Roy Karl Potter

Array ( [id] => 1114690 [patent_doc_number] => 06804081 [patent_country] => US [patent_kind] => B2 [patent_issue_date] => 2004-10-12 [patent_title] => 'Structure having pores and its manufacturing method' [patent_app_type] => B2 [patent_app_number] => 10/144257 [patent_app_country] => US [patent_app_date] => 2002-05-10 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 11 [patent_figures_cnt] => 18 [patent_no_of_words] => 8061 [patent_no_of_claims] => 19 [patent_no_of_ind_claims] => 3 [patent_words_short_claim] => 58 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/06/804/06804081.pdf [firstpage_image] =>[orig_patent_app_number] => 10144257 [rel_patent_id] =>[rel_patent_doc_number] =>)

Array ( [id] => 1281522 [patent_doc_number] => 06646356 [patent_country] => US [patent_kind] => B1 [patent_issue_date] => 2003-11-11 [patent_title] => 'Apparatus for providing mechanical support to a column grid array package' [patent_app_type] => B1 [patent_app_number] => 10/142027 [patent_app_country] => US [patent_app_date] => 2002-05-09 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 4 [patent_figures_cnt] => 7 [patent_no_of_words] => 1767 [patent_no_of_claims] => 13 [patent_no_of_ind_claims] => 2 [patent_words_short_claim] => 81 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/06/646/06646356.pdf [firstpage_image] =>[orig_patent_app_number] => 10142027 [rel_patent_id] =>[rel_patent_doc_number] =>)

Array ( [id] => 6415583 [patent_doc_number] => 20020125583 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2002-09-12 [patent_title] => 'Integrated circuit package with surface mounted pins on an organic substrate' [patent_app_type] => new [patent_app_number] => 10/142576 [patent_app_country] => US [patent_app_date] => 2002-05-08 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 6 [patent_figures_cnt] => 6 [patent_no_of_words] => 4386 [patent_no_of_claims] => 20 [patent_no_of_ind_claims] => 3 [patent_words_short_claim] => 108 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] => publications/A1/0125/20020125583.pdf [firstpage_image] =>[orig_patent_app_number] => 10142576 [rel_patent_id] =>[rel_patent_doc_number] =>)

Array ( [id] => 6723476 [patent_doc_number] => 20030205788 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2003-11-06 [patent_title] => 'LEADFRAME ASSEMBLY' [patent_app_type] => new [patent_app_number] => 10/139007 [patent_app_country] => US [patent_app_date] => 2002-05-03 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 4 [patent_figures_cnt] => 4 [patent_no_of_words] => 3357 [patent_no_of_claims] => 20 [patent_no_of_ind_claims] => 3 [patent_words_short_claim] => 66 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] => publications/A1/0205/20030205788.pdf [firstpage_image] =>[orig_patent_app_number] => 10139007 [rel_patent_id] =>[rel_patent_doc_number] =>)

Array ( [id] => 1277027 [patent_doc_number] => 06650004 [patent_country] => US [patent_kind] => B1 [patent_issue_date] => 2003-11-18 [patent_title] => 'Semiconductor device' [patent_app_type] => B1 [patent_app_number] => 10/111567 [patent_app_country] => US [patent_app_date] => 2002-04-26 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 9 [patent_figures_cnt] => 18 [patent_no_of_words] => 7026 [patent_no_of_claims] => 8 [patent_no_of_ind_claims] => 3 [patent_words_short_claim] => 114 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/06/650/06650004.pdf [firstpage_image] =>[orig_patent_app_number] => 10111567 [rel_patent_id] =>[rel_patent_doc_number] =>)

Array ( [id] => 1326870 [patent_doc_number] => 06599773 [patent_country] => US [patent_kind] => B2 [patent_issue_date] => 2003-07-29 [patent_title] => 'Electronic part and method of fabricating thereof' [patent_app_type] => B2 [patent_app_number] => 10/117037 [patent_app_country] => US [patent_app_date] => 2002-04-08 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 6 [patent_figures_cnt] => 19 [patent_no_of_words] => 4824 [patent_no_of_claims] => 7 [patent_no_of_ind_claims] => 1 [patent_words_short_claim] => 66 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/06/599/06599773.pdf [firstpage_image] =>[orig_patent_app_number] => 10117037 [rel_patent_id] =>[rel_patent_doc_number] =>)

