
Roy Karl Potter
Examiner (ID: 13991, Phone: (571)272-1842 , Office: P/2822 )
| Most Active Art Unit | 2822 |
| Art Unit(s) | 2822, 2508, 2811, 3621 |
| Total Applications | 2584 |
| Issued Applications | 2409 |
| Pending Applications | 46 |
| Abandoned Applications | 141 |
Applications
| Application number | Title of the application | Filing Date | Status |
|---|---|---|---|
Array
(
[id] => 419122
[patent_doc_number] => 07276797
[patent_country] => US
[patent_kind] => B2
[patent_issue_date] => 2007-10-02
[patent_title] => 'Structure and method for fabricating a bond pad structure'
[patent_app_type] => utility
[patent_app_number] => 11/284981
[patent_app_country] => US
[patent_app_date] => 2005-11-21
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 4
[patent_figures_cnt] => 8
[patent_no_of_words] => 4155
[patent_no_of_claims] => 14
[patent_no_of_ind_claims] => 2
[patent_words_short_claim] => 146
[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => patent
[pdf_file] => patents/07/276/07276797.pdf
[firstpage_image] =>[orig_patent_app_number] => 11284981
[rel_patent_id] =>[rel_patent_doc_number] =>) 11/284981 | Structure and method for fabricating a bond pad structure | Nov 20, 2005 | Issued |
Array
(
[id] => 408813
[patent_doc_number] => 07285849
[patent_country] => US
[patent_kind] => B2
[patent_issue_date] => 2007-10-23
[patent_title] => 'Semiconductor die package using leadframe and clip and method of manufacturing'
[patent_app_type] => utility
[patent_app_number] => 11/282967
[patent_app_country] => US
[patent_app_date] => 2005-11-18
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 10
[patent_figures_cnt] => 16
[patent_no_of_words] => 4967
[patent_no_of_claims] => 20
[patent_no_of_ind_claims] => 3
[patent_words_short_claim] => 51
[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => patent
[pdf_file] => patents/07/285/07285849.pdf
[firstpage_image] =>[orig_patent_app_number] => 11282967
[rel_patent_id] =>[rel_patent_doc_number] =>) 11/282967 | Semiconductor die package using leadframe and clip and method of manufacturing | Nov 17, 2005 | Issued |
Array
(
[id] => 5645999
[patent_doc_number] => 20060131731
[patent_country] => US
[patent_kind] => A1
[patent_issue_date] => 2006-06-22
[patent_title] => 'Midair semiconductor device and manufacturing method of the same'
[patent_app_type] => utility
[patent_app_number] => 11/281517
[patent_app_country] => US
[patent_app_date] => 2005-11-18
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 14
[patent_figures_cnt] => 14
[patent_no_of_words] => 10215
[patent_no_of_claims] => 18
[patent_no_of_ind_claims] => 4
[patent_words_short_claim] => 0
[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => publication
[pdf_file] => publications/A1/0131/20060131731.pdf
[firstpage_image] =>[orig_patent_app_number] => 11281517
[rel_patent_id] =>[rel_patent_doc_number] =>) 11/281517 | Midair semiconductor device and manufacturing method of the same | Nov 17, 2005 | Issued |
Array
(
[id] => 4820515
[patent_doc_number] => 20080121873
[patent_country] => US
[patent_kind] => A1
[patent_issue_date] => 2008-05-29
[patent_title] => 'Organic Thin Film Transistor Material, Organic Thin Film Transistor, Field-Effect Transistor, Switching Element, Organic Semiconductor Material and Organic Semiconductor Film'
[patent_app_type] => utility
[patent_app_number] => 11/720367
[patent_app_country] => US
[patent_app_date] => 2005-11-17
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 2
[patent_figures_cnt] => 2
[patent_no_of_words] => 6989
[patent_no_of_claims] => 15
[patent_no_of_ind_claims] => 5
[patent_words_short_claim] => 0
[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => publication
[pdf_file] => publications/A1/0121/20080121873.pdf
[firstpage_image] =>[orig_patent_app_number] => 11720367
[rel_patent_id] =>[rel_patent_doc_number] =>) 11/720367 | Organic thin film transistor material, organic thin film transistor, field-effect transistor, switching element, organic semiconductor material and organic semiconductor film | Nov 16, 2005 | Issued |
Array
(
[id] => 461373
[patent_doc_number] => 07242092
[patent_country] => US
[patent_kind] => B2
[patent_issue_date] => 2007-07-10
[patent_title] => 'Substrate assembly with direct electrical connection as a semiconductor package'
[patent_app_type] => utility
[patent_app_number] => 11/274397
[patent_app_country] => US
[patent_app_date] => 2005-11-14
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 3
