
Roy Karl Potter
Examiner (ID: 13991, Phone: (571)272-1842 , Office: P/2822 )
| Most Active Art Unit | 2822 |
| Art Unit(s) | 2822, 2508, 2811, 3621 |
| Total Applications | 2584 |
| Issued Applications | 2409 |
| Pending Applications | 46 |
| Abandoned Applications | 141 |
Applications
| Application number | Title of the application | Filing Date | Status |
|---|---|---|---|
Array
(
[id] => 4930431
[patent_doc_number] => 20080001206
[patent_country] => US
[patent_kind] => A1
[patent_issue_date] => 2008-01-03
[patent_title] => 'SEMICONDUCTOR STORAGE DEVICE COMPRISING MIS TRANSISTOR INCLUDING CHARGE STORAGE LAYER'
[patent_app_type] => utility
[patent_app_number] => 11/770415
[patent_app_country] => US
[patent_app_date] => 2007-06-28
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 19
[patent_figures_cnt] => 19
[patent_no_of_words] => 9912
[patent_no_of_claims] => 11
[patent_no_of_ind_claims] => 2
[patent_words_short_claim] => 0
[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => publication
[pdf_file] => publications/A1/0001/20080001206.pdf
[firstpage_image] =>[orig_patent_app_number] => 11770415
[rel_patent_id] =>[rel_patent_doc_number] =>) 11/770415 | Semiconductor storage device comprising MIS transistor including charge storage layer | Jun 27, 2007 | Issued |
Array
(
[id] => 4930463
[patent_doc_number] => 20080001238
[patent_country] => US
[patent_kind] => A1
[patent_issue_date] => 2008-01-03
[patent_title] => 'SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME'
[patent_app_type] => utility
[patent_app_number] => 11/770306
[patent_app_country] => US
[patent_app_date] => 2007-06-28
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 11
[patent_figures_cnt] => 11
[patent_no_of_words] => 5824
[patent_no_of_claims] => 6
[patent_no_of_ind_claims] => 2
[patent_words_short_claim] => 0
[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => publication
[pdf_file] => publications/A1/0001/20080001238.pdf
[firstpage_image] =>[orig_patent_app_number] => 11770306
[rel_patent_id] =>[rel_patent_doc_number] =>) 11/770306 | Semiconductor device and method of manufacturing the same | Jun 27, 2007 | Issued |
Array
(
[id] => 4795253
[patent_doc_number] => 20080006839
[patent_country] => US
[patent_kind] => A1
[patent_issue_date] => 2008-01-10
[patent_title] => 'LIGHT EMITTING DEVICE AND METHOD FOR MANUFACTURING THE SAME'
[patent_app_type] => utility
[patent_app_number] => 11/768396
[patent_app_country] => US
[patent_app_date] => 2007-06-26
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 7
[patent_figures_cnt] => 7
[patent_no_of_words] => 2781
[patent_no_of_claims] => 20
[patent_no_of_ind_claims] => 3
[patent_words_short_claim] => 0
[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => publication
[pdf_file] => publications/A1/0006/20080006839.pdf
[firstpage_image] =>[orig_patent_app_number] => 11768396
[rel_patent_id] =>[rel_patent_doc_number] =>) 11/768396 | LIGHT EMITTING DEVICE AND METHOD FOR MANUFACTURING THE SAME | Jun 25, 2007 | Abandoned |
Array
(
[id] => 5346207
[patent_doc_number] => 20090001568
[patent_country] => US
[patent_kind] => A1
[patent_issue_date] => 2009-01-01
[patent_title] => 'Wafer-level solder bumps'
[patent_app_type] => utility
[patent_app_number] => 11/821867
[patent_app_country] => US
[patent_app_date] => 2007-06-26
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 4
[patent_figures_cnt] => 4
[patent_no_of_words] => 1925
[patent_no_of_claims] => 8
[patent_no_of_ind_claims] => 2
[patent_words_short_claim] => 0
[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => publication
[pdf_file] => publications/A1/0001/20090001568.pdf
[firstpage_image] =>[orig_patent_app_number] => 11821867
[rel_patent_id] =>[rel_patent_doc_number] =>) 11/821867 | Wafer-level solder bumps | Jun 25, 2007 | Issued |
Array
(
[id] => 5210496
[patent_doc_number] => 20070249080
[patent_country] => US
[patent_kind] => A1
[patent_issue_date] => 2007-10-25
[patent_title] => 'Magnetic field sensing device and a fabricating method of the same'
[patent_app_type] => utility
[patent_app_number] => 11/819051
[patent_app_country] => US
[patent_app_date] => 2007-06-25
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 9
[patent_figures_cnt] => 9
[patent_no_of_words] => 4502
[patent_no_of_claims] => 13
[patent_no_of_ind_claims] => 2
[patent_words_short_claim] => 0
[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => publication
