
Roy Karl Potter
Examiner (ID: 13991, Phone: (571)272-1842 , Office: P/2822 )
| Most Active Art Unit | 2822 |
| Art Unit(s) | 2822, 2508, 2811, 3621 |
| Total Applications | 2584 |
| Issued Applications | 2409 |
| Pending Applications | 46 |
| Abandoned Applications | 141 |
Applications
| Application number | Title of the application | Filing Date | Status |
|---|---|---|---|
Array
(
[id] => 6656075
[patent_doc_number] => 20030132533
[patent_country] => US
[patent_kind] => A1
[patent_issue_date] => 2003-07-17
[patent_title] => 'Semiconductor device, method of manufacturing semiconductor device and a method of manufacturing lead frame'
[patent_app_type] => new
[patent_app_number] => 10/372177
[patent_app_country] => US
[patent_app_date] => 2003-02-25
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 32
[patent_figures_cnt] => 32
[patent_no_of_words] => 16074
[patent_no_of_claims] => 43
[patent_no_of_ind_claims] => 11
[patent_words_short_claim] => 29
[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => publication
[pdf_file] => publications/A1/0132/20030132533.pdf
[firstpage_image] =>[orig_patent_app_number] => 10372177
[rel_patent_id] =>[rel_patent_doc_number] =>) 10/372177 | Semiconductor device, method of manufacturing semiconductor device and a method of manufacturing lead frame | Feb 24, 2003 | Abandoned |
Array
(
[id] => 6706365
[patent_doc_number] => 20030153099
[patent_country] => US
[patent_kind] => A1
[patent_issue_date] => 2003-08-14
[patent_title] => 'Method of making a flexible substrate with a filler material'
[patent_app_type] => new
[patent_app_number] => 10/372594
[patent_app_country] => US
[patent_app_date] => 2003-02-24
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 7
[patent_figures_cnt] => 7
[patent_no_of_words] => 4367
[patent_no_of_claims] => 27
[patent_no_of_ind_claims] => 2
[patent_words_short_claim] => 25
[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => publication
[pdf_file] => publications/A1/0153/20030153099.pdf
[firstpage_image] =>[orig_patent_app_number] => 10372594
[rel_patent_id] =>[rel_patent_doc_number] =>) 10/372594 | Method of making a flexible substrate with a filler material | Feb 23, 2003 | Issued |
Array
(
[id] => 1153461
[patent_doc_number] => 06770981
[patent_country] => US
[patent_kind] => B2
[patent_issue_date] => 2004-08-03
[patent_title] => 'Composite interposer for BGA packages'
[patent_app_type] => B2
[patent_app_number] => 10/373261
[patent_app_country] => US
[patent_app_date] => 2003-02-24
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 6
[patent_figures_cnt] => 9
[patent_no_of_words] => 4327
[patent_no_of_claims] => 33
[patent_no_of_ind_claims] => 10
[patent_words_short_claim] => 26
[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => patent
[pdf_file] => patents/06/770/06770981.pdf
[firstpage_image] =>[orig_patent_app_number] => 10373261
[rel_patent_id] =>[rel_patent_doc_number] =>) 10/373261 | Composite interposer for BGA packages | Feb 23, 2003 | Issued |
Array
(
[id] => 6832782
[patent_doc_number] => 20030160327
[patent_country] => US
[patent_kind] => A1
[patent_issue_date] => 2003-08-28
[patent_title] => 'Semiconductor device'
[patent_app_type] => new
[patent_app_number] => 10/369517
[patent_app_country] => US
[patent_app_date] => 2003-02-21
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 14
[patent_figures_cnt] => 14
[patent_no_of_words] => 10694
[patent_no_of_claims] => 20
[patent_no_of_ind_claims] => 2
[patent_words_short_claim] => 80
[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => publication
[pdf_file] => publications/A1/0160/20030160327.pdf
[firstpage_image] =>[orig_patent_app_number] => 10369517
[rel_patent_id] =>[rel_patent_doc_number] =>) 10/369517 | Semiconductor device with protective layer | Feb 20, 2003 | Issued |
Array
(
[id] => 6823824
[patent_doc_number] => 20030234446
[patent_country] => US
[patent_kind] => A1
[patent_issue_date] => 2003-12-25
[patent_title] => 'Flat leadframe for a semiconductor package'
[patent_app_type] => new
[patent_app_number] => 10/371397
