
Roy Karl Potter
Examiner (ID: 13991, Phone: (571)272-1842 , Office: P/2822 )
| Most Active Art Unit | 2822 |
| Art Unit(s) | 2822, 2508, 2811, 3621 |
| Total Applications | 2584 |
| Issued Applications | 2409 |
| Pending Applications | 46 |
| Abandoned Applications | 141 |
Applications
| Application number | Title of the application | Filing Date | Status |
|---|---|---|---|
Array
(
[id] => 303961
[patent_doc_number] => 07535101
[patent_country] => US
[patent_kind] => B2
[patent_issue_date] => 2009-05-19
[patent_title] => 'Electrode pad on conductive semiconductor substrate'
[patent_app_type] => utility
[patent_app_number] => 10/576627
[patent_app_country] => US
[patent_app_date] => 2005-05-18
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 14
[patent_figures_cnt] => 17
[patent_no_of_words] => 9553
[patent_no_of_claims] => 20
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[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => patent
[pdf_file] => patents/07/535/07535101.pdf
[firstpage_image] =>[orig_patent_app_number] => 10576627
[rel_patent_id] =>[rel_patent_doc_number] =>) 10/576627 | Electrode pad on conductive semiconductor substrate | May 17, 2005 | Issued |
Array
(
[id] => 911411
[patent_doc_number] => 07329954
[patent_country] => US
[patent_kind] => B2
[patent_issue_date] => 2008-02-12
[patent_title] => 'Top layers of metal for high performance IC\'s'
[patent_app_type] => utility
[patent_app_number] => 11/130917
[patent_app_country] => US
[patent_app_date] => 2005-05-17
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 10
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[pdf_file] => patents/07/329/07329954.pdf
[firstpage_image] =>[orig_patent_app_number] => 11130917
[rel_patent_id] =>[rel_patent_doc_number] =>) 11/130917 | Top layers of metal for high performance IC's | May 16, 2005 | Issued |
Array
(
[id] => 690383
[patent_doc_number] => 07074636
[patent_country] => US
[patent_kind] => B2
[patent_issue_date] => 2006-07-11
[patent_title] => 'Methods and apparatus for attaching getters to MEMS device housings'
[patent_app_type] => utility
[patent_app_number] => 11/127388
[patent_app_country] => US
[patent_app_date] => 2005-05-12
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 7
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[firstpage_image] =>[orig_patent_app_number] => 11127388
[rel_patent_id] =>[rel_patent_doc_number] =>) 11/127388 | Methods and apparatus for attaching getters to MEMS device housings | May 11, 2005 | Issued |
Array
(
[id] => 7162261
[patent_doc_number] => 20050200020
[patent_country] => US
[patent_kind] => A1
[patent_issue_date] => 2005-09-15
[patent_title] => 'Method of forming smooth polycrystalline silicon electrodes for molecular electronic devices'
[patent_app_type] => utility
[patent_app_number] => 11/127917
[patent_app_country] => US
[patent_app_date] => 2005-05-11
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 3
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[firstpage_image] =>[orig_patent_app_number] => 11127917
[rel_patent_id] =>[rel_patent_doc_number] =>) 11/127917 | Method of forming smooth polycrystalline silicon electrodes for molecular electronic devices | May 10, 2005 | Issued |
Array
(
[id] => 5659231
[patent_doc_number] => 20060249827
[patent_country] => US
[patent_kind] => A1
[patent_issue_date] => 2006-11-09
[patent_title] => 'METHOD AND APPARATUS FOR FORMING STACKED DIE AND SUBSTRATE STRUCTURES FOR INCREASED PACKING DENSITY'
[patent_app_type] => utility
[patent_app_number] => 10/908277
[patent_app_country] => US
[patent_app_date] => 2005-05-05
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 5
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[pdf_file] => publications/A1/0249/20060249827.pdf
[firstpage_image] =>[orig_patent_app_number] => 10908277
[rel_patent_id] =>[rel_patent_doc_number] =>) 10/908277 | Method and apparatus for forming stacked die and substrate structures for increased packing density | May 4, 2005 | Issued |
Array
(
[id] => 7176705
[patent_doc_number] => 20050189636
[patent_country] => US
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[patent_issue_date] => 2005-09-01
[patent_title] => 'Packaging substrates for integrated circuits and soldering methods'
[patent_app_type] => utility
[patent_app_number] => 11/123532
[patent_app_country] => US
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[firstpage_image] =>[orig_patent_app_number] => 11123532
[rel_patent_id] =>[rel_patent_doc_number] =>) 11/123532 | Packaging substrates for integrated circuits and soldering methods | May 4, 2005 | Issued |
Array
(
[id] => 474065
[patent_doc_number] => 07230322
[patent_country] => US
[patent_kind] => B2
[patent_issue_date] => 2007-06-12
[patent_title] => 'Semiconductor device and method of manufacturing the same'
[patent_app_type] => utility
[patent_app_number] => 11/119745
