
Roy Karl Potter
Examiner (ID: 13991, Phone: (571)272-1842 , Office: P/2822 )
| Most Active Art Unit | 2822 |
| Art Unit(s) | 2822, 2508, 2811, 3621 |
| Total Applications | 2584 |
| Issued Applications | 2409 |
| Pending Applications | 46 |
| Abandoned Applications | 141 |
Applications
| Application number | Title of the application | Filing Date | Status |
|---|---|---|---|
Array
(
[id] => 7323480
[patent_doc_number] => 20040251533
[patent_country] => US
[patent_kind] => A1
[patent_issue_date] => 2004-12-16
[patent_title] => 'Hybrid integrated circuit device'
[patent_app_type] => new
[patent_app_number] => 10/813137
[patent_app_country] => US
[patent_app_date] => 2004-03-29
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 7
[patent_figures_cnt] => 7
[patent_no_of_words] => 3502
[patent_no_of_claims] => 9
[patent_no_of_ind_claims] => 2
[patent_words_short_claim] => 59
[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => publication
[pdf_file] => publications/A1/0251/20040251533.pdf
[firstpage_image] =>[orig_patent_app_number] => 10813137
[rel_patent_id] =>[rel_patent_doc_number] =>) 10/813137 | Hybrid integrated circuit device | Mar 28, 2004 | Issued |
Array
(
[id] => 696322
[patent_doc_number] => 07071552
[patent_country] => US
[patent_kind] => B2
[patent_issue_date] => 2006-07-04
[patent_title] => 'IC die with directly bonded liquid cooling device'
[patent_app_type] => utility
[patent_app_number] => 10/813187
[patent_app_country] => US
[patent_app_date] => 2004-03-29
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 6
[patent_figures_cnt] => 13
[patent_no_of_words] => 3460
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[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => patent
[pdf_file] => patents/07/071/07071552.pdf
[firstpage_image] =>[orig_patent_app_number] => 10813187
[rel_patent_id] =>[rel_patent_doc_number] =>) 10/813187 | IC die with directly bonded liquid cooling device | Mar 28, 2004 | Issued |
Array
(
[id] => 703150
[patent_doc_number] => 07064422
[patent_country] => US
[patent_kind] => B2
[patent_issue_date] => 2006-06-20
[patent_title] => 'Electronic assembly with integrated IO and power contacts'
[patent_app_type] => utility
[patent_app_number] => 10/810957
[patent_app_country] => US
[patent_app_date] => 2004-03-26
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 5
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[patent_no_of_words] => 2433
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[patent_current_assignee] =>[type] => patent
[pdf_file] => patents/07/064/07064422.pdf
[firstpage_image] =>[orig_patent_app_number] => 10810957
[rel_patent_id] =>[rel_patent_doc_number] =>) 10/810957 | Electronic assembly with integrated IO and power contacts | Mar 25, 2004 | Issued |
Array
(
[id] => 7442249
[patent_doc_number] => 20040195683
[patent_country] => US
[patent_kind] => A1
[patent_issue_date] => 2004-10-07
[patent_title] => 'Compact electronic device and package used therefor'
[patent_app_type] => new
[patent_app_number] => 10/809887
[patent_app_country] => US
[patent_app_date] => 2004-03-26
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 5
[patent_figures_cnt] => 5
[patent_no_of_words] => 6007
[patent_no_of_claims] => 22
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[patent_current_assignee] =>[type] => publication
[pdf_file] => publications/A1/0195/20040195683.pdf
[firstpage_image] =>[orig_patent_app_number] => 10809887
[rel_patent_id] =>[rel_patent_doc_number] =>) 10/809887 | Compact electronic device and package used therefor | Mar 25, 2004 | Abandoned |
Array
(
[id] => 6955765
[patent_doc_number] => 20050212135
[patent_country] => US
[patent_kind] => A1
[patent_issue_date] => 2005-09-29
[patent_title] => 'Interconnect structure with dielectric barrier and fabrication method thereof'
[patent_app_type] => utility
[patent_app_number] => 10/811186
[patent_app_country] => US
[patent_app_date] => 2004-03-26
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 5
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[patent_no_of_words] => 2203
[patent_no_of_claims] => 41
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[patent_current_assignee] =>[type] => publication
[pdf_file] => publications/A1/0212/20050212135.pdf
[firstpage_image] =>[orig_patent_app_number] => 10811186
[rel_patent_id] =>[rel_patent_doc_number] =>) 10/811186 | Interconnect structure with dielectric barrier and fabrication method thereof | Mar 25, 2004 | Issued |
Array
(
[id] => 7406499
[patent_doc_number] => 20040175873
[patent_country] => US
[patent_kind] => A1
[patent_issue_date] => 2004-09-09
[patent_title] => 'Semiconductor device and method of forming the same'
