Search

Roy Karl Potter

Examiner (ID: 13991, Phone: (571)272-1842 , Office: P/2822 )

Most Active Art Unit
2822
Art Unit(s)
2822, 2508, 2811, 3621
Total Applications
2584
Issued Applications
2409
Pending Applications
46
Abandoned Applications
141

Applications

Application numberTitle of the applicationFiling DateStatus
Array ( [id] => 4318272 [patent_doc_number] => 06316837 [patent_country] => US [patent_kind] => NA [patent_issue_date] => 2001-11-13 [patent_title] => 'Area array type semiconductor package and fabrication method' [patent_app_type] => 1 [patent_app_number] => 9/200937 [patent_app_country] => US [patent_app_date] => 1998-11-30 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 4 [patent_figures_cnt] => 11 [patent_no_of_words] => 1890 [patent_no_of_claims] => 21 [patent_no_of_ind_claims] => 4 [patent_words_short_claim] => 81 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/06/316/06316837.pdf [firstpage_image] =>[orig_patent_app_number] => 200937 [rel_patent_id] =>[rel_patent_doc_number] =>)
09/200937
Area array type semiconductor package and fabrication method Nov 29, 1998 Issued
Array ( [id] => 1461548 [patent_doc_number] => 06392302 [patent_country] => US [patent_kind] => B1 [patent_issue_date] => 2002-05-21 [patent_title] => 'Polycide structure and method for forming polycide structure' [patent_app_type] => B1 [patent_app_number] => 09/196437 [patent_app_country] => US [patent_app_date] => 1998-11-20 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 16 [patent_figures_cnt] => 16 [patent_no_of_words] => 3284 [patent_no_of_claims] => 63 [patent_no_of_ind_claims] => 5 [patent_words_short_claim] => 90 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/06/392/06392302.pdf [firstpage_image] =>[orig_patent_app_number] => 09196437 [rel_patent_id] =>[rel_patent_doc_number] =>)
09/196437
Polycide structure and method for forming polycide structure Nov 19, 1998 Issued
Array ( [id] => 1494317 [patent_doc_number] => 06342442 [patent_country] => US [patent_kind] => B1 [patent_issue_date] => 2002-01-29 [patent_title] => 'Kinetically controlled solder bonding' [patent_app_type] => B1 [patent_app_number] => 09/197074 [patent_app_country] => US [patent_app_date] => 1998-11-20 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 3 [patent_figures_cnt] => 7 [patent_no_of_words] => 2620 [patent_no_of_claims] => 9 [patent_no_of_ind_claims] => 1 [patent_words_short_claim] => 259 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/06/342/06342442.pdf [firstpage_image] =>[orig_patent_app_number] => 09197074 [rel_patent_id] =>[rel_patent_doc_number] =>)
09/197074
Kinetically controlled solder bonding Nov 19, 1998 Issued
Array ( [id] => 4101929 [patent_doc_number] => 06097082 [patent_country] => US [patent_kind] => NA [patent_issue_date] => 2000-08-01 [patent_title] => 'Semiconductor device' [patent_app_type] => 1 [patent_app_number] => 9/195697 [patent_app_country] => US [patent_app_date] => 1998-11-19 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 5 [patent_figures_cnt] => 9 [patent_no_of_words] => 2182 [patent_no_of_claims] => 12 [patent_no_of_ind_claims] => 2 [patent_words_short_claim] => 215 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/06/097/06097082.pdf [firstpage_image] =>[orig_patent_app_number] => 195697 [rel_patent_id] =>[rel_patent_doc_number] =>)
09/195697
Semiconductor device Nov 18, 1998 Issued
Array ( [id] => 4414409 [patent_doc_number] => 06265774 [patent_country] => US [patent_kind] => NA [patent_issue_date] => 2001-07-24 [patent_title] => 'Millimeter wave adjustable cavity package' [patent_app_type] => 1 [patent_app_number] => 9/195930 [patent_app_country] => US [patent_app_date] => 1998-11-19 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 3 [patent_figures_cnt] => 6 [patent_no_of_words] => 5376 [patent_no_of_claims] => 13 [patent_no_of_ind_claims] => 2 [patent_words_short_claim] => 230 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/06/265/06265774.pdf [firstpage_image] =>[orig_patent_app_number] => 195930 [rel_patent_id] =>[rel_patent_doc_number] =>)
