
Roy Karl Potter
Examiner (ID: 13991, Phone: (571)272-1842 , Office: P/2822 )
| Most Active Art Unit | 2822 |
| Art Unit(s) | 2822, 2508, 2811, 3621 |
| Total Applications | 2584 |
| Issued Applications | 2409 |
| Pending Applications | 46 |
| Abandoned Applications | 141 |
Applications
| Application number | Title of the application | Filing Date | Status |
|---|---|---|---|
Array
(
[id] => 4286365
[patent_doc_number] => 06268231
[patent_country] => US
[patent_kind] => NA
[patent_issue_date] => 2001-07-31
[patent_title] => 'Low cost CCD packaging'
[patent_app_type] => 1
[patent_app_number] => 9/417747
[patent_app_country] => US
[patent_app_date] => 1999-10-14
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 1
[patent_figures_cnt] => 3
[patent_no_of_words] => 2359
[patent_no_of_claims] => 4
[patent_no_of_ind_claims] => 1
[patent_words_short_claim] => 144
[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => patent
[pdf_file] => patents/06/268/06268231.pdf
[firstpage_image] =>[orig_patent_app_number] => 417747
[rel_patent_id] =>[rel_patent_doc_number] =>) 09/417747 | Low cost CCD packaging | Oct 13, 1999 | Issued |
Array
(
[id] => 4365002
[patent_doc_number] => 06191488
[patent_country] => US
[patent_kind] => NA
[patent_issue_date] => 2001-02-20
[patent_title] => 'Flip chip type semiconductor package and method of injecting resin into device thereof'
[patent_app_type] => 1
[patent_app_number] => 9/412637
[patent_app_country] => US
[patent_app_date] => 1999-10-05
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 3
[patent_figures_cnt] => 9
[patent_no_of_words] => 2737
[patent_no_of_claims] => 19
[patent_no_of_ind_claims] => 3
[patent_words_short_claim] => 123
[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => patent
[pdf_file] => patents/06/191/06191488.pdf
[firstpage_image] =>[orig_patent_app_number] => 412637
[rel_patent_id] =>[rel_patent_doc_number] =>) 09/412637 | Flip chip type semiconductor package and method of injecting resin into device thereof | Oct 4, 1999 | Issued |
Array
(
[id] => 4390127
[patent_doc_number] => 06262479
[patent_country] => US
[patent_kind] => NA
[patent_issue_date] => 2001-07-17
[patent_title] => 'Semiconductor packaging structure'
[patent_app_type] => 1
[patent_app_number] => 9/412427
[patent_app_country] => US
[patent_app_date] => 1999-10-05
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 3
[patent_figures_cnt] => 6
[patent_no_of_words] => 1234
[patent_no_of_claims] => 5
[patent_no_of_ind_claims] => 1
[patent_words_short_claim] => 118
[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => patent
[pdf_file] => patents/06/262/06262479.pdf
[firstpage_image] =>[orig_patent_app_number] => 412427
[rel_patent_id] =>[rel_patent_doc_number] =>) 09/412427 | Semiconductor packaging structure | Oct 4, 1999 | Issued |
Array
(
[id] => 4319887
[patent_doc_number] => 06242795
[patent_country] => US
[patent_kind] => NA
[patent_issue_date] => 2001-06-05
[patent_title] => 'Metal line structure and method of manufacturing the same'
[patent_app_type] => 1
[patent_app_number] => 9/401277
[patent_app_country] => US
[patent_app_date] => 1999-09-23
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 5
[patent_figures_cnt] => 14
[patent_no_of_words] => 2562
[patent_no_of_claims] => 1
[patent_no_of_ind_claims] => 1
[patent_words_short_claim] => 75
[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => patent
[pdf_file] => patents/06/242/06242795.pdf
[firstpage_image] =>[orig_patent_app_number] => 401277
[rel_patent_id] =>[rel_patent_doc_number] =>) 09/401277 | Metal line structure and method of manufacturing the same | Sep 22, 1999 | Issued |
Array
(
[id] => 4355762
[patent_doc_number] => 06215187
[patent_country] => US
[patent_kind] => NA
[patent_issue_date] => 2001-04-10
[patent_title] => 'Semiconductor device and manufacturing method thereof'
[patent_app_type] => 1
[patent_app_number] => 9/400857
[patent_app_country] => US
[patent_app_date] => 1999-09-21