[patent_app_country] => US
[patent_app_date] => 2003-02-20
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 8
[patent_figures_cnt] => 8
[patent_no_of_words] => 2573
[patent_no_of_claims] => 16
[patent_no_of_ind_claims] => 9
[patent_words_short_claim] => 43
[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => publication
[pdf_file] => publications/A1/0234/20030234446.pdf
[firstpage_image] =>[orig_patent_app_number] => 10371397
[rel_patent_id] =>[rel_patent_doc_number] =>) 10/371397 | Flat leadframe for a semiconductor package | Feb 19, 2003 | Issued |
Array
(
[id] => 6738295
[patent_doc_number] => 20030155663
[patent_country] => US
[patent_kind] => A1
[patent_issue_date] => 2003-08-21
[patent_title] => 'Adhesives, adhesive films and electric devices'
[patent_app_type] => new
[patent_app_number] => 10/369297
[patent_app_country] => US
[patent_app_date] => 2003-02-18
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 3
[patent_figures_cnt] => 3
[patent_no_of_words] => 4070
[patent_no_of_claims] => 8
[patent_no_of_ind_claims] => 3
[patent_words_short_claim] => 56
[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => publication
[pdf_file] => publications/A1/0155/20030155663.pdf
[firstpage_image] =>[orig_patent_app_number] => 10369297
[rel_patent_id] =>[rel_patent_doc_number] =>) 10/369297 | Adhesives, adhesive films and electric devices | Feb 17, 2003 | Issued |
Array
(
[id] => 539224
[patent_doc_number] => 07173341
[patent_country] => US
[patent_kind] => B2
[patent_issue_date] => 2007-02-06
[patent_title] => 'High performance thermally enhanced package and method of fabricating the same'
[patent_app_type] => utility
[patent_app_number] => 10/368337
[patent_app_country] => US
[patent_app_date] => 2003-02-18
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 9
[patent_figures_cnt] => 21
[patent_no_of_words] => 4322
[patent_no_of_claims] => 24
[patent_no_of_ind_claims] => 3
[patent_words_short_claim] => 138
[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => patent
[pdf_file] => patents/07/173/07173341.pdf
[firstpage_image] =>[orig_patent_app_number] => 10368337
[rel_patent_id] =>[rel_patent_doc_number] =>) 10/368337 | High performance thermally enhanced package and method of fabricating the same | Feb 17, 2003 | Issued |
Array
(
[id] => 1083506
[patent_doc_number] => 06833617
[patent_country] => US
[patent_kind] => B2
[patent_issue_date] => 2004-12-21
[patent_title] => 'Composite material including copper and cuprous oxide and application thereof'
[patent_app_type] => B2
[patent_app_number] => 10/364460
[patent_app_country] => US
[patent_app_date] => 2003-02-12
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 15
[patent_figures_cnt] => 26
[patent_no_of_words] => 9440
[patent_no_of_claims] => 12
[patent_no_of_ind_claims] => 4
[patent_words_short_claim] => 58
[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => patent
[pdf_file] => patents/06/833/06833617.pdf
[firstpage_image] =>[orig_patent_app_number] => 10364460
[rel_patent_id] =>[rel_patent_doc_number] =>) 10/364460 | Composite material including copper and cuprous oxide and application thereof | Feb 11, 2003 | Issued |
Array
(
[id] => 1132638
[patent_doc_number] => 06787922
[patent_country] => US
[patent_kind] => B2
[patent_issue_date] => 2004-09-07
[patent_title] => 'Semiconductor chipmounting board'
[patent_app_type] => B2
[patent_app_number] => 10/361605
[patent_app_country] => US
[patent_app_date] => 2003-02-11
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 8
[patent_figures_cnt] => 13
[patent_no_of_words] => 5039
[patent_no_of_claims] => 5
[patent_no_of_ind_claims] => 2
[patent_words_short_claim] => 195
[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => patent
[pdf_file] => patents/06/787/06787922.pdf
[firstpage_image] =>[orig_patent_app_number] => 10361605
[rel_patent_id] =>[rel_patent_doc_number] =>) 10/361605 | Semiconductor chipmounting board | Feb 10, 2003 | Issued |
Array
(
[id] => 6707601
[patent_doc_number] => 20030154335
[patent_country] => US
[patent_kind] => A1
[patent_issue_date] => 2003-08-14
