 2007-06-18 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 5 [patent_figures_cnt] => 5 [patent_no_of_words] => 2462 [patent_no_of_claims] => 15 [patent_no_of_ind_claims] => 2 [patent_words_short_claim] => 0 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] => publications/A1/0006/20080006939.pdf [firstpage_image] =>[orig_patent_app_number] => 11820237 [rel_patent_id] =>[rel_patent_doc_number] =>)
11/820237
Packaging of hybrid integrated circuits Jun 17, 2007 Issued
Array ( [id] => 4685683 [patent_doc_number] => 20080029864 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2008-02-07 [patent_title] => 'Package of MEMS device and method for fabricating the same' [patent_app_type] => utility [patent_app_number] => 11/808877 [patent_app_country] => US [patent_app_date] => 2007-06-13 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 23 [patent_figures_cnt] => 23 [patent_no_of_words] => 7586 [patent_no_of_claims] => 29 [patent_no_of_ind_claims] => 2 [patent_words_short_claim] => 0 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] => publications/A1/0029/20080029864.pdf [firstpage_image] =>[orig_patent_app_number] => 11808877 [rel_patent_id] =>[rel_patent_doc_number] =>)
11/808877
Package of MEMS device and method for fabricating the same Jun 12, 2007 Issued
Array ( [id] => 211894 [patent_doc_number] => 07622800 [patent_country] => US [patent_kind] => B2 [patent_issue_date] => 2009-11-24 [patent_title] => 'Stacked semiconductor packages and method therefor' [patent_app_type] => utility [patent_app_number] => 11/760712 [patent_app_country] => US [patent_app_date] => 2007-06-08 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 11 [patent_figures_cnt] => 29 [patent_no_of_words] => 5512 [patent_no_of_claims] => 20 [patent_no_of_ind_claims] => 6 [patent_words_short_claim] => 60 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/07/622/07622800.pdf [firstpage_image] =>[orig_patent_app_number] => 11760712 [rel_patent_id] =>[rel_patent_doc_number] =>)
11/760712
Stacked semiconductor packages and method therefor Jun 7, 2007 Issued
Array ( [id] => 4946889 [patent_doc_number] => 20080303015 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2008-12-11 [patent_title] => 'MEMORY HAVING SHARED STORAGE MATERIAL' [patent_app_type] => utility [patent_app_number] => 11/759467 [patent_app_country] => US [patent_app_date] => 2007-06-07 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 15 [patent_figures_cnt] => 15 [patent_no_of_words] => 8023 [patent_no_of_claims] => 30 [patent_no_of_ind_claims] => 5 [patent_words_short_claim] => 0 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] => publications/A1/0303/20080303015.pdf [firstpage_image] =>[orig_patent_app_number] => 11759467 [rel_patent_id] =>[rel_patent_doc_number] =>)
11/759467
MEMORY HAVING SHARED STORAGE MATERIAL Jun 6, 2007 Abandoned
Array ( [id] => 7754761 [patent_doc_number] => 08111865 [patent_country] => US [patent_kind] => B2 [patent_issue_date] => 2012-02-07 [patent_title] => 'Flat panel speaker mounting system' [patent_app_type] => utility [patent_app_number] => 11/810096 [patent_app_country] => US [patent_app_date] => 2007-06-05 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 9 [patent_figures_cnt] => 9 [patent_no_of_words] => 9506 [patent_no_of_claims] => 17 [patent_no_of_ind_claims] => 2 [patent_words_short_claim] => 143 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/08/111/08111865.pdf [firstpage_image] =>[orig_patent_app_number] => 11810096 [rel_patent_id] =>[rel_patent_doc_number] =>)
11/810096
Flat panel speaker mounting system Jun 4, 2007 Issued
Array ( [id] => 4890733 [patent_doc_number] => 20080099830 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2008-05-01 [patent_title] => 'CYLINDRICAL CHANNEL CHARGE TRAPPING DEVICES WITH EFFECTIVELY HIGH COUPLING RATIOS' [patent_app_type] => utility [patent_app_number] => 11/756557 [patent_app_country] => US [patent_app_date] => 2007-05-31 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 11 [patent_figures_cnt] => 11 [patent_no_of_words] => 8059 [patent_no_of_claims] => 47 [patent_no_of_ind_claims] => 4 [patent_words_short_claim] => 0 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] => publications/A1/0099/20080099830.pdf [firstpage_image] =>[orig_patent_app_number] => 11756557 [rel_patent_id] =>[rel_patent_doc_number] =>)
11/756557
Cylindrical channel charge trapping devices with effectively high coupling ratios May 30, 2007 Issued
Array ( [id] => 4708237 [patent_doc_number] => 20080296763 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2008-12-04 [patent_title] => 'Multi-Die Wafer Level Packaging' [patent_app_type] => utility [patent_app_number] => 11/756347 [patent_app_country] => US [patent_app_date] => 2007-05-31 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 7 [patent_figures_cnt] => 7 [patent_no_of_words] => 3940 [patent_no_of_claims] => 20 [patent_no_of_ind_claims] => 4 [patent_words_short_claim] => 0 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] => publications/A1/0296/20080296763.pdf [firstpage_image] =>[orig_patent_app_number] => 11756347 [rel_patent_id] =>[rel_patent_doc_number] =>)
11/756347
Multi-die wafer level packaging May 30, 2007 Issued
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