Search

Roy Karl Potter

Examiner (ID: 13991, Phone: (571)272-1842 , Office: P/2822 )

Most Active Art Unit
2822
Art Unit(s)
2822, 2508, 2811, 3621
Total Applications
2584
Issued Applications
2409
Pending Applications
46
Abandoned Applications
141

Applications

Application numberTitle of the applicationFiling DateStatus
Array ( [id] => 696325 [patent_doc_number] => 07071553 [patent_country] => US [patent_kind] => B2 [patent_issue_date] => 2006-07-04 [patent_title] => 'Package structure compatible with cooling system' [patent_app_type] => utility [patent_app_number] => 10/711237 [patent_app_country] => US [patent_app_date] => 2004-09-03 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 5 [patent_figures_cnt] => 5 [patent_no_of_words] => 1881 [patent_no_of_claims] => 7 [patent_no_of_ind_claims] => 1 [patent_words_short_claim] => 93 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/07/071/07071553.pdf [firstpage_image] =>[orig_patent_app_number] => 10711237 [rel_patent_id] =>[rel_patent_doc_number] =>)
10/711237
Package structure compatible with cooling system Sep 2, 2004 Issued
Array ( [id] => 774863 [patent_doc_number] => 07002243 [patent_country] => US [patent_kind] => B2 [patent_issue_date] => 2006-02-21 [patent_title] => 'Signal transmission circuit, CMOS semiconductor device, and circuit board' [patent_app_type] => utility [patent_app_number] => 10/932995 [patent_app_country] => US [patent_app_date] => 2004-09-02 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 19 [patent_figures_cnt] => 25 [patent_no_of_words] => 9575 [patent_no_of_claims] => 3 [patent_no_of_ind_claims] => 1 [patent_words_short_claim] => 83 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/07/002/07002243.pdf [firstpage_image] =>[orig_patent_app_number] => 10932995 [rel_patent_id] =>[rel_patent_doc_number] =>)
10/932995
Signal transmission circuit, CMOS semiconductor device, and circuit board Sep 1, 2004 Issued
Array ( [id] => 432272 [patent_doc_number] => 07265045 [patent_country] => US [patent_kind] => B2 [patent_issue_date] => 2007-09-04 [patent_title] => 'Method for fabricating thermal compliant semiconductor chip wiring structure for chip scale packaging' [patent_app_type] => utility [patent_app_number] => 10/925302 [patent_app_country] => US [patent_app_date] => 2004-08-24 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 7 [patent_figures_cnt] => 14 [patent_no_of_words] => 6503 [patent_no_of_claims] => 42 [patent_no_of_ind_claims] => 3 [patent_words_short_claim] => 47 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/07/265/07265045.pdf [firstpage_image] =>[orig_patent_app_number] => 10925302 [rel_patent_id] =>[rel_patent_doc_number] =>)
10/925302
Method for fabricating thermal compliant semiconductor chip wiring structure for chip scale packaging Aug 23, 2004 Issued
Array ( [id] => 5732941 [patent_doc_number] => 20060258058 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2006-11-16 [patent_title] => 'Surface-mounted device with leads' [patent_app_type] => utility [patent_app_number] => 10/569217 [patent_app_country] => US [patent_app_date] => 2004-08-17 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 3 [patent_figures_cnt] => 3 [patent_no_of_words] => 3078 [patent_no_of_claims] => 8 [patent_no_of_ind_claims] => 1 [patent_words_short_claim] => 0 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] => publications/A1/0258/20060258058.pdf [firstpage_image] =>[orig_patent_app_number] => 10569217 [rel_patent_id] =>[rel_patent_doc_number] =>)
10/569217
Surface-mounted device with leads Aug 16, 2004 Abandoned
Array ( [id] => 627379 [patent_doc_number] => 07135764 [patent_country] => US [patent_kind] => B2 [patent_issue_date] => 2006-11-14 [patent_title] => 'Shielded semiconductor chip carrier having a high-density external interface' [patent_app_type] => utility [patent_app_number] => 10/909767 [patent_app_country] => US [patent_app_date] => 2004-08-02 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 5 [patent_figures_cnt] => 7 [patent_no_of_words] => 3370 [patent_no_of_claims] => 10 [patent_no_of_ind_claims] => 1 [patent_words_short_claim] => 262 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/07/135/07135764.pdf [firstpage_image] =>[orig_patent_app_number] => 10909767 [rel_patent_id] =>[rel_patent_doc_number] =>)
