
Roy Karl Potter
Examiner (ID: 13991, Phone: (571)272-1842 , Office: P/2822 )
| Most Active Art Unit | 2822 |
| Art Unit(s) | 2822, 2508, 2811, 3621 |
| Total Applications | 2584 |
| Issued Applications | 2409 |
| Pending Applications | 46 |
| Abandoned Applications | 141 |
Applications
| Application number | Title of the application | Filing Date | Status |
|---|---|---|---|
Array
(
[id] => 1495446
[patent_doc_number] => 06342710
[patent_country] => US
[patent_kind] => B1
[patent_issue_date] => 2002-01-29
[patent_title] => 'Semiconductor integrated circuit'
[patent_app_type] => B1
[patent_app_number] => 09/521957
[patent_app_country] => US
[patent_app_date] => 2000-03-09
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 19
[patent_figures_cnt] => 26
[patent_no_of_words] => 11882
[patent_no_of_claims] => 12
[patent_no_of_ind_claims] => 3
[patent_words_short_claim] => 106
[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => patent
[pdf_file] => patents/06/342/06342710.pdf
[firstpage_image] =>[orig_patent_app_number] => 09521957
[rel_patent_id] =>[rel_patent_doc_number] =>) 09/521957 | Semiconductor integrated circuit | Mar 8, 2000 | Issued |
Array
(
[id] => 1115590
[patent_doc_number] => 06800533
[patent_country] => US
[patent_kind] => B1
[patent_issue_date] => 2004-10-05
[patent_title] => 'Integrated vertical spiral inductor on semiconductor material'
[patent_app_type] => B1
[patent_app_number] => 09/519427
[patent_app_country] => US
[patent_app_date] => 2000-03-06
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 14
[patent_figures_cnt] => 23
[patent_no_of_words] => 7530
[patent_no_of_claims] => 23
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[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => patent
[pdf_file] => patents/06/800/06800533.pdf
[firstpage_image] =>[orig_patent_app_number] => 09519427
[rel_patent_id] =>[rel_patent_doc_number] =>) 09/519427 | Integrated vertical spiral inductor on semiconductor material | Mar 5, 2000 | Issued |
Array
(
[id] => 1368260
[patent_doc_number] => RE038043
[patent_country] => US
[patent_kind] => E1
[patent_issue_date] => 2003-03-25
[patent_title] => 'Lead frame'
[patent_app_type] => E1
[patent_app_number] => 09/517748
[patent_app_country] => US
[patent_app_date] => 2000-03-03
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 21
[patent_figures_cnt] => 39
[patent_no_of_words] => 5380
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[patent_current_assignee] =>[type] => patent
[pdf_file] => patents/RE/038/RE038043.pdf
[firstpage_image] =>[orig_patent_app_number] => 09517748
[rel_patent_id] =>[rel_patent_doc_number] =>) 09/517748 | Lead frame | Mar 2, 2000 | Issued |
Array
(
[id] => 1554708
[patent_doc_number] => 06348737
[patent_country] => US
[patent_kind] => B1
[patent_issue_date] => 2002-02-19
[patent_title] => 'Metallic interlocking structure'
[patent_app_type] => B1
[patent_app_number] => 09/517847
[patent_app_country] => US
[patent_app_date] => 2000-03-02
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 9
[patent_figures_cnt] => 15
[patent_no_of_words] => 4590
[patent_no_of_claims] => 14
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[pdf_file] => patents/06/348/06348737.pdf
[firstpage_image] =>[orig_patent_app_number] => 09517847
[rel_patent_id] =>[rel_patent_doc_number] =>) 09/517847 | Metallic interlocking structure | Mar 1, 2000 | Issued |
Array
(
[id] => 1210820
[patent_doc_number] => 06713789
[patent_country] => US
[patent_kind] => B1
[patent_issue_date] => 2004-03-30
[patent_title] => 'Group III nitride compound semiconductor device and method of producing the same'
[patent_app_type] => B1
[patent_app_number] => 09/516177
[patent_app_country] => US
[patent_app_date] => 2000-03-01
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 12
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[patent_no_of_words] => 8924
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[pdf_file] => patents/06/713/06713789.pdf
[firstpage_image] =>[orig_patent_app_number] => 09516177
[rel_patent_id] =>[rel_patent_doc_number] =>) 09/516177 | Group III nitride compound semiconductor device and method of producing the same | Feb 29, 2000 | Issued |
Array
(
[id] => 1534659
[patent_doc_number] => 06410983
[patent_country] => US
[patent_kind] => B1
[patent_issue_date] => 2002-06-25
[patent_title] => 'Semiconductor device having a plurality of multi-chip modules interconnected by a wiring board having an interface LSI chip'
[patent_app_type] => B1
[patent_app_number] => 09/512657
[patent_app_country] => US
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[pdf_file] => patents/06/410/06410983.pdf
[firstpage_image] =>[orig_patent_app_number] => 09512657
[rel_patent_id] =>[rel_patent_doc_number] =>) 09/512657 | Semiconductor device having a plurality of multi-chip modules interconnected by a wiring board having an interface LSI chip | Feb 23, 2000 | Issued |
Array
(
[id] => 1583115
[patent_doc_number] => 06424049
[patent_country] => US
[patent_kind] => B1
[patent_issue_date] => 2002-07-23
[patent_title] => 'Semiconductor device having chip-on-chip structure and semiconductor chip used therefor'
[patent_app_type] => B1
[patent_app_number] => 09/511107
[patent_app_country] => US
[patent_app_date] => 2000-02-23
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 7
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[patent_no_of_words] => 4288
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[patent_current_assignee] =>[type] => patent
[pdf_file] => patents/06/424/06424049.pdf
[firstpage_image] =>[orig_patent_app_number] => 09511107
