
Roy Karl Potter
Examiner (ID: 13991, Phone: (571)272-1842 , Office: P/2822 )
| Most Active Art Unit | 2822 |
| Art Unit(s) | 2822, 2508, 2811, 3621 |
| Total Applications | 2584 |
| Issued Applications | 2409 |
| Pending Applications | 46 |
| Abandoned Applications | 141 |
Applications
| Application number | Title of the application | Filing Date | Status |
|---|---|---|---|
Array
(
[id] => 5163130
[patent_doc_number] => 20070284711
[patent_country] => US
[patent_kind] => A1
[patent_issue_date] => 2007-12-13
[patent_title] => 'Methods and apparatus for thermal management in a multi-layer embedded chip structure'
[patent_app_type] => utility
[patent_app_number] => 11/450667
[patent_app_country] => US
[patent_app_date] => 2006-06-09
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 5
[patent_figures_cnt] => 5
[patent_no_of_words] => 2849
[patent_no_of_claims] => 20
[patent_no_of_ind_claims] => 3
[patent_words_short_claim] => 0
[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => publication
[pdf_file] => publications/A1/0284/20070284711.pdf
[firstpage_image] =>[orig_patent_app_number] => 11450667
[rel_patent_id] =>[rel_patent_doc_number] =>) 11/450667 | Methods and apparatus for thermal management in a multi-layer embedded chip structure | Jun 8, 2006 | Issued |
Array
(
[id] => 589199
[patent_doc_number] => 07443035
[patent_country] => US
[patent_kind] => B2
[patent_issue_date] => 2008-10-28
[patent_title] => 'Method of forming a penetration electrode and substrate having a penetration electrode'
[patent_app_type] => utility
[patent_app_number] => 11/447257
[patent_app_country] => US
[patent_app_date] => 2006-06-06
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 4
[patent_figures_cnt] => 10
[patent_no_of_words] => 2993
[patent_no_of_claims] => 4
[patent_no_of_ind_claims] => 1
[patent_words_short_claim] => 130
[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => patent
[pdf_file] => patents/07/443/07443035.pdf
[firstpage_image] =>[orig_patent_app_number] => 11447257
[rel_patent_id] =>[rel_patent_doc_number] =>) 11/447257 | Method of forming a penetration electrode and substrate having a penetration electrode | Jun 5, 2006 | Issued |
Array
(
[id] => 370204
[patent_doc_number] => 07476979
[patent_country] => US
[patent_kind] => B2
[patent_issue_date] => 2009-01-13
[patent_title] => 'Chip scale surface mounted device and process of manufacture'
[patent_app_type] => utility
[patent_app_number] => 11/446878
[patent_app_country] => US
[patent_app_date] => 2006-06-05
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 6
[patent_figures_cnt] => 24
[patent_no_of_words] => 3034
[patent_no_of_claims] => 20
[patent_no_of_ind_claims] => 1
[patent_words_short_claim] => 106
[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => patent
[pdf_file] => patents/07/476/07476979.pdf
[firstpage_image] =>[orig_patent_app_number] => 11446878
[rel_patent_id] =>[rel_patent_doc_number] =>) 11/446878 | Chip scale surface mounted device and process of manufacture | Jun 4, 2006 | Issued |
Array
(
[id] => 425487
[patent_doc_number] => 07271470
[patent_country] => US
[patent_kind] => B1
[patent_issue_date] => 2007-09-18
[patent_title] => 'Electronic component having at least two semiconductor power devices'
[patent_app_type] => utility
[patent_app_number] => 11/421297
[patent_app_country] => US
[patent_app_date] => 2006-05-31
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 3
[patent_figures_cnt] => 5
[patent_no_of_words] => 10482
[patent_no_of_claims] => 25
[patent_no_of_ind_claims] => 3
[patent_words_short_claim] => 189
[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => patent
[pdf_file] => patents/07/271/07271470.pdf
[firstpage_image] =>[orig_patent_app_number] => 11421297
[rel_patent_id] =>[rel_patent_doc_number] =>) 11/421297 | Electronic component having at least two semiconductor power devices | May 30, 2006 | Issued |
Array
(
[id] => 5697622
[patent_doc_number] => 20060214306
