
Roy Karl Potter
Examiner (ID: 13991, Phone: (571)272-1842 , Office: P/2822 )
| Most Active Art Unit | 2822 |
| Art Unit(s) | 2822, 2508, 2811, 3621 |
| Total Applications | 2584 |
| Issued Applications | 2409 |
| Pending Applications | 46 |
| Abandoned Applications | 141 |
Applications
| Application number | Title of the application | Filing Date | Status |
|---|---|---|---|
Array
(
[id] => 10993085
[patent_doc_number] => 20160190030
[patent_country] => US
[patent_kind] => A1
[patent_issue_date] => 2016-06-30
[patent_title] => 'SELF-LIMITING CHEMICAL VAPOR DEPOSITION AND ATOMIC LAYER DEPOSITION METHODS'
[patent_app_type] => utility
[patent_app_number] => 15/060795
[patent_app_country] => US
[patent_app_date] => 2016-03-04
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 2
[patent_figures_cnt] => 2
[patent_no_of_words] => 4400
[patent_no_of_claims] => 18
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[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => publication
[pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 15060795
[rel_patent_id] =>[rel_patent_doc_number] =>) 15/060795 | Self-limiting chemical vapor deposition and atomic layer deposition methods | Mar 3, 2016 | Issued |
Array
(
[id] => 11753455
[patent_doc_number] => 09711473
[patent_country] => US
[patent_kind] => B1
[patent_issue_date] => 2017-07-18
[patent_title] => 'Semiconductor die, semiconductor wafer and method for manufacturing the same'
[patent_app_type] => utility
[patent_app_number] => 15/054502
[patent_app_country] => US
[patent_app_date] => 2016-02-26
[patent_effective_date] => 0000-00-00
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[pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 15054502
[rel_patent_id] =>[rel_patent_doc_number] =>) 15/054502 | Semiconductor die, semiconductor wafer and method for manufacturing the same | Feb 25, 2016 | Issued |
Array
(
[id] => 11391813
[patent_doc_number] => 09553064
[patent_country] => US
[patent_kind] => B2
[patent_issue_date] => 2017-01-24
[patent_title] => 'Electronic device, and manufacturing method of electronic device'
[patent_app_type] => utility
[patent_app_number] => 15/054413
[patent_app_country] => US
[patent_app_date] => 2016-02-26
[patent_effective_date] => 0000-00-00
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[rel_patent_id] =>[rel_patent_doc_number] =>) 15/054413 | Electronic device, and manufacturing method of electronic device | Feb 25, 2016 | Issued |
Array
(
[id] => 11630013
[patent_doc_number] => 20170140202
[patent_country] => US
[patent_kind] => A1
[patent_issue_date] => 2017-05-18
[patent_title] => 'Fingerprint Sensor Device and Method'
[patent_app_type] => utility
[patent_app_number] => 15/053357
[patent_app_country] => US
[patent_app_date] => 2016-02-25
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 16
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[rel_patent_id] =>[rel_patent_doc_number] =>) 15/053357 | Fingerprint sensor device and method | Feb 24, 2016 | Issued |
Array
(
[id] => 11551584
[patent_doc_number] => 09620440
[patent_country] => US
[patent_kind] => B1
[patent_issue_date] => 2017-04-11
[patent_title] => 'Power module packaging with dual side cooling'
[patent_app_type] => utility
[patent_app_number] => 15/054117
[patent_app_country] => US
[patent_app_date] => 2016-02-25
[patent_effective_date] => 0000-00-00
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[rel_patent_id] =>[rel_patent_doc_number] =>) 15/054117 | Power module packaging with dual side cooling | Feb 24, 2016 | Issued |
Array
(
[id] => 11063724
[patent_doc_number] => 20160260686
[patent_country] => US
[patent_kind] => A1
[patent_issue_date] => 2016-09-08
[patent_title] => 'RESIN-ENCAPSULATED SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME'
[patent_app_type] => utility
[patent_app_number] => 15/053267
[patent_app_country] => US
[patent_app_date] => 2016-02-25
[patent_effective_date] => 0000-00-00
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[rel_patent_id] =>[rel_patent_doc_number] =>) 15/053267 | Resin-encapsulated semiconductor device and method of manufacturing the same | Feb 24, 2016 | Issued |
Array
(
[id] => 11453249
[patent_doc_number] => 09576901
[patent_country] => US
[patent_kind] => B1
[patent_issue_date] => 2017-02-21
[patent_title] => 'Contact area structure and method for manufacturing the same'
[patent_app_type] => utility
[patent_app_number] => 15/053106
[patent_app_country] => US
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[patent_effective_date] => 0000-00-00
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[pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 15053106
[rel_patent_id] =>[rel_patent_doc_number] =>) 15/053106 | Contact area structure and method for manufacturing the same | Feb 24, 2016 | Issued |
Array
(
[id] => 11315363
[patent_doc_number] => 20160351472
[patent_country] => US
[patent_kind] => A1
[patent_issue_date] => 2016-12-01
[patent_title] => 'INTEGRATED CIRCUIT DEVICE AND METHOD OF MANUFACTURING THE SAME'
[patent_app_type] => utility
[patent_app_number] => 15/053410
[patent_app_country] => US
[patent_app_date] => 2016-02-25