[patent_app_type] => new
[patent_app_number] => 10/805327
[patent_app_country] => US
[patent_app_date] => 2004-03-22
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 11
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[patent_no_of_words] => 13983
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[pdf_file] => publications/A1/0175/20040175873.pdf
[firstpage_image] =>[orig_patent_app_number] => 10805327
[rel_patent_id] =>[rel_patent_doc_number] =>) 10/805327 | Semiconductor device and method of forming the same | Mar 21, 2004 | Issued |
Array
(
[id] => 7441156
[patent_doc_number] => 20040195577
[patent_country] => US
[patent_kind] => A1
[patent_issue_date] => 2004-10-07
[patent_title] => 'Solid-state imaging device'
[patent_app_type] => new
[patent_app_number] => 10/804807
[patent_app_country] => US
[patent_app_date] => 2004-03-19
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 18
[patent_figures_cnt] => 18
[patent_no_of_words] => 9007
[patent_no_of_claims] => 8
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[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => publication
[pdf_file] => publications/A1/0195/20040195577.pdf
[firstpage_image] =>[orig_patent_app_number] => 10804807
[rel_patent_id] =>[rel_patent_doc_number] =>) 10/804807 | Solid-state imaging device | Mar 18, 2004 | Issued |
Array
(
[id] => 6949153
[patent_doc_number] => 20050224247
[patent_country] => US
[patent_kind] => A1
[patent_issue_date] => 2005-10-13
[patent_title] => 'Cathodic lead insulator'
[patent_app_type] => utility
[patent_app_number] => 10/804316
[patent_app_country] => US
[patent_app_date] => 2004-03-18
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 6
[patent_figures_cnt] => 6
[patent_no_of_words] => 2900
[patent_no_of_claims] => 18
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[patent_current_assignee] =>[type] => publication
[pdf_file] => publications/A1/0224/20050224247.pdf
[firstpage_image] =>[orig_patent_app_number] => 10804316
[rel_patent_id] =>[rel_patent_doc_number] =>) 10/804316 | Cathodic lead insulator | Mar 17, 2004 | Issued |
Array
(
[id] => 737043
[patent_doc_number] => 07033858
[patent_country] => US
[patent_kind] => B2
[patent_issue_date] => 2006-04-25
[patent_title] => 'Method for making Group III nitride devices and devices produced thereby'
[patent_app_type] => utility
[patent_app_number] => 10/803467
[patent_app_country] => US
[patent_app_date] => 2004-03-18
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 7
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[patent_no_of_words] => 10962
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[patent_current_assignee] =>[type] => patent
[pdf_file] => patents/07/033/07033858.pdf
[firstpage_image] =>[orig_patent_app_number] => 10803467
[rel_patent_id] =>[rel_patent_doc_number] =>) 10/803467 | Method for making Group III nitride devices and devices produced thereby | Mar 17, 2004 | Issued |
Array
(
[id] => 7448691
[patent_doc_number] => 20040164424
[patent_country] => US
[patent_kind] => A1
[patent_issue_date] => 2004-08-26
[patent_title] => 'Flexibility enhanced integrated circuit carrier'
[patent_app_type] => new
[patent_app_number] => 10/791714
[patent_app_country] => US
[patent_app_date] => 2004-03-04
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 12
[patent_figures_cnt] => 12
[patent_no_of_words] => 3005
[patent_no_of_claims] => 12
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[patent_current_assignee] =>[type] => publication
[pdf_file] => publications/A1/0164/20040164424.pdf
[firstpage_image] =>[orig_patent_app_number] => 10791714
[rel_patent_id] =>[rel_patent_doc_number] =>) 10/791714 | Flexibility enhanced integrated circuit carrier | Mar 3, 2004 | Issued |
Array
(
[id] => 7086620
[patent_doc_number] => 20050006732
[patent_country] => US
[patent_kind] => A1
[patent_issue_date] => 2005-01-13
[patent_title] => 'Semiconductor package containing an integrated-circuit chip supported by electrical connection leads'
[patent_app_type] => utility
[patent_app_number] => 10/781557
[patent_app_country] => US
[patent_app_date] => 2004-02-18
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 7
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[patent_current_assignee] =>[type] => publication
[pdf_file] => publications/A1/0006/20050006732.pdf
[firstpage_image] =>[orig_patent_app_number] => 10781557
[rel_patent_id] =>[rel_patent_doc_number] =>) 10/781557 | Semiconductor package containing an integrated-circuit chip supported by electrical connection leads | Feb 17, 2004 | Issued |
Array
(
[id] => 774853
[patent_doc_number] => 07002240
[patent_country] => US