10/909767
Shielded semiconductor chip carrier having a high-density external interface Aug 1, 2004 Issued
Array ( [id] => 7191666 [patent_doc_number] => 20050040543 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2005-02-24 [patent_title] => 'Semiconductor device and method of manufacturing same' [patent_app_type] => utility [patent_app_number] => 10/902467 [patent_app_country] => US [patent_app_date] => 2004-07-30 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 13 [patent_figures_cnt] => 13 [patent_no_of_words] => 4744 [patent_no_of_claims] => 12 [patent_no_of_ind_claims] => 8 [patent_words_short_claim] => 0 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] => publications/A1/0040/20050040543.pdf [firstpage_image] =>[orig_patent_app_number] => 10902467 [rel_patent_id] =>[rel_patent_doc_number] =>)
10/902467
Semiconductor device and method of manufacturing the same Jul 29, 2004 Issued
Array ( [id] => 387007 [patent_doc_number] => 07304376 [patent_country] => US [patent_kind] => B2 [patent_issue_date] => 2007-12-04 [patent_title] => 'Microelectronic assemblies with springs' [patent_app_type] => utility [patent_app_number] => 10/901407 [patent_app_country] => US [patent_app_date] => 2004-07-28 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 7 [patent_figures_cnt] => 14 [patent_no_of_words] => 9211 [patent_no_of_claims] => 30 [patent_no_of_ind_claims] => 9 [patent_words_short_claim] => 97 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/07/304/07304376.pdf [firstpage_image] =>[orig_patent_app_number] => 10901407 [rel_patent_id] =>[rel_patent_doc_number] =>)
10/901407
Microelectronic assemblies with springs Jul 27, 2004 Issued
Array ( [id] => 7253145 [patent_doc_number] => 20040259346 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2004-12-23 [patent_title] => 'Semiconductor device having a ball grid array and a fabrication process thereof' [patent_app_type] => new [patent_app_number] => 10/893297 [patent_app_country] => US [patent_app_date] => 2004-07-19 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 44 [patent_figures_cnt] => 44 [patent_no_of_words] => 14850 [patent_no_of_claims] => 16 [patent_no_of_ind_claims] => 9 [patent_words_short_claim] => 3 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] => publications/A1/0259/20040259346.pdf [firstpage_image] =>[orig_patent_app_number] => 10893297 [rel_patent_id] =>[rel_patent_doc_number] =>)
10/893297
Semiconductor device having a ball grid array and a fabrication process thereof Jul 18, 2004 Issued
Array ( [id] => 7214690 [patent_doc_number] => 20050253279 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2005-11-17 [patent_title] => 'Semiconductor chip package and method for fabricating the same' [patent_app_type] => utility [patent_app_number] => 10/891377 [patent_app_country] => US [patent_app_date] => 2004-07-14 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 3 [patent_figures_cnt] => 3 [patent_no_of_words] => 2327 [patent_no_of_claims] => 13 [patent_no_of_ind_claims] => 2 [patent_words_short_claim] => 0 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] => publications/A1/0253/20050253279.pdf [firstpage_image] =>[orig_patent_app_number] => 10891377 [rel_patent_id] =>[rel_patent_doc_number] =>)
10/891377
Semiconductor chip package and method for fabricating the same Jul 13, 2004 Issued
Array ( [id] => 5735680 [patent_doc_number] => 20060006070 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2006-01-12 [patent_title] => 'Copper conductor' [patent_app_type] => utility [patent_app_number] => 10/887087 [patent_app_country] => US [patent_app_date] => 2004-07-09 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 4 [patent_figures_cnt] => 4 [patent_no_of_words] => 5816 [patent_no_of_claims] => 31 [patent_no_of_ind_claims] => 4 [patent_words_short_claim] => 0 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] => publications/A1/0006/20060006070.pdf [firstpage_image] =>[orig_patent_app_number] => 10887087 [rel_patent_id] =>[rel_patent_doc_number] =>)
