Search

Roy Karl Potter

Examiner (ID: 13991, Phone: (571)272-1842 , Office: P/2822 )

Most Active Art Unit
2822
Art Unit(s)
2822, 2508, 2811, 3621
Total Applications
2584
Issued Applications
2409
Pending Applications
46
Abandoned Applications
141

Applications

Application numberTitle of the applicationFiling DateStatus
Array ( [id] => 5838312 [patent_doc_number] => 20060118970 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2006-06-08 [patent_title] => 'Semiconductor device, its manufacturing method, and radio communication device' [patent_app_type] => utility [patent_app_number] => 11/326341 [patent_app_country] => US [patent_app_date] => 2006-01-06 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 18 [patent_figures_cnt] => 18 [patent_no_of_words] => 13636 [patent_no_of_claims] => 31 [patent_no_of_ind_claims] => 3 [patent_words_short_claim] => 0 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] => publications/A1/0118/20060118970.pdf [firstpage_image] =>[orig_patent_app_number] => 11326341 [rel_patent_id] =>[rel_patent_doc_number] =>)
11/326341
Semiconductor device, its manufacturing method, and radio communication device Jan 5, 2006 Issued
Array ( [id] => 923301 [patent_doc_number] => 07319273 [patent_country] => US [patent_kind] => B2 [patent_issue_date] => 2008-01-15 [patent_title] => 'Methods and apparatus for a flexible circuit interposer' [patent_app_type] => utility [patent_app_number] => 11/306657 [patent_app_country] => US [patent_app_date] => 2006-01-05 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 5 [patent_figures_cnt] => 6 [patent_no_of_words] => 2958 [patent_no_of_claims] => 61 [patent_no_of_ind_claims] => 4 [patent_words_short_claim] => 144 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/07/319/07319273.pdf [firstpage_image] =>[orig_patent_app_number] => 11306657 [rel_patent_id] =>[rel_patent_doc_number] =>)
11/306657
Methods and apparatus for a flexible circuit interposer Jan 4, 2006 Issued
Array ( [id] => 5217522 [patent_doc_number] => 20070158833 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2007-07-12 [patent_title] => 'INTEGRATED CIRCUIT PACKAGE SYSTEM INCLUDING STACKED DIE' [patent_app_type] => utility [patent_app_number] => 11/306627 [patent_app_country] => US [patent_app_date] => 2006-01-04 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 4 [patent_figures_cnt] => 4 [patent_no_of_words] => 2554 [patent_no_of_claims] => 20 [patent_no_of_ind_claims] => 2 [patent_words_short_claim] => 0 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] => publications/A1/0158/20070158833.pdf [firstpage_image] =>[orig_patent_app_number] => 11306627 [rel_patent_id] =>[rel_patent_doc_number] =>)
11/306627
Integrated circuit package system including stacked die Jan 3, 2006 Issued
Array ( [id] => 5188568 [patent_doc_number] => 20070166876 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2007-07-19 [patent_title] => 'Components, methods and assemblies for multi-chip packages' [patent_app_type] => utility [patent_app_number] => 11/324453 [patent_app_country] => US [patent_app_date] => 2006-01-03 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 13 [patent_figures_cnt] => 13 [patent_no_of_words] => 5805 [patent_no_of_claims] => 5 [patent_no_of_ind_claims] => 1 [patent_words_short_claim] => 0 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] => publications/A1/0166/20070166876.pdf [firstpage_image] =>[orig_patent_app_number] => 11324453 [rel_patent_id] =>[rel_patent_doc_number] =>)
11/324453
Components, methods and assemblies for multi-chip packages Jan 2, 2006 Abandoned
Array ( [id] => 5628798 [patent_doc_number] => 20060145266 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2006-07-06 [patent_title] => 'Semiconductor integrated circuit' [patent_app_type] => utility [patent_app_number] => 11/322377 [patent_app_country] => US [patent_app_date] => 2006-01-03 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 10 [patent_figures_cnt] => 10 [patent_no_of_words] => 6279 [patent_no_of_claims] => 11 [patent_no_of_ind_claims] => 5 [patent_words_short_claim] => 0 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] => publications/A1/0145/20060145266.pdf [firstpage_image] =>[orig_patent_app_number] => 11322377 [rel_patent_id] =>[rel_patent_doc_number] =>)
