Search

Roy Karl Potter

Examiner (ID: 13991, Phone: (571)272-1842 , Office: P/2822 )

Most Active Art Unit
2822
Art Unit(s)
2822, 2508, 2811, 3621
Total Applications
2584
Issued Applications
2409
Pending Applications
46
Abandoned Applications
141

Applications

Application numberTitle of the applicationFiling DateStatus
Array ( [id] => 6768091 [patent_doc_number] => 20030214031 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2003-11-20 [patent_title] => 'Thermoelectric module package' [patent_app_type] => new [patent_app_number] => 10/406237 [patent_app_country] => US [patent_app_date] => 2003-04-04 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 23 [patent_figures_cnt] => 23 [patent_no_of_words] => 11228 [patent_no_of_claims] => 13 [patent_no_of_ind_claims] => 7 [patent_words_short_claim] => 29 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] => publications/A1/0214/20030214031.pdf [firstpage_image] =>[orig_patent_app_number] => 10406237 [rel_patent_id] =>[rel_patent_doc_number] =>)
10/406237
Thermoelectric module package Apr 3, 2003 Issued
Array ( [id] => 6723477 [patent_doc_number] => 20030205789 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2003-11-06 [patent_title] => 'Structure and method for securing bussing leads' [patent_app_type] => new [patent_app_number] => 10/407648 [patent_app_country] => US [patent_app_date] => 2003-04-04 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 9 [patent_figures_cnt] => 9 [patent_no_of_words] => 3468 [patent_no_of_claims] => 14 [patent_no_of_ind_claims] => 5 [patent_words_short_claim] => 109 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] => publications/A1/0205/20030205789.pdf [firstpage_image] =>[orig_patent_app_number] => 10407648 [rel_patent_id] =>[rel_patent_doc_number] =>)
10/407648
Structure and method for securing bussing leads Apr 3, 2003 Issued
Array ( [id] => 560368 [patent_doc_number] => 07161246 [patent_country] => US [patent_kind] => B2 [patent_issue_date] => 2007-01-09 [patent_title] => 'Interconnect alloys and methods and apparatus using same' [patent_app_type] => utility [patent_app_number] => 10/405796 [patent_app_country] => US [patent_app_date] => 2003-03-31 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 5 [patent_figures_cnt] => 12 [patent_no_of_words] => 5758 [patent_no_of_claims] => 78 [patent_no_of_ind_claims] => 17 [patent_words_short_claim] => 13 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/07/161/07161246.pdf [firstpage_image] =>[orig_patent_app_number] => 10405796 [rel_patent_id] =>[rel_patent_doc_number] =>)
10/405796
Interconnect alloys and methods and apparatus using same Mar 30, 2003 Issued
Array ( [id] => 7610974 [patent_doc_number] => 06841883 [patent_country] => US [patent_kind] => B1 [patent_issue_date] => 2005-01-11 [patent_title] => 'Multi-dice chip scale semiconductor components and wafer level methods of fabrication' [patent_app_type] => utility [patent_app_number] => 10/403937 [patent_app_country] => US [patent_app_date] => 2003-03-31 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 27 [patent_figures_cnt] => 62 [patent_no_of_words] => 14675 [patent_no_of_claims] => 71 [patent_no_of_ind_claims] => 21 [patent_words_short_claim] => 64 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/06/841/06841883.pdf [firstpage_image] =>[orig_patent_app_number] => 10403937 [rel_patent_id] =>[rel_patent_doc_number] =>)
10/403937
Multi-dice chip scale semiconductor components and wafer level methods of fabrication Mar 30, 2003 Issued
Array ( [id] => 1034484 [patent_doc_number] => 06875693 [patent_country] => US [patent_kind] => B1 [patent_issue_date] => 2005-04-05 [patent_title] => 'Via and metal line interface capable of reducing the incidence of electro-migration induced voids' [patent_app_type] => utility [patent_app_number] => 10/400297 [patent_app_country] => US [patent_app_date] => 2003-03-26 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 5 [patent_figures_cnt] => 16 [patent_no_of_words] => 5926 [patent_no_of_claims] => 17 [patent_no_of_ind_claims] => 1 [patent_words_short_claim] => 162 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/06/875/06875693.pdf [firstpage_image] =>[orig_patent_app_number] => 10400297 [rel_patent_id] =>[rel_patent_doc_number] =>)