[pdf_file] => publications/A1/0249/20070249080.pdf
[firstpage_image] =>[orig_patent_app_number] => 11819051
[rel_patent_id] =>[rel_patent_doc_number] =>) 11/819051 | Magnetic field sensing device and a fabricating method of the same | Jun 24, 2007 | Issued |
Array
(
[id] => 4849631
[patent_doc_number] => 20080315373
[patent_country] => US
[patent_kind] => A1
[patent_issue_date] => 2008-12-25
[patent_title] => 'METHOD OF ENABLING ALIGNMENT OF WAFER IN EXPOSURE STEP OF IC PROCESS AFTER UV-BLOCKING METAL LAYER IS FORMED OVER THE WHOLE WAFER'
[patent_app_type] => utility
[patent_app_number] => 11/768007
[patent_app_country] => US
[patent_app_date] => 2007-06-25
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 3
[patent_figures_cnt] => 3
[patent_no_of_words] => 2724
[patent_no_of_claims] => 24
[patent_no_of_ind_claims] => 3
[patent_words_short_claim] => 0
[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => publication
[pdf_file] => publications/A1/0315/20080315373.pdf
[firstpage_image] =>[orig_patent_app_number] => 11768007
[rel_patent_id] =>[rel_patent_doc_number] =>) 11/768007 | Method of enabling alignment of wafer in exposure step of IC process after UV-blocking metal layer is formed over the whole wafer | Jun 24, 2007 | Issued |
Array
(
[id] => 4800539
[patent_doc_number] => 20080012126
[patent_country] => US
[patent_kind] => A1
[patent_issue_date] => 2008-01-17
[patent_title] => 'Paper including semiconductor device and manufacturing method thereof'
[patent_app_type] => utility
[patent_app_number] => 11/819157
[patent_app_country] => US
[patent_app_date] => 2007-06-25
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 20
[patent_figures_cnt] => 20
[patent_no_of_words] => 15265
[patent_no_of_claims] => 25
[patent_no_of_ind_claims] => 9
[patent_words_short_claim] => 0
[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => publication
[pdf_file] => publications/A1/0012/20080012126.pdf
[firstpage_image] =>[orig_patent_app_number] => 11819157
[rel_patent_id] =>[rel_patent_doc_number] =>) 11/819157 | Paper including semiconductor device and manufacturing method thereof | Jun 24, 2007 | Issued |
Array
(
[id] => 879719
[patent_doc_number] => 07354796
[patent_country] => US
[patent_kind] => B2
[patent_issue_date] => 2008-04-08
[patent_title] => 'Method for fabricating semiconductor package free of substrate'
[patent_app_type] => utility
[patent_app_number] => 11/821269
[patent_app_country] => US
[patent_app_date] => 2007-06-22
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 11
[patent_figures_cnt] => 27
[patent_no_of_words] => 4712
[patent_no_of_claims] => 14
[patent_no_of_ind_claims] => 1
[patent_words_short_claim] => 156
[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => patent
[pdf_file] => patents/07/354/07354796.pdf
[firstpage_image] =>[orig_patent_app_number] => 11821269
[rel_patent_id] =>[rel_patent_doc_number] =>) 11/821269 | Method for fabricating semiconductor package free of substrate | Jun 21, 2007 | Issued |
Array
(
[id] => 285911
[patent_doc_number] => 07550840
[patent_country] => US
[patent_kind] => B2
[patent_issue_date] => 2009-06-23
[patent_title] => 'Apparatus for effecting reliable heat transfer of bare die microelectronic device and method thereof'
[patent_app_type] => utility
[patent_app_number] => 11/766997
[patent_app_country] => US
[patent_app_date] => 2007-06-22
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 3
[patent_figures_cnt] => 3
[patent_no_of_words] => 3028
[patent_no_of_claims] => 11
[patent_no_of_ind_claims] => 3
[patent_words_short_claim] => 65
[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => patent
[pdf_file] => patents/07/550/07550840.pdf
[firstpage_image] =>[orig_patent_app_number] => 11766997
[rel_patent_id] =>[rel_patent_doc_number] =>) 11/766997 | Apparatus for effecting reliable heat transfer of bare die microelectronic device and method thereof | Jun 21, 2007 | Issued |
Array
(
[id] => 4648824
[patent_doc_number] => 20080036079
[patent_country] => US
[patent_kind] => A1
[patent_issue_date] => 2008-02-14
[patent_title] => 'Conductive connection structure formed on the surface of circuit board and manufacturing method thereof'
[patent_app_type] => utility
[patent_app_number] => 11/812407
[patent_app_country] => US
[patent_app_date] => 2007-06-19
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 3
[patent_figures_cnt] => 3
[patent_no_of_words] => 1974
[patent_no_of_claims] => 10