Array ( [id] => 1316356 [patent_doc_number] => 06611062 [patent_country] => US [patent_kind] => B2 [patent_issue_date] => 2003-08-26 [patent_title] => 'Twisted wordline strapping arrangement' [patent_app_type] => B2 [patent_app_number] => 10/109877 [patent_app_country] => US [patent_app_date] => 2002-04-01 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 6 [patent_figures_cnt] => 13 [patent_no_of_words] => 2803 [patent_no_of_claims] => 9 [patent_no_of_ind_claims] => 1 [patent_words_short_claim] => 162 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/06/611/06611062.pdf [firstpage_image] =>[orig_patent_app_number] => 10109877 [rel_patent_id] =>[rel_patent_doc_number] =>)

Array ( [id] => 6729943 [patent_doc_number] => 20030186133 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2003-10-02 [patent_title] => 'Electrical field alignment vernier' [patent_app_type] => new [patent_app_number] => 10/114707 [patent_app_country] => US [patent_app_date] => 2002-04-01 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 9 [patent_figures_cnt] => 9 [patent_no_of_words] => 2120 [patent_no_of_claims] => 12 [patent_no_of_ind_claims] => 3 [patent_words_short_claim] => 59 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] => publications/A1/0186/20030186133.pdf [firstpage_image] =>[orig_patent_app_number] => 10114707 [rel_patent_id] =>[rel_patent_doc_number] =>)

Array ( [id] => 1314532 [patent_doc_number] => 06614112 [patent_country] => US [patent_kind] => B2 [patent_issue_date] => 2003-09-02 [patent_title] => 'Semiconductor device with shock absorbing bond pad' [patent_app_type] => B2 [patent_app_number] => 10/109727 [patent_app_country] => US [patent_app_date] => 2002-04-01 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 7 [patent_figures_cnt] => 18 [patent_no_of_words] => 4152 [patent_no_of_claims] => 34 [patent_no_of_ind_claims] => 1 [patent_words_short_claim] => 80 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/06/614/06614112.pdf [firstpage_image] =>[orig_patent_app_number] => 10109727 [rel_patent_id] =>[rel_patent_doc_number] =>)

Array ( [id] => 6837214 [patent_doc_number] => 20030034554 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2003-02-20 [patent_title] => 'Composite ceramic board, method of producing the same, optical/electronic-mounted circuit substrate using said board, and mounted board equipped with said circuit substrate' [patent_app_type] => new [patent_app_number] => 10/113467 [patent_app_country] => US [patent_app_date] => 2002-03-29 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 6 [patent_figures_cnt] => 6 [patent_no_of_words] => 15180 [patent_no_of_claims] => 24 [patent_no_of_ind_claims] => 5 [patent_words_short_claim] => 65 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] => publications/A1/0034/20030034554.pdf [firstpage_image] =>[orig_patent_app_number] => 10113467 [rel_patent_id] =>[rel_patent_doc_number] =>)

Array ( [id] => 6170304 [patent_doc_number] => 20020153596 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2002-10-24 [patent_title] => 'Lead frame and semiconductor package formed using it' [patent_app_type] => new [patent_app_number] => 10/100507 [patent_app_country] => US [patent_app_date] => 2002-03-18 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 5 [patent_figures_cnt] => 5 [patent_no_of_words] => 4629 [patent_no_of_claims] => 2 [patent_no_of_ind_claims] => 2 [patent_words_short_claim] => 57 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] => publications/A1/0153/20020153596.pdf [firstpage_image] =>[orig_patent_app_number] => 10100507 [rel_patent_id] =>[rel_patent_doc_number] =>)

Array ( [id] => 6123515 [patent_doc_number] => 20020074630 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2002-06-20 [patent_title] => 'Semiconductor device having protruding electrodes higher than a sealed portion' [patent_app_type] => new [patent_app_number] => 10/076580 [patent_app_country] => US [patent_app_date] => 2002-02-19 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 31 [patent_figures_cnt] => 31 [patent_no_of_words] => 15700 [patent_no_of_claims] => 14 [patent_no_of_ind_claims] => 6 [patent_words_short_claim] => 124 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] => publications/A1/0074/20020074630.pdf [firstpage_image] =>[orig_patent_app_number] => 10076580 [rel_patent_id] =>[rel_patent_doc_number] =>)

Array ( [id] => 6843207 [patent_doc_number] => 20030148554 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2003-08-07 [patent_title] => 'Packaged semiconductor device and method of formation' [patent_app_type] => new [patent_app_number] => 10/072167 [patent_app_country] => US [patent_app_date] => 2002-02-07 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 4 [patent_figures_cnt] => 4 [patent_no_of_words] => 1887 [patent_no_of_claims] => 25 [patent_no_of_ind_claims] => 3 [patent_words_short_claim] => 34 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] => publications/A1/0148/20030148554.pdf [firstpage_image] =>[orig_patent_app_number] => 10072167 [rel_patent_id] =>[rel_patent_doc_number] =>)

