Search

Roy Karl Potter

Examiner (ID: 13991, Phone: (571)272-1842 , Office: P/2822 )

Most Active Art Unit
2822
Art Unit(s)
2822, 2508, 2811, 3621
Total Applications
2584
Issued Applications
2409
Pending Applications
46
Abandoned Applications
141

Applications

Application numberTitle of the applicationFiling DateStatus
Array ( [id] => 6656075 [patent_doc_number] => 20030132533 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2003-07-17 [patent_title] => 'Semiconductor device, method of manufacturing semiconductor device and a method of manufacturing lead frame' [patent_app_type] => new [patent_app_number] => 10/372177 [patent_app_country] => US [patent_app_date] => 2003-02-25 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 32 [patent_figures_cnt] => 32 [patent_no_of_words] => 16074 [patent_no_of_claims] => 43 [patent_no_of_ind_claims] => 11 [patent_words_short_claim] => 29 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] => publications/A1/0132/20030132533.pdf [firstpage_image] =>[orig_patent_app_number] => 10372177 [rel_patent_id] =>[rel_patent_doc_number] =>)
10/372177
Semiconductor device, method of manufacturing semiconductor device and a method of manufacturing lead frame Feb 24, 2003 Abandoned
Array ( [id] => 6706365 [patent_doc_number] => 20030153099 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2003-08-14 [patent_title] => 'Method of making a flexible substrate with a filler material' [patent_app_type] => new [patent_app_number] => 10/372594 [patent_app_country] => US [patent_app_date] => 2003-02-24 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 7 [patent_figures_cnt] => 7 [patent_no_of_words] => 4367 [patent_no_of_claims] => 27 [patent_no_of_ind_claims] => 2 [patent_words_short_claim] => 25 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] => publications/A1/0153/20030153099.pdf [firstpage_image] =>[orig_patent_app_number] => 10372594 [rel_patent_id] =>[rel_patent_doc_number] =>)
10/372594
Method of making a flexible substrate with a filler material Feb 23, 2003 Issued
Array ( [id] => 1153461 [patent_doc_number] => 06770981 [patent_country] => US [patent_kind] => B2 [patent_issue_date] => 2004-08-03 [patent_title] => 'Composite interposer for BGA packages' [patent_app_type] => B2 [patent_app_number] => 10/373261 [patent_app_country] => US [patent_app_date] => 2003-02-24 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 6 [patent_figures_cnt] => 9 [patent_no_of_words] => 4327 [patent_no_of_claims] => 33 [patent_no_of_ind_claims] => 10 [patent_words_short_claim] => 26 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/06/770/06770981.pdf [firstpage_image] =>[orig_patent_app_number] => 10373261 [rel_patent_id] =>[rel_patent_doc_number] =>)
10/373261
Composite interposer for BGA packages Feb 23, 2003 Issued
Array ( [id] => 6832782 [patent_doc_number] => 20030160327 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2003-08-28 [patent_title] => 'Semiconductor device' [patent_app_type] => new [patent_app_number] => 10/369517 [patent_app_country] => US [patent_app_date] => 2003-02-21 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 14 [patent_figures_cnt] => 14 [patent_no_of_words] => 10694 [patent_no_of_claims] => 20 [patent_no_of_ind_claims] => 2 [patent_words_short_claim] => 80 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] => publications/A1/0160/20030160327.pdf [firstpage_image] =>[orig_patent_app_number] => 10369517 [rel_patent_id] =>[rel_patent_doc_number] =>)
10/369517
Semiconductor device with protective layer Feb 20, 2003 Issued
Array ( [id] => 6823824 [patent_doc_number] => 20030234446 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2003-12-25 [patent_title] => 'Flat leadframe for a semiconductor package' [patent_app_type] => new [patent_app_number] => 10/371397 [patent_app_country] => US [patent_app_date] => 2003-02-20 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 8 [patent_figures_cnt] => 8 [patent_no_of_words] => 2573 [patent_no_of_claims] => 16 [patent_no_of_ind_claims] => 9 [patent_words_short_claim] => 43 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] => publications/A1/0234/20030234446.pdf [firstpage_image] =>[orig_patent_app_number] => 10371397 [rel_patent_id] =>[rel_patent_doc_number] =>)