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 23
[patent_figures_cnt] => 28
[patent_no_of_words] => 9603
[patent_no_of_claims] => 22
[patent_no_of_ind_claims] => 2
[patent_words_short_claim] => 60
[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => patent
[pdf_file] => patents/06/215/06215187.pdf
[firstpage_image] =>[orig_patent_app_number] => 400857
[rel_patent_id] =>[rel_patent_doc_number] =>) 09/400857 | Semiconductor device and manufacturing method thereof | Sep 20, 1999 | Issued |
Array
(
[id] => 4423750
[patent_doc_number] => 06177724
[patent_country] => US
[patent_kind] => NA
[patent_issue_date] => 2001-01-23
[patent_title] => 'Semiconductor device'
[patent_app_type] => 1
[patent_app_number] => 9/397770
[patent_app_country] => US
[patent_app_date] => 1999-09-16
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 6
[patent_figures_cnt] => 14
[patent_no_of_words] => 4199
[patent_no_of_claims] => 10
[patent_no_of_ind_claims] => 2
[patent_words_short_claim] => 119
[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => patent
[pdf_file] => patents/06/177/06177724.pdf
[firstpage_image] =>[orig_patent_app_number] => 397770
[rel_patent_id] =>[rel_patent_doc_number] =>) 09/397770 | Semiconductor device | Sep 15, 1999 | Issued |
Array
(
[id] => 4265132
[patent_doc_number] => 06204557
[patent_country] => US
[patent_kind] => NA
[patent_issue_date] => 2001-03-20
[patent_title] => 'Reduction of topside movement during temperature cycles'
[patent_app_type] => 1
[patent_app_number] => 9/394667
[patent_app_country] => US
[patent_app_date] => 1999-09-13
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 8
[patent_figures_cnt] => 13
[patent_no_of_words] => 3542
[patent_no_of_claims] => 20
[patent_no_of_ind_claims] => 1
[patent_words_short_claim] => 136
[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => patent
[pdf_file] => patents/06/204/06204557.pdf
[firstpage_image] =>[orig_patent_app_number] => 394667
[rel_patent_id] =>[rel_patent_doc_number] =>) 09/394667 | Reduction of topside movement during temperature cycles | Sep 12, 1999 | Issued |
Array
(
[id] => 1519043
[patent_doc_number] => 06501168
[patent_country] => US
[patent_kind] => B1
[patent_issue_date] => 2002-12-31
[patent_title] => 'Substrate for an integrated circuit package'
[patent_app_type] => B1
[patent_app_number] => 09/388332
[patent_app_country] => US
[patent_app_date] => 1999-09-01
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 5
[patent_figures_cnt] => 21
[patent_no_of_words] => 4393
[patent_no_of_claims] => 19
[patent_no_of_ind_claims] => 3
[patent_words_short_claim] => 73
[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => patent
[pdf_file] => patents/06/501/06501168.pdf
[firstpage_image] =>[orig_patent_app_number] => 09388332
[rel_patent_id] =>[rel_patent_doc_number] =>) 09/388332 | Substrate for an integrated circuit package | Aug 31, 1999 | Issued |
| 09/386137 | SEMICONDUCTOR MODULE AND PRODUCING METHOD THEREFOR | Aug 30, 1999 | Abandoned |
Array
(
[id] => 4265141
[patent_doc_number] => 06204558
[patent_country] => US
[patent_kind] => NA
[patent_issue_date] => 2001-03-20
[patent_title] => 'Two ball bump'
[patent_app_type] => 1
[patent_app_number] => 9/385957
[patent_app_country] => US
[patent_app_date] => 1999-08-30
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 5
[patent_figures_cnt] => 18
[patent_no_of_words] => 5521
[patent_no_of_claims] => 7
[patent_no_of_ind_claims] => 2
[patent_words_short_claim] => 90
[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => patent
[pdf_file] => patents/06/204/06204558.pdf
[firstpage_image] =>[orig_patent_app_number] => 385957
[rel_patent_id] =>[rel_patent_doc_number] =>) 09/385957 | Two ball bump | Aug 29, 1999 | Issued |
Array
(
[id] => 1509489
[patent_doc_number] => 06441480
[patent_country] => US
[patent_kind] => B1
[patent_issue_date] => 2002-08-27
[patent_title] => 'Microelectronic circuit package'
[patent_app_type] => B1
[patent_app_number] => 09/379537
