
Roy Karl Potter
Examiner (ID: 13991, Phone: (571)272-1842 , Office: P/2822 )
| Most Active Art Unit | 2822 |
| Art Unit(s) | 2822, 2508, 2811, 3621 |
| Total Applications | 2584 |
| Issued Applications | 2409 |
| Pending Applications | 46 |
| Abandoned Applications | 141 |
Applications
| Application number | Title of the application | Filing Date | Status |
|---|---|---|---|
Array
(
[id] => 696325
[patent_doc_number] => 07071553
[patent_country] => US
[patent_kind] => B2
[patent_issue_date] => 2006-07-04
[patent_title] => 'Package structure compatible with cooling system'
[patent_app_type] => utility
[patent_app_number] => 10/711237
[patent_app_country] => US
[patent_app_date] => 2004-09-03
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 5
[patent_figures_cnt] => 5
[patent_no_of_words] => 1881
[patent_no_of_claims] => 7
[patent_no_of_ind_claims] => 1
[patent_words_short_claim] => 93
[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => patent
[pdf_file] => patents/07/071/07071553.pdf
[firstpage_image] =>[orig_patent_app_number] => 10711237
[rel_patent_id] =>[rel_patent_doc_number] =>) 10/711237 | Package structure compatible with cooling system | Sep 2, 2004 | Issued |
Array
(
[id] => 774863
[patent_doc_number] => 07002243
[patent_country] => US
[patent_kind] => B2
[patent_issue_date] => 2006-02-21
[patent_title] => 'Signal transmission circuit, CMOS semiconductor device, and circuit board'
[patent_app_type] => utility
[patent_app_number] => 10/932995
[patent_app_country] => US
[patent_app_date] => 2004-09-02
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 19
[patent_figures_cnt] => 25
[patent_no_of_words] => 9575
[patent_no_of_claims] => 3
[patent_no_of_ind_claims] => 1
[patent_words_short_claim] => 83
[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => patent
[pdf_file] => patents/07/002/07002243.pdf
[firstpage_image] =>[orig_patent_app_number] => 10932995
[rel_patent_id] =>[rel_patent_doc_number] =>) 10/932995 | Signal transmission circuit, CMOS semiconductor device, and circuit board | Sep 1, 2004 | Issued |
Array
(
[id] => 432272
[patent_doc_number] => 07265045
[patent_country] => US
[patent_kind] => B2
[patent_issue_date] => 2007-09-04
[patent_title] => 'Method for fabricating thermal compliant semiconductor chip wiring structure for chip scale packaging'
[patent_app_type] => utility
[patent_app_number] => 10/925302
[patent_app_country] => US
[patent_app_date] => 2004-08-24
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 7
[patent_figures_cnt] => 14
[patent_no_of_words] => 6503
[patent_no_of_claims] => 42
[patent_no_of_ind_claims] => 3
[patent_words_short_claim] => 47
[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => patent
[pdf_file] => patents/07/265/07265045.pdf
[firstpage_image] =>[orig_patent_app_number] => 10925302
[rel_patent_id] =>[rel_patent_doc_number] =>) 10/925302 | Method for fabricating thermal compliant semiconductor chip wiring structure for chip scale packaging | Aug 23, 2004 | Issued |
Array
(
[id] => 5732941
[patent_doc_number] => 20060258058
[patent_country] => US
[patent_kind] => A1
[patent_issue_date] => 2006-11-16
[patent_title] => 'Surface-mounted device with leads'
[patent_app_type] => utility
[patent_app_number] => 10/569217
[patent_app_country] => US
[patent_app_date] => 2004-08-17
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 3
[patent_figures_cnt] => 3
[patent_no_of_words] => 3078
[patent_no_of_claims] => 8
[patent_no_of_ind_claims] => 1
[patent_words_short_claim] => 0
[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => publication
[pdf_file] => publications/A1/0258/20060258058.pdf
[firstpage_image] =>[orig_patent_app_number] => 10569217
[rel_patent_id] =>[rel_patent_doc_number] =>) 10/569217 | Surface-mounted device with leads | Aug 16, 2004 | Abandoned |
Array
(
[id] => 627379
[patent_doc_number] => 07135764
