Search

Roy Karl Potter

Examiner (ID: 13991, Phone: (571)272-1842 , Office: P/2822 )

Most Active Art Unit
2822
Art Unit(s)
2822, 2508, 2811, 3621
Total Applications
2584
Issued Applications
2409
Pending Applications
46
Abandoned Applications
141

Applications

Application numberTitle of the applicationFiling DateStatus
Array ( [id] => 1544361 [patent_doc_number] => 06373133 [patent_country] => US [patent_kind] => B1 [patent_issue_date] => 2002-04-16 [patent_title] => 'Multi-chip module and heat-sink cap combination' [patent_app_type] => B1 [patent_app_number] => 09/353467 [patent_app_country] => US [patent_app_date] => 1999-07-13 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 3 [patent_figures_cnt] => 6 [patent_no_of_words] => 4139 [patent_no_of_claims] => 15 [patent_no_of_ind_claims] => 3 [patent_words_short_claim] => 180 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/06/373/06373133.pdf [firstpage_image] =>[orig_patent_app_number] => 09353467 [rel_patent_id] =>[rel_patent_doc_number] =>)
09/353467
Multi-chip module and heat-sink cap combination Jul 12, 1999 Issued
Array ( [id] => 1466906 [patent_doc_number] => 06458622 [patent_country] => US [patent_kind] => B1 [patent_issue_date] => 2002-10-01 [patent_title] => 'Stress compensation composition and semiconductor component formed using the stress compensation composition' [patent_app_type] => B1 [patent_app_number] => 09/348737 [patent_app_country] => US [patent_app_date] => 1999-07-06 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 6 [patent_figures_cnt] => 9 [patent_no_of_words] => 3278 [patent_no_of_claims] => 8 [patent_no_of_ind_claims] => 3 [patent_words_short_claim] => 53 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/06/458/06458622.pdf [firstpage_image] =>[orig_patent_app_number] => 09348737 [rel_patent_id] =>[rel_patent_doc_number] =>)
09/348737
Stress compensation composition and semiconductor component formed using the stress compensation composition Jul 5, 1999 Issued
Array ( [id] => 4176880 [patent_doc_number] => 06140699 [patent_country] => US [patent_kind] => NA [patent_issue_date] => 2000-10-31 [patent_title] => 'Molding for holding heat sinks in a clamped stack' [patent_app_type] => 1 [patent_app_number] => 9/345510 [patent_app_country] => US [patent_app_date] => 1999-07-01 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 3 [patent_figures_cnt] => 3 [patent_no_of_words] => 2127 [patent_no_of_claims] => 10 [patent_no_of_ind_claims] => 1 [patent_words_short_claim] => 96 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/06/140/06140699.pdf [firstpage_image] =>[orig_patent_app_number] => 345510 [rel_patent_id] =>[rel_patent_doc_number] =>)
09/345510
Molding for holding heat sinks in a clamped stack Jun 30, 1999 Issued
Array ( [id] => 4310353 [patent_doc_number] => 06326694 [patent_country] => US [patent_kind] => NA [patent_issue_date] => 2001-12-04 [patent_title] => 'Printed circuit board' [patent_app_type] => 1 [patent_app_number] => 9/337407 [patent_app_country] => US [patent_app_date] => 1999-06-21 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 14 [patent_figures_cnt] => 49 [patent_no_of_words] => 11447 [patent_no_of_claims] => 32 [patent_no_of_ind_claims] => 2 [patent_words_short_claim] => 77 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/06/326/06326694.pdf [firstpage_image] =>[orig_patent_app_number] => 337407 [rel_patent_id] =>[rel_patent_doc_number] =>)
09/337407
Printed circuit board Jun 20, 1999 Issued
Array ( [id] => 1491884 [patent_doc_number] => 06417570 [patent_country] => US [patent_kind] => B1 [patent_issue_date] => 2002-07-09 [patent_title] => 'Layered dielectric film structure suitable for gate dielectric application in sub-0.25 m technologies' [patent_app_type] => B1 [patent_app_number] => 09/334977 [patent_app_country] => US [patent_app_date] => 1999-06-17 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 3 [patent_figures_cnt] => 9 [patent_no_of_words] => 5502 [patent_no_of_claims] => 9 [patent_no_of_ind_claims] => 2 [patent_words_short_claim] => 77 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/06/417/06417570.pdf [firstpage_image] =>[orig_patent_app_number] => 09334977 [rel_patent_id] =>[rel_patent_doc_number] =>)
