
Roy Karl Potter
Examiner (ID: 13991, Phone: (571)272-1842 , Office: P/2822 )
| Most Active Art Unit | 2822 |
| Art Unit(s) | 2822, 2508, 2811, 3621 |
| Total Applications | 2584 |
| Issued Applications | 2409 |
| Pending Applications | 46 |
| Abandoned Applications | 141 |
Applications
| Application number | Title of the application | Filing Date | Status |
|---|---|---|---|
Array
(
[id] => 7353823
[patent_doc_number] => 20040089925
[patent_country] => US
[patent_kind] => A1
[patent_issue_date] => 2004-05-13
[patent_title] => 'Semiconductor device having radiation structure'
[patent_app_type] => new
[patent_app_number] => 10/699746
[patent_app_country] => US
[patent_app_date] => 2003-11-04
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 27
[patent_figures_cnt] => 27
[patent_no_of_words] => 25167
[patent_no_of_claims] => 65
[patent_no_of_ind_claims] => 11
[patent_words_short_claim] => 67
[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => publication
[pdf_file] => publications/A1/0089/20040089925.pdf
[firstpage_image] =>[orig_patent_app_number] => 10699746
[rel_patent_id] =>[rel_patent_doc_number] =>) 10/699746 | Semiconductor device having radiation structure | Nov 3, 2003 | Issued |
Array
(
[id] => 931402
[patent_doc_number] => 06979906
[patent_country] => US
[patent_kind] => B2
[patent_issue_date] => 2005-12-27
[patent_title] => 'Solder on a sloped surface'
[patent_app_type] => utility
[patent_app_number] => 10/698725
[patent_app_country] => US
[patent_app_date] => 2003-10-30
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 7
[patent_figures_cnt] => 14
[patent_no_of_words] => 2980
[patent_no_of_claims] => 14
[patent_no_of_ind_claims] => 3
[patent_words_short_claim] => 42
[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => patent
[pdf_file] => patents/06/979/06979906.pdf
[firstpage_image] =>[orig_patent_app_number] => 10698725
[rel_patent_id] =>[rel_patent_doc_number] =>) 10/698725 | Solder on a sloped surface | Oct 29, 2003 | Issued |
Array
(
[id] => 7383103
[patent_doc_number] => 20040082102
[patent_country] => US
[patent_kind] => A1
[patent_issue_date] => 2004-04-29
[patent_title] => 'Semiconductor device, semiconductor package for use therein, and manufacturing method thereof'
[patent_app_type] => new
[patent_app_number] => 10/690627
[patent_app_country] => US
[patent_app_date] => 2003-10-23
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 7
[patent_figures_cnt] => 7
[patent_no_of_words] => 5280
[patent_no_of_claims] => 11
[patent_no_of_ind_claims] => 3
[patent_words_short_claim] => 77
[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => publication
[pdf_file] => publications/A1/0082/20040082102.pdf
[firstpage_image] =>[orig_patent_app_number] => 10690627
[rel_patent_id] =>[rel_patent_doc_number] =>) 10/690627 | Semiconductor device, semiconductor package for use therein, and manufacturing method thereof | Oct 22, 2003 | Issued |
Array
(
[id] => 7353997
[patent_doc_number] => 20040089945
[patent_country] => US
[patent_kind] => A1
[patent_issue_date] => 2004-05-13
[patent_title] => 'Semiconductor device'
[patent_app_type] => new
[patent_app_number] => 10/689097
[patent_app_country] => US
[patent_app_date] => 2003-10-21
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 7
[patent_figures_cnt] => 7
[patent_no_of_words] => 4457
[patent_no_of_claims] => 9
[patent_no_of_ind_claims] => 2
[patent_words_short_claim] => 78
[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => publication
[pdf_file] => publications/A1/0089/20040089945.pdf
[firstpage_image] =>[orig_patent_app_number] => 10689097
[rel_patent_id] =>[rel_patent_doc_number] =>) 10/689097 | Semiconductor device | Oct 20, 2003 | Issued |
Array
(
[id] => 734341
[patent_doc_number] => 07038318
[patent_country] => US
[patent_kind] => B2
[patent_issue_date] => 2006-05-02
[patent_title] => 'Compound structure for reduced contact resistance'
[patent_app_type] => utility
[patent_app_number] => 10/689894
[patent_app_country] => US
[patent_app_date] => 2003-10-21
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 7
[patent_figures_cnt] => 11
[patent_no_of_words] => 8654
[patent_no_of_claims] => 35
[patent_no_of_ind_claims] => 9
[patent_words_short_claim] => 71
[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => patent