10/371397
Flat leadframe for a semiconductor package Feb 19, 2003 Issued
Array ( [id] => 6738295 [patent_doc_number] => 20030155663 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2003-08-21 [patent_title] => 'Adhesives, adhesive films and electric devices' [patent_app_type] => new [patent_app_number] => 10/369297 [patent_app_country] => US [patent_app_date] => 2003-02-18 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 3 [patent_figures_cnt] => 3 [patent_no_of_words] => 4070 [patent_no_of_claims] => 8 [patent_no_of_ind_claims] => 3 [patent_words_short_claim] => 56 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] => publications/A1/0155/20030155663.pdf [firstpage_image] =>[orig_patent_app_number] => 10369297 [rel_patent_id] =>[rel_patent_doc_number] =>)
10/369297
Adhesives, adhesive films and electric devices Feb 17, 2003 Issued
Array ( [id] => 539224 [patent_doc_number] => 07173341 [patent_country] => US [patent_kind] => B2 [patent_issue_date] => 2007-02-06 [patent_title] => 'High performance thermally enhanced package and method of fabricating the same' [patent_app_type] => utility [patent_app_number] => 10/368337 [patent_app_country] => US [patent_app_date] => 2003-02-18 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 9 [patent_figures_cnt] => 21 [patent_no_of_words] => 4322 [patent_no_of_claims] => 24 [patent_no_of_ind_claims] => 3 [patent_words_short_claim] => 138 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/07/173/07173341.pdf [firstpage_image] =>[orig_patent_app_number] => 10368337 [rel_patent_id] =>[rel_patent_doc_number] =>)
10/368337
High performance thermally enhanced package and method of fabricating the same Feb 17, 2003 Issued
Array ( [id] => 1083506 [patent_doc_number] => 06833617 [patent_country] => US [patent_kind] => B2 [patent_issue_date] => 2004-12-21 [patent_title] => 'Composite material including copper and cuprous oxide and application thereof' [patent_app_type] => B2 [patent_app_number] => 10/364460 [patent_app_country] => US [patent_app_date] => 2003-02-12 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 15 [patent_figures_cnt] => 26 [patent_no_of_words] => 9440 [patent_no_of_claims] => 12 [patent_no_of_ind_claims] => 4 [patent_words_short_claim] => 58 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/06/833/06833617.pdf [firstpage_image] =>[orig_patent_app_number] => 10364460 [rel_patent_id] =>[rel_patent_doc_number] =>)
10/364460
Composite material including copper and cuprous oxide and application thereof Feb 11, 2003 Issued
Array ( [id] => 1132638 [patent_doc_number] => 06787922 [patent_country] => US [patent_kind] => B2 [patent_issue_date] => 2004-09-07 [patent_title] => 'Semiconductor chipmounting board' [patent_app_type] => B2 [patent_app_number] => 10/361605 [patent_app_country] => US [patent_app_date] => 2003-02-11 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 8 [patent_figures_cnt] => 13 [patent_no_of_words] => 5039 [patent_no_of_claims] => 5 [patent_no_of_ind_claims] => 2 [patent_words_short_claim] => 195 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/06/787/06787922.pdf [firstpage_image] =>[orig_patent_app_number] => 10361605 [rel_patent_id] =>[rel_patent_doc_number] =>)
10/361605
Semiconductor chipmounting board Feb 10, 2003 Issued
Array ( [id] => 6707601 [patent_doc_number] => 20030154335 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2003-08-14 [patent_title] => 'Encoding element for an electric module and electric module including such encoding element' [patent_app_type] => new [patent_app_number] => 10/360187 [patent_app_country] => US [patent_app_date] => 2003-02-07 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 6 [patent_figures_cnt] => 6 [patent_no_of_words] => 2400 [patent_no_of_claims] => 15 [patent_no_of_ind_claims] => 2 [patent_words_short_claim] => 41 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] => publications/A1/0154/20030154335.pdf [firstpage_image] =>[orig_patent_app_number] => 10360187 [rel_patent_id] =>[rel_patent_doc_number] =>)
10/360187
