Search

Roy Karl Potter

Examiner (ID: 13991, Phone: (571)272-1842 , Office: P/2822 )

Most Active Art Unit
2822
Art Unit(s)
2822, 2508, 2811, 3621
Total Applications
2584
Issued Applications
2409
Pending Applications
46
Abandoned Applications
141

Applications

Application numberTitle of the applicationFiling DateStatus
Array ( [id] => 5791036 [patent_doc_number] => 20060012053 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2006-01-19 [patent_title] => 'Flip-chip packaged SMD-type LED with antistatic function and having no wire bonding' [patent_app_type] => utility [patent_app_number] => 10/982767 [patent_app_country] => US [patent_app_date] => 2004-11-08 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 7 [patent_figures_cnt] => 7 [patent_no_of_words] => 2424 [patent_no_of_claims] => 35 [patent_no_of_ind_claims] => 3 [patent_words_short_claim] => 0 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] => publications/A1/0012/20060012053.pdf [firstpage_image] =>[orig_patent_app_number] => 10982767 [rel_patent_id] =>[rel_patent_doc_number] =>)
10/982767
Flip-chip packaged SMD-type LED with antistatic function and having no wire bonding Nov 7, 2004 Issued
Array ( [id] => 7154635 [patent_doc_number] => 20050082689 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2005-04-21 [patent_title] => 'Resin-sealed semiconductor device' [patent_app_type] => utility [patent_app_number] => 10/981472 [patent_app_country] => US [patent_app_date] => 2004-11-05 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 4 [patent_figures_cnt] => 4 [patent_no_of_words] => 3182 [patent_no_of_claims] => 6 [patent_no_of_ind_claims] => 2 [patent_words_short_claim] => 0 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] => publications/A1/0082/20050082689.pdf [firstpage_image] =>[orig_patent_app_number] => 10981472 [rel_patent_id] =>[rel_patent_doc_number] =>)
10/981472
Resin-sealed semiconductor device Nov 4, 2004 Issued
Array ( [id] => 5790963 [patent_doc_number] => 20060012017 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2006-01-19 [patent_title] => 'Semiconductor device and method of manufacturing the same' [patent_app_type] => utility [patent_app_number] => 10/981557 [patent_app_country] => US [patent_app_date] => 2004-11-05 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 26 [patent_figures_cnt] => 26 [patent_no_of_words] => 9812 [patent_no_of_claims] => 13 [patent_no_of_ind_claims] => 3 [patent_words_short_claim] => 0 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] => publications/A1/0012/20060012017.pdf [firstpage_image] =>[orig_patent_app_number] => 10981557 [rel_patent_id] =>[rel_patent_doc_number] =>)
10/981557
Semiconductor device and method of manufacturing the same Nov 4, 2004 Issued
Array ( [id] => 637785 [patent_doc_number] => 07125746 [patent_country] => US [patent_kind] => B2 [patent_issue_date] => 2006-10-24 [patent_title] => 'Flip-chip sub-assembly, methods of making same and device including same' [patent_app_type] => utility [patent_app_number] => 10/981477 [patent_app_country] => US [patent_app_date] => 2004-11-05 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 4 [patent_figures_cnt] => 8 [patent_no_of_words] => 3623 [patent_no_of_claims] => 6 [patent_no_of_ind_claims] => 1 [patent_words_short_claim] => 90 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/07/125/07125746.pdf [firstpage_image] =>[orig_patent_app_number] => 10981477 [rel_patent_id] =>[rel_patent_doc_number] =>)
10/981477
Flip-chip sub-assembly, methods of making same and device including same Nov 4, 2004 Issued
Array ( [id] => 530538 [patent_doc_number] => 07183643 [patent_country] => US [patent_kind] => B2 [patent_issue_date] => 2007-02-27 [patent_title] => 'Stacked packages and systems incorporating the same' [patent_app_type] => utility [patent_app_number] => 10/981067 [patent_app_country] => US [patent_app_date] => 2004-11-04 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 13 [patent_figures_cnt] => 18 [patent_no_of_words] => 10764 [patent_no_of_claims] => 50 [patent_no_of_ind_claims] => 8 [patent_words_short_claim] => 146 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/07/183/07183643.pdf [firstpage_image] =>[orig_patent_app_number] => 10981067 [rel_patent_id] =>[rel_patent_doc_number] =>)
