Search

Roy Karl Potter

Examiner (ID: 13991, Phone: (571)272-1842 , Office: P/2822 )

Most Active Art Unit
2822
Art Unit(s)
2822, 2508, 2811, 3621
Total Applications
2584
Issued Applications
2409
Pending Applications
46
Abandoned Applications
141

Applications

Application numberTitle of the applicationFiling DateStatus
Array ( [id] => 419122 [patent_doc_number] => 07276797 [patent_country] => US [patent_kind] => B2 [patent_issue_date] => 2007-10-02 [patent_title] => 'Structure and method for fabricating a bond pad structure' [patent_app_type] => utility [patent_app_number] => 11/284981 [patent_app_country] => US [patent_app_date] => 2005-11-21 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 4 [patent_figures_cnt] => 8 [patent_no_of_words] => 4155 [patent_no_of_claims] => 14 [patent_no_of_ind_claims] => 2 [patent_words_short_claim] => 146 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/07/276/07276797.pdf [firstpage_image] =>[orig_patent_app_number] => 11284981 [rel_patent_id] =>[rel_patent_doc_number] =>)
11/284981
Structure and method for fabricating a bond pad structure Nov 20, 2005 Issued
Array ( [id] => 408813 [patent_doc_number] => 07285849 [patent_country] => US [patent_kind] => B2 [patent_issue_date] => 2007-10-23 [patent_title] => 'Semiconductor die package using leadframe and clip and method of manufacturing' [patent_app_type] => utility [patent_app_number] => 11/282967 [patent_app_country] => US [patent_app_date] => 2005-11-18 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 10 [patent_figures_cnt] => 16 [patent_no_of_words] => 4967 [patent_no_of_claims] => 20 [patent_no_of_ind_claims] => 3 [patent_words_short_claim] => 51 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/07/285/07285849.pdf [firstpage_image] =>[orig_patent_app_number] => 11282967 [rel_patent_id] =>[rel_patent_doc_number] =>)
11/282967
Semiconductor die package using leadframe and clip and method of manufacturing Nov 17, 2005 Issued
Array ( [id] => 5645999 [patent_doc_number] => 20060131731 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2006-06-22 [patent_title] => 'Midair semiconductor device and manufacturing method of the same' [patent_app_type] => utility [patent_app_number] => 11/281517 [patent_app_country] => US [patent_app_date] => 2005-11-18 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 14 [patent_figures_cnt] => 14 [patent_no_of_words] => 10215 [patent_no_of_claims] => 18 [patent_no_of_ind_claims] => 4 [patent_words_short_claim] => 0 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] => publications/A1/0131/20060131731.pdf [firstpage_image] =>[orig_patent_app_number] => 11281517 [rel_patent_id] =>[rel_patent_doc_number] =>)
11/281517
Midair semiconductor device and manufacturing method of the same Nov 17, 2005 Issued
Array ( [id] => 4820515 [patent_doc_number] => 20080121873 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2008-05-29 [patent_title] => 'Organic Thin Film Transistor Material, Organic Thin Film Transistor, Field-Effect Transistor, Switching Element, Organic Semiconductor Material and Organic Semiconductor Film' [patent_app_type] => utility [patent_app_number] => 11/720367 [patent_app_country] => US [patent_app_date] => 2005-11-17 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 2 [patent_figures_cnt] => 2 [patent_no_of_words] => 6989 [patent_no_of_claims] => 15 [patent_no_of_ind_claims] => 5 [patent_words_short_claim] => 0 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] => publications/A1/0121/20080121873.pdf [firstpage_image] =>[orig_patent_app_number] => 11720367 [rel_patent_id] =>[rel_patent_doc_number] =>)
11/720367
Organic thin film transistor material, organic thin film transistor, field-effect transistor, switching element, organic semiconductor material and organic semiconductor film Nov 16, 2005 Issued
Array ( [id] => 461373 [patent_doc_number] => 07242092 [patent_country] => US [patent_kind] => B2 [patent_issue_date] => 2007-07-10 [patent_title] => 'Substrate assembly with direct electrical connection as a semiconductor package' [patent_app_type] => utility [patent_app_number] => 11/274397 [patent_app_country] => US [patent_app_date] => 2005-11-14 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 3 [patent_figures_cnt] => 7 [patent_no_of_words] => 3541 [patent_no_of_claims] => 20 [patent_no_of_ind_claims] => 3 [patent_words_short_claim] => 150 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/07/242/07242092.pdf [firstpage_image] =>[orig_patent_app_number] => 11274397 [rel_patent_id] =>[rel_patent_doc_number] =>)