[patent_app_country] => US
[patent_app_date] => 1999-08-24
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 4
[patent_figures_cnt] => 6
[patent_no_of_words] => 2202
[patent_no_of_claims] => 22
[patent_no_of_ind_claims] => 12
[patent_words_short_claim] => 51
[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => patent
[pdf_file] => patents/06/441/06441480.pdf
[firstpage_image] =>[orig_patent_app_number] => 09379537
[rel_patent_id] =>[rel_patent_doc_number] =>) 09/379537 | Microelectronic circuit package | Aug 23, 1999 | Issued |
Array
(
[id] => 1597138
[patent_doc_number] => 06384463
[patent_country] => US
[patent_kind] => B1
[patent_issue_date] => 2002-05-07
[patent_title] => 'High voltage shield'
[patent_app_type] => B1
[patent_app_number] => 09/379107
[patent_app_country] => US
[patent_app_date] => 1999-08-23
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 3
[patent_figures_cnt] => 4
[patent_no_of_words] => 1805
[patent_no_of_claims] => 16
[patent_no_of_ind_claims] => 2
[patent_words_short_claim] => 129
[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => patent
[pdf_file] => patents/06/384/06384463.pdf
[firstpage_image] =>[orig_patent_app_number] => 09379107
[rel_patent_id] =>[rel_patent_doc_number] =>) 09/379107 | High voltage shield | Aug 22, 1999 | Issued |
Array
(
[id] => 1469877
[patent_doc_number] => 06406989
[patent_country] => US
[patent_kind] => B1
[patent_issue_date] => 2002-06-18
[patent_title] => 'Method of fabricating semiconductor device with bump electrodes'
[patent_app_type] => B1
[patent_app_number] => 09/375637
[patent_app_country] => US
[patent_app_date] => 1999-08-17
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 4
[patent_figures_cnt] => 7
[patent_no_of_words] => 4754
[patent_no_of_claims] => 26
[patent_no_of_ind_claims] => 2
[patent_words_short_claim] => 140
[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => patent
[pdf_file] => patents/06/406/06406989.pdf
[firstpage_image] =>[orig_patent_app_number] => 09375637
[rel_patent_id] =>[rel_patent_doc_number] =>) 09/375637 | Method of fabricating semiconductor device with bump electrodes | Aug 16, 1999 | Issued |
Array
(
[id] => 4195266
[patent_doc_number] => 06153932
[patent_country] => US
[patent_kind] => NA
[patent_issue_date] => 2000-11-28
[patent_title] => 'Fix base of integrated circuit chipset and heat sink'
[patent_app_type] => 1
[patent_app_number] => 9/373170
[patent_app_country] => US
[patent_app_date] => 1999-08-12
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 5
[patent_figures_cnt] => 5
[patent_no_of_words] => 1929
[patent_no_of_claims] => 6
[patent_no_of_ind_claims] => 1
[patent_words_short_claim] => 122
[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => patent
[pdf_file] => patents/06/153/06153932.pdf
[firstpage_image] =>[orig_patent_app_number] => 373170
[rel_patent_id] =>[rel_patent_doc_number] =>) 09/373170 | Fix base of integrated circuit chipset and heat sink | Aug 11, 1999 | Issued |
Array
(
[id] => 1410955
[patent_doc_number] => 06534872
[patent_country] => US
[patent_kind] => B1
[patent_issue_date] => 2003-03-18
[patent_title] => 'Apparatus and system with increased signal trace routing options in printed wiring boards and integrated circuit packaging'
[patent_app_type] => B1
[patent_app_number] => 09/371722
[patent_app_country] => US
[patent_app_date] => 1999-08-10
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 16
[patent_figures_cnt] => 18
[patent_no_of_words] => 5323
[patent_no_of_claims] => 31
[patent_no_of_ind_claims] => 6
[patent_words_short_claim] => 88
[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => patent
[pdf_file] => patents/06/534/06534872.pdf
[firstpage_image] =>[orig_patent_app_number] => 09371722
[rel_patent_id] =>[rel_patent_doc_number] =>) 09/371722 | Apparatus and system with increased signal trace routing options in printed wiring boards and integrated circuit packaging | Aug 9, 1999 | Issued |
Array
(
[id] => 4265075
[patent_doc_number] => 06204553
