
Roy Karl Potter
Examiner (ID: 13991, Phone: (571)272-1842 , Office: P/2822 )
| Most Active Art Unit | 2822 |
| Art Unit(s) | 2822, 2508, 2811, 3621 |
| Total Applications | 2584 |
| Issued Applications | 2409 |
| Pending Applications | 46 |
| Abandoned Applications | 141 |
Applications
| Application number | Title of the application | Filing Date | Status |
|---|---|---|---|
Array
(
[id] => 5838312
[patent_doc_number] => 20060118970
[patent_country] => US
[patent_kind] => A1
[patent_issue_date] => 2006-06-08
[patent_title] => 'Semiconductor device, its manufacturing method, and radio communication device'
[patent_app_type] => utility
[patent_app_number] => 11/326341
[patent_app_country] => US
[patent_app_date] => 2006-01-06
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 18
[patent_figures_cnt] => 18
[patent_no_of_words] => 13636
[patent_no_of_claims] => 31
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[patent_current_assignee] =>[type] => publication
[pdf_file] => publications/A1/0118/20060118970.pdf
[firstpage_image] =>[orig_patent_app_number] => 11326341
[rel_patent_id] =>[rel_patent_doc_number] =>) 11/326341 | Semiconductor device, its manufacturing method, and radio communication device | Jan 5, 2006 | Issued |
Array
(
[id] => 923301
[patent_doc_number] => 07319273
[patent_country] => US
[patent_kind] => B2
[patent_issue_date] => 2008-01-15
[patent_title] => 'Methods and apparatus for a flexible circuit interposer'
[patent_app_type] => utility
[patent_app_number] => 11/306657
[patent_app_country] => US
[patent_app_date] => 2006-01-05
[patent_effective_date] => 0000-00-00
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[pdf_file] => patents/07/319/07319273.pdf
[firstpage_image] =>[orig_patent_app_number] => 11306657
[rel_patent_id] =>[rel_patent_doc_number] =>) 11/306657 | Methods and apparatus for a flexible circuit interposer | Jan 4, 2006 | Issued |
Array
(
[id] => 5217522
[patent_doc_number] => 20070158833
[patent_country] => US
[patent_kind] => A1
[patent_issue_date] => 2007-07-12
[patent_title] => 'INTEGRATED CIRCUIT PACKAGE SYSTEM INCLUDING STACKED DIE'
[patent_app_type] => utility
[patent_app_number] => 11/306627
[patent_app_country] => US
[patent_app_date] => 2006-01-04
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 4
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[pdf_file] => publications/A1/0158/20070158833.pdf
[firstpage_image] =>[orig_patent_app_number] => 11306627
[rel_patent_id] =>[rel_patent_doc_number] =>) 11/306627 | Integrated circuit package system including stacked die | Jan 3, 2006 | Issued |
Array
(
[id] => 5188568
[patent_doc_number] => 20070166876
[patent_country] => US
[patent_kind] => A1
[patent_issue_date] => 2007-07-19
[patent_title] => 'Components, methods and assemblies for multi-chip packages'
[patent_app_type] => utility
[patent_app_number] => 11/324453
[patent_app_country] => US
[patent_app_date] => 2006-01-03
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 13
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[patent_no_of_words] => 5805
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[firstpage_image] =>[orig_patent_app_number] => 11324453
[rel_patent_id] =>[rel_patent_doc_number] =>) 11/324453 | Components, methods and assemblies for multi-chip packages | Jan 2, 2006 | Abandoned |
Array
(
[id] => 5628798
[patent_doc_number] => 20060145266
[patent_country] => US
[patent_kind] => A1
[patent_issue_date] => 2006-07-06
[patent_title] => 'Semiconductor integrated circuit'
[patent_app_type] => utility
[patent_app_number] => 11/322377
[patent_app_country] => US
[patent_app_date] => 2006-01-03
[patent_effective_date] => 0000-00-00
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[firstpage_image] =>[orig_patent_app_number] => 11322377
[rel_patent_id] =>[rel_patent_doc_number] =>) 11/322377 | Semiconductor integrated circuit | Jan 2, 2006 | Abandoned |
Array
(
[id] => 840720
[patent_doc_number] => 07391051
[patent_country] => US
[patent_kind] => B2
[patent_issue_date] => 2008-06-24
[patent_title] => 'Semiconductor device forming method'
[patent_app_type] => utility
[patent_app_number] => 11/321640
[patent_app_country] => US
[patent_app_date] => 2005-12-30
[patent_effective_date] => 0000-00-00
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[pdf_file] => patents/07/391/07391051.pdf
[firstpage_image] =>[orig_patent_app_number] => 11321640
[rel_patent_id] =>[rel_patent_doc_number] =>) 11/321640 | Semiconductor device forming method | Dec 29, 2005 | Issued |
Array
(
[id] => 586267
[patent_doc_number] => 07449779
[patent_country] => US
[patent_kind] => B2
[patent_issue_date] => 2008-11-11
[patent_title] => 'Wire bonded wafer level cavity package'
[patent_app_type] => utility
[patent_app_number] => 11/322617
[patent_app_country] => US
[patent_app_date] => 2005-12-30
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 17
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[pdf_file] => patents/07/449/07449779.pdf
[firstpage_image] =>[orig_patent_app_number] => 11322617