10/981067
Stacked packages and systems incorporating the same Nov 3, 2004 Issued
Array ( [id] => 7008440 [patent_doc_number] => 20050062156 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2005-03-24 [patent_title] => 'Integrating chip scale packaging metallization into integrated circuit die structures' [patent_app_type] => utility [patent_app_number] => 10/980536 [patent_app_country] => US [patent_app_date] => 2004-11-03 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 5 [patent_figures_cnt] => 5 [patent_no_of_words] => 4343 [patent_no_of_claims] => 13 [patent_no_of_ind_claims] => 3 [patent_words_short_claim] => 0 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] => publications/A1/0062/20050062156.pdf [firstpage_image] =>[orig_patent_app_number] => 10980536 [rel_patent_id] =>[rel_patent_doc_number] =>)
10/980536
Integrating chip scale packaging metallization into integrated circuit die structures Nov 2, 2004 Issued
Array ( [id] => 6903489 [patent_doc_number] => 20050098884 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2005-05-12 [patent_title] => 'Semiconductor package' [patent_app_type] => utility [patent_app_number] => 10/978327 [patent_app_country] => US [patent_app_date] => 2004-11-01 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 8 [patent_figures_cnt] => 8 [patent_no_of_words] => 4329 [patent_no_of_claims] => 22 [patent_no_of_ind_claims] => 3 [patent_words_short_claim] => 0 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] => publications/A1/0098/20050098884.pdf [firstpage_image] =>[orig_patent_app_number] => 10978327 [rel_patent_id] =>[rel_patent_doc_number] =>)
10/978327
Semiconductor package Oct 31, 2004 Issued
Array ( [id] => 6949897 [patent_doc_number] => 20050224991 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2005-10-13 [patent_title] => 'Bump for semiconductor package, semiconductor package applying the bump, and method for fabricating the semiconductor package' [patent_app_type] => utility [patent_app_number] => 10/976427 [patent_app_country] => US [patent_app_date] => 2004-10-29 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 7 [patent_figures_cnt] => 7 [patent_no_of_words] => 4549 [patent_no_of_claims] => 26 [patent_no_of_ind_claims] => 3 [patent_words_short_claim] => 0 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] => publications/A1/0224/20050224991.pdf [firstpage_image] =>[orig_patent_app_number] => 10976427 [rel_patent_id] =>[rel_patent_doc_number] =>)
10/976427
Bump for semiconductor package, semiconductor package applying the bump, and method for fabricating the semiconductor package Oct 28, 2004 Issued
Array ( [id] => 624005 [patent_doc_number] => 07138715 [patent_country] => US [patent_kind] => B2 [patent_issue_date] => 2006-11-21 [patent_title] => 'Interconnect, interconnect forming method, thin film transistor, and display device' [patent_app_type] => utility [patent_app_number] => 10/974722 [patent_app_country] => US [patent_app_date] => 2004-10-28 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 8 [patent_figures_cnt] => 39 [patent_no_of_words] => 9656 [patent_no_of_claims] => 4 [patent_no_of_ind_claims] => 4 [patent_words_short_claim] => 131 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/07/138/07138715.pdf [firstpage_image] =>[orig_patent_app_number] => 10974722 [rel_patent_id] =>[rel_patent_doc_number] =>)
10/974722
Interconnect, interconnect forming method, thin film transistor, and display device Oct 27, 2004 Issued
Array ( [id] => 7101470 [patent_doc_number] => 20050104196 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2005-05-19 [patent_title] => 'Semiconductor package' [patent_app_type] => utility [patent_app_number] => 10/974727 [patent_app_country] => US [patent_app_date] => 2004-10-28 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 14 [patent_figures_cnt] => 14 [patent_no_of_words] => 8036 [patent_no_of_claims] => 16 [patent_no_of_ind_claims] => 2 [patent_words_short_claim] => 0 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] => publications/A1/0104/20050104196.pdf [firstpage_image] =>[orig_patent_app_number] => 10974727 [rel_patent_id] =>[rel_patent_doc_number] =>)