11/322377
Semiconductor integrated circuit Jan 2, 2006 Abandoned
Array ( [id] => 840720 [patent_doc_number] => 07391051 [patent_country] => US [patent_kind] => B2 [patent_issue_date] => 2008-06-24 [patent_title] => 'Semiconductor device forming method' [patent_app_type] => utility [patent_app_number] => 11/321640 [patent_app_country] => US [patent_app_date] => 2005-12-30 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 8 [patent_figures_cnt] => 30 [patent_no_of_words] => 11378 [patent_no_of_claims] => 17 [patent_no_of_ind_claims] => 6 [patent_words_short_claim] => 73 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/07/391/07391051.pdf [firstpage_image] =>[orig_patent_app_number] => 11321640 [rel_patent_id] =>[rel_patent_doc_number] =>)
11/321640
Semiconductor device forming method Dec 29, 2005 Issued
Array ( [id] => 586267 [patent_doc_number] => 07449779 [patent_country] => US [patent_kind] => B2 [patent_issue_date] => 2008-11-11 [patent_title] => 'Wire bonded wafer level cavity package' [patent_app_type] => utility [patent_app_number] => 11/322617 [patent_app_country] => US [patent_app_date] => 2005-12-30 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 17 [patent_figures_cnt] => 40 [patent_no_of_words] => 11016 [patent_no_of_claims] => 27 [patent_no_of_ind_claims] => 4 [patent_words_short_claim] => 115 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/07/449/07449779.pdf [firstpage_image] =>[orig_patent_app_number] => 11322617 [rel_patent_id] =>[rel_patent_doc_number] =>)
11/322617
Wire bonded wafer level cavity package Dec 29, 2005 Issued
Array ( [id] => 5217543 [patent_doc_number] => 20070158854 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2007-07-12 [patent_title] => 'Laser ablation and imprinting hybrid processing for fabrication of high density interconnect flip chip substrates' [patent_app_type] => utility [patent_app_number] => 11/319997 [patent_app_country] => US [patent_app_date] => 2005-12-27 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 3 [patent_figures_cnt] => 3 [patent_no_of_words] => 1971 [patent_no_of_claims] => 20 [patent_no_of_ind_claims] => 4 [patent_words_short_claim] => 0 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] => publications/A1/0158/20070158854.pdf [firstpage_image] =>[orig_patent_app_number] => 11319997 [rel_patent_id] =>[rel_patent_doc_number] =>)
11/319997
Laser ablation and imprinting hybrid processing for fabrication of high density interconnect flip chip substrates Dec 26, 2005 Issued
Array ( [id] => 881027 [patent_doc_number] => 07355209 [patent_country] => US [patent_kind] => B2 [patent_issue_date] => 2008-04-08 [patent_title] => 'Light emitting diode and method making the same' [patent_app_type] => utility [patent_app_number] => 11/316437 [patent_app_country] => US [patent_app_date] => 2005-12-22 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 5 [patent_figures_cnt] => 11 [patent_no_of_words] => 3263 [patent_no_of_claims] => 11 [patent_no_of_ind_claims] => 2 [patent_words_short_claim] => 66 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/07/355/07355209.pdf [firstpage_image] =>[orig_patent_app_number] => 11316437 [rel_patent_id] =>[rel_patent_doc_number] =>)
11/316437
Light emitting diode and method making the same Dec 21, 2005 Issued
Array ( [id] => 5652880 [patent_doc_number] => 20060138615 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2006-06-29 [patent_title] => 'Semiconductor package and lead frame therefor' [patent_app_type] => utility [patent_app_number] => 11/312597 [patent_app_country] => US [patent_app_date] => 2005-12-21 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 14 [patent_figures_cnt] => 14 [patent_no_of_words] => 4409 [patent_no_of_claims] => 9 [patent_no_of_ind_claims] => 2 [patent_words_short_claim] => 0 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] => publications/A1/0138/20060138615.pdf [firstpage_image] =>[orig_patent_app_number] => 11312597 [rel_patent_id] =>[rel_patent_doc_number] =>)
