
Roy Karl Potter
Examiner (ID: 13991, Phone: (571)272-1842 , Office: P/2822 )
| Most Active Art Unit | 2822 |
| Art Unit(s) | 2822, 2508, 2811, 3621 |
| Total Applications | 2584 |
| Issued Applications | 2409 |
| Pending Applications | 46 |
| Abandoned Applications | 141 |
Applications
| Application number | Title of the application | Filing Date | Status |
|---|---|---|---|
Array
(
[id] => 4349842
[patent_doc_number] => 06291262
[patent_country] => US
[patent_kind] => NA
[patent_issue_date] => 2001-09-18
[patent_title] => 'Surface mount TO-220 package and process for the manufacture thereof'
[patent_app_type] => 1
[patent_app_number] => 9/563358
[patent_app_country] => US
[patent_app_date] => 2000-05-03
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 4
[patent_figures_cnt] => 11
[patent_no_of_words] => 1624
[patent_no_of_claims] => 7
[patent_no_of_ind_claims] => 2
[patent_words_short_claim] => 166
[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => patent
[pdf_file] => patents/06/291/06291262.pdf
[firstpage_image] =>[orig_patent_app_number] => 563358
[rel_patent_id] =>[rel_patent_doc_number] =>) 09/563358 | Surface mount TO-220 package and process for the manufacture thereof | May 2, 2000 | Issued |
Array
(
[id] => 1428494
[patent_doc_number] => 06504249
[patent_country] => US
[patent_kind] => B1
[patent_issue_date] => 2003-01-07
[patent_title] => 'Integrated circuit device with reduced cross talk'
[patent_app_type] => B1
[patent_app_number] => 09/558930
[patent_app_country] => US
[patent_app_date] => 2000-04-26
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 3
[patent_figures_cnt] => 3
[patent_no_of_words] => 1464
[patent_no_of_claims] => 15
[patent_no_of_ind_claims] => 3
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[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => patent
[pdf_file] => patents/06/504/06504249.pdf
[firstpage_image] =>[orig_patent_app_number] => 09558930
[rel_patent_id] =>[rel_patent_doc_number] =>) 09/558930 | Integrated circuit device with reduced cross talk | Apr 25, 2000 | Issued |
Array
(
[id] => 1509573
[patent_doc_number] => 06441504
[patent_country] => US
[patent_kind] => B1
[patent_issue_date] => 2002-08-27
[patent_title] => 'Precision aligned and marked structure'
[patent_app_type] => B1
[patent_app_number] => 09/558397
[patent_app_country] => US
[patent_app_date] => 2000-04-25
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 7
[patent_figures_cnt] => 11
[patent_no_of_words] => 7927
[patent_no_of_claims] => 25
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[patent_current_assignee] =>[type] => patent
[pdf_file] => patents/06/441/06441504.pdf
[firstpage_image] =>[orig_patent_app_number] => 09558397
[rel_patent_id] =>[rel_patent_doc_number] =>) 09/558397 | Precision aligned and marked structure | Apr 24, 2000 | Issued |
Array
(
[id] => 4394320
[patent_doc_number] => 06297073
[patent_country] => US
[patent_kind] => NA
[patent_issue_date] => 2001-10-02
[patent_title] => 'Semiconductor device'
[patent_app_type] => 1
[patent_app_number] => 9/547937
[patent_app_country] => US
[patent_app_date] => 2000-04-11
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 4
[patent_figures_cnt] => 7
[patent_no_of_words] => 4732
[patent_no_of_claims] => 8
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[pdf_file] => patents/06/297/06297073.pdf
[firstpage_image] =>[orig_patent_app_number] => 547937
[rel_patent_id] =>[rel_patent_doc_number] =>) 09/547937 | Semiconductor device | Apr 10, 2000 | Issued |
Array
(
[id] => 1455571
[patent_doc_number] => 06462421
[patent_country] => US
[patent_kind] => B1
[patent_issue_date] => 2002-10-08
[patent_title] => 'Multichip module'
[patent_app_type] => B1
[patent_app_number] => 09/546627
[patent_app_country] => US
[patent_app_date] => 2000-04-10
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 3
[patent_figures_cnt] => 5
[patent_no_of_words] => 2705
[patent_no_of_claims] => 10
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[patent_current_assignee] =>[type] => patent
[pdf_file] => patents/06/462/06462421.pdf
[firstpage_image] =>[orig_patent_app_number] => 09546627
[rel_patent_id] =>[rel_patent_doc_number] =>) 09/546627 | Multichip module | Apr 9, 2000 | Issued |
Array
(
[id] => 1448156
[patent_doc_number] => 06369455
[patent_country] => US
[patent_kind] => B1
[patent_issue_date] => 2002-04-09