10/974727
Semiconductor package Oct 27, 2004 Abandoned
Array ( [id] => 7125174 [patent_doc_number] => 20050056918 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2005-03-17 [patent_title] => 'Power module package having improved heat dissipating capability' [patent_app_type] => utility [patent_app_number] => 10/974357 [patent_app_country] => US [patent_app_date] => 2004-10-26 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 8 [patent_figures_cnt] => 8 [patent_no_of_words] => 4274 [patent_no_of_claims] => 5 [patent_no_of_ind_claims] => 3 [patent_words_short_claim] => 0 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] => publications/A1/0056/20050056918.pdf [firstpage_image] =>[orig_patent_app_number] => 10974357 [rel_patent_id] =>[rel_patent_doc_number] =>)
10/974357
Power module package having improved heat dissipating capability Oct 25, 2004 Issued
Array ( [id] => 463371 [patent_doc_number] => 07238602 [patent_country] => US [patent_kind] => B2 [patent_issue_date] => 2007-07-03 [patent_title] => 'Chip-size package structure and method of the same' [patent_app_type] => utility [patent_app_number] => 10/973557 [patent_app_country] => US [patent_app_date] => 2004-10-26 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 4 [patent_figures_cnt] => 7 [patent_no_of_words] => 3560 [patent_no_of_claims] => 32 [patent_no_of_ind_claims] => 1 [patent_words_short_claim] => 146 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/07/238/07238602.pdf [firstpage_image] =>[orig_patent_app_number] => 10973557 [rel_patent_id] =>[rel_patent_doc_number] =>)
10/973557
Chip-size package structure and method of the same Oct 25, 2004 Issued
Array ( [id] => 7154606 [patent_doc_number] => 20050082678 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2005-04-21 [patent_title] => 'Method to form selective cap layers on metal features with narrow spaces' [patent_app_type] => utility [patent_app_number] => 10/973207 [patent_app_country] => US [patent_app_date] => 2004-10-26 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 6 [patent_figures_cnt] => 6 [patent_no_of_words] => 5127 [patent_no_of_claims] => 39 [patent_no_of_ind_claims] => 4 [patent_words_short_claim] => 0 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] => publications/A1/0082/20050082678.pdf [firstpage_image] =>[orig_patent_app_number] => 10973207 [rel_patent_id] =>[rel_patent_doc_number] =>)
10/973207
Method to form selective cap layers on metal features with narrow spaces Oct 25, 2004 Abandoned
Array ( [id] => 7198893 [patent_doc_number] => 20050051898 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2005-03-10 [patent_title] => 'Semiconductor device' [patent_app_type] => utility [patent_app_number] => 10/970027 [patent_app_country] => US [patent_app_date] => 2004-10-22 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 38 [patent_figures_cnt] => 38 [patent_no_of_words] => 14849 [patent_no_of_claims] => 3 [patent_no_of_ind_claims] => 2 [patent_words_short_claim] => 0 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] => publications/A1/0051/20050051898.pdf [firstpage_image] =>[orig_patent_app_number] => 10970027 [rel_patent_id] =>[rel_patent_doc_number] =>)
10/970027
Semiconductor device Oct 21, 2004 Issued
Array ( [id] => 6988808 [patent_doc_number] => 20050087881 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2005-04-28 [patent_title] => 'Electronic device' [patent_app_type] => utility [patent_app_number] => 10/970527 [patent_app_country] => US [patent_app_date] => 2004-10-21 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 4 [patent_figures_cnt] => 4 [patent_no_of_words] => 4534 [patent_no_of_claims] => 24 [patent_no_of_ind_claims] => 2 [patent_words_short_claim] => 0 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] => publications/A1/0087/20050087881.pdf [firstpage_image] =>[orig_patent_app_number] => 10970527 [rel_patent_id] =>[rel_patent_doc_number] =>)