11/312597
Semiconductor package and lead frame therefor Dec 20, 2005 Issued
Array ( [id] => 415520 [patent_doc_number] => 07279705 [patent_country] => US [patent_kind] => B2 [patent_issue_date] => 2007-10-09 [patent_title] => 'Organic light-emitting device' [patent_app_type] => utility [patent_app_number] => 11/314895 [patent_app_country] => US [patent_app_date] => 2005-12-20 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 2 [patent_figures_cnt] => 3 [patent_no_of_words] => 2936 [patent_no_of_claims] => 20 [patent_no_of_ind_claims] => 1 [patent_words_short_claim] => 53 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/07/279/07279705.pdf [firstpage_image] =>[orig_patent_app_number] => 11314895 [rel_patent_id] =>[rel_patent_doc_number] =>)
11/314895
Organic light-emitting device Dec 19, 2005 Issued
Array ( [id] => 873323 [patent_doc_number] => 07361982 [patent_country] => US [patent_kind] => B2 [patent_issue_date] => 2008-04-22 [patent_title] => 'Bumpless chip package' [patent_app_type] => utility [patent_app_number] => 11/314787 [patent_app_country] => US [patent_app_date] => 2005-12-19 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 7 [patent_figures_cnt] => 9 [patent_no_of_words] => 2928 [patent_no_of_claims] => 20 [patent_no_of_ind_claims] => 1 [patent_words_short_claim] => 153 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/07/361/07361982.pdf [firstpage_image] =>[orig_patent_app_number] => 11314787 [rel_patent_id] =>[rel_patent_doc_number] =>)
11/314787
Bumpless chip package Dec 18, 2005 Issued
Array ( [id] => 5116907 [patent_doc_number] => 20070138621 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2007-06-21 [patent_title] => 'Low temperature phase change thermal interface material dam' [patent_app_type] => utility [patent_app_number] => 11/305527 [patent_app_country] => US [patent_app_date] => 2005-12-16 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 8 [patent_figures_cnt] => 8 [patent_no_of_words] => 3926 [patent_no_of_claims] => 19 [patent_no_of_ind_claims] => 3 [patent_words_short_claim] => 0 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] => publications/A1/0138/20070138621.pdf [firstpage_image] =>[orig_patent_app_number] => 11305527 [rel_patent_id] =>[rel_patent_doc_number] =>)
11/305527
Low temperature phase change thermal interface material dam Dec 15, 2005 Issued
Array ( [id] => 5038216 [patent_doc_number] => 20070090498 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2007-04-26 [patent_title] => 'Stack type semiconductor package module utilizing solder coated stacking protrusions and method for manufacturing the same' [patent_app_type] => utility [patent_app_number] => 11/304047 [patent_app_country] => US [patent_app_date] => 2005-12-15 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 7 [patent_figures_cnt] => 7 [patent_no_of_words] => 2176 [patent_no_of_claims] => 8 [patent_no_of_ind_claims] => 2 [patent_words_short_claim] => 0 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] => publications/A1/0090/20070090498.pdf [firstpage_image] =>[orig_patent_app_number] => 11304047 [rel_patent_id] =>[rel_patent_doc_number] =>)
11/304047
Stack type semiconductor package module utilizing solder coated stacking protrusions and method for manufacturing the same Dec 14, 2005 Issued
Array ( [id] => 5250630 [patent_doc_number] => 20070132086 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2007-06-14 [patent_title] => 'Integrated circuit devices including compliant material under bond pads and methods of fabrication' [patent_app_type] => utility [patent_app_number] => 11/301557 [patent_app_country] => US [patent_app_date] => 2005-12-13 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 6 [patent_figures_cnt] => 6 [patent_no_of_words] => 4167 [patent_no_of_claims] => 32 [patent_no_of_ind_claims] => 4 [patent_words_short_claim] => 0 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] => publications/A1/0132/20070132086.pdf [firstpage_image] =>[orig_patent_app_number] => 11301557 [rel_patent_id] =>[rel_patent_doc_number] =>)
11/301557