Encoding element for an electric module and electric module including such encoding element Feb 6, 2003 Abandoned
Array ( [id] => 1300285 [patent_doc_number] => 06627990 [patent_country] => US [patent_kind] => B1 [patent_issue_date] => 2003-09-30 [patent_title] => 'Thermally enhanced stacked die package' [patent_app_type] => B1 [patent_app_number] => 10/359407 [patent_app_country] => US [patent_app_date] => 2003-02-06 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 5 [patent_figures_cnt] => 10 [patent_no_of_words] => 3794 [patent_no_of_claims] => 56 [patent_no_of_ind_claims] => 3 [patent_words_short_claim] => 98 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/06/627/06627990.pdf [firstpage_image] =>[orig_patent_app_number] => 10359407 [rel_patent_id] =>[rel_patent_doc_number] =>)
10/359407
Thermally enhanced stacked die package Feb 5, 2003 Issued
Array ( [id] => 7260291 [patent_doc_number] => 20040150079 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2004-08-05 [patent_title] => 'UNDERFILL COMPOUNDS INCLUDING ELECTRICALLY CHARGED FILLER ELEMENTS, MICROELECTRONIC DEVICES HAVING UNDERFILL COMPOUNDS INCLUDING ELECTRICALLY CHARGED FILLER ELEMENTS, AND METHODS OF UNDERFILLING MICROELECTRONIC DEVICES' [patent_app_type] => new [patent_app_number] => 10/357587 [patent_app_country] => US [patent_app_date] => 2003-02-03 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 6 [patent_figures_cnt] => 6 [patent_no_of_words] => 4411 [patent_no_of_claims] => 89 [patent_no_of_ind_claims] => 14 [patent_words_short_claim] => 45 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] => publications/A1/0150/20040150079.pdf [firstpage_image] =>[orig_patent_app_number] => 10357587 [rel_patent_id] =>[rel_patent_doc_number] =>)
10/357587
UNDERFILL COMPOUNDS INCLUDING ELECTRICALLY CHARGED FILLER ELEMENTS, MICROELECTRONIC DEVICES HAVING UNDERFILL COMPOUNDS INCLUDING ELECTRICALLY CHARGED FILLER ELEMENTS, AND METHODS OF UNDERFILLING MICROELECTRONIC DEVICES Feb 2, 2003 Issued
Array ( [id] => 7260413 [patent_doc_number] => 20040150103 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2004-08-05 [patent_title] => 'Sacrificial Metal Liner For Copper' [patent_app_type] => new [patent_app_number] => 10/248637 [patent_app_country] => US [patent_app_date] => 2003-02-03 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 4 [patent_figures_cnt] => 4 [patent_no_of_words] => 3077 [patent_no_of_claims] => 15 [patent_no_of_ind_claims] => 1 [patent_words_short_claim] => 87 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] => publications/A1/0150/20040150103.pdf [firstpage_image] =>[orig_patent_app_number] => 10248637 [rel_patent_id] =>[rel_patent_doc_number] =>)
10/248637
Sacrificial Metal Liner For Copper Feb 2, 2003 Abandoned
Array ( [id] => 6851561 [patent_doc_number] => 20030143764 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2003-07-31 [patent_title] => 'Silicon carbide interconnect for semiconductor components and method of fabrication' [patent_app_type] => new [patent_app_number] => 10/351742 [patent_app_country] => US [patent_app_date] => 2003-01-27 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 10 [patent_figures_cnt] => 10 [patent_no_of_words] => 10085 [patent_no_of_claims] => 65 [patent_no_of_ind_claims] => 11 [patent_words_short_claim] => 41 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] => publications/A1/0143/20030143764.pdf [firstpage_image] =>[orig_patent_app_number] => 10351742 [rel_patent_id] =>[rel_patent_doc_number] =>)
10/351742
Silicon carbide interconnect for semiconductor components Jan 26, 2003 Issued
Array ( [id] => 6704410 [patent_doc_number] => 20030151144 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2003-08-14 [patent_title] => 'Semiconductor device and method of manufacturing semiconductor device' [patent_app_type] => new [patent_app_number] => 10/347937 [patent_app_country] => US [patent_app_date] => 2003-01-22 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 9 [patent_figures_cnt] => 9 [patent_no_of_words] => 13065 [patent_no_of_claims] => 31 [patent_no_of_ind_claims] => 4 [patent_words_short_claim] => 108 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] => publications/A1/0151/20030151144.pdf [firstpage_image] =>[orig_patent_app_number] => 10347937 [rel_patent_id] =>[rel_patent_doc_number] =>)