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 34
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[pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 15053410
[rel_patent_id] =>[rel_patent_doc_number] =>) 15/053410 | INTEGRATED CIRCUIT DEVICE AND METHOD OF MANUFACTURING THE SAME | Feb 24, 2016 | Abandoned |
Array
(
[id] => 11585822
[patent_doc_number] => 09640474
[patent_country] => US
[patent_kind] => B1
[patent_issue_date] => 2017-05-02
[patent_title] => 'Power semiconductor package having power semiconductor die in a support substrate with bar vias'
[patent_app_type] => utility
[patent_app_number] => 15/052520
[patent_app_country] => US
[patent_app_date] => 2016-02-24
[patent_effective_date] => 0000-00-00
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[rel_patent_id] =>[rel_patent_doc_number] =>) 15/052520 | Power semiconductor package having power semiconductor die in a support substrate with bar vias | Feb 23, 2016 | Issued |
Array
(
[id] => 11861962
[patent_doc_number] => 09741651
[patent_country] => US
[patent_kind] => B1
[patent_issue_date] => 2017-08-22
[patent_title] => 'Redistribution layer lines'
[patent_app_type] => utility
[patent_app_number] => 15/052505
[patent_app_country] => US
[patent_app_date] => 2016-02-24
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 11
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[patent_current_assignee] =>[type] => patent
[pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 15052505
[rel_patent_id] =>[rel_patent_doc_number] =>) 15/052505 | Redistribution layer lines | Feb 23, 2016 | Issued |
Array
(
[id] => 11071236
[patent_doc_number] => 20160268200
[patent_country] => US
[patent_kind] => A1
[patent_issue_date] => 2016-09-15
[patent_title] => 'SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF'
[patent_app_type] => utility
[patent_app_number] => 15/052377
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[rel_patent_id] =>[rel_patent_doc_number] =>) 15/052377 | Semiconductor device and manufacturing method thereof | Feb 23, 2016 | Issued |
Array
(
[id] => 11911203
[patent_doc_number] => 09780024
[patent_country] => US
[patent_kind] => B2
[patent_issue_date] => 2017-10-03
[patent_title] => 'Semiconductor package and manufacturing method thereof'
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[rel_patent_id] =>[rel_patent_doc_number] =>) 15/052219 | Semiconductor package and manufacturing method thereof | Feb 23, 2016 | Issued |
Array
(
[id] => 11315380
[patent_doc_number] => 20160351491
[patent_country] => US
[patent_kind] => A1
[patent_issue_date] => 2016-12-01
[patent_title] => 'WIRING STRUCTURE AND ELECTRONIC DEVICE INCLUDING THE SAME'
[patent_app_type] => utility
[patent_app_number] => 15/052290
[patent_app_country] => US
[patent_app_date] => 2016-02-24
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[rel_patent_id] =>[rel_patent_doc_number] =>) 15/052290 | Wiring structure and electronic device including the same | Feb 23, 2016 | Issued |
Array
(
[id] => 11939702
[patent_doc_number] => 20170243852
[patent_country] => US
[patent_kind] => A1
[patent_issue_date] => 2017-08-24
[patent_title] => 'ENHANCED CLEANING FOR WATER-SOLUBLE FLUX SOLDERING'
[patent_app_type] => utility
[patent_app_number] => 15/052461
[patent_app_country] => US
[patent_app_date] => 2016-02-24
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[pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 15052461
[rel_patent_id] =>[rel_patent_doc_number] =>) 15/052461 | Enhanced cleaning for water-soluble flux soldering | Feb 23, 2016 | Issued |
Array
(
[id] => 11087669
[patent_doc_number] => 20160284638
[patent_country] => US
[patent_kind] => A1
[patent_issue_date] => 2016-09-29
[patent_title] => 'CHIP PACKAGE STRUCTURE AND MANUFACTURING METHOD THEREFOR'
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[patent_app_number] => 15/051432
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[rel_patent_id] =>[rel_patent_doc_number] =>) 15/051432 | Chip package structure and manufacturing method therefor | Feb 22, 2016 | Issued |
Array
(
[id] => 10817522
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[patent_title] => 'Air Trench in Packages Incorporating Hybrid Bonding'
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[rel_patent_id] =>[rel_patent_doc_number] =>) 15/042268 | Air trench in packages incorporating hybrid bonding | Feb 11, 2016 | Issued |
Array
(
[id] => 13392755
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[patent_title] => DISPLAY DEVICE AND IMAGING DEVICE
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[rel_patent_id] =>[rel_patent_doc_number] =>) 15/553324 | Display device and imaging device | Jan 31, 2016 | Issued |
Array
(
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[patent_issue_date] => 2018-05-29
[patent_title] => Film-forming mask, film-forming device, and film-forming method
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Array
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[patent_title] => Ball grid array and land grid array assemblies fabricated using temporary resist
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Array
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