Roy Karl Potter

Array ( [id] => 7375712 [patent_doc_number] => 20040178508 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2004-09-16 [patent_title] => 'Stacked semiconductor device' [patent_app_type] => new [patent_app_number] => 10/763267 [patent_app_country] => US [patent_app_date] => 2004-01-26 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 8 [patent_figures_cnt] => 8 [patent_no_of_words] => 6497 [patent_no_of_claims] => 9 [patent_no_of_ind_claims] => 1 [patent_words_short_claim] => 171 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] => publications/A1/0178/20040178508.pdf [firstpage_image] =>[orig_patent_app_number] => 10763267 [rel_patent_id] =>[rel_patent_doc_number] =>)

Array ( [id] => 725907 [patent_doc_number] => 07045895 [patent_country] => US [patent_kind] => B2 [patent_issue_date] => 2006-05-16 [patent_title] => 'Semiconductor device and method for manufacturing the same' [patent_app_type] => utility [patent_app_number] => 10/763847 [patent_app_country] => US [patent_app_date] => 2004-01-23 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 25 [patent_figures_cnt] => 37 [patent_no_of_words] => 7527 [patent_no_of_claims] => 16 [patent_no_of_ind_claims] => 2 [patent_words_short_claim] => 62 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/07/045/07045895.pdf [firstpage_image] =>[orig_patent_app_number] => 10763847 [rel_patent_id] =>[rel_patent_doc_number] =>)

Array ( [id] => 404648 [patent_doc_number] => 07288477 [patent_country] => US [patent_kind] => B2 [patent_issue_date] => 2007-10-30 [patent_title] => 'Electro-luminescence device including a thin film transistor and method of fabricating an electro-luminescence device' [patent_app_type] => utility [patent_app_number] => 10/761607 [patent_app_country] => US [patent_app_date] => 2004-01-21 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 8 [patent_figures_cnt] => 14 [patent_no_of_words] => 6016 [patent_no_of_claims] => 13 [patent_no_of_ind_claims] => 2 [patent_words_short_claim] => 124 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/07/288/07288477.pdf [firstpage_image] =>[orig_patent_app_number] => 10761607 [rel_patent_id] =>[rel_patent_doc_number] =>)

Array ( [id] => 1009776 [patent_doc_number] => 06900538 [patent_country] => US [patent_kind] => B2 [patent_issue_date] => 2005-05-31 [patent_title] => 'Integrating chip scale packaging metallization into integrated circuit die structures' [patent_app_type] => utility [patent_app_number] => 10/760434 [patent_app_country] => US [patent_app_date] => 2004-01-20 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 4 [patent_figures_cnt] => 7 [patent_no_of_words] => 4348 [patent_no_of_claims] => 7 [patent_no_of_ind_claims] => 2 [patent_words_short_claim] => 79 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/06/900/06900538.pdf [firstpage_image] =>[orig_patent_app_number] => 10760434 [rel_patent_id] =>[rel_patent_doc_number] =>)

Array ( [id] => 7412034 [patent_doc_number] => 20040207094 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2004-10-21 [patent_title] => 'Package substrate and a flip chip mounted semiconductor device' [patent_app_type] => new [patent_app_number] => 10/756507 [patent_app_country] => US [patent_app_date] => 2004-01-14 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 21 [patent_figures_cnt] => 21 [patent_no_of_words] => 7427 [patent_no_of_claims] => 19 [patent_no_of_ind_claims] => 2 [patent_words_short_claim] => 101 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] => publications/A1/0207/20040207094.pdf [firstpage_image] =>[orig_patent_app_number] => 10756507 [rel_patent_id] =>[rel_patent_doc_number] =>)

Array ( [id] => 7283651 [patent_doc_number] => 20040145042 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2004-07-29 [patent_title] => 'Semiconductor device' [patent_app_type] => new [patent_app_number] => 10/756497 [patent_app_country] => US [patent_app_date] => 2004-01-14 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 9 [patent_figures_cnt] => 9 [patent_no_of_words] => 5429 [patent_no_of_claims] => 20 [patent_no_of_ind_claims] => 3 [patent_words_short_claim] => 144 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] => publications/A1/0145/20040145042.pdf [firstpage_image] =>[orig_patent_app_number] => 10756497 [rel_patent_id] =>[rel_patent_doc_number] =>)

Array ( [id] => 638389 [patent_doc_number] => 07126227 [patent_country] => US [patent_kind] => B2 [patent_issue_date] => 2006-10-24 [patent_title] => 'Wiring substrate, semiconductor device, semiconductor module, electronic equipment, method for designing wiring substrate, method for manufacturing semiconductor device, and method for manufacturing semiconductor module' [patent_app_type] => utility [patent_app_number] => 10/753357 [patent_app_country] => US [patent_app_date] => 2004-01-09 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 13 [patent_figures_cnt] => 32 [patent_no_of_words] => 8865 [patent_no_of_claims] => 13 [patent_no_of_ind_claims] => 12 [patent_words_short_claim] => 34 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/07/126/07126227.pdf [firstpage_image] =>[orig_patent_app_number] => 10753357 [rel_patent_id] =>[rel_patent_doc_number] =>)