[patent_country] => US
[patent_kind] => B2
[patent_issue_date] => 2006-11-14
[patent_title] => 'Shielded semiconductor chip carrier having a high-density external interface'
[patent_app_type] => utility
[patent_app_number] => 10/909767
[patent_app_country] => US
[patent_app_date] => 2004-08-02
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 5
[patent_figures_cnt] => 7
[patent_no_of_words] => 3370
[patent_no_of_claims] => 10
[patent_no_of_ind_claims] => 1
[patent_words_short_claim] => 262
[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => patent
[pdf_file] => patents/07/135/07135764.pdf
[firstpage_image] =>[orig_patent_app_number] => 10909767
[rel_patent_id] =>[rel_patent_doc_number] =>) 10/909767 | Shielded semiconductor chip carrier having a high-density external interface | Aug 1, 2004 | Issued |
Array
(
[id] => 7191666
[patent_doc_number] => 20050040543
[patent_country] => US
[patent_kind] => A1
[patent_issue_date] => 2005-02-24
[patent_title] => 'Semiconductor device and method of manufacturing same'
[patent_app_type] => utility
[patent_app_number] => 10/902467
[patent_app_country] => US
[patent_app_date] => 2004-07-30
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 13
[patent_figures_cnt] => 13
[patent_no_of_words] => 4744
[patent_no_of_claims] => 12
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[patent_current_assignee] =>[type] => publication
[pdf_file] => publications/A1/0040/20050040543.pdf
[firstpage_image] =>[orig_patent_app_number] => 10902467
[rel_patent_id] =>[rel_patent_doc_number] =>) 10/902467 | Semiconductor device and method of manufacturing the same | Jul 29, 2004 | Issued |
Array
(
[id] => 387007
[patent_doc_number] => 07304376
[patent_country] => US
[patent_kind] => B2
[patent_issue_date] => 2007-12-04
[patent_title] => 'Microelectronic assemblies with springs'
[patent_app_type] => utility
[patent_app_number] => 10/901407
[patent_app_country] => US
[patent_app_date] => 2004-07-28
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 7
[patent_figures_cnt] => 14
[patent_no_of_words] => 9211
[patent_no_of_claims] => 30
[patent_no_of_ind_claims] => 9
[patent_words_short_claim] => 97
[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => patent
[pdf_file] => patents/07/304/07304376.pdf
[firstpage_image] =>[orig_patent_app_number] => 10901407
[rel_patent_id] =>[rel_patent_doc_number] =>) 10/901407 | Microelectronic assemblies with springs | Jul 27, 2004 | Issued |
Array
(
[id] => 7253145
[patent_doc_number] => 20040259346
[patent_country] => US
[patent_kind] => A1
[patent_issue_date] => 2004-12-23
[patent_title] => 'Semiconductor device having a ball grid array and a fabrication process thereof'
[patent_app_type] => new
[patent_app_number] => 10/893297
[patent_app_country] => US
[patent_app_date] => 2004-07-19
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 44
[patent_figures_cnt] => 44
[patent_no_of_words] => 14850
[patent_no_of_claims] => 16
[patent_no_of_ind_claims] => 9
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[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => publication
[pdf_file] => publications/A1/0259/20040259346.pdf
[firstpage_image] =>[orig_patent_app_number] => 10893297
[rel_patent_id] =>[rel_patent_doc_number] =>) 10/893297 | Semiconductor device having a ball grid array and a fabrication process thereof | Jul 18, 2004 | Issued |
Array
(
[id] => 7214690
[patent_doc_number] => 20050253279
[patent_country] => US
[patent_kind] => A1
[patent_issue_date] => 2005-11-17
[patent_title] => 'Semiconductor chip package and method for fabricating the same'
[patent_app_type] => utility
[patent_app_number] => 10/891377
[patent_app_country] => US
[patent_app_date] => 2004-07-14
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 3
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[patent_no_of_words] => 2327