10/887087
Copper conductor Jul 8, 2004 Issued
Array ( [id] => 602819 [patent_doc_number] => 07432583 [patent_country] => US [patent_kind] => B2 [patent_issue_date] => 2008-10-07 [patent_title] => 'Leadless leadframe package substitute and stack package' [patent_app_type] => utility [patent_app_number] => 10/888827 [patent_app_country] => US [patent_app_date] => 2004-07-08 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 9 [patent_figures_cnt] => 11 [patent_no_of_words] => 5017 [patent_no_of_claims] => 12 [patent_no_of_ind_claims] => 3 [patent_words_short_claim] => 122 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/07/432/07432583.pdf [firstpage_image] =>[orig_patent_app_number] => 10888827 [rel_patent_id] =>[rel_patent_doc_number] =>)
10/888827
Leadless leadframe package substitute and stack package Jul 7, 2004 Issued
Array ( [id] => 738994 [patent_doc_number] => 07034392 [patent_country] => US [patent_kind] => B2 [patent_issue_date] => 2006-04-25 [patent_title] => 'Duplexer' [patent_app_type] => utility [patent_app_number] => 10/886047 [patent_app_country] => US [patent_app_date] => 2004-07-08 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 9 [patent_figures_cnt] => 13 [patent_no_of_words] => 3927 [patent_no_of_claims] => 2 [patent_no_of_ind_claims] => 1 [patent_words_short_claim] => 215 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/07/034/07034392.pdf [firstpage_image] =>[orig_patent_app_number] => 10886047 [rel_patent_id] =>[rel_patent_doc_number] =>)
10/886047
Duplexer Jul 7, 2004 Issued
Array ( [id] => 5736135 [patent_doc_number] => 20060006525 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2006-01-12 [patent_title] => 'System and method for dissipating heat from a semiconductor module' [patent_app_type] => utility [patent_app_number] => 10/888907 [patent_app_country] => US [patent_app_date] => 2004-07-08 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 12 [patent_figures_cnt] => 12 [patent_no_of_words] => 4276 [patent_no_of_claims] => 81 [patent_no_of_ind_claims] => 4 [patent_words_short_claim] => 0 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] => publications/A1/0006/20060006525.pdf [firstpage_image] =>[orig_patent_app_number] => 10888907 [rel_patent_id] =>[rel_patent_doc_number] =>)
10/888907
System and method for dissipating heat from a semiconductor module Jul 7, 2004 Issued
Array ( [id] => 7058946 [patent_doc_number] => 20050001305 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2005-01-06 [patent_title] => 'Stack package of semiconductor device' [patent_app_type] => utility [patent_app_number] => 10/884407 [patent_app_country] => US [patent_app_date] => 2004-07-02 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 8 [patent_figures_cnt] => 8 [patent_no_of_words] => 5180 [patent_no_of_claims] => 30 [patent_no_of_ind_claims] => 4 [patent_words_short_claim] => 0 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] => publications/A1/0001/20050001305.pdf [firstpage_image] =>[orig_patent_app_number] => 10884407 [rel_patent_id] =>[rel_patent_doc_number] =>)
10/884407
Stack package of semiconductor device Jul 1, 2004 Issued
Array ( [id] => 696365 [patent_doc_number] => 07071570 [patent_country] => US [patent_kind] => B2 [patent_issue_date] => 2006-07-04 [patent_title] => 'Chip scale package and method of fabricating the same' [patent_app_type] => utility [patent_app_number] => 10/879157 [patent_app_country] => US [patent_app_date] => 2004-06-30 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 6 [patent_figures_cnt] => 11 [patent_no_of_words] => 4034 [patent_no_of_claims] => 20 [patent_no_of_ind_claims] => 3 [patent_words_short_claim] => 101 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/07/071/07071570.pdf [firstpage_image] =>[orig_patent_app_number] => 10879157 [rel_patent_id] =>[rel_patent_doc_number] =>)
10/879157
Chip scale package and method of fabricating the same Jun 29, 2004 Issued