Array ( [id] => 436177 [patent_doc_number] => 07262435 [patent_country] => US [patent_kind] => B2 [patent_issue_date] => 2007-08-28 [patent_title] => 'Single-transverse-mode laser diode with multi-mode waveguide region and manufacturing method of the same' [patent_app_type] => utility [patent_app_number] => 10/752565 [patent_app_country] => US [patent_app_date] => 2004-01-08 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 8 [patent_figures_cnt] => 9 [patent_no_of_words] => 3449 [patent_no_of_claims] => 4 [patent_no_of_ind_claims] => 2 [patent_words_short_claim] => 66 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/07/262/07262435.pdf [firstpage_image] =>[orig_patent_app_number] => 10752565 [rel_patent_id] =>[rel_patent_doc_number] =>)

Array ( [id] => 767211 [patent_doc_number] => 07009270 [patent_country] => US [patent_kind] => B2 [patent_issue_date] => 2006-03-07 [patent_title] => 'Substrate for stressed systems and method of making same' [patent_app_type] => utility [patent_app_number] => 10/755007 [patent_app_country] => US [patent_app_date] => 2004-01-08 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 3 [patent_figures_cnt] => 8 [patent_no_of_words] => 3861 [patent_no_of_claims] => 27 [patent_no_of_ind_claims] => 3 [patent_words_short_claim] => 59 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/07/009/07009270.pdf [firstpage_image] =>[orig_patent_app_number] => 10755007 [rel_patent_id] =>[rel_patent_doc_number] =>)

Array ( [id] => 536037 [patent_doc_number] => 07180171 [patent_country] => US [patent_kind] => B1 [patent_issue_date] => 2007-02-20 [patent_title] => 'Single IC packaging solution for multi chip modules' [patent_app_type] => utility [patent_app_number] => 10/754807 [patent_app_country] => US [patent_app_date] => 2004-01-08 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 4 [patent_figures_cnt] => 6 [patent_no_of_words] => 2178 [patent_no_of_claims] => 14 [patent_no_of_ind_claims] => 3 [patent_words_short_claim] => 45 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/07/180/07180171.pdf [firstpage_image] =>[orig_patent_app_number] => 10754807 [rel_patent_id] =>[rel_patent_doc_number] =>)

Array ( [id] => 7260481 [patent_doc_number] => 20040150117 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2004-08-05 [patent_title] => 'Semiconductor device and method of packaging the same' [patent_app_type] => new [patent_app_number] => 10/753827 [patent_app_country] => US [patent_app_date] => 2004-01-05 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 4 [patent_figures_cnt] => 4 [patent_no_of_words] => 3894 [patent_no_of_claims] => 20 [patent_no_of_ind_claims] => 4 [patent_words_short_claim] => 48 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] => publications/A1/0150/20040150117.pdf [firstpage_image] =>[orig_patent_app_number] => 10753827 [rel_patent_id] =>[rel_patent_doc_number] =>)

Array ( [id] => 7318925 [patent_doc_number] => 20040135244 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2004-07-15 [patent_title] => 'Semiconductor device' [patent_app_type] => new [patent_app_number] => 10/750857 [patent_app_country] => US [patent_app_date] => 2004-01-05 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 6 [patent_figures_cnt] => 6 [patent_no_of_words] => 5283 [patent_no_of_claims] => 10 [patent_no_of_ind_claims] => 3 [patent_words_short_claim] => 78 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] => publications/A1/0135/20040135244.pdf [firstpage_image] =>[orig_patent_app_number] => 10750857 [rel_patent_id] =>[rel_patent_doc_number] =>)

Array ( [id] => 769572 [patent_doc_number] => 07000316 [patent_country] => US [patent_kind] => B2 [patent_issue_date] => 2006-02-21 [patent_title] => 'Conductor board and method for producing a conductor board' [patent_app_type] => utility [patent_app_number] => 10/750617 [patent_app_country] => US [patent_app_date] => 2003-12-31 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 5 [patent_figures_cnt] => 5 [patent_no_of_words] => 4561 [patent_no_of_claims] => 18 [patent_no_of_ind_claims] => 2 [patent_words_short_claim] => 118 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/07/000/07000316.pdf [firstpage_image] =>[orig_patent_app_number] => 10750617 [rel_patent_id] =>[rel_patent_doc_number] =>)

