
Roy Karl Potter
Examiner (ID: 13991, Phone: (571)272-1842 , Office: P/2822 )
| Most Active Art Unit | 2822 |
| Art Unit(s) | 2822, 2508, 2811, 3621 |
| Total Applications | 2584 |
| Issued Applications | 2409 |
| Pending Applications | 46 |
| Abandoned Applications | 141 |
Applications
| Application number | Title of the application | Filing Date | Status |
|---|---|---|---|
Array
(
[id] => 637857
[patent_doc_number] => 07125810
[patent_country] => US
[patent_kind] => B2
[patent_issue_date] => 2006-10-24
[patent_title] => 'Semiconductor device and method of manufacturing semiconductor device'
[patent_app_type] => utility
[patent_app_number] => 10/964714
[patent_app_country] => US
[patent_app_date] => 2004-10-15
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 8
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[patent_no_of_words] => 12957
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[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => patent
[pdf_file] => patents/07/125/07125810.pdf
[firstpage_image] =>[orig_patent_app_number] => 10964714
[rel_patent_id] =>[rel_patent_doc_number] =>) 10/964714 | Semiconductor device and method of manufacturing semiconductor device | Oct 14, 2004 | Issued |
Array
(
[id] => 885857
[patent_doc_number] => 07352056
[patent_country] => US
[patent_kind] => B2
[patent_issue_date] => 2008-04-01
[patent_title] => 'Semiconductor package structure with microstrip antennan'
[patent_app_type] => utility
[patent_app_number] => 10/962437
[patent_app_country] => US
[patent_app_date] => 2004-10-13
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[firstpage_image] =>[orig_patent_app_number] => 10962437
[rel_patent_id] =>[rel_patent_doc_number] =>) 10/962437 | Semiconductor package structure with microstrip antennan | Oct 12, 2004 | Issued |
Array
(
[id] => 487583
[patent_doc_number] => 07218005
[patent_country] => US
[patent_kind] => B2
[patent_issue_date] => 2007-05-15
[patent_title] => 'Compact semiconductor device capable of mounting a plurality of semiconductor chips with high density and method of manufacturing the same'
[patent_app_type] => utility
[patent_app_number] => 10/960917
[patent_app_country] => US
[patent_app_date] => 2004-10-12
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 10
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[rel_patent_id] =>[rel_patent_doc_number] =>) 10/960917 | Compact semiconductor device capable of mounting a plurality of semiconductor chips with high density and method of manufacturing the same | Oct 11, 2004 | Issued |
Array
(
[id] => 5713309
[patent_doc_number] => 20060076672
[patent_country] => US
[patent_kind] => A1
[patent_issue_date] => 2006-04-13
[patent_title] => 'Magnetic attachment method for LED light engines'
[patent_app_type] => utility
[patent_app_number] => 10/962947
[patent_app_country] => US
[patent_app_date] => 2004-10-12
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 3
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[rel_patent_id] =>[rel_patent_doc_number] =>) 10/962947 | Magnetic attachment method for LED light engines | Oct 11, 2004 | Issued |
Array
(
[id] => 7080658
[patent_doc_number] => 20050046038
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[patent_kind] => A1
[patent_issue_date] => 2005-03-03
[patent_title] => 'Multi-dice chip scale semiconductor components'
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Array
(
[id] => 623995
[patent_doc_number] => 07138704
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[patent_issue_date] => 2006-11-21
[patent_title] => 'Concealable chip leadframe unit structure'
[patent_app_type] => utility
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Array
(
[id] => 5713301
[patent_doc_number] => 20060076664
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[patent_title] => '3D interconnect with protruding contacts'
[patent_app_type] => utility
[patent_app_number] => 10/960827
[patent_app_country] => US
[patent_app_date] => 2004-10-07
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 9
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[rel_patent_id] =>[rel_patent_doc_number] =>) 10/960827 | 3D interconnect with protruding contacts | Oct 6, 2004 | Issued |
Array
(
[id] => 5346157
[patent_doc_number] => 20090001518
[patent_country] => US
[patent_kind] => A1
[patent_issue_date] => 2009-01-01
[patent_title] => 'Varactor'
[patent_app_type] => utility
[patent_app_number] => 11/576828
[patent_app_country] => US
[patent_app_date] => 2004-10-06
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 2
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[pdf_file] => publications/A1/0001/20090001518.pdf
[firstpage_image] =>[orig_patent_app_number] => 11576828
[rel_patent_id] =>[rel_patent_doc_number] =>) 11/576828 | Varactor | Oct 5, 2004 | Issued |
Array
(
[id] => 547678
[patent_doc_number] => 07166905
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[patent_kind] => B1
[patent_issue_date] => 2007-01-23
[patent_title] => 'Stacked paddle micro leadframe package'
[patent_app_type] => utility
[patent_app_number] => 10/958697
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[firstpage_image] =>[orig_patent_app_number] => 10958697
[rel_patent_id] =>[rel_patent_doc_number] =>) 10/958697 | Stacked paddle micro leadframe package | Oct 4, 2004 | Issued |
Array
(
[id] => 7101423
[patent_doc_number] => 20050104149
[patent_country] => US
[patent_kind] => A1
[patent_issue_date] => 2005-05-19
[patent_title] => 'Semiconductor component and sensor component for data transmission devices'
[patent_app_type] => utility
[patent_app_number] => 10/956087
[patent_app_country] => US
[patent_app_date] => 2004-10-04
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 7
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[firstpage_image] =>[orig_patent_app_number] => 10956087
[rel_patent_id] =>[rel_patent_doc_number] =>) 10/956087 | Semiconductor component and sensor component for data transmission devices | Oct 3, 2004 | Issued |
Array
(
[id] => 7191557
[patent_doc_number] => 20050040521
[patent_country] => US
[patent_kind] => A1
[patent_issue_date] => 2005-02-24
[patent_title] => 'Relaxed tolerance flip chip assembly'
[patent_app_type] => utility
[patent_app_number] => 10/955706
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[rel_patent_id] =>[rel_patent_doc_number] =>) 10/955706 | Relaxed tolerance flip chip assembly | Sep 29, 2004 | Issued |
Array
(
[id] => 478572
[patent_doc_number] => 07223695
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[patent_kind] => B2
[patent_issue_date] => 2007-05-29
[patent_title] => 'Methods to deposit metal alloy barrier layers'
[patent_app_type] => utility
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Array
(
[id] => 5718481
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[patent_title] => 'High dynamic range image sensor'
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Array
(
[id] => 5718539
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[patent_title] => 'Semiconducting device that includes wirebonds'
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Array
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Array
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Array
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Array
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Array
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Array
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