[patent_title] => 'Externally-embedded heat-dissipating device for ball grid array integrated circuit package'
[patent_app_type] => B1
[patent_app_number] => 09/545357
[patent_app_country] => US
[patent_app_date] => 2000-04-07
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 5
[patent_figures_cnt] => 14
[patent_no_of_words] => 4276
[patent_no_of_claims] => 14
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[patent_current_assignee] =>[type] => patent
[pdf_file] => patents/06/369/06369455.pdf
[firstpage_image] =>[orig_patent_app_number] => 09545357
[rel_patent_id] =>[rel_patent_doc_number] =>) 09/545357 | Externally-embedded heat-dissipating device for ball grid array integrated circuit package | Apr 6, 2000 | Issued |
Array
(
[id] => 1461511
[patent_doc_number] => 06392290
[patent_country] => US
[patent_kind] => B1
[patent_issue_date] => 2002-05-21
[patent_title] => 'Vertical structure for semiconductor wafer-level chip scale packages'
[patent_app_type] => B1
[patent_app_number] => 09/545287
[patent_app_country] => US
[patent_app_date] => 2000-04-07
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 56
[patent_figures_cnt] => 168
[patent_no_of_words] => 6306
[patent_no_of_claims] => 23
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[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => patent
[pdf_file] => patents/06/392/06392290.pdf
[firstpage_image] =>[orig_patent_app_number] => 09545287
[rel_patent_id] =>[rel_patent_doc_number] =>) 09/545287 | Vertical structure for semiconductor wafer-level chip scale packages | Apr 6, 2000 | Issued |
Array
(
[id] => 1341572
[patent_doc_number] => 06586329
[patent_country] => US
[patent_kind] => B1
[patent_issue_date] => 2003-07-01
[patent_title] => 'Semiconductor device and a method of manufacturing thereof'
[patent_app_type] => B1
[patent_app_number] => 09/544997
[patent_app_country] => US
[patent_app_date] => 2000-04-06
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 116
[patent_figures_cnt] => 214
[patent_no_of_words] => 30713
[patent_no_of_claims] => 41
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[patent_current_assignee] =>[type] => patent
[pdf_file] => patents/06/586/06586329.pdf
[firstpage_image] =>[orig_patent_app_number] => 09544997
[rel_patent_id] =>[rel_patent_doc_number] =>) 09/544997 | Semiconductor device and a method of manufacturing thereof | Apr 5, 2000 | Issued |
Array
(
[id] => 1590957
[patent_doc_number] => 06483196
[patent_country] => US
[patent_kind] => B1
[patent_issue_date] => 2002-11-19
[patent_title] => 'Flip chip led apparatus'
[patent_app_type] => B1
[patent_app_number] => 09/542037
[patent_app_country] => US
[patent_app_date] => 2000-04-03
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 11
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[patent_no_of_words] => 4338
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[patent_current_assignee] =>[type] => patent
[pdf_file] => patents/06/483/06483196.pdf
[firstpage_image] =>[orig_patent_app_number] => 09542037
[rel_patent_id] =>[rel_patent_doc_number] =>) 09/542037 | Flip chip led apparatus | Apr 2, 2000 | Issued |
Array
(
[id] => 1544354
[patent_doc_number] => 06373130
[patent_country] => US
[patent_kind] => B1
[patent_issue_date] => 2002-04-16
[patent_title] => 'Electrical or electronic component encapsulated in a sealed manner'
[patent_app_type] => B1
[patent_app_number] => 09/538777
[patent_app_country] => US
[patent_app_date] => 2000-03-30
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 2
[patent_figures_cnt] => 5
[patent_no_of_words] => 3559
[patent_no_of_claims] => 13
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[patent_current_assignee] =>[type] => patent
[pdf_file] => patents/06/373/06373130.pdf
[firstpage_image] =>[orig_patent_app_number] => 09538777
[rel_patent_id] =>[rel_patent_doc_number] =>) 09/538777 | Electrical or electronic component encapsulated in a sealed manner | Mar 29, 2000 | Issued |
Array
(
[id] => 1486796
[patent_doc_number] => 06365962
[patent_country] => US
[patent_kind] => B1
[patent_issue_date] => 2002-04-02
[patent_title] => 'Flip-chip on flex for high performance packaging applications'
[patent_app_type] => B1
[patent_app_number] => 09/538327
[patent_app_country] => US
[patent_app_date] => 2000-03-29
[patent_effective_date] => 0000-00-00
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[pdf_file] => patents/06/365/06365962.pdf
