
Roy Karl Potter
Examiner (ID: 13991, Phone: (571)272-1842 , Office: P/2822 )
| Most Active Art Unit | 2822 |
| Art Unit(s) | 2822, 2508, 2811, 3621 |
| Total Applications | 2584 |
| Issued Applications | 2409 |
| Pending Applications | 46 |
| Abandoned Applications | 141 |
Applications
| Application number | Title of the application | Filing Date | Status |
|---|---|---|---|
Array
(
[id] => 4318272
[patent_doc_number] => 06316837
[patent_country] => US
[patent_kind] => NA
[patent_issue_date] => 2001-11-13
[patent_title] => 'Area array type semiconductor package and fabrication method'
[patent_app_type] => 1
[patent_app_number] => 9/200937
[patent_app_country] => US
[patent_app_date] => 1998-11-30
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 4
[patent_figures_cnt] => 11
[patent_no_of_words] => 1890
[patent_no_of_claims] => 21
[patent_no_of_ind_claims] => 4
[patent_words_short_claim] => 81
[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => patent
[pdf_file] => patents/06/316/06316837.pdf
[firstpage_image] =>[orig_patent_app_number] => 200937
[rel_patent_id] =>[rel_patent_doc_number] =>) 09/200937 | Area array type semiconductor package and fabrication method | Nov 29, 1998 | Issued |
Array
(
[id] => 1461548
[patent_doc_number] => 06392302
[patent_country] => US
[patent_kind] => B1
[patent_issue_date] => 2002-05-21
[patent_title] => 'Polycide structure and method for forming polycide structure'
[patent_app_type] => B1
[patent_app_number] => 09/196437
[patent_app_country] => US
[patent_app_date] => 1998-11-20
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 16
[patent_figures_cnt] => 16
[patent_no_of_words] => 3284
[patent_no_of_claims] => 63
[patent_no_of_ind_claims] => 5
[patent_words_short_claim] => 90
[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => patent
[pdf_file] => patents/06/392/06392302.pdf
[firstpage_image] =>[orig_patent_app_number] => 09196437
[rel_patent_id] =>[rel_patent_doc_number] =>) 09/196437 | Polycide structure and method for forming polycide structure | Nov 19, 1998 | Issued |
Array
(
[id] => 1494317
[patent_doc_number] => 06342442
[patent_country] => US
[patent_kind] => B1
[patent_issue_date] => 2002-01-29
[patent_title] => 'Kinetically controlled solder bonding'
[patent_app_type] => B1
[patent_app_number] => 09/197074
[patent_app_country] => US
[patent_app_date] => 1998-11-20
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 3
[patent_figures_cnt] => 7
[patent_no_of_words] => 2620
[patent_no_of_claims] => 9
[patent_no_of_ind_claims] => 1
[patent_words_short_claim] => 259
[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => patent
[pdf_file] => patents/06/342/06342442.pdf
[firstpage_image] =>[orig_patent_app_number] => 09197074
[rel_patent_id] =>[rel_patent_doc_number] =>) 09/197074 | Kinetically controlled solder bonding | Nov 19, 1998 | Issued |
Array
(
[id] => 4101929
[patent_doc_number] => 06097082
[patent_country] => US
[patent_kind] => NA
[patent_issue_date] => 2000-08-01
[patent_title] => 'Semiconductor device'
[patent_app_type] => 1
[patent_app_number] => 9/195697
[patent_app_country] => US
[patent_app_date] => 1998-11-19
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 5
[patent_figures_cnt] => 9
[patent_no_of_words] => 2182
[patent_no_of_claims] => 12
[patent_no_of_ind_claims] => 2
[patent_words_short_claim] => 215
[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => patent
[pdf_file] => patents/06/097/06097082.pdf
[firstpage_image] =>[orig_patent_app_number] => 195697
[rel_patent_id] =>[rel_patent_doc_number] =>) 09/195697 | Semiconductor device | Nov 18, 1998 | Issued |
Array
(
[id] => 4414409
[patent_doc_number] => 06265774
[patent_country] => US
[patent_kind] => NA
[patent_issue_date] => 2001-07-24
[patent_title] => 'Millimeter wave adjustable cavity package'
[patent_app_type] => 1
[patent_app_number] => 9/195930
[patent_app_country] => US
[patent_app_date] => 1998-11-19
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 3