10/400297
Via and metal line interface capable of reducing the incidence of electro-migration induced voids Mar 25, 2003 Issued
Array ( [id] => 6727728 [patent_doc_number] => 20030183918 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2003-10-02 [patent_title] => 'Tape Carrier Package' [patent_app_type] => new [patent_app_number] => 10/395232 [patent_app_country] => US [patent_app_date] => 2003-03-25 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 3 [patent_figures_cnt] => 3 [patent_no_of_words] => 3351 [patent_no_of_claims] => 35 [patent_no_of_ind_claims] => 4 [patent_words_short_claim] => 164 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] => publications/A1/0183/20030183918.pdf [firstpage_image] =>[orig_patent_app_number] => 10395232 [rel_patent_id] =>[rel_patent_doc_number] =>)
10/395232
Tape carrier package Mar 24, 2003 Issued
Array ( [id] => 1248267 [patent_doc_number] => 06673708 [patent_country] => US [patent_kind] => B1 [patent_issue_date] => 2004-01-06 [patent_title] => 'Thermal and mechanical attachment of a heatspreader to a flip-chip integrated circuit structure using underfill' [patent_app_type] => B1 [patent_app_number] => 10/397065 [patent_app_country] => US [patent_app_date] => 2003-03-25 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 2 [patent_figures_cnt] => 5 [patent_no_of_words] => 4058 [patent_no_of_claims] => 15 [patent_no_of_ind_claims] => 1 [patent_words_short_claim] => 46 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/06/673/06673708.pdf [firstpage_image] =>[orig_patent_app_number] => 10397065 [rel_patent_id] =>[rel_patent_doc_number] =>)
10/397065
Thermal and mechanical attachment of a heatspreader to a flip-chip integrated circuit structure using underfill Mar 24, 2003 Issued
Array ( [id] => 1109029 [patent_doc_number] => 06809404 [patent_country] => US [patent_kind] => B2 [patent_issue_date] => 2004-10-26 [patent_title] => 'Semiconductor device' [patent_app_type] => B2 [patent_app_number] => 10/393917 [patent_app_country] => US [patent_app_date] => 2003-03-24 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 7 [patent_figures_cnt] => 10 [patent_no_of_words] => 5006 [patent_no_of_claims] => 7 [patent_no_of_ind_claims] => 1 [patent_words_short_claim] => 158 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/06/809/06809404.pdf [firstpage_image] =>[orig_patent_app_number] => 10393917 [rel_patent_id] =>[rel_patent_doc_number] =>)
10/393917
Semiconductor device Mar 23, 2003 Issued
Array ( [id] => 7388524 [patent_doc_number] => 20040017007 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2004-01-29 [patent_title] => 'Semiconductor package and substrate thereof' [patent_app_type] => new [patent_app_number] => 10/394347 [patent_app_country] => US [patent_app_date] => 2003-03-24 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 9 [patent_figures_cnt] => 9 [patent_no_of_words] => 3483 [patent_no_of_claims] => 29 [patent_no_of_ind_claims] => 4 [patent_words_short_claim] => 66 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] => publications/A1/0017/20040017007.pdf [firstpage_image] =>[orig_patent_app_number] => 10394347 [rel_patent_id] =>[rel_patent_doc_number] =>)
10/394347
Semiconductor package and substrate thereof Mar 23, 2003 Issued
Array ( [id] => 7421200 [patent_doc_number] => 20040183177 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2004-09-23 [patent_title] => 'Methods and apparatus for attaching getters to MEMS device housings' [patent_app_type] => new [patent_app_number] => 10/393237 [patent_app_country] => US [patent_app_date] => 2003-03-20 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 8 [patent_figures_cnt] => 8 [patent_no_of_words] => 3894 [patent_no_of_claims] => 31 [patent_no_of_ind_claims] => 5 [patent_words_short_claim] => 50 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] => publications/A1/0183/20040183177.pdf [firstpage_image] =>[orig_patent_app_number] => 10393237 [rel_patent_id] =>[rel_patent_doc_number] =>)
10/393237
Methods and apparatus for attaching getters to MEMS device housings Mar 19, 2003 Issued