11/274397
Substrate assembly with direct electrical connection as a semiconductor package Nov 13, 2005 Issued
Array ( [id] => 380333 [patent_doc_number] => 07309909 [patent_country] => US [patent_kind] => B2 [patent_issue_date] => 2007-12-18 [patent_title] => 'Leadframes for improved moisture reliability of semiconductor devices' [patent_app_type] => utility [patent_app_number] => 11/273467 [patent_app_country] => US [patent_app_date] => 2005-11-14 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 2 [patent_figures_cnt] => 5 [patent_no_of_words] => 3204 [patent_no_of_claims] => 12 [patent_no_of_ind_claims] => 2 [patent_words_short_claim] => 50 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/07/309/07309909.pdf [firstpage_image] =>[orig_patent_app_number] => 11273467 [rel_patent_id] =>[rel_patent_doc_number] =>)
11/273467
Leadframes for improved moisture reliability of semiconductor devices Nov 13, 2005 Issued
Array ( [id] => 124019 [patent_doc_number] => 07705376 [patent_country] => US [patent_kind] => B2 [patent_issue_date] => 2010-04-27 [patent_title] => 'Sensor and method of manufacturing the same' [patent_app_type] => utility [patent_app_number] => 11/270568 [patent_app_country] => US [patent_app_date] => 2005-11-10 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 9 [patent_figures_cnt] => 20 [patent_no_of_words] => 11529 [patent_no_of_claims] => 7 [patent_no_of_ind_claims] => 6 [patent_words_short_claim] => 46 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/07/705/07705376.pdf [firstpage_image] =>[orig_patent_app_number] => 11270568 [rel_patent_id] =>[rel_patent_doc_number] =>)
11/270568
Sensor and method of manufacturing the same Nov 9, 2005 Issued
Array ( [id] => 390253 [patent_doc_number] => 07300849 [patent_country] => US [patent_kind] => B2 [patent_issue_date] => 2007-11-27 [patent_title] => 'Bandgap engineered mono-crystalline silicon cap layers for SiGe HBT performance enhancement' [patent_app_type] => utility [patent_app_number] => 11/266797 [patent_app_country] => US [patent_app_date] => 2005-11-04 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 7 [patent_figures_cnt] => 13 [patent_no_of_words] => 3397 [patent_no_of_claims] => 13 [patent_no_of_ind_claims] => 3 [patent_words_short_claim] => 65 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/07/300/07300849.pdf [firstpage_image] =>[orig_patent_app_number] => 11266797 [rel_patent_id] =>[rel_patent_doc_number] =>)
11/266797
Bandgap engineered mono-crystalline silicon cap layers for SiGe HBT performance enhancement Nov 3, 2005 Issued
Array ( [id] => 278356 [patent_doc_number] => 07557433 [patent_country] => US [patent_kind] => B2 [patent_issue_date] => 2009-07-07 [patent_title] => 'Microelectronic device with integrated energy source' [patent_app_type] => utility [patent_app_number] => 11/259567 [patent_app_country] => US [patent_app_date] => 2005-10-25 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 19 [patent_figures_cnt] => 37 [patent_no_of_words] => 19485 [patent_no_of_claims] => 59 [patent_no_of_ind_claims] => 4 [patent_words_short_claim] => 62 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/07/557/07557433.pdf [firstpage_image] =>[orig_patent_app_number] => 11259567 [rel_patent_id] =>[rel_patent_doc_number] =>)
11/259567
Microelectronic device with integrated energy source Oct 24, 2005 Issued
Array ( [id] => 5805186 [patent_doc_number] => 20060091539 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2006-05-04 [patent_title] => 'Semiconductor device, circuit board, electro-optic device, electronic device' [patent_app_type] => utility [patent_app_number] => 11/257457 [patent_app_country] => US [patent_app_date] => 2005-10-24 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 7 [patent_figures_cnt] => 7 [patent_no_of_words] => 6171 [patent_no_of_claims] => 24 [patent_no_of_ind_claims] => 2 [patent_words_short_claim] => 0 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] => publications/A1/0091/20060091539.pdf [firstpage_image] =>[orig_patent_app_number] => 11257457 [rel_patent_id] =>[rel_patent_doc_number] =>)