[patent_app_country] => US
[patent_app_date] => 2005-05-03
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[pdf_file] => patents/07/230/07230322.pdf
[firstpage_image] =>[orig_patent_app_number] => 11119745
[rel_patent_id] =>[rel_patent_doc_number] =>) 11/119745 | Semiconductor device and method of manufacturing the same | May 2, 2005 | Issued |
Array
(
[id] => 5661581
[patent_doc_number] => 20060252177
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[patent_issue_date] => 2006-11-09
[patent_title] => 'Semiconductor package with selective underfill and fabrication method therfor'
[patent_app_type] => utility
[patent_app_number] => 11/121847
[patent_app_country] => US
[patent_app_date] => 2005-05-03
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 4
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[firstpage_image] =>[orig_patent_app_number] => 11121847
[rel_patent_id] =>[rel_patent_doc_number] =>) 11/121847 | Semiconductor package with selective underfill and fabrication method therfor | May 2, 2005 | Issued |
Array
(
[id] => 820906
[patent_doc_number] => 07408240
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[patent_issue_date] => 2008-08-05
[patent_title] => 'Memory device'
[patent_app_type] => utility
[patent_app_number] => 11/120007
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[firstpage_image] =>[orig_patent_app_number] => 11120007
[rel_patent_id] =>[rel_patent_doc_number] =>) 11/120007 | Memory device | May 1, 2005 | Issued |
Array
(
[id] => 7214630
[patent_doc_number] => 20050253271
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[patent_issue_date] => 2005-11-17
[patent_title] => 'Semiconductor apparatus'
[patent_app_type] => utility
[patent_app_number] => 11/115407
[patent_app_country] => US
[patent_app_date] => 2005-04-27
[patent_effective_date] => 0000-00-00
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[firstpage_image] =>[orig_patent_app_number] => 11115407
[rel_patent_id] =>[rel_patent_doc_number] =>) 11/115407 | Semiconductor apparatus | Apr 26, 2005 | Issued |
Array
(
[id] => 425491
[patent_doc_number] => 07271474
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[patent_issue_date] => 2007-09-18
[patent_title] => 'Method and integrated circuits of module packing'
[patent_app_type] => utility
[patent_app_number] => 11/111727
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[pdf_file] => patents/07/271/07271474.pdf
[firstpage_image] =>[orig_patent_app_number] => 11111727
[rel_patent_id] =>[rel_patent_doc_number] =>) 11/111727 | Method and integrated circuits of module packing | Apr 21, 2005 | Issued |
Array
(
[id] => 6942619
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[patent_title] => 'Semiconductor package free of substrate and fabrication method thereof'
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[rel_patent_id] =>[rel_patent_doc_number] =>) 11/112108 | Semiconductor package free of substrate and fabrication method thereof | Apr 20, 2005 | Issued |
Array
(
[id] => 889195
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[patent_issue_date] => 2008-03-25
[patent_title] => 'Method and structures for indexing dice'
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[rel_patent_id] =>[rel_patent_doc_number] =>) 11/109977 | Method and structures for indexing dice | Apr 18, 2005 | Issued |
Array
(
[id] => 571001
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Array
(
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[patent_title] => 'Complete device layer transfer without edge exclusion via direct wafer bonding and constrained bond-strengthening process'
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Array
(
[id] => 360083
[patent_doc_number] => 07485962
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[patent_title] => 'Semiconductor device, wiring substrate forming method, and substrate processing apparatus'
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Array
(
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[patent_title] => 'Integrated circuit edge protection method and apparatus'
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[rel_patent_id] =>[rel_patent_doc_number] =>) 11/096427 | Integrated circuit edge protection method and apparatus | Mar 30, 2005 | Issued |
Array
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[rel_patent_id] =>[rel_patent_doc_number] =>) 10/907327 | Semiconductor packages and methods of manufacturing thereof | Mar 28, 2005 | Issued |
Array
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[rel_patent_id] =>[rel_patent_doc_number] =>) 11/089737 | Minimizing the effect of directly converted x-rays in x-ray imagers | Mar 24, 2005 | Issued |
Array
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[rel_patent_id] =>[rel_patent_doc_number] =>) 11/081679 | Semiconductor device and method of manufacturing the same | Mar 16, 2005 | Abandoned |