[patent_no_of_ind_claims] => 2
[patent_words_short_claim] => 0
[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => publication
[pdf_file] => publications/A1/0036/20080036079.pdf
[firstpage_image] =>[orig_patent_app_number] => 11812407
[rel_patent_id] =>[rel_patent_doc_number] =>) 11/812407 | Conductive connection structure formed on the surface of circuit board and manufacturing method thereof | Jun 18, 2007 | Abandoned |
Array
(
[id] => 4443761
[patent_doc_number] => 07928567
[patent_country] => US
[patent_kind] => B2
[patent_issue_date] => 2011-04-19
[patent_title] => 'Power supply network'
[patent_app_type] => utility
[patent_app_number] => 12/306898
[patent_app_country] => US
[patent_app_date] => 2007-06-19
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 6
[patent_figures_cnt] => 9
[patent_no_of_words] => 5782
[patent_no_of_claims] => 21
[patent_no_of_ind_claims] => 3
[patent_words_short_claim] => 107
[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => patent
[pdf_file] => patents/07/928/07928567.pdf
[firstpage_image] =>[orig_patent_app_number] => 12306898
[rel_patent_id] =>[rel_patent_doc_number] =>) 12/306898 | Power supply network | Jun 18, 2007 | Issued |
Array
(
[id] => 4795355
[patent_doc_number] => 20080006941
[patent_country] => US
[patent_kind] => A1
[patent_issue_date] => 2008-01-10
[patent_title] => 'Semiconductor package and method of manufacturing the same'
[patent_app_type] => utility
[patent_app_number] => 11/812307
[patent_app_country] => US
[patent_app_date] => 2007-06-18
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 6
[patent_figures_cnt] => 6
[patent_no_of_words] => 2461
[patent_no_of_claims] => 18
[patent_no_of_ind_claims] => 2
[patent_words_short_claim] => 0
[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => publication
[pdf_file] => publications/A1/0006/20080006941.pdf
[firstpage_image] =>[orig_patent_app_number] => 11812307
[rel_patent_id] =>[rel_patent_doc_number] =>) 11/812307 | Semiconductor package and method of manufacturing the same | Jun 17, 2007 | Issued |
Array
(
[id] => 5245175
[patent_doc_number] => 20070241409
[patent_country] => US
[patent_kind] => A1
[patent_issue_date] => 2007-10-18
[patent_title] => 'SEMICONDUCTOR STRUCTURES FOR LATCH-UP SUPPRESSION AND METHODS OF FORMING SUCH SEMICONDUCTOR STRUCTURES'
[patent_app_type] => utility
[patent_app_number] => 11/764571
[patent_app_country] => US
[patent_app_date] => 2007-06-18
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 11
[patent_figures_cnt] => 11
[patent_no_of_words] => 8891
[patent_no_of_claims] => 26
[patent_no_of_ind_claims] => 5
[patent_words_short_claim] => 0
[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => publication
[pdf_file] => publications/A1/0241/20070241409.pdf
[firstpage_image] =>[orig_patent_app_number] => 11764571
[rel_patent_id] =>[rel_patent_doc_number] =>) 11/764571 | Semiconductor structures for latch-up suppression and methods of forming such semiconductor structures | Jun 17, 2007 | Issued |
Array
(
[id] => 4795353
[patent_doc_number] => 20080006939
[patent_country] => US
[patent_kind] => A1
[patent_issue_date] => 2008-01-10
[patent_title] => 'Packaging of hybrib integrated circuits'
[patent_app_type] => utility
[patent_app_number] => 11/820237
[patent_app_country] => US
[patent_app_date] => 2007-06-18
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 5
[patent_figures_cnt] => 5
[patent_no_of_words] => 2462
[patent_no_of_claims] => 15
[patent_no_of_ind_claims] => 2
[patent_words_short_claim] => 0
[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => publication
[pdf_file] => publications/A1/0006/20080006939.pdf
[firstpage_image] =>[orig_patent_app_number] => 11820237
[rel_patent_id] =>[rel_patent_doc_number] =>) 11/820237 | Packaging of hybrid integrated circuits | Jun 17, 2007 | Issued |
Array
(
[id] => 4685683
[patent_doc_number] => 20080029864
[patent_country] => US
[patent_kind] => A1
[patent_issue_date] => 2008-02-07
[patent_title] => 'Package of MEMS device and method for fabricating the same'
[patent_app_type] => utility
[patent_app_number] => 11/808877
[patent_app_country] => US
[patent_app_date] => 2007-06-13
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 23
[patent_figures_cnt] => 23
[patent_no_of_words] => 7586
[patent_no_of_claims] => 29
[patent_no_of_ind_claims] => 2
[patent_words_short_claim] => 0
[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => publication