[rel_patent_id] =>[rel_patent_doc_number] =>) 11/322617 | Wire bonded wafer level cavity package | Dec 29, 2005 | Issued |
Array
(
[id] => 5217543
[patent_doc_number] => 20070158854
[patent_country] => US
[patent_kind] => A1
[patent_issue_date] => 2007-07-12
[patent_title] => 'Laser ablation and imprinting hybrid processing for fabrication of high density interconnect flip chip substrates'
[patent_app_type] => utility
[patent_app_number] => 11/319997
[patent_app_country] => US
[patent_app_date] => 2005-12-27
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 3
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[patent_no_of_words] => 1971
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[pdf_file] => publications/A1/0158/20070158854.pdf
[firstpage_image] =>[orig_patent_app_number] => 11319997
[rel_patent_id] =>[rel_patent_doc_number] =>) 11/319997 | Laser ablation and imprinting hybrid processing for fabrication of high density interconnect flip chip substrates | Dec 26, 2005 | Issued |
Array
(
[id] => 881027
[patent_doc_number] => 07355209
[patent_country] => US
[patent_kind] => B2
[patent_issue_date] => 2008-04-08
[patent_title] => 'Light emitting diode and method making the same'
[patent_app_type] => utility
[patent_app_number] => 11/316437
[patent_app_country] => US
[patent_app_date] => 2005-12-22
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 5
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[pdf_file] => patents/07/355/07355209.pdf
[firstpage_image] =>[orig_patent_app_number] => 11316437
[rel_patent_id] =>[rel_patent_doc_number] =>) 11/316437 | Light emitting diode and method making the same | Dec 21, 2005 | Issued |
Array
(
[id] => 5652880
[patent_doc_number] => 20060138615
[patent_country] => US
[patent_kind] => A1
[patent_issue_date] => 2006-06-29
[patent_title] => 'Semiconductor package and lead frame therefor'
[patent_app_type] => utility
[patent_app_number] => 11/312597
[patent_app_country] => US
[patent_app_date] => 2005-12-21
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 14
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[pdf_file] => publications/A1/0138/20060138615.pdf
[firstpage_image] =>[orig_patent_app_number] => 11312597
[rel_patent_id] =>[rel_patent_doc_number] =>) 11/312597 | Semiconductor package and lead frame therefor | Dec 20, 2005 | Issued |
Array
(
[id] => 415520
[patent_doc_number] => 07279705
[patent_country] => US
[patent_kind] => B2
[patent_issue_date] => 2007-10-09
[patent_title] => 'Organic light-emitting device'
[patent_app_type] => utility
[patent_app_number] => 11/314895
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[pdf_file] => patents/07/279/07279705.pdf
[firstpage_image] =>[orig_patent_app_number] => 11314895
[rel_patent_id] =>[rel_patent_doc_number] =>) 11/314895 | Organic light-emitting device | Dec 19, 2005 | Issued |
Array
(
[id] => 873323
[patent_doc_number] => 07361982
[patent_country] => US
[patent_kind] => B2
[patent_issue_date] => 2008-04-22
[patent_title] => 'Bumpless chip package'
[patent_app_type] => utility
[patent_app_number] => 11/314787
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[firstpage_image] =>[orig_patent_app_number] => 11314787
[rel_patent_id] =>[rel_patent_doc_number] =>) 11/314787 | Bumpless chip package | Dec 18, 2005 | Issued |
Array
(
[id] => 5116907
[patent_doc_number] => 20070138621
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[patent_title] => 'Low temperature phase change thermal interface material dam'
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[firstpage_image] =>[orig_patent_app_number] => 11305527
[rel_patent_id] =>[rel_patent_doc_number] =>) 11/305527 | Low temperature phase change thermal interface material dam | Dec 15, 2005 | Issued |
Array
(
[id] => 5038216
[patent_doc_number] => 20070090498
[patent_country] => US
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[patent_issue_date] => 2007-04-26
[patent_title] => 'Stack type semiconductor package module utilizing solder coated stacking protrusions and method for manufacturing the same'
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[rel_patent_id] =>[rel_patent_doc_number] =>) 11/304047 | Stack type semiconductor package module utilizing solder coated stacking protrusions and method for manufacturing the same | Dec 14, 2005 | Issued |
Array
(
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[patent_doc_number] => 20070132086
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[patent_title] => 'Integrated circuit devices including compliant material under bond pads and methods of fabrication'
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Array
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[id] => 383396
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[patent_title] => 'Semiconductor components having through wire interconnects (TWI)'
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Array
(
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[patent_title] => 'Conductor board and method for producing a conductor board'
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Array
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