Array ( [id] => 1352275 [patent_doc_number] => 06580158 [patent_country] => US [patent_kind] => B2 [patent_issue_date] => 2003-06-17 [patent_title] => 'High speed IC package configuration' [patent_app_type] => B2 [patent_app_number] => 10/071943 [patent_app_country] => US [patent_app_date] => 2002-02-05 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 11 [patent_figures_cnt] => 11 [patent_no_of_words] => 7862 [patent_no_of_claims] => 29 [patent_no_of_ind_claims] => 9 [patent_words_short_claim] => 134 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/06/580/06580158.pdf [firstpage_image] =>[orig_patent_app_number] => 10071943 [rel_patent_id] =>[rel_patent_doc_number] =>)

Array ( [id] => 7269955 [patent_doc_number] => 20040058473 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2004-03-25 [patent_title] => 'Substrate for an electric component and method for the production thereof' [patent_app_type] => new [patent_app_number] => 10/470117 [patent_app_country] => US [patent_app_date] => 2003-07-25 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 3 [patent_figures_cnt] => 3 [patent_no_of_words] => 2582 [patent_no_of_claims] => 12 [patent_no_of_ind_claims] => 7 [patent_words_short_claim] => 16 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] => publications/A1/0058/20040058473.pdf [firstpage_image] =>[orig_patent_app_number] => 10470117 [rel_patent_id] =>[rel_patent_doc_number] =>)

Array ( [id] => 1380489 [patent_doc_number] => 06563212 [patent_country] => US [patent_kind] => B2 [patent_issue_date] => 2003-05-13 [patent_title] => 'Semiconductor device' [patent_app_type] => B2 [patent_app_number] => 10/046204 [patent_app_country] => US [patent_app_date] => 2002-01-16 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 17 [patent_figures_cnt] => 17 [patent_no_of_words] => 6605 [patent_no_of_claims] => 2 [patent_no_of_ind_claims] => 1 [patent_words_short_claim] => 120 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/06/563/06563212.pdf [firstpage_image] =>[orig_patent_app_number] => 10046204 [rel_patent_id] =>[rel_patent_doc_number] =>)

Array ( [id] => 1306229 [patent_doc_number] => 06621160 [patent_country] => US [patent_kind] => B2 [patent_issue_date] => 2003-09-16 [patent_title] => 'Semiconductor device and mounting board' [patent_app_type] => B2 [patent_app_number] => 10/046258 [patent_app_country] => US [patent_app_date] => 2002-01-16 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 17 [patent_figures_cnt] => 30 [patent_no_of_words] => 6621 [patent_no_of_claims] => 1 [patent_no_of_ind_claims] => 1 [patent_words_short_claim] => 155 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/06/621/06621160.pdf [firstpage_image] =>[orig_patent_app_number] => 10046258 [rel_patent_id] =>[rel_patent_doc_number] =>)

Array ( [id] => 6659734 [patent_doc_number] => 20030134499 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2003-07-17 [patent_title] => 'Bilayer HDP CVD / PE CVD cap in advanced BEOL interconnect structures and method thereof' [patent_app_type] => new [patent_app_number] => 10/047964 [patent_app_country] => US [patent_app_date] => 2002-01-15 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 6 [patent_figures_cnt] => 6 [patent_no_of_words] => 7486 [patent_no_of_claims] => 26 [patent_no_of_ind_claims] => 2 [patent_words_short_claim] => 80 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] => publications/A1/0134/20030134499.pdf [firstpage_image] =>[orig_patent_app_number] => 10047964 [rel_patent_id] =>[rel_patent_doc_number] =>)

Array ( [id] => 6778806 [patent_doc_number] => 20030049887 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2003-03-13 [patent_title] => 'Semiconductor device and a method of manufacturing the same' [patent_app_type] => new [patent_app_number] => 10/240187 [patent_app_country] => US [patent_app_date] => 2002-09-30 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 40 [patent_figures_cnt] => 40 [patent_no_of_words] => 16389 [patent_no_of_claims] => 48 [patent_no_of_ind_claims] => 8 [patent_words_short_claim] => 55 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] => publications/A1/0049/20030049887.pdf [firstpage_image] =>[orig_patent_app_number] => 10240187 [rel_patent_id] =>[rel_patent_doc_number] =>)