[patent_figures_cnt] => 6
[patent_no_of_words] => 5376
[patent_no_of_claims] => 13
[patent_no_of_ind_claims] => 2
[patent_words_short_claim] => 230
[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => patent
[pdf_file] => patents/06/265/06265774.pdf
[firstpage_image] =>[orig_patent_app_number] => 195930
[rel_patent_id] =>[rel_patent_doc_number] =>) 09/195930 | Millimeter wave adjustable cavity package | Nov 18, 1998 | Issued |
Array
(
[id] => 4310201
[patent_doc_number] => 06326683
[patent_country] => US
[patent_kind] => NA
[patent_issue_date] => 2001-12-04
[patent_title] => 'Carrier element for a semiconductor chip'
[patent_app_type] => 1
[patent_app_number] => 9/193577
[patent_app_country] => US
[patent_app_date] => 1998-11-17
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 5
[patent_figures_cnt] => 8
[patent_no_of_words] => 4385
[patent_no_of_claims] => 13
[patent_no_of_ind_claims] => 3
[patent_words_short_claim] => 23
[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => patent
[pdf_file] => patents/06/326/06326683.pdf
[firstpage_image] =>[orig_patent_app_number] => 193577
[rel_patent_id] =>[rel_patent_doc_number] =>) 09/193577 | Carrier element for a semiconductor chip | Nov 16, 1998 | Issued |
Array
(
[id] => 4351205
[patent_doc_number] => 06285079
[patent_country] => US
[patent_kind] => NA
[patent_issue_date] => 2001-09-04
[patent_title] => 'Semiconductor device employing grid array electrodes and compact chip-size package'
[patent_app_type] => 1
[patent_app_number] => 9/193247
[patent_app_country] => US
[patent_app_date] => 1998-11-17
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 11
[patent_figures_cnt] => 26
[patent_no_of_words] => 9376
[patent_no_of_claims] => 9
[patent_no_of_ind_claims] => 1
[patent_words_short_claim] => 195
[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => patent
[pdf_file] => patents/06/285/06285079.pdf
[firstpage_image] =>[orig_patent_app_number] => 193247
[rel_patent_id] =>[rel_patent_doc_number] =>) 09/193247 | Semiconductor device employing grid array electrodes and compact chip-size package | Nov 16, 1998 | Issued |
Array
(
[id] => 4414359
[patent_doc_number] => 06265769
[patent_country] => US
[patent_kind] => NA
[patent_issue_date] => 2001-07-24
[patent_title] => 'Double-sided chip mount package'
[patent_app_type] => 1
[patent_app_number] => 9/191487
[patent_app_country] => US
[patent_app_date] => 1998-11-13
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 2
[patent_figures_cnt] => 2
[patent_no_of_words] => 1078
[patent_no_of_claims] => 5
[patent_no_of_ind_claims] => 2
[patent_words_short_claim] => 63
[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => patent
[pdf_file] => patents/06/265/06265769.pdf
[firstpage_image] =>[orig_patent_app_number] => 191487
[rel_patent_id] =>[rel_patent_doc_number] =>) 09/191487 | Double-sided chip mount package | Nov 12, 1998 | Issued |
Array
(
[id] => 1550967
[patent_doc_number] => 06346742
[patent_country] => US
[patent_kind] => B1
[patent_issue_date] => 2002-02-12
[patent_title] => 'Chip-scale packaged pressure sensor'
[patent_app_type] => B1
[patent_app_number] => 09/190500
[patent_app_country] => US
[patent_app_date] => 1998-11-12
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 7
[patent_figures_cnt] => 25
[patent_no_of_words] => 3720
[patent_no_of_claims] => 82
[patent_no_of_ind_claims] => 8
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[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => patent
[pdf_file] => patents/06/346/06346742.pdf
[firstpage_image] =>[orig_patent_app_number] => 09190500
[rel_patent_id] =>[rel_patent_doc_number] =>) 09/190500 | Chip-scale packaged pressure sensor | Nov 11, 1998 | Issued |
Array
(
[id] => 1461555
[patent_doc_number] => 06392304
[patent_country] => US
[patent_kind] => B1
[patent_issue_date] => 2002-05-21
[patent_title] => 'Multi-chip memory apparatus and associated method'
[patent_app_type] => B1
[patent_app_number] => 09/190660
[patent_app_country] => US