09/195930
Millimeter wave adjustable cavity package Nov 18, 1998 Issued
Array ( [id] => 4310201 [patent_doc_number] => 06326683 [patent_country] => US [patent_kind] => NA [patent_issue_date] => 2001-12-04 [patent_title] => 'Carrier element for a semiconductor chip' [patent_app_type] => 1 [patent_app_number] => 9/193577 [patent_app_country] => US [patent_app_date] => 1998-11-17 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 5 [patent_figures_cnt] => 8 [patent_no_of_words] => 4385 [patent_no_of_claims] => 13 [patent_no_of_ind_claims] => 3 [patent_words_short_claim] => 23 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/06/326/06326683.pdf [firstpage_image] =>[orig_patent_app_number] => 193577 [rel_patent_id] =>[rel_patent_doc_number] =>)
09/193577
Carrier element for a semiconductor chip Nov 16, 1998 Issued
Array ( [id] => 4351205 [patent_doc_number] => 06285079 [patent_country] => US [patent_kind] => NA [patent_issue_date] => 2001-09-04 [patent_title] => 'Semiconductor device employing grid array electrodes and compact chip-size package' [patent_app_type] => 1 [patent_app_number] => 9/193247 [patent_app_country] => US [patent_app_date] => 1998-11-17 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 11 [patent_figures_cnt] => 26 [patent_no_of_words] => 9376 [patent_no_of_claims] => 9 [patent_no_of_ind_claims] => 1 [patent_words_short_claim] => 195 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/06/285/06285079.pdf [firstpage_image] =>[orig_patent_app_number] => 193247 [rel_patent_id] =>[rel_patent_doc_number] =>)
09/193247
Semiconductor device employing grid array electrodes and compact chip-size package Nov 16, 1998 Issued
Array ( [id] => 4414359 [patent_doc_number] => 06265769 [patent_country] => US [patent_kind] => NA [patent_issue_date] => 2001-07-24 [patent_title] => 'Double-sided chip mount package' [patent_app_type] => 1 [patent_app_number] => 9/191487 [patent_app_country] => US [patent_app_date] => 1998-11-13 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 2 [patent_figures_cnt] => 2 [patent_no_of_words] => 1078 [patent_no_of_claims] => 5 [patent_no_of_ind_claims] => 2 [patent_words_short_claim] => 63 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/06/265/06265769.pdf [firstpage_image] =>[orig_patent_app_number] => 191487 [rel_patent_id] =>[rel_patent_doc_number] =>)
09/191487
Double-sided chip mount package Nov 12, 1998 Issued
Array ( [id] => 1550967 [patent_doc_number] => 06346742 [patent_country] => US [patent_kind] => B1 [patent_issue_date] => 2002-02-12 [patent_title] => 'Chip-scale packaged pressure sensor' [patent_app_type] => B1 [patent_app_number] => 09/190500 [patent_app_country] => US [patent_app_date] => 1998-11-12 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 7 [patent_figures_cnt] => 25 [patent_no_of_words] => 3720 [patent_no_of_claims] => 82 [patent_no_of_ind_claims] => 8 [patent_words_short_claim] => 47 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/06/346/06346742.pdf [firstpage_image] =>[orig_patent_app_number] => 09190500 [rel_patent_id] =>[rel_patent_doc_number] =>)
09/190500
Chip-scale packaged pressure sensor Nov 11, 1998 Issued
Array ( [id] => 1461555 [patent_doc_number] => 06392304 [patent_country] => US [patent_kind] => B1 [patent_issue_date] => 2002-05-21 [patent_title] => 'Multi-chip memory apparatus and associated method' [patent_app_type] => B1 [patent_app_number] => 09/190660 [patent_app_country] => US [patent_app_date] => 1998-11-12 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 6 [patent_figures_cnt] => 7 [patent_no_of_words] => 3802 [patent_no_of_claims] => 11 [patent_no_of_ind_claims] => 9 [patent_words_short_claim] => 99 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/06/392/06392304.pdf [firstpage_image] =>[orig_patent_app_number] => 09190660 [rel_patent_id] =>[rel_patent_doc_number] =>)