[patent_country] => US
[patent_kind] => NA
[patent_issue_date] => 2001-03-20
[patent_title] => 'Lead frame structure'
[patent_app_type] => 1
[patent_app_number] => 9/371677
[patent_app_country] => US
[patent_app_date] => 1999-08-10
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 4
[patent_figures_cnt] => 6
[patent_no_of_words] => 1914
[patent_no_of_claims] => 11
[patent_no_of_ind_claims] => 3
[patent_words_short_claim] => 82
[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => patent
[pdf_file] => patents/06/204/06204553.pdf
[firstpage_image] =>[orig_patent_app_number] => 371677
[rel_patent_id] =>[rel_patent_doc_number] =>) 09/371677 | Lead frame structure | Aug 9, 1999 | Issued |
Array
(
[id] => 1448107
[patent_doc_number] => 06369439
[patent_country] => US
[patent_kind] => B1
[patent_issue_date] => 2002-04-09
[patent_title] => 'Strip of semiconductor package'
[patent_app_type] => B1
[patent_app_number] => 09/366637
[patent_app_country] => US
[patent_app_date] => 1999-08-04
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 5
[patent_figures_cnt] => 6
[patent_no_of_words] => 2007
[patent_no_of_claims] => 11
[patent_no_of_ind_claims] => 2
[patent_words_short_claim] => 87
[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => patent
[pdf_file] => patents/06/369/06369439.pdf
[firstpage_image] =>[orig_patent_app_number] => 09366637
[rel_patent_id] =>[rel_patent_doc_number] =>) 09/366637 | Strip of semiconductor package | Aug 3, 1999 | Issued |
Array
(
[id] => 4408885
[patent_doc_number] => 06300248
[patent_country] => US
[patent_kind] => NA
[patent_issue_date] => 2001-10-09
[patent_title] => 'On-chip pad conditioning for chemical mechanical polishing'
[patent_app_type] => 1
[patent_app_number] => 9/366227
[patent_app_country] => US
[patent_app_date] => 1999-08-03
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 5
[patent_figures_cnt] => 9
[patent_no_of_words] => 4067
[patent_no_of_claims] => 15
[patent_no_of_ind_claims] => 2
[patent_words_short_claim] => 87
[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => patent
[pdf_file] => patents/06/300/06300248.pdf
[firstpage_image] =>[orig_patent_app_number] => 366227
[rel_patent_id] =>[rel_patent_doc_number] =>) 09/366227 | On-chip pad conditioning for chemical mechanical polishing | Aug 2, 1999 | Issued |
Array
(
[id] => 4366692
[patent_doc_number] => 06255732
[patent_country] => US
[patent_kind] => NA
[patent_issue_date] => 2001-07-03
[patent_title] => 'Semiconductor device and process for producing the same'
[patent_app_type] => 1
[patent_app_number] => 9/366517
[patent_app_country] => US
[patent_app_date] => 1999-08-03
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 9
[patent_figures_cnt] => 18
[patent_no_of_words] => 5765
[patent_no_of_claims] => 14
[patent_no_of_ind_claims] => 2
[patent_words_short_claim] => 127
[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => patent
[pdf_file] => patents/06/255/06255732.pdf
[firstpage_image] =>[orig_patent_app_number] => 366517
[rel_patent_id] =>[rel_patent_doc_number] =>) 09/366517 | Semiconductor device and process for producing the same | Aug 2, 1999 | Issued |
Array
(
[id] => 1419346
[patent_doc_number] => 06525392
[patent_country] => US
[patent_kind] => B1
[patent_issue_date] => 2003-02-25
[patent_title] => 'Semiconductor power device with insulated circuit'
[patent_app_type] => B1
[patent_app_number] => 09/352477
[patent_app_country] => US
[patent_app_date] => 1999-07-13
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 3
[patent_figures_cnt] => 3
[patent_no_of_words] => 3205
[patent_no_of_claims] => 20
[patent_no_of_ind_claims] => 2
[patent_words_short_claim] => 72
[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => patent
[pdf_file] => patents/06/525/06525392.pdf
[firstpage_image] =>[orig_patent_app_number] => 09352477
[rel_patent_id] =>[rel_patent_doc_number] =>) 09/352477 | Semiconductor power device with insulated circuit | Jul 12, 1999 | Issued |