09/334977
Layered dielectric film structure suitable for gate dielectric application in sub-0.25 m technologies Jun 16, 1999 Issued
Array ( [id] => 1597946 [patent_doc_number] => 06492721 [patent_country] => US [patent_kind] => B1 [patent_issue_date] => 2002-12-10 [patent_title] => 'High-voltage signal detecting circuit' [patent_app_type] => B1 [patent_app_number] => 09/330080 [patent_app_country] => US [patent_app_date] => 1999-06-11 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 5 [patent_figures_cnt] => 5 [patent_no_of_words] => 2307 [patent_no_of_claims] => 7 [patent_no_of_ind_claims] => 1 [patent_words_short_claim] => 107 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/06/492/06492721.pdf [firstpage_image] =>[orig_patent_app_number] => 09330080 [rel_patent_id] =>[rel_patent_doc_number] =>)
09/330080
High-voltage signal detecting circuit Jun 10, 1999 Issued
Array ( [id] => 4300394 [patent_doc_number] => 06181018 [patent_country] => US [patent_kind] => NA [patent_issue_date] => 2001-01-30 [patent_title] => 'Semiconductor device' [patent_app_type] => 1 [patent_app_number] => 9/330270 [patent_app_country] => US [patent_app_date] => 1999-06-11 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 7 [patent_figures_cnt] => 13 [patent_no_of_words] => 4245 [patent_no_of_claims] => 5 [patent_no_of_ind_claims] => 1 [patent_words_short_claim] => 72 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/06/181/06181018.pdf [firstpage_image] =>[orig_patent_app_number] => 330270 [rel_patent_id] =>[rel_patent_doc_number] =>)
09/330270
Semiconductor device Jun 10, 1999 Issued
Array ( [id] => 4411120 [patent_doc_number] => 06232665 [patent_country] => US [patent_kind] => NA [patent_issue_date] => 2001-05-15 [patent_title] => 'Silicon-doped titanium wetting layer for aluminum plug' [patent_app_type] => 1 [patent_app_number] => 9/328117 [patent_app_country] => US [patent_app_date] => 1999-06-08 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 1 [patent_figures_cnt] => 1 [patent_no_of_words] => 2382 [patent_no_of_claims] => 12 [patent_no_of_ind_claims] => 1 [patent_words_short_claim] => 93 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/06/232/06232665.pdf [firstpage_image] =>[orig_patent_app_number] => 328117 [rel_patent_id] =>[rel_patent_doc_number] =>)
09/328117
Silicon-doped titanium wetting layer for aluminum plug Jun 7, 1999 Issued
Array ( [id] => 4300366 [patent_doc_number] => 06181016 [patent_country] => US [patent_kind] => NA [patent_issue_date] => 2001-01-30 [patent_title] => 'Bond-pad with a single anchoring structure' [patent_app_type] => 1 [patent_app_number] => 9/327877 [patent_app_country] => US [patent_app_date] => 1999-06-08 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 8 [patent_figures_cnt] => 15 [patent_no_of_words] => 5245 [patent_no_of_claims] => 15 [patent_no_of_ind_claims] => 9 [patent_words_short_claim] => 71 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/06/181/06181016.pdf [firstpage_image] =>[orig_patent_app_number] => 327877 [rel_patent_id] =>[rel_patent_doc_number] =>)
09/327877
Bond-pad with a single anchoring structure Jun 7, 1999 Issued
Array ( [id] => 1476292 [patent_doc_number] => 06388285 [patent_country] => US [patent_kind] => B1 [patent_issue_date] => 2002-05-14 [patent_title] => 'Feram cell with internal oxygen source and method of oxygen release' [patent_app_type] => B1 [patent_app_number] => 09/325857 [patent_app_country] => US [patent_app_date] => 1999-06-04 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 4 [patent_figures_cnt] => 9 [patent_no_of_words] => 4054 [patent_no_of_claims] => 30 [patent_no_of_ind_claims] => 2 [patent_words_short_claim] => 45 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/06/388/06388285.pdf [firstpage_image] =>[orig_patent_app_number] => 09325857 [rel_patent_id] =>[rel_patent_doc_number] =>)
