Search

Roy Karl Potter

Examiner (ID: 13991, Phone: (571)272-1842 , Office: P/2822 )

Most Active Art Unit
2822
Art Unit(s)
2822, 2508, 2811, 3621
Total Applications
2584
Issued Applications
2409
Pending Applications
46
Abandoned Applications
141

Applications

Application numberTitle of the applicationFiling DateStatus
Array ( [id] => 5163130 [patent_doc_number] => 20070284711 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2007-12-13 [patent_title] => 'Methods and apparatus for thermal management in a multi-layer embedded chip structure' [patent_app_type] => utility [patent_app_number] => 11/450667 [patent_app_country] => US [patent_app_date] => 2006-06-09 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 5 [patent_figures_cnt] => 5 [patent_no_of_words] => 2849 [patent_no_of_claims] => 20 [patent_no_of_ind_claims] => 3 [patent_words_short_claim] => 0 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] => publications/A1/0284/20070284711.pdf [firstpage_image] =>[orig_patent_app_number] => 11450667 [rel_patent_id] =>[rel_patent_doc_number] =>)
11/450667
Methods and apparatus for thermal management in a multi-layer embedded chip structure Jun 8, 2006 Issued
Array ( [id] => 589199 [patent_doc_number] => 07443035 [patent_country] => US [patent_kind] => B2 [patent_issue_date] => 2008-10-28 [patent_title] => 'Method of forming a penetration electrode and substrate having a penetration electrode' [patent_app_type] => utility [patent_app_number] => 11/447257 [patent_app_country] => US [patent_app_date] => 2006-06-06 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 4 [patent_figures_cnt] => 10 [patent_no_of_words] => 2993 [patent_no_of_claims] => 4 [patent_no_of_ind_claims] => 1 [patent_words_short_claim] => 130 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/07/443/07443035.pdf [firstpage_image] =>[orig_patent_app_number] => 11447257 [rel_patent_id] =>[rel_patent_doc_number] =>)
11/447257
Method of forming a penetration electrode and substrate having a penetration electrode Jun 5, 2006 Issued
Array ( [id] => 370204 [patent_doc_number] => 07476979 [patent_country] => US [patent_kind] => B2 [patent_issue_date] => 2009-01-13 [patent_title] => 'Chip scale surface mounted device and process of manufacture' [patent_app_type] => utility [patent_app_number] => 11/446878 [patent_app_country] => US [patent_app_date] => 2006-06-05 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 6 [patent_figures_cnt] => 24 [patent_no_of_words] => 3034 [patent_no_of_claims] => 20 [patent_no_of_ind_claims] => 1 [patent_words_short_claim] => 106 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/07/476/07476979.pdf [firstpage_image] =>[orig_patent_app_number] => 11446878 [rel_patent_id] =>[rel_patent_doc_number] =>)
11/446878
Chip scale surface mounted device and process of manufacture Jun 4, 2006 Issued
Array ( [id] => 425487 [patent_doc_number] => 07271470 [patent_country] => US [patent_kind] => B1 [patent_issue_date] => 2007-09-18 [patent_title] => 'Electronic component having at least two semiconductor power devices' [patent_app_type] => utility [patent_app_number] => 11/421297 [patent_app_country] => US [patent_app_date] => 2006-05-31 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 3 [patent_figures_cnt] => 5 [patent_no_of_words] => 10482 [patent_no_of_claims] => 25 [patent_no_of_ind_claims] => 3 [patent_words_short_claim] => 189 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/07/271/07271470.pdf [firstpage_image] =>[orig_patent_app_number] => 11421297 [rel_patent_id] =>[rel_patent_doc_number] =>)
11/421297
Electronic component having at least two semiconductor power devices May 30, 2006 Issued
Array ( [id] => 5697622 [patent_doc_number] => 20060214306 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2006-09-28 [patent_title] => 'Semiconductor Chip and Method for Manufacturing the Same' [patent_app_type] => utility [patent_app_number] => 11/420390 [patent_app_country] => US [patent_app_date] => 2006-05-25 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 19 [patent_figures_cnt] => 19 [patent_no_of_words] => 17495 [patent_no_of_claims] => 24 [patent_no_of_ind_claims] => 4 [patent_words_short_claim] => 0 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] => publications/A1/0214/20060214306.pdf [firstpage_image] =>[orig_patent_app_number] => 11420390 [rel_patent_id] =>[rel_patent_doc_number] =>)
11/420390
Semiconductor chip and method manufacturing the same May 24, 2006 Issued
Array ( [id] => 5163153 [patent_doc_number] => 20070284734 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2007-12-13 [patent_title] => 'Integrated circuit interconnect' [patent_app_type] => utility [patent_app_number] => 11/438167 [patent_app_country] => US [patent_app_date] => 2006-05-22 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 5 [patent_figures_cnt] => 5 [patent_no_of_words] => 3850 [patent_no_of_claims] => 17 [patent_no_of_ind_claims] => 3 [patent_words_short_claim] => 0 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] => publications/A1/0284/20070284734.pdf [firstpage_image] =>[orig_patent_app_number] => 11438167 [rel_patent_id] =>[rel_patent_doc_number] =>)