Array ( [id] => 7421424 [patent_doc_number] => 20040183210 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2004-09-23 [patent_title] => 'Protective layers formed on semiconductor device components so as to reduce or eliminate the occurrence of delamination thereof and cracking therein' [patent_app_type] => new [patent_app_number] => 10/391267 [patent_app_country] => US [patent_app_date] => 2003-03-18 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 5 [patent_figures_cnt] => 5 [patent_no_of_words] => 6469 [patent_no_of_claims] => 62 [patent_no_of_ind_claims] => 3 [patent_words_short_claim] => 46 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] => publications/A1/0183/20040183210.pdf [firstpage_image] =>[orig_patent_app_number] => 10391267 [rel_patent_id] =>[rel_patent_doc_number] =>)
10/391267
Protective layers formed on semiconductor device components so as to reduce or eliminate the occurrence of delamination thereof and cracking therein Mar 17, 2003 Issued
Array ( [id] => 6794785 [patent_doc_number] => 20030173658 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2003-09-18 [patent_title] => 'Semiconductor device, manufacturing method for semiconductor device and mounting method for the same' [patent_app_type] => new [patent_app_number] => 10/386490 [patent_app_country] => US [patent_app_date] => 2003-03-13 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 13 [patent_figures_cnt] => 13 [patent_no_of_words] => 4252 [patent_no_of_claims] => 9 [patent_no_of_ind_claims] => 6 [patent_words_short_claim] => 51 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] => publications/A1/0173/20030173658.pdf [firstpage_image] =>[orig_patent_app_number] => 10386490 [rel_patent_id] =>[rel_patent_doc_number] =>)
10/386490
Semiconductor device, manufacturing method for semiconductor device and mounting method for the same Mar 12, 2003 Issued
Array ( [id] => 1155833 [patent_doc_number] => 06764937 [patent_country] => US [patent_kind] => B1 [patent_issue_date] => 2004-07-20 [patent_title] => 'Solder on a sloped surface' [patent_app_type] => B1 [patent_app_number] => 10/385487 [patent_app_country] => US [patent_app_date] => 2003-03-12 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 7 [patent_figures_cnt] => 14 [patent_no_of_words] => 2954 [patent_no_of_claims] => 26 [patent_no_of_ind_claims] => 4 [patent_words_short_claim] => 78 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/06/764/06764937.pdf [firstpage_image] =>[orig_patent_app_number] => 10385487 [rel_patent_id] =>[rel_patent_doc_number] =>)
10/385487
Solder on a sloped surface Mar 11, 2003 Issued
Array ( [id] => 6738272 [patent_doc_number] => 20030155640 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2003-08-21 [patent_title] => 'Integrated circuit package' [patent_app_type] => new [patent_app_number] => 10/387046 [patent_app_country] => US [patent_app_date] => 2003-03-12 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 12 [patent_figures_cnt] => 12 [patent_no_of_words] => 4741 [patent_no_of_claims] => 41 [patent_no_of_ind_claims] => 7 [patent_words_short_claim] => 30 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] => publications/A1/0155/20030155640.pdf [firstpage_image] =>[orig_patent_app_number] => 10387046 [rel_patent_id] =>[rel_patent_doc_number] =>)
10/387046
Integrated circuit package Mar 11, 2003 Issued
Array ( [id] => 1210965 [patent_doc_number] => 06713861 [patent_country] => US [patent_kind] => B2 [patent_issue_date] => 2004-03-30 [patent_title] => 'Method of removing free halogen from a halogenated polymer insulating layer of a semiconductor device and resulting semiconductor device' [patent_app_type] => B2 [patent_app_number] => 10/382835 [patent_app_country] => US [patent_app_date] => 2003-03-07 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 5 [patent_figures_cnt] => 11 [patent_no_of_words] => 3486 [patent_no_of_claims] => 10 [patent_no_of_ind_claims] => 2 [patent_words_short_claim] => 34 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/06/713/06713861.pdf [firstpage_image] =>[orig_patent_app_number] => 10382835 [rel_patent_id] =>[rel_patent_doc_number] =>)
10/382835