[patent_title] => 'Encoding element for an electric module and electric module including such encoding element'
[patent_app_type] => new
[patent_app_number] => 10/360187
[patent_app_country] => US
[patent_app_date] => 2003-02-07
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 6
[patent_figures_cnt] => 6
[patent_no_of_words] => 2400
[patent_no_of_claims] => 15
[patent_no_of_ind_claims] => 2
[patent_words_short_claim] => 41
[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => publication
[pdf_file] => publications/A1/0154/20030154335.pdf
[firstpage_image] =>[orig_patent_app_number] => 10360187
[rel_patent_id] =>[rel_patent_doc_number] =>) 10/360187 | Encoding element for an electric module and electric module including such encoding element | Feb 6, 2003 | Abandoned |
Array
(
[id] => 1300285
[patent_doc_number] => 06627990
[patent_country] => US
[patent_kind] => B1
[patent_issue_date] => 2003-09-30
[patent_title] => 'Thermally enhanced stacked die package'
[patent_app_type] => B1
[patent_app_number] => 10/359407
[patent_app_country] => US
[patent_app_date] => 2003-02-06
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 5
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[patent_no_of_words] => 3794
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[patent_current_assignee] =>[type] => patent
[pdf_file] => patents/06/627/06627990.pdf
[firstpage_image] =>[orig_patent_app_number] => 10359407
[rel_patent_id] =>[rel_patent_doc_number] =>) 10/359407 | Thermally enhanced stacked die package | Feb 5, 2003 | Issued |
Array
(
[id] => 7260291
[patent_doc_number] => 20040150079
[patent_country] => US
[patent_kind] => A1
[patent_issue_date] => 2004-08-05
[patent_title] => 'UNDERFILL COMPOUNDS INCLUDING ELECTRICALLY CHARGED FILLER ELEMENTS, MICROELECTRONIC DEVICES HAVING UNDERFILL COMPOUNDS INCLUDING ELECTRICALLY CHARGED FILLER ELEMENTS, AND METHODS OF UNDERFILLING MICROELECTRONIC DEVICES'
[patent_app_type] => new
[patent_app_number] => 10/357587
[patent_app_country] => US
[patent_app_date] => 2003-02-03
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 6
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[patent_no_of_claims] => 89
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[patent_current_assignee] =>[type] => publication
[pdf_file] => publications/A1/0150/20040150079.pdf
[firstpage_image] =>[orig_patent_app_number] => 10357587
[rel_patent_id] =>[rel_patent_doc_number] =>) 10/357587 | UNDERFILL COMPOUNDS INCLUDING ELECTRICALLY CHARGED FILLER ELEMENTS, MICROELECTRONIC DEVICES HAVING UNDERFILL COMPOUNDS INCLUDING ELECTRICALLY CHARGED FILLER ELEMENTS, AND METHODS OF UNDERFILLING MICROELECTRONIC DEVICES | Feb 2, 2003 | Issued |
Array
(
[id] => 7260413
[patent_doc_number] => 20040150103
[patent_country] => US
[patent_kind] => A1
[patent_issue_date] => 2004-08-05
[patent_title] => 'Sacrificial Metal Liner For Copper'
[patent_app_type] => new
[patent_app_number] => 10/248637
[patent_app_country] => US
[patent_app_date] => 2003-02-03
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 4
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[patent_no_of_words] => 3077
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[pdf_file] => publications/A1/0150/20040150103.pdf
[firstpage_image] =>[orig_patent_app_number] => 10248637
[rel_patent_id] =>[rel_patent_doc_number] =>) 10/248637 | Sacrificial Metal Liner For Copper | Feb 2, 2003 | Abandoned |
Array
(
[id] => 6851561
[patent_doc_number] => 20030143764
[patent_country] => US
[patent_kind] => A1
[patent_issue_date] => 2003-07-31
[patent_title] => 'Silicon carbide interconnect for semiconductor components and method of fabrication'
[patent_app_type] => new
[patent_app_number] => 10/351742
[patent_app_country] => US
[patent_app_date] => 2003-01-27
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 10
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[patent_no_of_words] => 10085
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[pdf_file] => publications/A1/0143/20030143764.pdf
[firstpage_image] =>[orig_patent_app_number] => 10351742