11/438167
Integrated circuit interconnect May 21, 2006 Issued
Array ( [id] => 5217489 [patent_doc_number] => 20070158800 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2007-07-12 [patent_title] => 'Managed memory component' [patent_app_type] => utility [patent_app_number] => 11/436957 [patent_app_country] => US [patent_app_date] => 2006-05-18 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 19 [patent_figures_cnt] => 19 [patent_no_of_words] => 3529 [patent_no_of_claims] => 32 [patent_no_of_ind_claims] => 3 [patent_words_short_claim] => 0 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] => publications/A1/0158/20070158800.pdf [firstpage_image] =>[orig_patent_app_number] => 11436957 [rel_patent_id] =>[rel_patent_doc_number] =>)
11/436957
Managed memory component May 17, 2006 Issued
Array ( [id] => 823580 [patent_doc_number] => 07405135 [patent_country] => US [patent_kind] => B2 [patent_issue_date] => 2008-07-29 [patent_title] => 'Substrate for stressed systems and method of making same' [patent_app_type] => utility [patent_app_number] => 11/434930 [patent_app_country] => US [patent_app_date] => 2006-05-17 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 3 [patent_figures_cnt] => 8 [patent_no_of_words] => 3927 [patent_no_of_claims] => 19 [patent_no_of_ind_claims] => 1 [patent_words_short_claim] => 68 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/07/405/07405135.pdf [firstpage_image] =>[orig_patent_app_number] => 11434930 [rel_patent_id] =>[rel_patent_doc_number] =>)
11/434930
Substrate for stressed systems and method of making same May 16, 2006 Issued
Array ( [id] => 5659243 [patent_doc_number] => 20060249839 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2006-11-09 [patent_title] => 'Semiconductor device and fabrication method thereof' [patent_app_type] => utility [patent_app_number] => 11/415067 [patent_app_country] => US [patent_app_date] => 2006-05-02 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 6 [patent_figures_cnt] => 6 [patent_no_of_words] => 6645 [patent_no_of_claims] => 11 [patent_no_of_ind_claims] => 1 [patent_words_short_claim] => 0 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] => publications/A1/0249/20060249839.pdf [firstpage_image] =>[orig_patent_app_number] => 11415067 [rel_patent_id] =>[rel_patent_doc_number] =>)
11/415067
Semiconductor device and fabrication method thereof May 1, 2006 Issued
Array ( [id] => 857362 [patent_doc_number] => 07375416 [patent_country] => US [patent_kind] => B2 [patent_issue_date] => 2008-05-20 [patent_title] => 'Leadframe enhancement and method of producing a multi-row semiconductor package' [patent_app_type] => utility [patent_app_number] => 11/406357 [patent_app_country] => US [patent_app_date] => 2006-04-19 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 15 [patent_figures_cnt] => 43 [patent_no_of_words] => 3216 [patent_no_of_claims] => 9 [patent_no_of_ind_claims] => 2 [patent_words_short_claim] => 95 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/07/375/07375416.pdf [firstpage_image] =>[orig_patent_app_number] => 11406357 [rel_patent_id] =>[rel_patent_doc_number] =>)
11/406357
Leadframe enhancement and method of producing a multi-row semiconductor package Apr 18, 2006 Issued
Array ( [id] => 326944 [patent_doc_number] => 07514718 [patent_country] => US [patent_kind] => B2 [patent_issue_date] => 2009-04-07 [patent_title] => 'LED package, manufacturing method thereof, and LED array module using the same' [patent_app_type] => utility [patent_app_number] => 11/405567 [patent_app_country] => US [patent_app_date] => 2006-04-18 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 17 [patent_figures_cnt] => 26 [patent_no_of_words] => 4992 [patent_no_of_claims] => 20 [patent_no_of_ind_claims] => 6 [patent_words_short_claim] => 71 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/07/514/07514718.pdf [firstpage_image] =>[orig_patent_app_number] => 11405567 [rel_patent_id] =>[rel_patent_doc_number] =>)
11/405567
LED package, manufacturing method thereof, and LED array module using the same Apr 17, 2006 Issued
Array ( [id] => 5680937 [patent_doc_number] => 20060197204 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2006-09-07 [patent_title] => 'Semiconductor device' [patent_app_type] => utility [patent_app_number] => 11/404135 [patent_app_country] => US [patent_app_date] => 2006-04-14 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 16 [patent_figures_cnt] => 16 [patent_no_of_words] => 4917 [patent_no_of_claims] => 24 [patent_no_of_ind_claims] => 4 [patent_words_short_claim] => 0 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] => publications/A1/0197/20060197204.pdf [firstpage_image] =>[orig_patent_app_number] => 11404135 [rel_patent_id] =>[rel_patent_doc_number] =>)
11/404135
Semiconductor device Apr 13, 2006 Issued