Method of removing free halogen from a halogenated polymer insulating layer of a semiconductor device and resulting semiconductor device Mar 6, 2003 Issued
Array ( [id] => 6823831 [patent_doc_number] => 20030234453 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2003-12-25 [patent_title] => 'FLIP CHIP INTERCONNCETION STRUCTURE AND PROCESS OF MAKING THE SAME' [patent_app_type] => new [patent_app_number] => 10/248992 [patent_app_country] => US [patent_app_date] => 2003-03-07 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 6 [patent_figures_cnt] => 6 [patent_no_of_words] => 3050 [patent_no_of_claims] => 8 [patent_no_of_ind_claims] => 1 [patent_words_short_claim] => 106 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] => publications/A1/0234/20030234453.pdf [firstpage_image] =>[orig_patent_app_number] => 10248992 [rel_patent_id] =>[rel_patent_doc_number] =>)
10/248992
Flip chip interconnection structure and process of making the same Mar 6, 2003 Issued
Array ( [id] => 7610987 [patent_doc_number] => 06841870 [patent_country] => US [patent_kind] => B2 [patent_issue_date] => 2005-01-11 [patent_title] => 'Semiconductor device' [patent_app_type] => utility [patent_app_number] => 10/382497 [patent_app_country] => US [patent_app_date] => 2003-03-07 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 11 [patent_figures_cnt] => 21 [patent_no_of_words] => 6147 [patent_no_of_claims] => 20 [patent_no_of_ind_claims] => 4 [patent_words_short_claim] => 108 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/06/841/06841870.pdf [firstpage_image] =>[orig_patent_app_number] => 10382497 [rel_patent_id] =>[rel_patent_doc_number] =>)
10/382497
Semiconductor device Mar 6, 2003 Issued
Array ( [id] => 1134092 [patent_doc_number] => 06784040 [patent_country] => US [patent_kind] => B2 [patent_issue_date] => 2004-08-31 [patent_title] => 'Nonvolatile semiconductor memory device and method for fabricating the same' [patent_app_type] => B2 [patent_app_number] => 10/382508 [patent_app_country] => US [patent_app_date] => 2003-03-07 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 52 [patent_figures_cnt] => 172 [patent_no_of_words] => 41853 [patent_no_of_claims] => 59 [patent_no_of_ind_claims] => 6 [patent_words_short_claim] => 281 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/06/784/06784040.pdf [firstpage_image] =>[orig_patent_app_number] => 10382508 [rel_patent_id] =>[rel_patent_doc_number] =>)
10/382508
Nonvolatile semiconductor memory device and method for fabricating the same Mar 6, 2003 Issued
Array ( [id] => 6699467 [patent_doc_number] => 20030222347 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2003-12-04 [patent_title] => 'High aspect ratio fill method and resulting structure' [patent_app_type] => new [patent_app_number] => 10/376280 [patent_app_country] => US [patent_app_date] => 2003-03-03 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 6 [patent_figures_cnt] => 6 [patent_no_of_words] => 3431 [patent_no_of_claims] => 65 [patent_no_of_ind_claims] => 3 [patent_words_short_claim] => 53 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] => publications/A1/0222/20030222347.pdf [firstpage_image] =>[orig_patent_app_number] => 10376280 [rel_patent_id] =>[rel_patent_doc_number] =>)
10/376280
High aspect ratio fill method and resulting structure Mar 2, 2003 Issued
Array ( [id] => 6662194 [patent_doc_number] => 20030201520 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2003-10-30 [patent_title] => 'Structure and method of forming a multiple leadframe semiconductor device' [patent_app_type] => new [patent_app_number] => 10/374630 [patent_app_country] => US [patent_app_date] => 2003-02-27 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 6 [patent_figures_cnt] => 6 [patent_no_of_words] => 3895 [patent_no_of_claims] => 38 [patent_no_of_ind_claims] => 10 [patent_words_short_claim] => 31 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] => publications/A1/0201/20030201520.pdf [firstpage_image] =>[orig_patent_app_number] => 10374630 [rel_patent_id] =>[rel_patent_doc_number] =>)
10/374630
Structure and method of forming a multiple leadframe semiconductor device Feb 26, 2003 Issued
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