09/190660
Multi-chip memory apparatus and associated method Nov 11, 1998 Issued
Array ( [id] => 4266187 [patent_doc_number] => 06259157 [patent_country] => US [patent_kind] => NA [patent_issue_date] => 2001-07-10 [patent_title] => 'Hybrid integrated circuit device, and method of manufacturing thereof' [patent_app_type] => 1 [patent_app_number] => 9/188717 [patent_app_country] => US [patent_app_date] => 1998-11-10 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 8 [patent_figures_cnt] => 17 [patent_no_of_words] => 8306 [patent_no_of_claims] => 16 [patent_no_of_ind_claims] => 1 [patent_words_short_claim] => 82 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/06/259/06259157.pdf [firstpage_image] =>[orig_patent_app_number] => 188717 [rel_patent_id] =>[rel_patent_doc_number] =>)
09/188717
Hybrid integrated circuit device, and method of manufacturing thereof Nov 9, 1998 Issued
Array ( [id] => 4414619 [patent_doc_number] => 06229218 [patent_country] => US [patent_kind] => NA [patent_issue_date] => 2001-05-08 [patent_title] => 'Interconnect device and method for mating dissimilar electronic package footprints' [patent_app_type] => 1 [patent_app_number] => 9/187477 [patent_app_country] => US [patent_app_date] => 1998-11-06 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 3 [patent_figures_cnt] => 6 [patent_no_of_words] => 1895 [patent_no_of_claims] => 2 [patent_no_of_ind_claims] => 1 [patent_words_short_claim] => 122 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/06/229/06229218.pdf [firstpage_image] =>[orig_patent_app_number] => 187477 [rel_patent_id] =>[rel_patent_doc_number] =>)
09/187477
Interconnect device and method for mating dissimilar electronic package footprints Nov 5, 1998 Issued
Array ( [id] => 4373463 [patent_doc_number] => 06274924 [patent_country] => US [patent_kind] => NA [patent_issue_date] => 2001-08-14 [patent_title] => 'Surface mountable LED package' [patent_app_type] => 1 [patent_app_number] => 9/187547 [patent_app_country] => US [patent_app_date] => 1998-11-05 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 2 [patent_figures_cnt] => 2 [patent_no_of_words] => 1440 [patent_no_of_claims] => 28 [patent_no_of_ind_claims] => 2 [patent_words_short_claim] => 60 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/06/274/06274924.pdf [firstpage_image] =>[orig_patent_app_number] => 187547 [rel_patent_id] =>[rel_patent_doc_number] =>)
09/187547
Surface mountable LED package Nov 4, 1998 Issued
Array ( [id] => 4351144 [patent_doc_number] => 06285075 [patent_country] => US [patent_kind] => NA [patent_issue_date] => 2001-09-04 [patent_title] => 'Integrated circuit package with bonding planes on a ceramic ring using an adhesive assembly' [patent_app_type] => 1 [patent_app_number] => 9/184787 [patent_app_country] => US [patent_app_date] => 1998-11-02 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 4 [patent_figures_cnt] => 6 [patent_no_of_words] => 1835 [patent_no_of_claims] => 19 [patent_no_of_ind_claims] => 2 [patent_words_short_claim] => 189 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/06/285/06285075.pdf [firstpage_image] =>[orig_patent_app_number] => 184787 [rel_patent_id] =>[rel_patent_doc_number] =>)
09/184787
Integrated circuit package with bonding planes on a ceramic ring using an adhesive assembly Nov 1, 1998 Issued