[patent_country] => US
[patent_kind] => A1
[patent_issue_date] => 2006-09-28
[patent_title] => 'Semiconductor Chip and Method for Manufacturing the Same'
[patent_app_type] => utility
[patent_app_number] => 11/420390
[patent_app_country] => US
[patent_app_date] => 2006-05-25
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 19
[patent_figures_cnt] => 19
[patent_no_of_words] => 17495
[patent_no_of_claims] => 24
[patent_no_of_ind_claims] => 4
[patent_words_short_claim] => 0
[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => publication
[pdf_file] => publications/A1/0214/20060214306.pdf
[firstpage_image] =>[orig_patent_app_number] => 11420390
[rel_patent_id] =>[rel_patent_doc_number] =>) 11/420390 | Semiconductor chip and method manufacturing the same | May 24, 2006 | Issued |
Array
(
[id] => 5163153
[patent_doc_number] => 20070284734
[patent_country] => US
[patent_kind] => A1
[patent_issue_date] => 2007-12-13
[patent_title] => 'Integrated circuit interconnect'
[patent_app_type] => utility
[patent_app_number] => 11/438167
[patent_app_country] => US
[patent_app_date] => 2006-05-22
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 5
[patent_figures_cnt] => 5
[patent_no_of_words] => 3850
[patent_no_of_claims] => 17
[patent_no_of_ind_claims] => 3
[patent_words_short_claim] => 0
[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => publication
[pdf_file] => publications/A1/0284/20070284734.pdf
[firstpage_image] =>[orig_patent_app_number] => 11438167
[rel_patent_id] =>[rel_patent_doc_number] =>) 11/438167 | Integrated circuit interconnect | May 21, 2006 | Issued |
Array
(
[id] => 5217489
[patent_doc_number] => 20070158800
[patent_country] => US
[patent_kind] => A1
[patent_issue_date] => 2007-07-12
[patent_title] => 'Managed memory component'
[patent_app_type] => utility
[patent_app_number] => 11/436957
[patent_app_country] => US
[patent_app_date] => 2006-05-18
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 19
[patent_figures_cnt] => 19
[patent_no_of_words] => 3529
[patent_no_of_claims] => 32
[patent_no_of_ind_claims] => 3
[patent_words_short_claim] => 0
[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => publication
[pdf_file] => publications/A1/0158/20070158800.pdf
[firstpage_image] =>[orig_patent_app_number] => 11436957
[rel_patent_id] =>[rel_patent_doc_number] =>) 11/436957 | Managed memory component | May 17, 2006 | Issued |
Array
(
[id] => 823580
[patent_doc_number] => 07405135
[patent_country] => US
[patent_kind] => B2
[patent_issue_date] => 2008-07-29
[patent_title] => 'Substrate for stressed systems and method of making same'
[patent_app_type] => utility
[patent_app_number] => 11/434930
[patent_app_country] => US
[patent_app_date] => 2006-05-17
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 3
[patent_figures_cnt] => 8
[patent_no_of_words] => 3927
[patent_no_of_claims] => 19
[patent_no_of_ind_claims] => 1
[patent_words_short_claim] => 68
[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => patent
[pdf_file] => patents/07/405/07405135.pdf
[firstpage_image] =>[orig_patent_app_number] => 11434930
[rel_patent_id] =>[rel_patent_doc_number] =>) 11/434930 | Substrate for stressed systems and method of making same | May 16, 2006 | Issued |
Array
(
[id] => 5659243
[patent_doc_number] => 20060249839
[patent_country] => US
[patent_kind] => A1
[patent_issue_date] => 2006-11-09
[patent_title] => 'Semiconductor device and fabrication method thereof'
[patent_app_type] => utility
[patent_app_number] => 11/415067
[patent_app_country] => US
[patent_app_date] => 2006-05-02
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 6
[patent_figures_cnt] => 6
[patent_no_of_words] => 6645
[patent_no_of_claims] => 11
[patent_no_of_ind_claims] => 1
[patent_words_short_claim] => 0
[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => publication
[pdf_file] => publications/A1/0249/20060249839.pdf
[firstpage_image] =>[orig_patent_app_number] => 11415067