[pdf_file] => publications/A1/0029/20080029864.pdf
[firstpage_image] =>[orig_patent_app_number] => 11808877
[rel_patent_id] =>[rel_patent_doc_number] =>) 11/808877 | Package of MEMS device and method for fabricating the same | Jun 12, 2007 | Issued |
Array
(
[id] => 211894
[patent_doc_number] => 07622800
[patent_country] => US
[patent_kind] => B2
[patent_issue_date] => 2009-11-24
[patent_title] => 'Stacked semiconductor packages and method therefor'
[patent_app_type] => utility
[patent_app_number] => 11/760712
[patent_app_country] => US
[patent_app_date] => 2007-06-08
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 11
[patent_figures_cnt] => 29
[patent_no_of_words] => 5512
[patent_no_of_claims] => 20
[patent_no_of_ind_claims] => 6
[patent_words_short_claim] => 60
[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => patent
[pdf_file] => patents/07/622/07622800.pdf
[firstpage_image] =>[orig_patent_app_number] => 11760712
[rel_patent_id] =>[rel_patent_doc_number] =>) 11/760712 | Stacked semiconductor packages and method therefor | Jun 7, 2007 | Issued |
Array
(
[id] => 4946889
[patent_doc_number] => 20080303015
[patent_country] => US
[patent_kind] => A1
[patent_issue_date] => 2008-12-11
[patent_title] => 'MEMORY HAVING SHARED STORAGE MATERIAL'
[patent_app_type] => utility
[patent_app_number] => 11/759467
[patent_app_country] => US
[patent_app_date] => 2007-06-07
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 15
[patent_figures_cnt] => 15
[patent_no_of_words] => 8023
[patent_no_of_claims] => 30
[patent_no_of_ind_claims] => 5
[patent_words_short_claim] => 0
[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => publication
[pdf_file] => publications/A1/0303/20080303015.pdf
[firstpage_image] =>[orig_patent_app_number] => 11759467
[rel_patent_id] =>[rel_patent_doc_number] =>) 11/759467 | MEMORY HAVING SHARED STORAGE MATERIAL | Jun 6, 2007 | Abandoned |
Array
(
[id] => 7754761
[patent_doc_number] => 08111865
[patent_country] => US
[patent_kind] => B2
[patent_issue_date] => 2012-02-07
[patent_title] => 'Flat panel speaker mounting system'
[patent_app_type] => utility
[patent_app_number] => 11/810096
[patent_app_country] => US
[patent_app_date] => 2007-06-05
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 9
[patent_figures_cnt] => 9
[patent_no_of_words] => 9506
[patent_no_of_claims] => 17
[patent_no_of_ind_claims] => 2
[patent_words_short_claim] => 143
[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => patent
[pdf_file] => patents/08/111/08111865.pdf
[firstpage_image] =>[orig_patent_app_number] => 11810096
[rel_patent_id] =>[rel_patent_doc_number] =>) 11/810096 | Flat panel speaker mounting system | Jun 4, 2007 | Issued |
Array
(
[id] => 4890733
[patent_doc_number] => 20080099830
[patent_country] => US
[patent_kind] => A1
[patent_issue_date] => 2008-05-01
[patent_title] => 'CYLINDRICAL CHANNEL CHARGE TRAPPING DEVICES WITH EFFECTIVELY HIGH COUPLING RATIOS'
[patent_app_type] => utility
[patent_app_number] => 11/756557
[patent_app_country] => US
[patent_app_date] => 2007-05-31
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 11
[patent_figures_cnt] => 11
[patent_no_of_words] => 8059
[patent_no_of_claims] => 47
[patent_no_of_ind_claims] => 4
[patent_words_short_claim] => 0
[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => publication
[pdf_file] => publications/A1/0099/20080099830.pdf
[firstpage_image] =>[orig_patent_app_number] => 11756557
[rel_patent_id] =>[rel_patent_doc_number] =>) 11/756557 | Cylindrical channel charge trapping devices with effectively high coupling ratios | May 30, 2007 | Issued |
Array
(
[id] => 4708237
[patent_doc_number] => 20080296763
[patent_country] => US
[patent_kind] => A1
[patent_issue_date] => 2008-12-04
[patent_title] => 'Multi-Die Wafer Level Packaging'
[patent_app_type] => utility
[patent_app_number] => 11/756347
[patent_app_country] => US
[patent_app_date] => 2007-05-31
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 7
[patent_figures_cnt] => 7
[patent_no_of_words] => 3940
[patent_no_of_claims] => 20
[patent_no_of_ind_claims] => 4
[patent_words_short_claim] => 0
[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => publication
[pdf_file] => publications/A1/0296/20080296763.pdf
[firstpage_image] =>[orig_patent_app_number] => 11756347
[rel_patent_id] =>[rel_patent_doc_number] =>) 11/756347 | Multi-die wafer level packaging | May 30, 2007 | Issued |