Array ( [id] => 5675560 [patent_doc_number] => 20060180915 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2006-08-17 [patent_title] => 'Semiconductor package using terminals formed on a conductive layer of a circuit board' [patent_app_type] => utility [patent_app_number] => 11/403383 [patent_app_country] => US [patent_app_date] => 2006-04-12 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 5 [patent_figures_cnt] => 5 [patent_no_of_words] => 2058 [patent_no_of_claims] => 20 [patent_no_of_ind_claims] => 3 [patent_words_short_claim] => 0 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] => publications/A1/0180/20060180915.pdf [firstpage_image] =>[orig_patent_app_number] => 11403383 [rel_patent_id] =>[rel_patent_doc_number] =>)
11/403383
Semiconductor package using terminals formed on a conductive layer of a circuit board Apr 11, 2006 Abandoned
Array ( [id] => 5675407 [patent_doc_number] => 20060180762 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2006-08-17 [patent_title] => 'Terahertz frequency band wavelength selector' [patent_app_type] => utility [patent_app_number] => 11/401717 [patent_app_country] => US [patent_app_date] => 2006-04-11 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 6 [patent_figures_cnt] => 6 [patent_no_of_words] => 5647 [patent_no_of_claims] => 11 [patent_no_of_ind_claims] => 1 [patent_words_short_claim] => 0 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] => publications/A1/0180/20060180762.pdf [firstpage_image] =>[orig_patent_app_number] => 11401717 [rel_patent_id] =>[rel_patent_doc_number] =>)
11/401717
Terahertz frequency band wavelength selector Apr 10, 2006 Issued
Array ( [id] => 229235 [patent_doc_number] => 07602050 [patent_country] => US [patent_kind] => B2 [patent_issue_date] => 2009-10-13 [patent_title] => 'Integrated circuit packaging' [patent_app_type] => utility [patent_app_number] => 11/399017 [patent_app_country] => US [patent_app_date] => 2006-04-05 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 5 [patent_figures_cnt] => 5 [patent_no_of_words] => 5769 [patent_no_of_claims] => 29 [patent_no_of_ind_claims] => 3 [patent_words_short_claim] => 167 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/07/602/07602050.pdf [firstpage_image] =>[orig_patent_app_number] => 11399017 [rel_patent_id] =>[rel_patent_doc_number] =>)
11/399017
Integrated circuit packaging Apr 4, 2006 Issued
Array ( [id] => 889184 [patent_doc_number] => 07348677 [patent_country] => US [patent_kind] => B2 [patent_issue_date] => 2008-03-25 [patent_title] => 'Method of providing printed circuit board with conductive holes and board resulting therefrom' [patent_app_type] => utility [patent_app_number] => 11/397713 [patent_app_country] => US [patent_app_date] => 2006-04-05 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 3 [patent_figures_cnt] => 9 [patent_no_of_words] => 5075 [patent_no_of_claims] => 16 [patent_no_of_ind_claims] => 2 [patent_words_short_claim] => 236 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/07/348/07348677.pdf [firstpage_image] =>[orig_patent_app_number] => 11397713 [rel_patent_id] =>[rel_patent_doc_number] =>)
11/397713
Method of providing printed circuit board with conductive holes and board resulting therefrom Apr 4, 2006 Issued
Array ( [id] => 8234506 [patent_doc_number] => 08199959 [patent_country] => US [patent_kind] => B2 [patent_issue_date] => 2012-06-12 [patent_title] => 'Card-type device and method for manufacturing same' [patent_app_type] => utility [patent_app_number] => 11/813447 [patent_app_country] => US [patent_app_date] => 2006-03-31 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 7 [patent_figures_cnt] => 23 [patent_no_of_words] => 8360 [patent_no_of_claims] => 4 [patent_no_of_ind_claims] => 1 [patent_words_short_claim] => 68 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/08/199/08199959.pdf [firstpage_image] =>[orig_patent_app_number] => 11813447 [rel_patent_id] =>[rel_patent_doc_number] =>)
11/813447
Card-type device and method for manufacturing same Mar 30, 2006 Issued
Array ( [id] => 7601420 [patent_doc_number] => 07385285 [patent_country] => US [patent_kind] => B2 [patent_issue_date] => 2008-06-10 [patent_title] => 'Light assembly' [patent_app_type] => utility [patent_app_number] => 11/392417 [patent_app_country] => US [patent_app_date] => 2006-03-29 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 4 [patent_figures_cnt] => 7 [patent_no_of_words] => 1962 [patent_no_of_claims] => 7 [patent_no_of_ind_claims] => 1 [patent_words_short_claim] => 95 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/07/385/07385285.pdf [firstpage_image] =>[orig_patent_app_number] => 11392417 [rel_patent_id] =>[rel_patent_doc_number] =>)
11/392417
Light assembly Mar 28, 2006 Issued
11/386115 Interconnector line of thin film, sputter target for forming the wiring film and electronic component using the same Mar 21, 2006 Abandoned
11/386114 Interconnector line of thin film, sputter target for forming the wiring film and electronic component using the same Mar 21, 2006 Abandoned
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