[pdf_file] => patents/07/038/07038318.pdf
[firstpage_image] =>[orig_patent_app_number] => 10689894
[rel_patent_id] =>[rel_patent_doc_number] =>) 10/689894 | Compound structure for reduced contact resistance | Oct 20, 2003 | Issued |
Array
(
[id] => 7612387
[patent_doc_number] => 06903450
[patent_country] => US
[patent_kind] => B2
[patent_issue_date] => 2005-06-07
[patent_title] => 'Semiconductor device and method of manufacturing the same'
[patent_app_type] => utility
[patent_app_number] => 10/686587
[patent_app_country] => US
[patent_app_date] => 2003-10-17
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 12
[patent_figures_cnt] => 30
[patent_no_of_words] => 10942
[patent_no_of_claims] => 19
[patent_no_of_ind_claims] => 2
[patent_words_short_claim] => 121
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[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => patent
[pdf_file] => patents/06/903/06903450.pdf
[firstpage_image] =>[orig_patent_app_number] => 10686587
[rel_patent_id] =>[rel_patent_doc_number] =>) 10/686587 | Semiconductor device and method of manufacturing the same | Oct 16, 2003 | Issued |
Array
(
[id] => 7353718
[patent_doc_number] => 20040089911
[patent_country] => US
[patent_kind] => A1
[patent_issue_date] => 2004-05-13
[patent_title] => 'Semiconductor integrated circuit and method of manufacturing the same'
[patent_app_type] => new
[patent_app_number] => 10/685387
[patent_app_country] => US
[patent_app_date] => 2003-10-16
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 15
[patent_figures_cnt] => 15
[patent_no_of_words] => 14290
[patent_no_of_claims] => 30
[patent_no_of_ind_claims] => 13
[patent_words_short_claim] => 60
[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => publication
[pdf_file] => publications/A1/0089/20040089911.pdf
[firstpage_image] =>[orig_patent_app_number] => 10685387
[rel_patent_id] =>[rel_patent_doc_number] =>) 10/685387 | Semiconductor integrated circuit and method of manufacturing the same | Oct 15, 2003 | Issued |
Array
(
[id] => 7334144
[patent_doc_number] => 20040188789
[patent_country] => US
[patent_kind] => A1
[patent_issue_date] => 2004-09-30
[patent_title] => 'Semiconductor device and method for machining a semiconductor substrate'
[patent_app_type] => new
[patent_app_number] => 10/684507
[patent_app_country] => US
[patent_app_date] => 2003-10-15
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 5
[patent_figures_cnt] => 5
[patent_no_of_words] => 5368
[patent_no_of_claims] => 5
[patent_no_of_ind_claims] => 2
[patent_words_short_claim] => 100
[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => publication
[pdf_file] => publications/A1/0188/20040188789.pdf
[firstpage_image] =>[orig_patent_app_number] => 10684507
[rel_patent_id] =>[rel_patent_doc_number] =>) 10/684507 | Semiconductor device and method for machining a semiconductor substrate | Oct 14, 2003 | Abandoned |
Array
(
[id] => 7466739
[patent_doc_number] => 20040102000
[patent_country] => US
[patent_kind] => A1
[patent_issue_date] => 2004-05-27
[patent_title] => 'Photon-blocking layer'
[patent_app_type] => new
[patent_app_number] => 10/684617
[patent_app_country] => US
[patent_app_date] => 2003-10-14
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 4
[patent_figures_cnt] => 4
[patent_no_of_words] => 1602
[patent_no_of_claims] => 26
[patent_no_of_ind_claims] => 3
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[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => publication
[pdf_file] => publications/A1/0102/20040102000.pdf
[firstpage_image] =>[orig_patent_app_number] => 10684617
[rel_patent_id] =>[rel_patent_doc_number] =>) 10/684617 | Photon-blocking layer | Oct 13, 2003 | Issued |
Array
(
[id] => 7405397
[patent_doc_number] => 20040262777
[patent_country] => US
[patent_kind] => A1
[patent_issue_date] => 2004-12-30
[patent_title] => 'Components, methods and assemblies for multi-chip packages'
[patent_app_type] => new
[patent_app_number] => 10/683097
[patent_app_country] => US
[patent_app_date] => 2003-10-10
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 13
[patent_figures_cnt] => 13
[patent_no_of_words] => 5820
[patent_no_of_claims] => 27
[patent_no_of_ind_claims] => 4
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[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => publication