Array ( [id] => 944340 [patent_doc_number] => 06967394 [patent_country] => US [patent_kind] => B2 [patent_issue_date] => 2005-11-22 [patent_title] => 'Multi-chip package' [patent_app_type] => utility [patent_app_number] => 10/748257 [patent_app_country] => US [patent_app_date] => 2003-12-31 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 3 [patent_figures_cnt] => 5 [patent_no_of_words] => 2971 [patent_no_of_claims] => 18 [patent_no_of_ind_claims] => 2 [patent_words_short_claim] => 161 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/06/967/06967394.pdf [firstpage_image] =>[orig_patent_app_number] => 10748257 [rel_patent_id] =>[rel_patent_doc_number] =>)

Array ( [id] => 774886 [patent_doc_number] => 07002255 [patent_country] => US [patent_kind] => B2 [patent_issue_date] => 2006-02-21 [patent_title] => 'Multi-chips stacked package' [patent_app_type] => utility [patent_app_number] => 10/747127 [patent_app_country] => US [patent_app_date] => 2003-12-30 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 2 [patent_figures_cnt] => 4 [patent_no_of_words] => 2230 [patent_no_of_claims] => 11 [patent_no_of_ind_claims] => 1 [patent_words_short_claim] => 137 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/07/002/07002255.pdf [firstpage_image] =>[orig_patent_app_number] => 10747127 [rel_patent_id] =>[rel_patent_doc_number] =>)

Array ( [id] => 7421375 [patent_doc_number] => 20040183201 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2004-09-23 [patent_title] => 'Wiring structure for semiconductor device' [patent_app_type] => new [patent_app_number] => 10/747807 [patent_app_country] => US [patent_app_date] => 2003-12-30 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 6 [patent_figures_cnt] => 6 [patent_no_of_words] => 2615 [patent_no_of_claims] => 6 [patent_no_of_ind_claims] => 1 [patent_words_short_claim] => 34 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] => publications/A1/0183/20040183201.pdf [firstpage_image] =>[orig_patent_app_number] => 10747807 [rel_patent_id] =>[rel_patent_doc_number] =>)

Array ( [id] => 7421291 [patent_doc_number] => 20040183188 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2004-09-23 [patent_title] => 'Semiconductor module and semiconductor device' [patent_app_type] => new [patent_app_number] => 10/744787 [patent_app_country] => US [patent_app_date] => 2003-12-24 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 19 [patent_figures_cnt] => 19 [patent_no_of_words] => 13906 [patent_no_of_claims] => 23 [patent_no_of_ind_claims] => 4 [patent_words_short_claim] => 139 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] => publications/A1/0183/20040183188.pdf [firstpage_image] =>[orig_patent_app_number] => 10744787 [rel_patent_id] =>[rel_patent_doc_number] =>)

Array ( [id] => 7375941 [patent_doc_number] => 20040219775 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2004-11-04 [patent_title] => 'Lead free bump and method of forming the same' [patent_app_type] => new [patent_app_number] => 10/743757 [patent_app_country] => US [patent_app_date] => 2003-12-24 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 7 [patent_figures_cnt] => 7 [patent_no_of_words] => 5171 [patent_no_of_claims] => 17 [patent_no_of_ind_claims] => 3 [patent_words_short_claim] => 32 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] => publications/A1/0219/20040219775.pdf [firstpage_image] =>[orig_patent_app_number] => 10743757 [rel_patent_id] =>[rel_patent_doc_number] =>)

Array ( [id] => 7036895 [patent_doc_number] => 20050156329 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2005-07-21 [patent_title] => 'Semiconductor device by embedded package' [patent_app_type] => utility [patent_app_number] => 10/743777 [patent_app_country] => US [patent_app_date] => 2003-12-24 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 4 [patent_figures_cnt] => 4 [patent_no_of_words] => 1352 [patent_no_of_claims] => 4 [patent_no_of_ind_claims] => 1 [patent_words_short_claim] => 0 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] => publications/A1/0156/20050156329.pdf [firstpage_image] =>[orig_patent_app_number] => 10743777 [rel_patent_id] =>[rel_patent_doc_number] =>)

Array ( [id] => 770230 [patent_doc_number] => 07005725 [patent_country] => US [patent_kind] => B2 [patent_issue_date] => 2006-02-28 [patent_title] => 'Discrete component comprising HF diodes in series with a common cathode' [patent_app_type] => utility [patent_app_number] => 10/744407 [patent_app_country] => US [patent_app_date] => 2003-12-23 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 3 [patent_figures_cnt] => 7 [patent_no_of_words] => 2863 [patent_no_of_claims] => 7 [patent_no_of_ind_claims] => 1 [patent_words_short_claim] => 142 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/07/005/07005725.pdf [firstpage_image] =>[orig_patent_app_number] => 10744407 [rel_patent_id] =>[rel_patent_doc_number] =>)