10/347937
Semiconductor device and method of manufacturing semiconductor device Jan 21, 2003 Issued
Array ( [id] => 1168005 [patent_doc_number] => 06759735 [patent_country] => US [patent_kind] => B2 [patent_issue_date] => 2004-07-06 [patent_title] => 'High power semiconductor device having semiconductor chips' [patent_app_type] => B2 [patent_app_number] => 10/347927 [patent_app_country] => US [patent_app_date] => 2003-01-22 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 28 [patent_figures_cnt] => 40 [patent_no_of_words] => 15596 [patent_no_of_claims] => 22 [patent_no_of_ind_claims] => 2 [patent_words_short_claim] => 200 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/06/759/06759735.pdf [firstpage_image] =>[orig_patent_app_number] => 10347927 [rel_patent_id] =>[rel_patent_doc_number] =>)
10/347927
High power semiconductor device having semiconductor chips Jan 21, 2003 Issued
Array ( [id] => 1050654 [patent_doc_number] => 06861733 [patent_country] => US [patent_kind] => B2 [patent_issue_date] => 2005-03-01 [patent_title] => 'Lead frame wire bonding clamp member' [patent_app_type] => utility [patent_app_number] => 10/349598 [patent_app_country] => US [patent_app_date] => 2003-01-22 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 2 [patent_figures_cnt] => 4 [patent_no_of_words] => 3299 [patent_no_of_claims] => 13 [patent_no_of_ind_claims] => 2 [patent_words_short_claim] => 64 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/06/861/06861733.pdf [firstpage_image] =>[orig_patent_app_number] => 10349598 [rel_patent_id] =>[rel_patent_doc_number] =>)
10/349598
Lead frame wire bonding clamp member Jan 21, 2003 Issued
Array ( [id] => 7306408 [patent_doc_number] => 20040141421 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2004-07-22 [patent_title] => 'ELECTRICAL THROUGH WAFER INTERCONNECTS' [patent_app_type] => new [patent_app_number] => 10/349597 [patent_app_country] => US [patent_app_date] => 2003-01-22 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 7 [patent_figures_cnt] => 7 [patent_no_of_words] => 2891 [patent_no_of_claims] => 12 [patent_no_of_ind_claims] => 5 [patent_words_short_claim] => 21 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] => publications/A1/0141/20040141421.pdf [firstpage_image] =>[orig_patent_app_number] => 10349597 [rel_patent_id] =>[rel_patent_doc_number] =>)
10/349597
Electrical through wafer interconnects Jan 21, 2003 Issued
Array ( [id] => 1086558 [patent_doc_number] => 06831368 [patent_country] => US [patent_kind] => B2 [patent_issue_date] => 2004-12-14 [patent_title] => 'Semiconductor device and method of manufacturing the same' [patent_app_type] => B2 [patent_app_number] => 10/347237 [patent_app_country] => US [patent_app_date] => 2003-01-21 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 3 [patent_figures_cnt] => 7 [patent_no_of_words] => 3331 [patent_no_of_claims] => 16 [patent_no_of_ind_claims] => 1 [patent_words_short_claim] => 126 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/06/831/06831368.pdf [firstpage_image] =>[orig_patent_app_number] => 10347237 [rel_patent_id] =>[rel_patent_doc_number] =>)
10/347237
Semiconductor device and method of manufacturing the same Jan 20, 2003 Issued
Array ( [id] => 906524 [patent_doc_number] => RE040061 [patent_country] => US [patent_kind] => E1 [patent_issue_date] => 2008-02-12 [patent_title] => 'Multi-chip stacked devices' [patent_app_type] => reissue [patent_app_number] => 10/346860 [patent_app_country] => US [patent_app_date] => 2003-01-16 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 2 [patent_figures_cnt] => 2 [patent_no_of_words] => 1882 [patent_no_of_claims] => 10 [patent_no_of_ind_claims] => 1 [patent_words_short_claim] => 170 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/RE/040/RE040061.pdf [firstpage_image] =>[orig_patent_app_number] => 10346860 [rel_patent_id] =>[rel_patent_doc_number] =>)
10/346860
Multi-chip stacked devices Jan 15, 2003 Issued
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