[firstpage_image] =>[orig_patent_app_number] => 09538327
[rel_patent_id] =>[rel_patent_doc_number] =>) 09/538327 | Flip-chip on flex for high performance packaging applications | Mar 28, 2000 | Issued |
Array
(
[id] => 7647045
[patent_doc_number] => 06476473
[patent_country] => US
[patent_kind] => B1
[patent_issue_date] => 2002-11-05
[patent_title] => 'Memory module having backup function'
[patent_app_type] => B1
[patent_app_number] => 09/537227
[patent_app_country] => US
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[pdf_file] => patents/06/476/06476473.pdf
[firstpage_image] =>[orig_patent_app_number] => 09537227
[rel_patent_id] =>[rel_patent_doc_number] =>) 09/537227 | Memory module having backup function | Mar 27, 2000 | Issued |
Array
(
[id] => 1505490
[patent_doc_number] => 06465877
[patent_country] => US
[patent_kind] => B1
[patent_issue_date] => 2002-10-15
[patent_title] => 'Semiconductor package including flex circuit, interconnects and dense array external contacts'
[patent_app_type] => B1
[patent_app_number] => 09/536827
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[pdf_file] => patents/06/465/06465877.pdf
[firstpage_image] =>[orig_patent_app_number] => 09536827
[rel_patent_id] =>[rel_patent_doc_number] =>) 09/536827 | Semiconductor package including flex circuit, interconnects and dense array external contacts | Mar 26, 2000 | Issued |
Array
(
[id] => 1509515
[patent_doc_number] => 06441489
[patent_country] => US
[patent_kind] => B1
[patent_issue_date] => 2002-08-27
[patent_title] => 'Semiconductor device with tantalum nitride barrier film'
[patent_app_type] => B1
[patent_app_number] => 09/533247
[patent_app_country] => US
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[patent_effective_date] => 0000-00-00
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[firstpage_image] =>[orig_patent_app_number] => 09533247
[rel_patent_id] =>[rel_patent_doc_number] =>) 09/533247 | Semiconductor device with tantalum nitride barrier film | Mar 21, 2000 | Issued |
Array
(
[id] => 1486829
[patent_doc_number] => 06365974
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[patent_title] => 'Flex circuit substrate for an integrated circuit package'
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[rel_patent_id] =>[rel_patent_doc_number] =>) 09/531387 | Flex circuit substrate for an integrated circuit package | Mar 20, 2000 | Issued |
Array
(
[id] => 1544384
[patent_doc_number] => 06373137
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[patent_kind] => B1
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[patent_title] => 'Copper interconnect for an integrated circuit and methods for its fabrication'
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[firstpage_image] =>[orig_patent_app_number] => 09532087
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Array
(
[id] => 1390872
[patent_doc_number] => 06552380
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[patent_title] => 'Semiconductor device and manufacturing method thereof'
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Array
(
[id] => 1491891
[patent_doc_number] => 06417573
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[patent_kind] => B1
[patent_issue_date] => 2002-07-09
[patent_title] => 'High temperature flip chip joining flux that obviates the cleaning process'
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Array
(
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[patent_doc_number] => 06437446
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[patent_title] => 'Semiconductor device having first and second chips'
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[rel_patent_id] =>[rel_patent_doc_number] =>) 09/527217 | Semiconductor device having first and second chips | Mar 15, 2000 | Issued |
Array
(
[id] => 4376691
[patent_doc_number] => 06288439
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[patent_kind] => NA
[patent_issue_date] => 2001-09-11
[patent_title] => 'Tape carrier package for a semiconductor device'
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[patent_current_assignee] =>[type] => patent
[pdf_file] => patents/06/288/06288439.pdf
[firstpage_image] =>[orig_patent_app_number] => 524817
[rel_patent_id] =>[rel_patent_doc_number] =>) 09/524817 | Tape carrier package for a semiconductor device | Mar 13, 2000 | Issued |