[patent_app_date] => 1998-11-12
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 6
[patent_figures_cnt] => 7
[patent_no_of_words] => 3802
[patent_no_of_claims] => 11
[patent_no_of_ind_claims] => 9
[patent_words_short_claim] => 99
[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => patent
[pdf_file] => patents/06/392/06392304.pdf
[firstpage_image] =>[orig_patent_app_number] => 09190660
[rel_patent_id] =>[rel_patent_doc_number] =>) 09/190660 | Multi-chip memory apparatus and associated method | Nov 11, 1998 | Issued |
Array
(
[id] => 4266187
[patent_doc_number] => 06259157
[patent_country] => US
[patent_kind] => NA
[patent_issue_date] => 2001-07-10
[patent_title] => 'Hybrid integrated circuit device, and method of manufacturing thereof'
[patent_app_type] => 1
[patent_app_number] => 9/188717
[patent_app_country] => US
[patent_app_date] => 1998-11-10
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 8
[patent_figures_cnt] => 17
[patent_no_of_words] => 8306
[patent_no_of_claims] => 16
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[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => patent
[pdf_file] => patents/06/259/06259157.pdf
[firstpage_image] =>[orig_patent_app_number] => 188717
[rel_patent_id] =>[rel_patent_doc_number] =>) 09/188717 | Hybrid integrated circuit device, and method of manufacturing thereof | Nov 9, 1998 | Issued |
Array
(
[id] => 4414619
[patent_doc_number] => 06229218
[patent_country] => US
[patent_kind] => NA
[patent_issue_date] => 2001-05-08
[patent_title] => 'Interconnect device and method for mating dissimilar electronic package footprints'
[patent_app_type] => 1
[patent_app_number] => 9/187477
[patent_app_country] => US
[patent_app_date] => 1998-11-06
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 3
[patent_figures_cnt] => 6
[patent_no_of_words] => 1895
[patent_no_of_claims] => 2
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[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => patent
[pdf_file] => patents/06/229/06229218.pdf
[firstpage_image] =>[orig_patent_app_number] => 187477
[rel_patent_id] =>[rel_patent_doc_number] =>) 09/187477 | Interconnect device and method for mating dissimilar electronic package footprints | Nov 5, 1998 | Issued |
Array
(
[id] => 4373463
[patent_doc_number] => 06274924
[patent_country] => US
[patent_kind] => NA
[patent_issue_date] => 2001-08-14
[patent_title] => 'Surface mountable LED package'
[patent_app_type] => 1
[patent_app_number] => 9/187547
[patent_app_country] => US
[patent_app_date] => 1998-11-05
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 2
[patent_figures_cnt] => 2
[patent_no_of_words] => 1440
[patent_no_of_claims] => 28
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[patent_words_short_claim] => 60
[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => patent
[pdf_file] => patents/06/274/06274924.pdf
[firstpage_image] =>[orig_patent_app_number] => 187547
[rel_patent_id] =>[rel_patent_doc_number] =>) 09/187547 | Surface mountable LED package | Nov 4, 1998 | Issued |
Array
(
[id] => 4351144
[patent_doc_number] => 06285075
[patent_country] => US
[patent_kind] => NA
[patent_issue_date] => 2001-09-04
[patent_title] => 'Integrated circuit package with bonding planes on a ceramic ring using an adhesive assembly'
[patent_app_type] => 1
[patent_app_number] => 9/184787
[patent_app_country] => US
[patent_app_date] => 1998-11-02
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 4
[patent_figures_cnt] => 6
[patent_no_of_words] => 1835
[patent_no_of_claims] => 19
[patent_no_of_ind_claims] => 2
[patent_words_short_claim] => 189
[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => patent
[pdf_file] => patents/06/285/06285075.pdf
[firstpage_image] =>[orig_patent_app_number] => 184787
[rel_patent_id] =>[rel_patent_doc_number] =>) 09/184787 | Integrated circuit package with bonding planes on a ceramic ring using an adhesive assembly | Nov 1, 1998 | Issued |
Array
(
[id] => 4210325