10/970527
Electronic device Oct 20, 2004 Issued
Array ( [id] => 928771 [patent_doc_number] => 07315081 [patent_country] => US [patent_kind] => B2 [patent_issue_date] => 2008-01-01 [patent_title] => 'Semiconductor device package utilizing proud interconnect material' [patent_app_type] => utility [patent_app_number] => 10/970557 [patent_app_country] => US [patent_app_date] => 2004-10-21 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 8 [patent_figures_cnt] => 19 [patent_no_of_words] => 6119 [patent_no_of_claims] => 20 [patent_no_of_ind_claims] => 1 [patent_words_short_claim] => 83 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/07/315/07315081.pdf [firstpage_image] =>[orig_patent_app_number] => 10970557 [rel_patent_id] =>[rel_patent_doc_number] =>)
10/970557
Semiconductor device package utilizing proud interconnect material Oct 20, 2004 Issued
Array ( [id] => 484493 [patent_doc_number] => 07221046 [patent_country] => US [patent_kind] => B2 [patent_issue_date] => 2007-05-22 [patent_title] => 'System to control effective series resistance of power delivery circuit' [patent_app_type] => utility [patent_app_number] => 10/970237 [patent_app_country] => US [patent_app_date] => 2004-10-21 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 7 [patent_figures_cnt] => 7 [patent_no_of_words] => 1830 [patent_no_of_claims] => 15 [patent_no_of_ind_claims] => 5 [patent_words_short_claim] => 93 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/07/221/07221046.pdf [firstpage_image] =>[orig_patent_app_number] => 10970237 [rel_patent_id] =>[rel_patent_doc_number] =>)
10/970237
System to control effective series resistance of power delivery circuit Oct 20, 2004 Issued
Array ( [id] => 6923458 [patent_doc_number] => 20050236713 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2005-10-27 [patent_title] => 'Semiconductor device' [patent_app_type] => utility [patent_app_number] => 10/968167 [patent_app_country] => US [patent_app_date] => 2004-10-20 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 33 [patent_figures_cnt] => 33 [patent_no_of_words] => 9177 [patent_no_of_claims] => 15 [patent_no_of_ind_claims] => 2 [patent_words_short_claim] => 0 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] => publications/A1/0236/20050236713.pdf [firstpage_image] =>[orig_patent_app_number] => 10968167 [rel_patent_id] =>[rel_patent_doc_number] =>)
10/968167
Semiconductor device Oct 19, 2004 Issued
Array ( [id] => 530406 [patent_doc_number] => 07183631 [patent_country] => US [patent_kind] => B2 [patent_issue_date] => 2007-02-27 [patent_title] => 'Package structure module of bump posited type lead frame' [patent_app_type] => utility [patent_app_number] => 10/968187 [patent_app_country] => US [patent_app_date] => 2004-10-20 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 5 [patent_figures_cnt] => 10 [patent_no_of_words] => 1806 [patent_no_of_claims] => 10 [patent_no_of_ind_claims] => 4 [patent_words_short_claim] => 40 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/07/183/07183631.pdf [firstpage_image] =>[orig_patent_app_number] => 10968187 [rel_patent_id] =>[rel_patent_doc_number] =>)
10/968187
Package structure module of bump posited type lead frame Oct 19, 2004 Issued
Array ( [id] => 1002401 [patent_doc_number] => 06908855 [patent_country] => US [patent_kind] => B2 [patent_issue_date] => 2005-06-21 [patent_title] => 'Plating tail design for IC packages' [patent_app_type] => utility [patent_app_number] => 10/969133 [patent_app_country] => US [patent_app_date] => 2004-10-19 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 2 [patent_figures_cnt] => 3 [patent_no_of_words] => 1555 [patent_no_of_claims] => 10 [patent_no_of_ind_claims] => 2 [patent_words_short_claim] => 128 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/06/908/06908855.pdf [firstpage_image] =>[orig_patent_app_number] => 10969133 [rel_patent_id] =>[rel_patent_doc_number] =>)
10/969133
Plating tail design for IC packages Oct 18, 2004 Issued
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