Integrated circuit devices including compliant material under bond pads and methods of fabrication Dec 12, 2005 Issued
Array ( [id] => 383396 [patent_doc_number] => 07307348 [patent_country] => US [patent_kind] => B2 [patent_issue_date] => 2007-12-11 [patent_title] => 'Semiconductor components having through wire interconnects (TWI)' [patent_app_type] => utility [patent_app_number] => 11/296057 [patent_app_country] => US [patent_app_date] => 2005-12-07 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 21 [patent_figures_cnt] => 55 [patent_no_of_words] => 12041 [patent_no_of_claims] => 56 [patent_no_of_ind_claims] => 5 [patent_words_short_claim] => 86 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/07/307/07307348.pdf [firstpage_image] =>[orig_patent_app_number] => 11296057 [rel_patent_id] =>[rel_patent_doc_number] =>)
11/296057
Semiconductor components having through wire interconnects (TWI) Dec 6, 2005 Issued
Array ( [id] => 311438 [patent_doc_number] => 07528470 [patent_country] => US [patent_kind] => B2 [patent_issue_date] => 2009-05-05 [patent_title] => 'Conductor board and method for producing a conductor board' [patent_app_type] => utility [patent_app_number] => 11/292656 [patent_app_country] => US [patent_app_date] => 2005-12-02 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 5 [patent_figures_cnt] => 5 [patent_no_of_words] => 4591 [patent_no_of_claims] => 30 [patent_no_of_ind_claims] => 3 [patent_words_short_claim] => 136 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/07/528/07528470.pdf [firstpage_image] =>[orig_patent_app_number] => 11292656 [rel_patent_id] =>[rel_patent_doc_number] =>)
11/292656
Conductor board and method for producing a conductor board Dec 1, 2005 Issued
Array ( [id] => 918202 [patent_doc_number] => 07323728 [patent_country] => US [patent_kind] => B2 [patent_issue_date] => 2008-01-29 [patent_title] => 'Semiconductor device' [patent_app_type] => utility [patent_app_number] => 11/288117 [patent_app_country] => US [patent_app_date] => 2005-11-29 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 4 [patent_figures_cnt] => 6 [patent_no_of_words] => 3541 [patent_no_of_claims] => 20 [patent_no_of_ind_claims] => 2 [patent_words_short_claim] => 283 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/07/323/07323728.pdf [firstpage_image] =>[orig_patent_app_number] => 11288117 [rel_patent_id] =>[rel_patent_doc_number] =>)
11/288117
Semiconductor device Nov 28, 2005 Issued
Array ( [id] => 544003 [patent_doc_number] => 07163873 [patent_country] => US [patent_kind] => B2 [patent_issue_date] => 2007-01-16 [patent_title] => 'Substrate for stressed systems and method of making same' [patent_app_type] => utility [patent_app_number] => 11/287379 [patent_app_country] => US [patent_app_date] => 2005-11-28 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 3 [patent_figures_cnt] => 8 [patent_no_of_words] => 3902 [patent_no_of_claims] => 20 [patent_no_of_ind_claims] => 1 [patent_words_short_claim] => 92 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/07/163/07163873.pdf [firstpage_image] =>[orig_patent_app_number] => 11287379 [rel_patent_id] =>[rel_patent_doc_number] =>)
11/287379
Substrate for stressed systems and method of making same Nov 27, 2005 Issued
Array ( [id] => 5713286 [patent_doc_number] => 20060076649 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2006-04-13 [patent_title] => 'Substrate for stressed systems and method of making same' [patent_app_type] => utility [patent_app_number] => 11/287371 [patent_app_country] => US [patent_app_date] => 2005-11-28 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 4 [patent_figures_cnt] => 4 [patent_no_of_words] => 3895 [patent_no_of_claims] => 20 [patent_no_of_ind_claims] => 2 [patent_words_short_claim] => 0 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] => publications/A1/0076/20060076649.pdf [firstpage_image] =>[orig_patent_app_number] => 11287371 [rel_patent_id] =>[rel_patent_doc_number] =>)
11/287371
Substrate for stressed systems and method of making same Nov 27, 2005 Issued
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