[rel_patent_id] =>[rel_patent_doc_number] =>) 11/415067 | Semiconductor device and fabrication method thereof | May 1, 2006 | Issued |
Array
(
[id] => 857362
[patent_doc_number] => 07375416
[patent_country] => US
[patent_kind] => B2
[patent_issue_date] => 2008-05-20
[patent_title] => 'Leadframe enhancement and method of producing a multi-row semiconductor package'
[patent_app_type] => utility
[patent_app_number] => 11/406357
[patent_app_country] => US
[patent_app_date] => 2006-04-19
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 15
[patent_figures_cnt] => 43
[patent_no_of_words] => 3216
[patent_no_of_claims] => 9
[patent_no_of_ind_claims] => 2
[patent_words_short_claim] => 95
[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => patent
[pdf_file] => patents/07/375/07375416.pdf
[firstpage_image] =>[orig_patent_app_number] => 11406357
[rel_patent_id] =>[rel_patent_doc_number] =>) 11/406357 | Leadframe enhancement and method of producing a multi-row semiconductor package | Apr 18, 2006 | Issued |
Array
(
[id] => 326944
[patent_doc_number] => 07514718
[patent_country] => US
[patent_kind] => B2
[patent_issue_date] => 2009-04-07
[patent_title] => 'LED package, manufacturing method thereof, and LED array module using the same'
[patent_app_type] => utility
[patent_app_number] => 11/405567
[patent_app_country] => US
[patent_app_date] => 2006-04-18
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 17
[patent_figures_cnt] => 26
[patent_no_of_words] => 4992
[patent_no_of_claims] => 20
[patent_no_of_ind_claims] => 6
[patent_words_short_claim] => 71
[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => patent
[pdf_file] => patents/07/514/07514718.pdf
[firstpage_image] =>[orig_patent_app_number] => 11405567
[rel_patent_id] =>[rel_patent_doc_number] =>) 11/405567 | LED package, manufacturing method thereof, and LED array module using the same | Apr 17, 2006 | Issued |
Array
(
[id] => 5680937
[patent_doc_number] => 20060197204
[patent_country] => US
[patent_kind] => A1
[patent_issue_date] => 2006-09-07
[patent_title] => 'Semiconductor device'
[patent_app_type] => utility
[patent_app_number] => 11/404135
[patent_app_country] => US
[patent_app_date] => 2006-04-14
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 16
[patent_figures_cnt] => 16
[patent_no_of_words] => 4917
[patent_no_of_claims] => 24
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[patent_current_assignee] =>[type] => publication
[pdf_file] => publications/A1/0197/20060197204.pdf
[firstpage_image] =>[orig_patent_app_number] => 11404135
[rel_patent_id] =>[rel_patent_doc_number] =>) 11/404135 | Semiconductor device | Apr 13, 2006 | Issued |
Array
(
[id] => 5675560
[patent_doc_number] => 20060180915
[patent_country] => US
[patent_kind] => A1
[patent_issue_date] => 2006-08-17
[patent_title] => 'Semiconductor package using terminals formed on a conductive layer of a circuit board'
[patent_app_type] => utility
[patent_app_number] => 11/403383
[patent_app_country] => US
[patent_app_date] => 2006-04-12
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 5
[patent_figures_cnt] => 5
[patent_no_of_words] => 2058
[patent_no_of_claims] => 20
[patent_no_of_ind_claims] => 3
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[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => publication
[pdf_file] => publications/A1/0180/20060180915.pdf
[firstpage_image] =>[orig_patent_app_number] => 11403383
[rel_patent_id] =>[rel_patent_doc_number] =>) 11/403383 | Semiconductor package using terminals formed on a conductive layer of a circuit board | Apr 11, 2006 | Abandoned |
Array
(
[id] => 5675407
[patent_doc_number] => 20060180762
[patent_country] => US
[patent_kind] => A1
[patent_issue_date] => 2006-08-17
[patent_title] => 'Terahertz frequency band wavelength selector'
[patent_app_type] => utility
[patent_app_number] => 11/401717
[patent_app_country] => US
[patent_app_date] => 2006-04-11
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 6