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[patent_current_assignee] =>[type] => publication
[pdf_file] => publications/A1/0253/20050253279.pdf
[firstpage_image] =>[orig_patent_app_number] => 10891377
[rel_patent_id] =>[rel_patent_doc_number] =>) 10/891377 | Semiconductor chip package and method for fabricating the same | Jul 13, 2004 | Issued |
Array
(
[id] => 5735680
[patent_doc_number] => 20060006070
[patent_country] => US
[patent_kind] => A1
[patent_issue_date] => 2006-01-12
[patent_title] => 'Copper conductor'
[patent_app_type] => utility
[patent_app_number] => 10/887087
[patent_app_country] => US
[patent_app_date] => 2004-07-09
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 4
[patent_figures_cnt] => 4
[patent_no_of_words] => 5816
[patent_no_of_claims] => 31
[patent_no_of_ind_claims] => 4
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[patent_maintenance] => 1
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[patent_current_assignee] =>[type] => publication
[pdf_file] => publications/A1/0006/20060006070.pdf
[firstpage_image] =>[orig_patent_app_number] => 10887087
[rel_patent_id] =>[rel_patent_doc_number] =>) 10/887087 | Copper conductor | Jul 8, 2004 | Issued |
Array
(
[id] => 602819
[patent_doc_number] => 07432583
[patent_country] => US
[patent_kind] => B2
[patent_issue_date] => 2008-10-07
[patent_title] => 'Leadless leadframe package substitute and stack package'
[patent_app_type] => utility
[patent_app_number] => 10/888827
[patent_app_country] => US
[patent_app_date] => 2004-07-08
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 9
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[patent_no_of_words] => 5017
[patent_no_of_claims] => 12
[patent_no_of_ind_claims] => 3
[patent_words_short_claim] => 122
[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => patent
[pdf_file] => patents/07/432/07432583.pdf
[firstpage_image] =>[orig_patent_app_number] => 10888827
[rel_patent_id] =>[rel_patent_doc_number] =>) 10/888827 | Leadless leadframe package substitute and stack package | Jul 7, 2004 | Issued |
Array
(
[id] => 738994
[patent_doc_number] => 07034392
[patent_country] => US
[patent_kind] => B2
[patent_issue_date] => 2006-04-25
[patent_title] => 'Duplexer'
[patent_app_type] => utility
[patent_app_number] => 10/886047
[patent_app_country] => US
[patent_app_date] => 2004-07-08
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 9
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[patent_no_of_words] => 3927
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[patent_current_assignee] =>[type] => patent
[pdf_file] => patents/07/034/07034392.pdf
[firstpage_image] =>[orig_patent_app_number] => 10886047
[rel_patent_id] =>[rel_patent_doc_number] =>) 10/886047 | Duplexer | Jul 7, 2004 | Issued |
Array
(
[id] => 5736135
[patent_doc_number] => 20060006525
[patent_country] => US
[patent_kind] => A1
[patent_issue_date] => 2006-01-12
[patent_title] => 'System and method for dissipating heat from a semiconductor module'
[patent_app_type] => utility
[patent_app_number] => 10/888907
[patent_app_country] => US
[patent_app_date] => 2004-07-08
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 12
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[patent_no_of_words] => 4276
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[pdf_file] => publications/A1/0006/20060006525.pdf
[firstpage_image] =>[orig_patent_app_number] => 10888907
[rel_patent_id] =>[rel_patent_doc_number] =>) 10/888907 | System and method for dissipating heat from a semiconductor module | Jul 7, 2004 | Issued |
Array
(
[id] => 7058946
[patent_doc_number] => 20050001305
[patent_country] => US
[patent_kind] => A1
[patent_issue_date] => 2005-01-06
[patent_title] => 'Stack package of semiconductor device'
[patent_app_type] => utility
[patent_app_number] => 10/884407