[rel_patent_id] =>[rel_patent_doc_number] =>) 10/351742 | Silicon carbide interconnect for semiconductor components | Jan 26, 2003 | Issued |
Array
(
[id] => 6704410
[patent_doc_number] => 20030151144
[patent_country] => US
[patent_kind] => A1
[patent_issue_date] => 2003-08-14
[patent_title] => 'Semiconductor device and method of manufacturing semiconductor device'
[patent_app_type] => new
[patent_app_number] => 10/347937
[patent_app_country] => US
[patent_app_date] => 2003-01-22
[patent_effective_date] => 0000-00-00
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[pdf_file] => publications/A1/0151/20030151144.pdf
[firstpage_image] =>[orig_patent_app_number] => 10347937
[rel_patent_id] =>[rel_patent_doc_number] =>) 10/347937 | Semiconductor device and method of manufacturing semiconductor device | Jan 21, 2003 | Issued |
Array
(
[id] => 1168005
[patent_doc_number] => 06759735
[patent_country] => US
[patent_kind] => B2
[patent_issue_date] => 2004-07-06
[patent_title] => 'High power semiconductor device having semiconductor chips'
[patent_app_type] => B2
[patent_app_number] => 10/347927
[patent_app_country] => US
[patent_app_date] => 2003-01-22
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 28
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[pdf_file] => patents/06/759/06759735.pdf
[firstpage_image] =>[orig_patent_app_number] => 10347927
[rel_patent_id] =>[rel_patent_doc_number] =>) 10/347927 | High power semiconductor device having semiconductor chips | Jan 21, 2003 | Issued |
Array
(
[id] => 1050654
[patent_doc_number] => 06861733
[patent_country] => US
[patent_kind] => B2
[patent_issue_date] => 2005-03-01
[patent_title] => 'Lead frame wire bonding clamp member'
[patent_app_type] => utility
[patent_app_number] => 10/349598
[patent_app_country] => US
[patent_app_date] => 2003-01-22
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 2
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[pdf_file] => patents/06/861/06861733.pdf
[firstpage_image] =>[orig_patent_app_number] => 10349598
[rel_patent_id] =>[rel_patent_doc_number] =>) 10/349598 | Lead frame wire bonding clamp member | Jan 21, 2003 | Issued |
Array
(
[id] => 7306408
[patent_doc_number] => 20040141421
[patent_country] => US
[patent_kind] => A1
[patent_issue_date] => 2004-07-22
[patent_title] => 'ELECTRICAL THROUGH WAFER INTERCONNECTS'
[patent_app_type] => new
[patent_app_number] => 10/349597
[patent_app_country] => US
[patent_app_date] => 2003-01-22
[patent_effective_date] => 0000-00-00
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[pdf_file] => publications/A1/0141/20040141421.pdf
[firstpage_image] =>[orig_patent_app_number] => 10349597
[rel_patent_id] =>[rel_patent_doc_number] =>) 10/349597 | Electrical through wafer interconnects | Jan 21, 2003 | Issued |
Array
(
[id] => 1086558
[patent_doc_number] => 06831368
[patent_country] => US
[patent_kind] => B2
[patent_issue_date] => 2004-12-14
[patent_title] => 'Semiconductor device and method of manufacturing the same'
[patent_app_type] => B2
[patent_app_number] => 10/347237
[patent_app_country] => US
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[pdf_file] => patents/06/831/06831368.pdf
[firstpage_image] =>[orig_patent_app_number] => 10347237
[rel_patent_id] =>[rel_patent_doc_number] =>) 10/347237 | Semiconductor device and method of manufacturing the same | Jan 20, 2003 | Issued |
Array
(
[id] => 906524
[patent_doc_number] => RE040061
[patent_country] => US
[patent_kind] => E1
[patent_issue_date] => 2008-02-12
[patent_title] => 'Multi-chip stacked devices'
[patent_app_type] => reissue
[patent_app_number] => 10/346860
[patent_app_country] => US
[patent_app_date] => 2003-01-16
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 2
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[patent_current_assignee] =>[type] => patent
[pdf_file] => patents/RE/040/RE040061.pdf
[firstpage_image] =>[orig_patent_app_number] => 10346860
[rel_patent_id] =>[rel_patent_doc_number] =>) 10/346860 | Multi-chip stacked devices | Jan 15, 2003 | Issued |