09/325857
Feram cell with internal oxygen source and method of oxygen release Jun 3, 1999 Issued
Array ( [id] => 4222610 [patent_doc_number] => 06111312 [patent_country] => US [patent_kind] => NA [patent_issue_date] => 2000-08-29 [patent_title] => 'Semiconductor device with leads engaged with notches' [patent_app_type] => 1 [patent_app_number] => 9/324167 [patent_app_country] => US [patent_app_date] => 1999-06-02 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 15 [patent_figures_cnt] => 26 [patent_no_of_words] => 5443 [patent_no_of_claims] => 7 [patent_no_of_ind_claims] => 1 [patent_words_short_claim] => 128 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/06/111/06111312.pdf [firstpage_image] =>[orig_patent_app_number] => 324167 [rel_patent_id] =>[rel_patent_doc_number] =>)
09/324167
Semiconductor device with leads engaged with notches Jun 1, 1999 Issued
Array ( [id] => 4419974 [patent_doc_number] => 06225154 [patent_country] => US [patent_kind] => NA [patent_issue_date] => 2001-05-01 [patent_title] => 'Bonding of silicon wafers' [patent_app_type] => 1 [patent_app_number] => 9/322967 [patent_app_country] => US [patent_app_date] => 1999-05-28 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 5 [patent_figures_cnt] => 12 [patent_no_of_words] => 2275 [patent_no_of_claims] => 20 [patent_no_of_ind_claims] => 4 [patent_words_short_claim] => 89 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/06/225/06225154.pdf [firstpage_image] =>[orig_patent_app_number] => 322967 [rel_patent_id] =>[rel_patent_doc_number] =>)
09/322967
Bonding of silicon wafers May 27, 1999 Issued
Array ( [id] => 4341451 [patent_doc_number] => 06333558 [patent_country] => US [patent_kind] => NA [patent_issue_date] => 2001-12-25 [patent_title] => 'Semiconductor device and method for fabricating the same' [patent_app_type] => 1 [patent_app_number] => 9/318737 [patent_app_country] => US [patent_app_date] => 1999-05-26 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 3 [patent_figures_cnt] => 7 [patent_no_of_words] => 6074 [patent_no_of_claims] => 21 [patent_no_of_ind_claims] => 2 [patent_words_short_claim] => 58 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/06/333/06333558.pdf [firstpage_image] =>[orig_patent_app_number] => 318737 [rel_patent_id] =>[rel_patent_doc_number] =>)
09/318737
Semiconductor device and method for fabricating the same May 25, 1999 Issued
Array ( [id] => 1497177 [patent_doc_number] => 06404056 [patent_country] => US [patent_kind] => B1 [patent_issue_date] => 2002-06-11 [patent_title] => 'Semiconductor integrated circuit' [patent_app_type] => B1 [patent_app_number] => 09/313249 [patent_app_country] => US [patent_app_date] => 1999-05-18 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 27 [patent_figures_cnt] => 31 [patent_no_of_words] => 10437 [patent_no_of_claims] => 18 [patent_no_of_ind_claims] => 3 [patent_words_short_claim] => 132 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/06/404/06404056.pdf [firstpage_image] =>[orig_patent_app_number] => 09313249 [rel_patent_id] =>[rel_patent_doc_number] =>)
09/313249
Semiconductor integrated circuit May 17, 1999 Issued
Array ( [id] => 4411012 [patent_doc_number] => 06271591 [patent_country] => US [patent_kind] => NA [patent_issue_date] => 2001-08-07 [patent_title] => 'Copper-aluminum metallization' [patent_app_type] => 1 [patent_app_number] => 9/312937 [patent_app_country] => US [patent_app_date] => 1999-05-17 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 4 [patent_figures_cnt] => 8 [patent_no_of_words] => 2287 [patent_no_of_claims] => 7 [patent_no_of_ind_claims] => 1 [patent_words_short_claim] => 78 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/06/271/06271591.pdf [firstpage_image] =>[orig_patent_app_number] => 312937 [rel_patent_id] =>[rel_patent_doc_number] =>)