[patent_doc_number] => 06078103
[patent_country] => US
[patent_kind] => NA
[patent_issue_date] => 2000-06-20
[patent_title] => 'Dimpled contacts for metal-to-semiconductor connections, and methods for fabricating same'
[patent_app_type] => 1
[patent_app_number] => 9/182387
[patent_app_country] => US
[patent_app_date] => 1998-10-29
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 4
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[patent_no_of_words] => 4791
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[patent_current_assignee] =>[type] => patent
[pdf_file] => patents/06/078/06078103.pdf
[firstpage_image] =>[orig_patent_app_number] => 182387
[rel_patent_id] =>[rel_patent_doc_number] =>) 09/182387 | Dimpled contacts for metal-to-semiconductor connections, and methods for fabricating same | Oct 28, 1998 | Issued |
Array
(
[id] => 4355624
[patent_doc_number] => 06215178
[patent_country] => US
[patent_kind] => NA
[patent_issue_date] => 2001-04-10
[patent_title] => 'Semiconductor device'
[patent_app_type] => 1
[patent_app_number] => 9/181870
[patent_app_country] => US
[patent_app_date] => 1998-10-29
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 5
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[patent_words_short_claim] => 148
[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => patent
[pdf_file] => patents/06/215/06215178.pdf
[firstpage_image] =>[orig_patent_app_number] => 181870
[rel_patent_id] =>[rel_patent_doc_number] =>) 09/181870 | Semiconductor device | Oct 28, 1998 | Issued |
Array
(
[id] => 4197899
[patent_doc_number] => 06043564
[patent_country] => US
[patent_kind] => NA
[patent_issue_date] => 2000-03-28
[patent_title] => 'Semiconductor device having ball-bonded pads'
[patent_app_type] => 1
[patent_app_number] => 9/175807
[patent_app_country] => US
[patent_app_date] => 1998-10-20
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 6
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[patent_no_of_words] => 2418
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[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => patent
[pdf_file] => patents/06/043/06043564.pdf
[firstpage_image] =>[orig_patent_app_number] => 175807
[rel_patent_id] =>[rel_patent_doc_number] =>) 09/175807 | Semiconductor device having ball-bonded pads | Oct 19, 1998 | Issued |
| 09/170380 | APPARATUS AND SYSTEM WITH INCREASED SIGNAL TRACE ROUTING OPTIONS IN PRINTED WIRING BOARDS AND INTEGRATED CIRCUIT PACKAGING | Oct 12, 1998 | Abandoned |
Array
(
[id] => 4333919
[patent_doc_number] => 06320255
[patent_country] => US
[patent_kind] => NA
[patent_issue_date] => 2001-11-20
[patent_title] => 'Rerouted semiconductor device and method of fabrication'
[patent_app_type] => 1
[patent_app_number] => 9/169310
[patent_app_country] => US
[patent_app_date] => 1998-10-09
[patent_effective_date] => 0000-00-00
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[patent_current_assignee] =>[type] => patent
[pdf_file] => patents/06/320/06320255.pdf
[firstpage_image] =>[orig_patent_app_number] => 169310
[rel_patent_id] =>[rel_patent_doc_number] =>) 09/169310 | Rerouted semiconductor device and method of fabrication | Oct 8, 1998 | Issued |
Array
(
[id] => 4087016
[patent_doc_number] => 06054755
[patent_country] => US
[patent_kind] => NA
[patent_issue_date] => 2000-04-25
[patent_title] => 'Semiconductor package with improved moisture vapor relief function and method of fabricating the same'
[patent_app_type] => 1
[patent_app_number] => 9/168960
[patent_app_country] => US
[patent_app_date] => 1998-10-09
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 5
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[patent_current_assignee] =>[type] => patent
[pdf_file] => patents/06/054/06054755.pdf
[firstpage_image] =>[orig_patent_app_number] => 168960
[rel_patent_id] =>[rel_patent_doc_number] =>) 09/168960 | Semiconductor package with improved moisture vapor relief function and method of fabricating the same | Oct 8, 1998 | Issued |