Array ( [id] => 4210325 [patent_doc_number] => 06078103 [patent_country] => US [patent_kind] => NA [patent_issue_date] => 2000-06-20 [patent_title] => 'Dimpled contacts for metal-to-semiconductor connections, and methods for fabricating same' [patent_app_type] => 1 [patent_app_number] => 9/182387 [patent_app_country] => US [patent_app_date] => 1998-10-29 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 4 [patent_figures_cnt] => 11 [patent_no_of_words] => 4791 [patent_no_of_claims] => 9 [patent_no_of_ind_claims] => 1 [patent_words_short_claim] => 81 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/06/078/06078103.pdf [firstpage_image] =>[orig_patent_app_number] => 182387 [rel_patent_id] =>[rel_patent_doc_number] =>)
09/182387
Dimpled contacts for metal-to-semiconductor connections, and methods for fabricating same Oct 28, 1998 Issued
Array ( [id] => 4355624 [patent_doc_number] => 06215178 [patent_country] => US [patent_kind] => NA [patent_issue_date] => 2001-04-10 [patent_title] => 'Semiconductor device' [patent_app_type] => 1 [patent_app_number] => 9/181870 [patent_app_country] => US [patent_app_date] => 1998-10-29 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 5 [patent_figures_cnt] => 10 [patent_no_of_words] => 3623 [patent_no_of_claims] => 9 [patent_no_of_ind_claims] => 1 [patent_words_short_claim] => 148 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/06/215/06215178.pdf [firstpage_image] =>[orig_patent_app_number] => 181870 [rel_patent_id] =>[rel_patent_doc_number] =>)
09/181870
Semiconductor device Oct 28, 1998 Issued
Array ( [id] => 4197899 [patent_doc_number] => 06043564 [patent_country] => US [patent_kind] => NA [patent_issue_date] => 2000-03-28 [patent_title] => 'Semiconductor device having ball-bonded pads' [patent_app_type] => 1 [patent_app_number] => 9/175807 [patent_app_country] => US [patent_app_date] => 1998-10-20 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 6 [patent_figures_cnt] => 13 [patent_no_of_words] => 2418 [patent_no_of_claims] => 27 [patent_no_of_ind_claims] => 5 [patent_words_short_claim] => 59 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/06/043/06043564.pdf [firstpage_image] =>[orig_patent_app_number] => 175807 [rel_patent_id] =>[rel_patent_doc_number] =>)
09/175807
Semiconductor device having ball-bonded pads Oct 19, 1998 Issued
09/170380 APPARATUS AND SYSTEM WITH INCREASED SIGNAL TRACE ROUTING OPTIONS IN PRINTED WIRING BOARDS AND INTEGRATED CIRCUIT PACKAGING Oct 12, 1998 Abandoned
Array ( [id] => 4333919 [patent_doc_number] => 06320255 [patent_country] => US [patent_kind] => NA [patent_issue_date] => 2001-11-20 [patent_title] => 'Rerouted semiconductor device and method of fabrication' [patent_app_type] => 1 [patent_app_number] => 9/169310 [patent_app_country] => US [patent_app_date] => 1998-10-09 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 4 [patent_figures_cnt] => 23 [patent_no_of_words] => 4089 [patent_no_of_claims] => 11 [patent_no_of_ind_claims] => 4 [patent_words_short_claim] => 69 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/06/320/06320255.pdf [firstpage_image] =>[orig_patent_app_number] => 169310 [rel_patent_id] =>[rel_patent_doc_number] =>)
09/169310
Rerouted semiconductor device and method of fabrication Oct 8, 1998 Issued
Array ( [id] => 4087016 [patent_doc_number] => 06054755 [patent_country] => US [patent_kind] => NA [patent_issue_date] => 2000-04-25 [patent_title] => 'Semiconductor package with improved moisture vapor relief function and method of fabricating the same' [patent_app_type] => 1 [patent_app_number] => 9/168960 [patent_app_country] => US [patent_app_date] => 1998-10-09 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 5 [patent_figures_cnt] => 17 [patent_no_of_words] => 4281 [patent_no_of_claims] => 6 [patent_no_of_ind_claims] => 1 [patent_words_short_claim] => 115 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/06/054/06054755.pdf [firstpage_image] =>[orig_patent_app_number] => 168960 [rel_patent_id] =>[rel_patent_doc_number] =>)
09/168960
Semiconductor package with improved moisture vapor relief function and method of fabricating the same Oct 8, 1998 Issued
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