09/312937
Copper-aluminum metallization May 16, 1999 Issued
Array ( [id] => 4301293 [patent_doc_number] => 06184573 [patent_country] => US [patent_kind] => NA [patent_issue_date] => 2001-02-06 [patent_title] => 'Chip packaging' [patent_app_type] => 1 [patent_app_number] => 9/310727 [patent_app_country] => US [patent_app_date] => 1999-05-13 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 3 [patent_figures_cnt] => 5 [patent_no_of_words] => 2216 [patent_no_of_claims] => 11 [patent_no_of_ind_claims] => 2 [patent_words_short_claim] => 90 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/06/184/06184573.pdf [firstpage_image] =>[orig_patent_app_number] => 310727 [rel_patent_id] =>[rel_patent_doc_number] =>)
09/310727
Chip packaging May 12, 1999 Issued
Array ( [id] => 4297819 [patent_doc_number] => 06236114 [patent_country] => US [patent_kind] => NA [patent_issue_date] => 2001-05-22 [patent_title] => 'Bonding pad structure' [patent_app_type] => 1 [patent_app_number] => 9/306097 [patent_app_country] => US [patent_app_date] => 1999-05-06 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 2 [patent_figures_cnt] => 3 [patent_no_of_words] => 1747 [patent_no_of_claims] => 11 [patent_no_of_ind_claims] => 3 [patent_words_short_claim] => 89 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/06/236/06236114.pdf [firstpage_image] =>[orig_patent_app_number] => 306097 [rel_patent_id] =>[rel_patent_doc_number] =>)
09/306097
Bonding pad structure May 5, 1999 Issued
Array ( [id] => 4364926 [patent_doc_number] => 06191483 [patent_country] => US [patent_kind] => NA [patent_issue_date] => 2001-02-20 [patent_title] => 'Package structure for low cost and ultra thin chip scale package' [patent_app_type] => 1 [patent_app_number] => 9/306517 [patent_app_country] => US [patent_app_date] => 1999-05-06 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 2 [patent_figures_cnt] => 5 [patent_no_of_words] => 3202 [patent_no_of_claims] => 6 [patent_no_of_ind_claims] => 2 [patent_words_short_claim] => 233 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/06/191/06191483.pdf [firstpage_image] =>[orig_patent_app_number] => 306517 [rel_patent_id] =>[rel_patent_doc_number] =>)
09/306517
Package structure for low cost and ultra thin chip scale package May 5, 1999 Issued
Array ( [id] => 7636640 [patent_doc_number] => 06380015 [patent_country] => US [patent_kind] => B1 [patent_issue_date] => 2002-04-30 [patent_title] => 'MOSFETs with improved short channel effects and method of making the same' [patent_app_type] => B1 [patent_app_number] => 09/306617 [patent_app_country] => US [patent_app_date] => 1999-05-06 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 6 [patent_figures_cnt] => 12 [patent_no_of_words] => 2310 [patent_no_of_claims] => 3 [patent_no_of_ind_claims] => 2 [patent_words_short_claim] => 22 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/06/380/06380015.pdf [firstpage_image] =>[orig_patent_app_number] => 09306617 [rel_patent_id] =>[rel_patent_doc_number] =>)
09/306617
MOSFETs with improved short channel effects and method of making the same May 5, 1999 Issued
Array ( [id] => 4191422 [patent_doc_number] => 06043150 [patent_country] => US [patent_kind] => NA [patent_issue_date] => 2000-03-28 [patent_title] => 'Method for uniform plating of dendrites' [patent_app_type] => 1 [patent_app_number] => 9/304920 [patent_app_country] => US [patent_app_date] => 1999-05-04 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 1 [patent_figures_cnt] => 4 [patent_no_of_words] => 2595 [patent_no_of_claims] => 11 [patent_no_of_ind_claims] => 3 [patent_words_short_claim] => 94 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/06/043/06043150.pdf [firstpage_image] =>[orig_patent_app_number] => 304920 [rel_patent_id] =>[rel_patent_doc_number] =>)
09/304920
Method for uniform plating of dendrites May 3, 1999 Issued
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