[pdf_file] => publications/A1/0262/20040262777.pdf
[firstpage_image] =>[orig_patent_app_number] => 10683097
[rel_patent_id] =>[rel_patent_doc_number] =>) 10/683097 | Components, methods and assemblies for multi-chip packages | Oct 9, 2003 | Issued |
Array
(
[id] => 7295051
[patent_doc_number] => 20040124007
[patent_country] => US
[patent_kind] => A1
[patent_issue_date] => 2004-07-01
[patent_title] => 'Circuit board, mounting structure for semiconductor device with bumps, and electro-optic device and electronic device'
[patent_app_type] => new
[patent_app_number] => 10/682357
[patent_app_country] => US
[patent_app_date] => 2003-10-09
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 20
[patent_figures_cnt] => 20
[patent_no_of_words] => 7418
[patent_no_of_claims] => 13
[patent_no_of_ind_claims] => 3
[patent_words_short_claim] => 66
[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => publication
[pdf_file] => publications/A1/0124/20040124007.pdf
[firstpage_image] =>[orig_patent_app_number] => 10682357
[rel_patent_id] =>[rel_patent_doc_number] =>) 10/682357 | Circuit board, mounting structure for semiconductor device with bumps, and electro-optic device and electronic device | Oct 8, 2003 | Issued |
Array
(
[id] => 638376
[patent_doc_number] => 07126219
[patent_country] => US
[patent_kind] => B2
[patent_issue_date] => 2006-10-24
[patent_title] => 'Small memory card'
[patent_app_type] => utility
[patent_app_number] => 10/683837
[patent_app_country] => US
[patent_app_date] => 2003-10-09
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 2
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[patent_no_of_words] => 1227
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[patent_words_short_claim] => 223
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[patent_current_assignee] =>[type] => patent
[pdf_file] => patents/07/126/07126219.pdf
[firstpage_image] =>[orig_patent_app_number] => 10683837
[rel_patent_id] =>[rel_patent_doc_number] =>) 10/683837 | Small memory card | Oct 8, 2003 | Issued |
Array
(
[id] => 7159612
[patent_doc_number] => 20040075169
[patent_country] => US
[patent_kind] => A1
[patent_issue_date] => 2004-04-22
[patent_title] => 'Semiconductor integrated circuit'
[patent_app_type] => new
[patent_app_number] => 10/680117
[patent_app_country] => US
[patent_app_date] => 2003-10-08
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 5
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[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => publication
[pdf_file] => publications/A1/0075/20040075169.pdf
[firstpage_image] =>[orig_patent_app_number] => 10680117
[rel_patent_id] =>[rel_patent_doc_number] =>) 10/680117 | Semiconductor integrated circuit | Oct 7, 2003 | Issued |
Array
(
[id] => 7301298
[patent_doc_number] => 20040113275
[patent_country] => US
[patent_kind] => A1
[patent_issue_date] => 2004-06-17
[patent_title] => 'Semiconductor multi-package module having inverted second package stacked over die-up flip-chip ball grid array (BGA) package'
[patent_app_type] => new
[patent_app_number] => 10/681747
[patent_app_country] => US
[patent_app_date] => 2003-10-08
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 21
[patent_figures_cnt] => 21
[patent_no_of_words] => 28695
[patent_no_of_claims] => 42
[patent_no_of_ind_claims] => 2
[patent_words_short_claim] => 61
[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => publication
[pdf_file] => publications/A1/0113/20040113275.pdf
[firstpage_image] =>[orig_patent_app_number] => 10681747
[rel_patent_id] =>[rel_patent_doc_number] =>) 10/681747 | Semiconductor multi-package module having inverted second package stacked over die-up flip-chip ball grid array (BGA) package | Oct 7, 2003 | Issued |
Array
(
[id] => 738999
[patent_doc_number] => 07034394
[patent_country] => US
[patent_kind] => B2
[patent_issue_date] => 2006-04-25
[patent_title] => 'Microelectronic assembly having thermoelectric elements to cool a die and a method of making the same'
[patent_app_type] => utility
[patent_app_number] => 10/682137
[patent_app_country] => US
[patent_app_date] => 2003-10-08
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 8
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[patent_current_assignee] =>[type] => patent