[patent_app_country] => US
[patent_app_date] => 2004-07-02
[patent_effective_date] => 0000-00-00
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[patent_no_of_words] => 5180
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[patent_current_assignee] =>[type] => publication
[pdf_file] => publications/A1/0001/20050001305.pdf
[firstpage_image] =>[orig_patent_app_number] => 10884407
[rel_patent_id] =>[rel_patent_doc_number] =>) 10/884407 | Stack package of semiconductor device | Jul 1, 2004 | Issued |
Array
(
[id] => 696365
[patent_doc_number] => 07071570
[patent_country] => US
[patent_kind] => B2
[patent_issue_date] => 2006-07-04
[patent_title] => 'Chip scale package and method of fabricating the same'
[patent_app_type] => utility
[patent_app_number] => 10/879157
[patent_app_country] => US
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[pdf_file] => patents/07/071/07071570.pdf
[firstpage_image] =>[orig_patent_app_number] => 10879157
[rel_patent_id] =>[rel_patent_doc_number] =>) 10/879157 | Chip scale package and method of fabricating the same | Jun 29, 2004 | Issued |
Array
(
[id] => 6978098
[patent_doc_number] => 20050287816
[patent_country] => US
[patent_kind] => A1
[patent_issue_date] => 2005-12-29
[patent_title] => 'Methods of forming patterned photoresist layers over semiconductor substrates'
[patent_app_type] => utility
[patent_app_number] => 10/879367
[patent_app_country] => US
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[pdf_file] => publications/A1/0287/20050287816.pdf
[firstpage_image] =>[orig_patent_app_number] => 10879367
[rel_patent_id] =>[rel_patent_doc_number] =>) 10/879367 | Methods of forming patterned photoresist layers over semiconductor substrates | Jun 27, 2004 | Issued |
Array
(
[id] => 536211
[patent_doc_number] => 07180187
[patent_country] => US
[patent_kind] => B2
[patent_issue_date] => 2007-02-20
[patent_title] => 'Interlayer connector for preventing delamination of semiconductor device'
[patent_app_type] => utility
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[pdf_file] => patents/07/180/07180187.pdf
[firstpage_image] =>[orig_patent_app_number] => 10710147
[rel_patent_id] =>[rel_patent_doc_number] =>) 10/710147 | Interlayer connector for preventing delamination of semiconductor device | Jun 21, 2004 | Issued |
Array
(
[id] => 7058972
[patent_doc_number] => 20050001331
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[patent_kind] => A1
[patent_issue_date] => 2005-01-06
[patent_title] => 'Module with a built-in semiconductor and method for producing the same'
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[pdf_file] => publications/A1/0001/20050001331.pdf
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[rel_patent_id] =>[rel_patent_doc_number] =>) 10/872727 | Module with a built-in semiconductor and method for producing the same | Jun 21, 2004 | Issued |
Array
(
[id] => 6929105
[patent_doc_number] => 20050280138
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[patent_issue_date] => 2005-12-22
[patent_title] => 'Ground plane for integrated circuit package'
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[firstpage_image] =>[orig_patent_app_number] => 10873817
[rel_patent_id] =>[rel_patent_doc_number] =>) 10/873817 | Ground plane for integrated circuit package | Jun 20, 2004 | Issued |
Array
(
[id] => 7407412
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[patent_title] => 'Semiconductor package having flex circuit with external contacts'
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[patent_current_assignee] =>[type] => publication
[pdf_file] => publications/A1/0227/20040227218.pdf
[firstpage_image] =>[orig_patent_app_number] => 10871925
[rel_patent_id] =>[rel_patent_doc_number] =>) 10/871925 | Semiconductor package having flex circuit with external contacts | Jun 17, 2004 | Issued |