[patent_figures_cnt] => 7
[patent_no_of_words] => 3541
[patent_no_of_claims] => 20
[patent_no_of_ind_claims] => 3
[patent_words_short_claim] => 150
[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => patent
[pdf_file] => patents/07/242/07242092.pdf
[firstpage_image] =>[orig_patent_app_number] => 11274397
[rel_patent_id] =>[rel_patent_doc_number] =>) 11/274397 | Substrate assembly with direct electrical connection as a semiconductor package | Nov 13, 2005 | Issued |
Array
(
[id] => 380333
[patent_doc_number] => 07309909
[patent_country] => US
[patent_kind] => B2
[patent_issue_date] => 2007-12-18
[patent_title] => 'Leadframes for improved moisture reliability of semiconductor devices'
[patent_app_type] => utility
[patent_app_number] => 11/273467
[patent_app_country] => US
[patent_app_date] => 2005-11-14
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 2
[patent_figures_cnt] => 5
[patent_no_of_words] => 3204
[patent_no_of_claims] => 12
[patent_no_of_ind_claims] => 2
[patent_words_short_claim] => 50
[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => patent
[pdf_file] => patents/07/309/07309909.pdf
[firstpage_image] =>[orig_patent_app_number] => 11273467
[rel_patent_id] =>[rel_patent_doc_number] =>) 11/273467 | Leadframes for improved moisture reliability of semiconductor devices | Nov 13, 2005 | Issued |
Array
(
[id] => 124019
[patent_doc_number] => 07705376
[patent_country] => US
[patent_kind] => B2
[patent_issue_date] => 2010-04-27
[patent_title] => 'Sensor and method of manufacturing the same'
[patent_app_type] => utility
[patent_app_number] => 11/270568
[patent_app_country] => US
[patent_app_date] => 2005-11-10
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 9
[patent_figures_cnt] => 20
[patent_no_of_words] => 11529
[patent_no_of_claims] => 7
[patent_no_of_ind_claims] => 6
[patent_words_short_claim] => 46
[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => patent
[pdf_file] => patents/07/705/07705376.pdf
[firstpage_image] =>[orig_patent_app_number] => 11270568
[rel_patent_id] =>[rel_patent_doc_number] =>) 11/270568 | Sensor and method of manufacturing the same | Nov 9, 2005 | Issued |
Array
(
[id] => 390253
[patent_doc_number] => 07300849
[patent_country] => US
[patent_kind] => B2
[patent_issue_date] => 2007-11-27
[patent_title] => 'Bandgap engineered mono-crystalline silicon cap layers for SiGe HBT performance enhancement'
[patent_app_type] => utility
[patent_app_number] => 11/266797
[patent_app_country] => US
[patent_app_date] => 2005-11-04
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 7
[patent_figures_cnt] => 13
[patent_no_of_words] => 3397
[patent_no_of_claims] => 13
[patent_no_of_ind_claims] => 3
[patent_words_short_claim] => 65
[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => patent
[pdf_file] => patents/07/300/07300849.pdf
[firstpage_image] =>[orig_patent_app_number] => 11266797
[rel_patent_id] =>[rel_patent_doc_number] =>) 11/266797 | Bandgap engineered mono-crystalline silicon cap layers for SiGe HBT performance enhancement | Nov 3, 2005 | Issued |
Array
(
[id] => 278356
[patent_doc_number] => 07557433
[patent_country] => US
[patent_kind] => B2
[patent_issue_date] => 2009-07-07
[patent_title] => 'Microelectronic device with integrated energy source'
[patent_app_type] => utility
[patent_app_number] => 11/259567
[patent_app_country] => US
[patent_app_date] => 2005-10-25
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 19
[patent_figures_cnt] => 37
[patent_no_of_words] => 19485
[patent_no_of_claims] => 59
[patent_no_of_ind_claims] => 4
[patent_words_short_claim] => 62
[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => patent
[pdf_file] => patents/07/557/07557433.pdf
[firstpage_image] =>[orig_patent_app_number] => 11259567
[rel_patent_id] =>[rel_patent_doc_number] =>) 11/259567 | Microelectronic device with integrated energy source | Oct 24, 2005 | Issued |
Array
(
[id] => 5805186
[patent_doc_number] => 20060091539
[patent_country] => US
[patent_kind] => A1
[patent_issue_date] => 2006-05-04
[patent_title] => 'Semiconductor device, circuit board, electro-optic device, electronic device'
[patent_app_type] => utility
[patent_app_number] => 11/257457
[patent_app_country] => US
[patent_app_date] => 2005-10-24
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 7
[patent_figures_cnt] => 7
[patent_no_of_words] => 6171
[patent_no_of_claims] => 24
[patent_no_of_ind_claims] => 2
[patent_words_short_claim] => 0