[rel_patent_id] =>[rel_patent_doc_number] =>) 09/511107 | Semiconductor device having chip-on-chip structure and semiconductor chip used therefor | Feb 22, 2000 | Issued |
Array
(
[id] => 1387172
[patent_doc_number] => 06555908
[patent_country] => US
[patent_kind] => B1
[patent_issue_date] => 2003-04-29
[patent_title] => 'Compliant, solderable input/output bump structures'
[patent_app_type] => B1
[patent_app_number] => 09/501177
[patent_app_country] => US
[patent_app_date] => 2000-02-10
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 32
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[patent_no_of_words] => 11043
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[patent_current_assignee] =>[type] => patent
[pdf_file] => patents/06/555/06555908.pdf
[firstpage_image] =>[orig_patent_app_number] => 09501177
[rel_patent_id] =>[rel_patent_doc_number] =>) 09/501177 | Compliant, solderable input/output bump structures | Feb 9, 2000 | Issued |
Array
(
[id] => 1497101
[patent_doc_number] => 06404040
[patent_country] => US
[patent_kind] => B1
[patent_issue_date] => 2002-06-11
[patent_title] => 'Semiconductor device with metal peripheral area'
[patent_app_type] => B1
[patent_app_number] => 09/497157
[patent_app_country] => US
[patent_app_date] => 2000-02-03
[patent_effective_date] => 0000-00-00
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[pdf_file] => patents/06/404/06404040.pdf
[firstpage_image] =>[orig_patent_app_number] => 09497157
[rel_patent_id] =>[rel_patent_doc_number] =>) 09/497157 | Semiconductor device with metal peripheral area | Feb 2, 2000 | Issued |
Array
(
[id] => 1522323
[patent_doc_number] => 06414389
[patent_country] => US
[patent_kind] => B1
[patent_issue_date] => 2002-07-02
[patent_title] => 'Alignment pedestals in an LDMOS power package'
[patent_app_type] => B1
[patent_app_number] => 09/493297
[patent_app_country] => US
[patent_app_date] => 2000-01-28
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 5
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[pdf_file] => patents/06/414/06414389.pdf
[firstpage_image] =>[orig_patent_app_number] => 09493297
[rel_patent_id] =>[rel_patent_doc_number] =>) 09/493297 | Alignment pedestals in an LDMOS power package | Jan 27, 2000 | Issued |
Array
(
[id] => 1522340
[patent_doc_number] => 06414396
[patent_country] => US
[patent_kind] => B1
[patent_issue_date] => 2002-07-02
[patent_title] => 'Package for stacked integrated circuits'
[patent_app_type] => B1
[patent_app_number] => 09/490317
[patent_app_country] => US
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[patent_effective_date] => 0000-00-00
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[pdf_file] => patents/06/414/06414396.pdf
[firstpage_image] =>[orig_patent_app_number] => 09490317
[rel_patent_id] =>[rel_patent_doc_number] =>) 09/490317 | Package for stacked integrated circuits | Jan 23, 2000 | Issued |
Array
(
[id] => 1587958
[patent_doc_number] => 06359341
[patent_country] => US
[patent_kind] => B1
[patent_issue_date] => 2002-03-19
[patent_title] => 'Ball grid array integrated circuit package structure'
[patent_app_type] => B1
[patent_app_number] => 09/489167
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[firstpage_image] =>[orig_patent_app_number] => 09489167
[rel_patent_id] =>[rel_patent_doc_number] =>) 09/489167 | Ball grid array integrated circuit package structure | Jan 20, 2000 | Issued |
Array
(
[id] => 1568491
[patent_doc_number] => 06376916
[patent_country] => US
[patent_kind] => B1
[patent_issue_date] => 2002-04-23
[patent_title] => 'Tape carrier for BGA and semiconductor device using the same'
[patent_app_type] => B1
[patent_app_number] => 09/488507
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[rel_patent_id] =>[rel_patent_doc_number] =>) 09/488507 | Tape carrier for BGA and semiconductor device using the same | Jan 19, 2000 | Issued |
Array
(
[id] => 7645227
[patent_doc_number] => 06472745
[patent_country] => US
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[patent_issue_date] => 2002-10-29
[patent_title] => 'Semiconductor device'
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[firstpage_image] =>[orig_patent_app_number] => 09482337
[rel_patent_id] =>[rel_patent_doc_number] =>) 09/482337 | Semiconductor device | Jan 13, 2000 | Issued |
Array
(
[id] => 7645239
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[patent_title] => 'Electronic circuit support comprising tear resistant means'
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Array
(
[id] => 1448118
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Array
(
[id] => 4387616
[patent_doc_number] => 06294833
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[patent_title] => 'Semiconductor device and fabrication process thereof'
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Array
(
[id] => 1380533
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[patent_title] => 'Silicon carbide interconnect for semiconductor components and method of fabrication'
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[rel_patent_id] =>[rel_patent_doc_number] =>) 09/480027 | Silicon carbide interconnect for semiconductor components and method of fabrication | Jan 9, 2000 | Issued |
Array
(
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Array
(
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[patent_title] => 'Method for programming a substrate for array-type packages'
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[firstpage_image] =>[orig_patent_app_number] => 09477306
[rel_patent_id] =>[rel_patent_doc_number] =>) 09/477306 | Method for programming a substrate for array-type packages | Jan 3, 2000 | Issued |