11/257457
Semiconductor device, circuit board, electro-optic device, electronic device Oct 23, 2005 Issued
Array ( [id] => 5871142 [patent_doc_number] => 20060164757 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2006-07-27 [patent_title] => 'Magnetic field sensing device and a fabricating method of the same' [patent_app_type] => utility [patent_app_number] => 11/252737 [patent_app_country] => US [patent_app_date] => 2005-10-19 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 9 [patent_figures_cnt] => 9 [patent_no_of_words] => 4455 [patent_no_of_claims] => 20 [patent_no_of_ind_claims] => 3 [patent_words_short_claim] => 0 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] => publications/A1/0164/20060164757.pdf [firstpage_image] =>[orig_patent_app_number] => 11252737 [rel_patent_id] =>[rel_patent_doc_number] =>)
11/252737
Magnetic field sensing device and a fabricating method of the same Oct 18, 2005 Issued
Array ( [id] => 4941340 [patent_doc_number] => 20080078662 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2008-04-03 [patent_title] => 'Electromechanical Switch' [patent_app_type] => utility [patent_app_number] => 11/577017 [patent_app_country] => US [patent_app_date] => 2005-10-18 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 44 [patent_figures_cnt] => 44 [patent_no_of_words] => 17407 [patent_no_of_claims] => 22 [patent_no_of_ind_claims] => 1 [patent_words_short_claim] => 0 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] => publications/A1/0078/20080078662.pdf [firstpage_image] =>[orig_patent_app_number] => 11577017 [rel_patent_id] =>[rel_patent_doc_number] =>)
11/577017
Electromechanical switch Oct 17, 2005 Issued
Array ( [id] => 341953 [patent_doc_number] => 07501711 [patent_country] => US [patent_kind] => B2 [patent_issue_date] => 2009-03-10 [patent_title] => 'Epoxy resin composition for semiconductor encapsulation and semiconductor device using the same' [patent_app_type] => utility [patent_app_number] => 11/665967 [patent_app_country] => US [patent_app_date] => 2005-10-18 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 1 [patent_figures_cnt] => 1 [patent_no_of_words] => 4597 [patent_no_of_claims] => 3 [patent_no_of_ind_claims] => 1 [patent_words_short_claim] => 59 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/07/501/07501711.pdf [firstpage_image] =>[orig_patent_app_number] => 11665967 [rel_patent_id] =>[rel_patent_doc_number] =>)
11/665967
Epoxy resin composition for semiconductor encapsulation and semiconductor device using the same Oct 17, 2005 Issued
Array ( [id] => 348804 [patent_doc_number] => 07494920 [patent_country] => US [patent_kind] => B2 [patent_issue_date] => 2009-02-24 [patent_title] => 'Method of fabricating a vertically mountable IC package' [patent_app_type] => utility [patent_app_number] => 11/250687 [patent_app_country] => US [patent_app_date] => 2005-10-14 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 5 [patent_figures_cnt] => 11 [patent_no_of_words] => 2943 [patent_no_of_claims] => 18 [patent_no_of_ind_claims] => 2 [patent_words_short_claim] => 101 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/07/494/07494920.pdf [firstpage_image] =>[orig_patent_app_number] => 11250687 [rel_patent_id] =>[rel_patent_doc_number] =>)
11/250687
Method of fabricating a vertically mountable IC package Oct 13, 2005 Issued
Array ( [id] => 5334498 [patent_doc_number] => 20090050962 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2009-02-26 [patent_title] => 'MOSFET WITH ISOLATION STRUCTURE FOR MONOLITHIC INTEGRATION AND FABRICATION METHOD THEREOF' [patent_app_type] => utility [patent_app_number] => 11/913037 [patent_app_country] => US [patent_app_date] => 2005-10-14 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 7 [patent_figures_cnt] => 7 [patent_no_of_words] => 4202 [patent_no_of_claims] => 12 [patent_no_of_ind_claims] => 4 [patent_words_short_claim] => 0 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] => publications/A1/0050/20090050962.pdf [firstpage_image] =>[orig_patent_app_number] => 11913037 [rel_patent_id] =>[rel_patent_doc_number] =>)