[pdf_file] => patents/07/034/07034394.pdf
[firstpage_image] =>[orig_patent_app_number] => 10682137
[rel_patent_id] =>[rel_patent_doc_number] =>) 10/682137 | Microelectronic assembly having thermoelectric elements to cool a die and a method of making the same | Oct 7, 2003 | Issued |
Array
(
[id] => 627371
[patent_doc_number] => 07135756
[patent_country] => US
[patent_kind] => B2
[patent_issue_date] => 2006-11-14
[patent_title] => 'Array of cells including a selection bipolar transistor and fabrication method thereof'
[patent_app_type] => utility
[patent_app_number] => 10/680727
[patent_app_country] => US
[patent_app_date] => 2003-10-07
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 4
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[patent_no_of_words] => 2695
[patent_no_of_claims] => 31
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[patent_current_assignee] =>[type] => patent
[pdf_file] => patents/07/135/07135756.pdf
[firstpage_image] =>[orig_patent_app_number] => 10680727
[rel_patent_id] =>[rel_patent_doc_number] =>) 10/680727 | Array of cells including a selection bipolar transistor and fabrication method thereof | Oct 6, 2003 | Issued |
Array
(
[id] => 7246907
[patent_doc_number] => 20050073813
[patent_country] => US
[patent_kind] => A1
[patent_issue_date] => 2005-04-07
[patent_title] => 'Circuit board assembly'
[patent_app_type] => utility
[patent_app_number] => 10/680857
[patent_app_country] => US
[patent_app_date] => 2003-10-07
[patent_effective_date] => 0000-00-00
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[patent_current_assignee] =>[type] => publication
[pdf_file] => publications/A1/0073/20050073813.pdf
[firstpage_image] =>[orig_patent_app_number] => 10680857
[rel_patent_id] =>[rel_patent_doc_number] =>) 10/680857 | Circuit board assembly | Oct 6, 2003 | Issued |
Array
(
[id] => 1037811
[patent_doc_number] => 06872962
[patent_country] => US
[patent_kind] => B1
[patent_issue_date] => 2005-03-29
[patent_title] => 'Radio frequency (RF) filter within multilayered low temperature co-fired ceramic (LTCC) substrate'
[patent_app_type] => utility
[patent_app_number] => 10/675547
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[pdf_file] => patents/06/872/06872962.pdf
[firstpage_image] =>[orig_patent_app_number] => 10675547
[rel_patent_id] =>[rel_patent_doc_number] =>) 10/675547 | Radio frequency (RF) filter within multilayered low temperature co-fired ceramic (LTCC) substrate | Sep 29, 2003 | Issued |
Array
(
[id] => 7270004
[patent_doc_number] => 20040058522
[patent_country] => US
[patent_kind] => A1
[patent_issue_date] => 2004-03-25
[patent_title] => 'Integrated circuit devices formed through selective etching of an insulation layer to increase the self-aligned contact area adjacent a semiconductor region'
[patent_app_type] => new
[patent_app_number] => 10/663968
[patent_app_country] => US
[patent_app_date] => 2003-09-16
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 24
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[pdf_file] => publications/A1/0058/20040058522.pdf
[firstpage_image] =>[orig_patent_app_number] => 10663968
[rel_patent_id] =>[rel_patent_doc_number] =>) 10/663968 | Integrated circuit devices formed through selective etching of an insulation layer to increase the self-aligned contact area adjacent a semiconductor region | Sep 15, 2003 | Issued |
Array
(
[id] => 521376
[patent_doc_number] => 07186593
[patent_country] => US
[patent_kind] => B2
[patent_issue_date] => 2007-03-06
[patent_title] => 'Methods of fabricating integrated circuit devices having fuse structures including buffer layers'
[patent_app_type] => utility
[patent_app_number] => 10/663967
[patent_app_country] => US
[patent_app_date] => 2003-09-16
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 15
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[patent_no_of_words] => 7644
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[patent_current_assignee] =>[type] => patent
[pdf_file] => patents/07/186/07186593.pdf
[firstpage_image] =>[orig_patent_app_number] => 10663967
[rel_patent_id] =>[rel_patent_doc_number] =>) 10/663967 | Methods of fabricating integrated circuit devices having fuse structures including buffer layers | Sep 15, 2003 | Issued |