[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => publication
[pdf_file] => publications/A1/0091/20060091539.pdf
[firstpage_image] =>[orig_patent_app_number] => 11257457
[rel_patent_id] =>[rel_patent_doc_number] =>) 11/257457 | Semiconductor device, circuit board, electro-optic device, electronic device | Oct 23, 2005 | Issued |
Array
(
[id] => 5871142
[patent_doc_number] => 20060164757
[patent_country] => US
[patent_kind] => A1
[patent_issue_date] => 2006-07-27
[patent_title] => 'Magnetic field sensing device and a fabricating method of the same'
[patent_app_type] => utility
[patent_app_number] => 11/252737
[patent_app_country] => US
[patent_app_date] => 2005-10-19
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 9
[patent_figures_cnt] => 9
[patent_no_of_words] => 4455
[patent_no_of_claims] => 20
[patent_no_of_ind_claims] => 3
[patent_words_short_claim] => 0
[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => publication
[pdf_file] => publications/A1/0164/20060164757.pdf
[firstpage_image] =>[orig_patent_app_number] => 11252737
[rel_patent_id] =>[rel_patent_doc_number] =>) 11/252737 | Magnetic field sensing device and a fabricating method of the same | Oct 18, 2005 | Issued |
Array
(
[id] => 4941340
[patent_doc_number] => 20080078662
[patent_country] => US
[patent_kind] => A1
[patent_issue_date] => 2008-04-03
[patent_title] => 'Electromechanical Switch'
[patent_app_type] => utility
[patent_app_number] => 11/577017
[patent_app_country] => US
[patent_app_date] => 2005-10-18
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 44
[patent_figures_cnt] => 44
[patent_no_of_words] => 17407
[patent_no_of_claims] => 22
[patent_no_of_ind_claims] => 1
[patent_words_short_claim] => 0
[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => publication
[pdf_file] => publications/A1/0078/20080078662.pdf
[firstpage_image] =>[orig_patent_app_number] => 11577017
[rel_patent_id] =>[rel_patent_doc_number] =>) 11/577017 | Electromechanical switch | Oct 17, 2005 | Issued |
Array
(
[id] => 341953
[patent_doc_number] => 07501711
[patent_country] => US
[patent_kind] => B2
[patent_issue_date] => 2009-03-10
[patent_title] => 'Epoxy resin composition for semiconductor encapsulation and semiconductor device using the same'
[patent_app_type] => utility
[patent_app_number] => 11/665967
[patent_app_country] => US
[patent_app_date] => 2005-10-18
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 1
[patent_figures_cnt] => 1
[patent_no_of_words] => 4597
[patent_no_of_claims] => 3
[patent_no_of_ind_claims] => 1
[patent_words_short_claim] => 59
[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => patent
[pdf_file] => patents/07/501/07501711.pdf
[firstpage_image] =>[orig_patent_app_number] => 11665967
[rel_patent_id] =>[rel_patent_doc_number] =>) 11/665967 | Epoxy resin composition for semiconductor encapsulation and semiconductor device using the same | Oct 17, 2005 | Issued |
Array
(
[id] => 348804
[patent_doc_number] => 07494920
[patent_country] => US
[patent_kind] => B2
[patent_issue_date] => 2009-02-24
[patent_title] => 'Method of fabricating a vertically mountable IC package'
[patent_app_type] => utility
[patent_app_number] => 11/250687
[patent_app_country] => US
[patent_app_date] => 2005-10-14
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 5
[patent_figures_cnt] => 11
[patent_no_of_words] => 2943
[patent_no_of_claims] => 18
[patent_no_of_ind_claims] => 2
[patent_words_short_claim] => 101
[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => patent
[pdf_file] => patents/07/494/07494920.pdf
[firstpage_image] =>[orig_patent_app_number] => 11250687
[rel_patent_id] =>[rel_patent_doc_number] =>) 11/250687 | Method of fabricating a vertically mountable IC package | Oct 13, 2005 | Issued |
Array
(
[id] => 5334498
[patent_doc_number] => 20090050962
[patent_country] => US
[patent_kind] => A1
[patent_issue_date] => 2009-02-26
[patent_title] => 'MOSFET WITH ISOLATION STRUCTURE FOR MONOLITHIC INTEGRATION AND FABRICATION METHOD THEREOF'
[patent_app_type] => utility
[patent_app_number] => 11/913037
[patent_app_country] => US
[patent_app_date] => 2005-10-14
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 7
[patent_figures_cnt] => 7
[patent_no_of_words] => 4202
[patent_no_of_claims] => 12
[patent_no_of_ind_claims] => 4
[patent_words_short_claim] => 0
[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => publication
[pdf_file] => publications/A1/0050/20090050962.pdf
[firstpage_image] =>[orig_patent_app_number] => 11913037