11/913037
MOSFET with isolation structure for monolithic integration and fabrication method thereof Oct 13, 2005 Issued
Array ( [id] => 915351 [patent_doc_number] => 07326994 [patent_country] => US [patent_kind] => B2 [patent_issue_date] => 2008-02-05 [patent_title] => 'Logic compatible non-volatile memory cell' [patent_app_type] => utility [patent_app_number] => 11/248357 [patent_app_country] => US [patent_app_date] => 2005-10-12 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 7 [patent_figures_cnt] => 9 [patent_no_of_words] => 4684 [patent_no_of_claims] => 19 [patent_no_of_ind_claims] => 2 [patent_words_short_claim] => 124 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/07/326/07326994.pdf [firstpage_image] =>[orig_patent_app_number] => 11248357 [rel_patent_id] =>[rel_patent_doc_number] =>)
11/248357
Logic compatible non-volatile memory cell Oct 11, 2005 Issued
Array ( [id] => 5718464 [patent_doc_number] => 20060071237 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2006-04-06 [patent_title] => 'Circuit arrangement comprising a power component and a drive circuit integrated in two semiconductor bodies' [patent_app_type] => utility [patent_app_number] => 11/238677 [patent_app_country] => US [patent_app_date] => 2005-09-29 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 5 [patent_figures_cnt] => 5 [patent_no_of_words] => 5068 [patent_no_of_claims] => 20 [patent_no_of_ind_claims] => 3 [patent_words_short_claim] => 0 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] => publications/A1/0071/20060071237.pdf [firstpage_image] =>[orig_patent_app_number] => 11238677 [rel_patent_id] =>[rel_patent_doc_number] =>)
11/238677
Circuit arrangement comprising a power component and a drive circuit integrated in two semiconductor bodies Sep 28, 2005 Issued
Array ( [id] => 443606 [patent_doc_number] => 07256420 [patent_country] => US [patent_kind] => B2 [patent_issue_date] => 2007-08-14 [patent_title] => 'Semiconductor device and manufacturing method thereof' [patent_app_type] => utility [patent_app_number] => 11/236847 [patent_app_country] => US [patent_app_date] => 2005-09-28 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 6 [patent_figures_cnt] => 12 [patent_no_of_words] => 3026 [patent_no_of_claims] => 8 [patent_no_of_ind_claims] => 2 [patent_words_short_claim] => 73 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/07/256/07256420.pdf [firstpage_image] =>[orig_patent_app_number] => 11236847 [rel_patent_id] =>[rel_patent_doc_number] =>)
11/236847
Semiconductor device and manufacturing method thereof Sep 27, 2005 Issued
Array ( [id] => 5038120 [patent_doc_number] => 20070090402 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2007-04-26 [patent_title] => 'Bond pad structure' [patent_app_type] => utility [patent_app_number] => 11/236217 [patent_app_country] => US [patent_app_date] => 2005-09-27 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 11 [patent_figures_cnt] => 11 [patent_no_of_words] => 2947 [patent_no_of_claims] => 26 [patent_no_of_ind_claims] => 3 [patent_words_short_claim] => 0 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] => publications/A1/0090/20070090402.pdf [firstpage_image] =>[orig_patent_app_number] => 11236217 [rel_patent_id] =>[rel_patent_doc_number] =>)
11/236217
Bond pad structure Sep 26, 2005 Issued
Array ( [id] => 319081 [patent_doc_number] => 07521793 [patent_country] => US [patent_kind] => B2 [patent_issue_date] => 2009-04-21 [patent_title] => 'Integrated circuit mounting for thermal stress relief useable in a multi-chip module' [patent_app_type] => utility [patent_app_number] => 11/234937 [patent_app_country] => US [patent_app_date] => 2005-09-26 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 3 [patent_figures_cnt] => 5 [patent_no_of_words] => 2893 [patent_no_of_claims] => 20 [patent_no_of_ind_claims] => 2 [patent_words_short_claim] => 119 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/07/521/07521793.pdf [firstpage_image] =>[orig_patent_app_number] => 11234937 [rel_patent_id] =>[rel_patent_doc_number] =>)
11/234937
Integrated circuit mounting for thermal stress relief useable in a multi-chip module Sep 25, 2005 Issued
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