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[patent_no_of_words] => 5647
[patent_no_of_claims] => 11
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[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => publication
[pdf_file] => publications/A1/0180/20060180762.pdf
[firstpage_image] =>[orig_patent_app_number] => 11401717
[rel_patent_id] =>[rel_patent_doc_number] =>) 11/401717 | Terahertz frequency band wavelength selector | Apr 10, 2006 | Issued |
Array
(
[id] => 229235
[patent_doc_number] => 07602050
[patent_country] => US
[patent_kind] => B2
[patent_issue_date] => 2009-10-13
[patent_title] => 'Integrated circuit packaging'
[patent_app_type] => utility
[patent_app_number] => 11/399017
[patent_app_country] => US
[patent_app_date] => 2006-04-05
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 5
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[patent_no_of_words] => 5769
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[patent_current_assignee] =>[type] => patent
[pdf_file] => patents/07/602/07602050.pdf
[firstpage_image] =>[orig_patent_app_number] => 11399017
[rel_patent_id] =>[rel_patent_doc_number] =>) 11/399017 | Integrated circuit packaging | Apr 4, 2006 | Issued |
Array
(
[id] => 889184
[patent_doc_number] => 07348677
[patent_country] => US
[patent_kind] => B2
[patent_issue_date] => 2008-03-25
[patent_title] => 'Method of providing printed circuit board with conductive holes and board resulting therefrom'
[patent_app_type] => utility
[patent_app_number] => 11/397713
[patent_app_country] => US
[patent_app_date] => 2006-04-05
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 3
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[patent_no_of_words] => 5075
[patent_no_of_claims] => 16
[patent_no_of_ind_claims] => 2
[patent_words_short_claim] => 236
[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => patent
[pdf_file] => patents/07/348/07348677.pdf
[firstpage_image] =>[orig_patent_app_number] => 11397713
[rel_patent_id] =>[rel_patent_doc_number] =>) 11/397713 | Method of providing printed circuit board with conductive holes and board resulting therefrom | Apr 4, 2006 | Issued |
Array
(
[id] => 8234506
[patent_doc_number] => 08199959
[patent_country] => US
[patent_kind] => B2
[patent_issue_date] => 2012-06-12
[patent_title] => 'Card-type device and method for manufacturing same'
[patent_app_type] => utility
[patent_app_number] => 11/813447
[patent_app_country] => US
[patent_app_date] => 2006-03-31
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 7
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[patent_no_of_words] => 8360
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[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => patent
[pdf_file] => patents/08/199/08199959.pdf
[firstpage_image] =>[orig_patent_app_number] => 11813447
[rel_patent_id] =>[rel_patent_doc_number] =>) 11/813447 | Card-type device and method for manufacturing same | Mar 30, 2006 | Issued |
Array
(
[id] => 7601420
[patent_doc_number] => 07385285
[patent_country] => US
[patent_kind] => B2
[patent_issue_date] => 2008-06-10
[patent_title] => 'Light assembly'
[patent_app_type] => utility
[patent_app_number] => 11/392417
[patent_app_country] => US
[patent_app_date] => 2006-03-29
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 4
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[patent_current_assignee] =>[type] => patent
[pdf_file] => patents/07/385/07385285.pdf
[firstpage_image] =>[orig_patent_app_number] => 11392417
[rel_patent_id] =>[rel_patent_doc_number] =>) 11/392417 | Light assembly | Mar 28, 2006 | Issued |
| 11/386115 | Interconnector line of thin film, sputter target for forming the wiring film and electronic component using the same | Mar 21, 2006 | Abandoned |
| 11/386114 | Interconnector line of thin film, sputter target for forming the wiring film and electronic component using the same | Mar 21, 2006 | Abandoned |