[rel_patent_id] =>[rel_patent_doc_number] =>) 11/913037 | MOSFET with isolation structure for monolithic integration and fabrication method thereof | Oct 13, 2005 | Issued |
Array
(
[id] => 915351
[patent_doc_number] => 07326994
[patent_country] => US
[patent_kind] => B2
[patent_issue_date] => 2008-02-05
[patent_title] => 'Logic compatible non-volatile memory cell'
[patent_app_type] => utility
[patent_app_number] => 11/248357
[patent_app_country] => US
[patent_app_date] => 2005-10-12
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 7
[patent_figures_cnt] => 9
[patent_no_of_words] => 4684
[patent_no_of_claims] => 19
[patent_no_of_ind_claims] => 2
[patent_words_short_claim] => 124
[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => patent
[pdf_file] => patents/07/326/07326994.pdf
[firstpage_image] =>[orig_patent_app_number] => 11248357
[rel_patent_id] =>[rel_patent_doc_number] =>) 11/248357 | Logic compatible non-volatile memory cell | Oct 11, 2005 | Issued |
Array
(
[id] => 5718464
[patent_doc_number] => 20060071237
[patent_country] => US
[patent_kind] => A1
[patent_issue_date] => 2006-04-06
[patent_title] => 'Circuit arrangement comprising a power component and a drive circuit integrated in two semiconductor bodies'
[patent_app_type] => utility
[patent_app_number] => 11/238677
[patent_app_country] => US
[patent_app_date] => 2005-09-29
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 5
[patent_figures_cnt] => 5
[patent_no_of_words] => 5068
[patent_no_of_claims] => 20
[patent_no_of_ind_claims] => 3
[patent_words_short_claim] => 0
[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => publication
[pdf_file] => publications/A1/0071/20060071237.pdf
[firstpage_image] =>[orig_patent_app_number] => 11238677
[rel_patent_id] =>[rel_patent_doc_number] =>) 11/238677 | Circuit arrangement comprising a power component and a drive circuit integrated in two semiconductor bodies | Sep 28, 2005 | Issued |
Array
(
[id] => 443606
[patent_doc_number] => 07256420
[patent_country] => US
[patent_kind] => B2
[patent_issue_date] => 2007-08-14
[patent_title] => 'Semiconductor device and manufacturing method thereof'
[patent_app_type] => utility
[patent_app_number] => 11/236847
[patent_app_country] => US
[patent_app_date] => 2005-09-28
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 6
[patent_figures_cnt] => 12
[patent_no_of_words] => 3026
[patent_no_of_claims] => 8
[patent_no_of_ind_claims] => 2
[patent_words_short_claim] => 73
[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => patent
[pdf_file] => patents/07/256/07256420.pdf
[firstpage_image] =>[orig_patent_app_number] => 11236847
[rel_patent_id] =>[rel_patent_doc_number] =>) 11/236847 | Semiconductor device and manufacturing method thereof | Sep 27, 2005 | Issued |
Array
(
[id] => 5038120
[patent_doc_number] => 20070090402
[patent_country] => US
[patent_kind] => A1
[patent_issue_date] => 2007-04-26
[patent_title] => 'Bond pad structure'
[patent_app_type] => utility
[patent_app_number] => 11/236217
[patent_app_country] => US
[patent_app_date] => 2005-09-27
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 11
[patent_figures_cnt] => 11
[patent_no_of_words] => 2947
[patent_no_of_claims] => 26
[patent_no_of_ind_claims] => 3
[patent_words_short_claim] => 0
[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => publication
[pdf_file] => publications/A1/0090/20070090402.pdf
[firstpage_image] =>[orig_patent_app_number] => 11236217
[rel_patent_id] =>[rel_patent_doc_number] =>) 11/236217 | Bond pad structure | Sep 26, 2005 | Issued |
Array
(
[id] => 319081
[patent_doc_number] => 07521793
[patent_country] => US
[patent_kind] => B2
[patent_issue_date] => 2009-04-21
[patent_title] => 'Integrated circuit mounting for thermal stress relief useable in a multi-chip module'
[patent_app_type] => utility
[patent_app_number] => 11/234937
[patent_app_country] => US
[patent_app_date] => 2005-09-26
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 3
[patent_figures_cnt] => 5
[patent_no_of_words] => 2893
[patent_no_of_claims] => 20
[patent_no_of_ind_claims] => 2
[patent_words_short_claim] => 119
[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => patent
[pdf_file] => patents/07/521/07521793.pdf
[firstpage_image] =>[orig_patent_app_number] => 11234937
[rel_patent_id] =>[rel_patent_doc_number] =>) 11/234937 | Integrated circuit mounting for thermal stress relief useable in a multi-chip module | Sep 25, 2005 | Issued |