Array ( [id] => 6978098 [patent_doc_number] => 20050287816 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2005-12-29 [patent_title] => 'Methods of forming patterned photoresist layers over semiconductor substrates' [patent_app_type] => utility [patent_app_number] => 10/879367 [patent_app_country] => US [patent_app_date] => 2004-06-28 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 6 [patent_figures_cnt] => 6 [patent_no_of_words] => 3725 [patent_no_of_claims] => 64 [patent_no_of_ind_claims] => 4 [patent_words_short_claim] => 0 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] => publications/A1/0287/20050287816.pdf [firstpage_image] =>[orig_patent_app_number] => 10879367 [rel_patent_id] =>[rel_patent_doc_number] =>)
10/879367
Methods of forming patterned photoresist layers over semiconductor substrates Jun 27, 2004 Issued
Array ( [id] => 536211 [patent_doc_number] => 07180187 [patent_country] => US [patent_kind] => B2 [patent_issue_date] => 2007-02-20 [patent_title] => 'Interlayer connector for preventing delamination of semiconductor device' [patent_app_type] => utility [patent_app_number] => 10/710147 [patent_app_country] => US [patent_app_date] => 2004-06-22 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 5 [patent_figures_cnt] => 10 [patent_no_of_words] => 4325 [patent_no_of_claims] => 5 [patent_no_of_ind_claims] => 1 [patent_words_short_claim] => 180 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/07/180/07180187.pdf [firstpage_image] =>[orig_patent_app_number] => 10710147 [rel_patent_id] =>[rel_patent_doc_number] =>)
10/710147
Interlayer connector for preventing delamination of semiconductor device Jun 21, 2004 Issued
Array ( [id] => 7058972 [patent_doc_number] => 20050001331 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2005-01-06 [patent_title] => 'Module with a built-in semiconductor and method for producing the same' [patent_app_type] => utility [patent_app_number] => 10/872727 [patent_app_country] => US [patent_app_date] => 2004-06-22 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 19 [patent_figures_cnt] => 19 [patent_no_of_words] => 18139 [patent_no_of_claims] => 36 [patent_no_of_ind_claims] => 2 [patent_words_short_claim] => 0 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] => publications/A1/0001/20050001331.pdf [firstpage_image] =>[orig_patent_app_number] => 10872727 [rel_patent_id] =>[rel_patent_doc_number] =>)
10/872727
Module with a built-in semiconductor and method for producing the same Jun 21, 2004 Issued
Array ( [id] => 6929105 [patent_doc_number] => 20050280138 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2005-12-22 [patent_title] => 'Ground plane for integrated circuit package' [patent_app_type] => utility [patent_app_number] => 10/873817 [patent_app_country] => US [patent_app_date] => 2004-06-21 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 4 [patent_figures_cnt] => 4 [patent_no_of_words] => 3409 [patent_no_of_claims] => 21 [patent_no_of_ind_claims] => 3 [patent_words_short_claim] => 0 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] => publications/A1/0280/20050280138.pdf [firstpage_image] =>[orig_patent_app_number] => 10873817 [rel_patent_id] =>[rel_patent_doc_number] =>)
10/873817
Ground plane for integrated circuit package Jun 20, 2004 Issued
Array ( [id] => 7407412 [patent_doc_number] => 20040227218 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2004-11-18 [patent_title] => 'Semiconductor package having flex circuit with external contacts' [patent_app_type] => new [patent_app_number] => 10/871925 [patent_app_country] => US [patent_app_date] => 2004-06-18 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 5 [patent_figures_cnt] => 5 [patent_no_of_words] => 5406 [patent_no_of_claims] => 26 [patent_no_of_ind_claims] => 9 [patent_words_short_claim] => 3 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] => publications/A1/0227/20040227218.pdf [firstpage_image] =>[orig_patent_app_number] => 10871925 [rel_patent_id] =>[rel_patent_doc_number] =>)
10/871925
Semiconductor package having flex circuit with external contacts Jun 17, 2004 Issued
Menu