[patent_kind] => B2
[patent_issue_date] => 2006-02-21
[patent_title] => 'Semiconductor leadframe for staggered board attach'
[patent_app_type] => utility
[patent_app_number] => 10/779117
[patent_app_country] => US
[patent_app_date] => 2004-02-12
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 5
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[patent_current_assignee] =>[type] => patent
[pdf_file] => patents/07/002/07002240.pdf
[firstpage_image] =>[orig_patent_app_number] => 10779117
[rel_patent_id] =>[rel_patent_doc_number] =>) 10/779117 | Semiconductor leadframe for staggered board attach | Feb 11, 2004 | Issued |
Array
(
[id] => 7291833
[patent_doc_number] => 20040212072
[patent_country] => US
[patent_kind] => A1
[patent_issue_date] => 2004-10-28
[patent_title] => 'Semiconductor package'
[patent_app_type] => new
[patent_app_number] => 10/776227
[patent_app_country] => US
[patent_app_date] => 2004-02-12
[patent_effective_date] => 0000-00-00
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[pdf_file] => publications/A1/0212/20040212072.pdf
[firstpage_image] =>[orig_patent_app_number] => 10776227
[rel_patent_id] =>[rel_patent_doc_number] =>) 10/776227 | Semiconductor package | Feb 11, 2004 | Issued |
Array
(
[id] => 810015
[patent_doc_number] => 07416918
[patent_country] => US
[patent_kind] => B2
[patent_issue_date] => 2008-08-26
[patent_title] => 'Direct build-up layer on an encapsulated die package having a moisture barrier structure'
[patent_app_type] => utility
[patent_app_number] => 10/774923
[patent_app_country] => US
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[patent_current_assignee] =>[type] => patent
[pdf_file] => patents/07/416/07416918.pdf
[firstpage_image] =>[orig_patent_app_number] => 10774923
[rel_patent_id] =>[rel_patent_doc_number] =>) 10/774923 | Direct build-up layer on an encapsulated die package having a moisture barrier structure | Feb 8, 2004 | Issued |
Array
(
[id] => 774739
[patent_doc_number] => 07002179
[patent_country] => US
[patent_kind] => B2
[patent_issue_date] => 2006-02-21
[patent_title] => 'ZnO system semiconductor device'
[patent_app_type] => utility
[patent_app_number] => 10/772077
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[pdf_file] => patents/07/002/07002179.pdf
[firstpage_image] =>[orig_patent_app_number] => 10772077
[rel_patent_id] =>[rel_patent_doc_number] =>) 10/772077 | ZnO system semiconductor device | Feb 3, 2004 | Issued |
Array
(
[id] => 938387
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[patent_title] => 'Semiconductor package with enhanced electrical and thermal performance and method for fabricating the same'
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[pdf_file] => patents/06/972/06972216.pdf
[firstpage_image] =>[orig_patent_app_number] => 10768307
[rel_patent_id] =>[rel_patent_doc_number] =>) 10/768307 | Semiconductor package with enhanced electrical and thermal performance and method for fabricating the same | Jan 28, 2004 | Issued |
Array
(
[id] => 7420570
[patent_doc_number] => 20040183073
[patent_country] => US
[patent_kind] => A1
[patent_issue_date] => 2004-09-23
[patent_title] => 'Large grain size polysilicon films formed by nuclei-induced solid phase crystallization'
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[patent_app_number] => 10/767525
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[rel_patent_id] =>[rel_patent_doc_number] =>) 10/767525 | Large grain size polysilicon films formed by nuclei-induced solid phase crystallization | Jan 28, 2004 | Issued |
Array
(
[id] => 7421155
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[firstpage_image] =>[orig_patent_app_number] => 10764457
[rel_patent_id] =>[rel_patent_doc_number] =>) 10/764457 | IC chip package | Jan 26, 2004 | Issued |
Array
(
[id] => 712271
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[patent_title] => 'Cavity case with clip/plug for use on multi-media card'
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[rel_patent_id] =>[rel_patent_doc_number] =>) 10/765397 | Cavity case with clip/plug for use on multi-media card | Jan 26, 2004 | Issued |
Array
(
[id] => 664118
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[patent_title] => 'Lead frame, manufacturing method of the same, and semiconductor device using the same'
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[patent_current_assignee] =>[type] => patent
[pdf_file] => patents/07/102/07102210.pdf
[firstpage_image] =>[orig_patent_app_number] => 10763227
[rel_patent_id] =>[rel_patent_doc_number] =>) 10/763227 | Lead frame, manufacturing method of the same, and semiconductor device using the same | Jan 25, 2004 | Issued |