
Roy Karl Potter
Examiner (ID: 13991, Phone: (571)272-1842 , Office: P/2822 )
| Most Active Art Unit | 2822 |
| Art Unit(s) | 2822, 2508, 2811, 3621 |
| Total Applications | 2584 |
| Issued Applications | 2409 |
| Pending Applications | 46 |
| Abandoned Applications | 141 |
Applications
| Application number | Title of the application | Filing Date | Status |
|---|---|---|---|
Array
(
[id] => 4140157
[patent_doc_number] => 06121688
[patent_country] => US
[patent_kind] => NA
[patent_issue_date] => 2000-09-19
[patent_title] => 'Anisotropic conductive sheet and printed circuit board'
[patent_app_type] => 1
[patent_app_number] => 9/168148
[patent_app_country] => US
[patent_app_date] => 1998-10-08
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 6
[patent_figures_cnt] => 18
[patent_no_of_words] => 6332
[patent_no_of_claims] => 8
[patent_no_of_ind_claims] => 3
[patent_words_short_claim] => 109
[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => patent
[pdf_file] => patents/06/121/06121688.pdf
[firstpage_image] =>[orig_patent_app_number] => 168148
[rel_patent_id] =>[rel_patent_doc_number] =>) 09/168148 | Anisotropic conductive sheet and printed circuit board | Oct 7, 1998 | Issued |
Array
(
[id] => 1590905
[patent_doc_number] => 06483183
[patent_country] => US
[patent_kind] => B1
[patent_issue_date] => 2002-11-19
[patent_title] => 'Integrated circuit (IC) package with a microcontroller having an n-bit bus and up to n-pins coupled to the microcontroller'
[patent_app_type] => B1
[patent_app_number] => 09/522026
[patent_app_country] => US
[patent_app_date] => 1998-10-08
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 1
[patent_figures_cnt] => 1
[patent_no_of_words] => 1745
[patent_no_of_claims] => 4
[patent_no_of_ind_claims] => 2
[patent_words_short_claim] => 30
[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => patent
[pdf_file] => patents/06/483/06483183.pdf
[firstpage_image] =>[orig_patent_app_number] => 09522026
[rel_patent_id] =>[rel_patent_doc_number] =>) 09/522026 | Integrated circuit (IC) package with a microcontroller having an n-bit bus and up to n-pins coupled to the microcontroller | Oct 7, 1998 | Issued |
Array
(
[id] => 4076155
[patent_doc_number] => 06069403
[patent_country] => US
[patent_kind] => NA
[patent_issue_date] => 2000-05-30
[patent_title] => 'Power module with lowered inductance and reduced voltage overshoots'
[patent_app_type] => 1
[patent_app_number] => 9/167203
[patent_app_country] => US
[patent_app_date] => 1998-10-06
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 2
[patent_figures_cnt] => 4
[patent_no_of_words] => 3435
[patent_no_of_claims] => 23
[patent_no_of_ind_claims] => 3
[patent_words_short_claim] => 173
[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => patent
[pdf_file] => patents/06/069/06069403.pdf
[firstpage_image] =>[orig_patent_app_number] => 167203
[rel_patent_id] =>[rel_patent_doc_number] =>) 09/167203 | Power module with lowered inductance and reduced voltage overshoots | Oct 5, 1998 | Issued |
Array
(
[id] => 4191022
[patent_doc_number] => 06130112
[patent_country] => US
[patent_kind] => NA
[patent_issue_date] => 2000-10-10
[patent_title] => 'Semiconductor device'
[patent_app_type] => 1
[patent_app_number] => 9/166857
[patent_app_country] => US
[patent_app_date] => 1998-10-06
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 4
[patent_figures_cnt] => 7
[patent_no_of_words] => 4596
[patent_no_of_claims] => 7
[patent_no_of_ind_claims] => 3
[patent_words_short_claim] => 95
[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => patent
[pdf_file] => patents/06/130/06130112.pdf
[firstpage_image] =>[orig_patent_app_number] => 166857
[rel_patent_id] =>[rel_patent_doc_number] =>) 09/166857 | Semiconductor device | Oct 5, 1998 | Issued |
Array
(
[id] => 1509544
[patent_doc_number] => 06441495
[patent_country] => US
[patent_kind] => B1
[patent_issue_date] => 2002-08-27
[patent_title] => 'Semiconductor device of stacked chips'
[patent_app_type] => B1
[patent_app_number] => 09/166260
[patent_app_country] => US
[patent_app_date] => 1998-10-05
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 16
[patent_figures_cnt] => 30
[patent_no_of_words] => 10478
[patent_no_of_claims] => 8
[patent_no_of_ind_claims] => 1
[patent_words_short_claim] => 148
[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => patent
[pdf_file] => patents/06/441/06441495.pdf
[firstpage_image] =>[orig_patent_app_number] => 09166260
[rel_patent_id] =>[rel_patent_doc_number] =>) 09/166260 | Semiconductor device of stacked chips | Oct 4, 1998 | Issued |
Array
(
[id] => 4278231
[patent_doc_number] => 06323548
[patent_country] => US
[patent_kind] => NA
[patent_issue_date] => 2001-11-27
[patent_title] => 'Semiconductor integrated circuit device'
[patent_app_type] => 1
[patent_app_number] => 9/161997
[patent_app_country] => US
[patent_app_date] => 1998-09-29
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 6
[patent_figures_cnt] => 8
[patent_no_of_words] => 2363
[patent_no_of_claims] => 8
[patent_no_of_ind_claims] => 2
[patent_words_short_claim] => 141
[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => patent
[pdf_file] => patents/06/323/06323548.pdf
[firstpage_image] =>[orig_patent_app_number] => 161997
[rel_patent_id] =>[rel_patent_doc_number] =>) 09/161997 | Semiconductor integrated circuit device | Sep 28, 1998 | Issued |
Array
(
[id] => 4318043
[patent_doc_number] => 06316821
[patent_country] => US
[patent_kind] => NA
[patent_issue_date] => 2001-11-13
[patent_title] => 'High density lead frames and methods for plastic injection molding'
[patent_app_type] => 1
[patent_app_number] => 9/162107
[patent_app_country] => US
[patent_app_date] => 1998-09-28
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 5
[patent_figures_cnt] => 5
[patent_no_of_words] => 3638
[patent_no_of_claims] => 12
[patent_no_of_ind_claims] => 3
[patent_words_short_claim] => 85
[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => patent
[pdf_file] => patents/06/316/06316821.pdf
[firstpage_image] =>[orig_patent_app_number] => 162107
[rel_patent_id] =>[rel_patent_doc_number] =>) 09/162107 | High density lead frames and methods for plastic injection molding | Sep 27, 1998 | Issued |
Array
(
[id] => 1440956
[patent_doc_number] => 06335222
[patent_country] => US
[patent_kind] => B1
[patent_issue_date] => 2002-01-01
[patent_title] => 'Microelectronic packages with solder interconnections'
[patent_app_type] => B1
[patent_app_number] => 09/157047
[patent_app_country] => US
[patent_app_date] => 1998-09-18
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 4
[patent_figures_cnt] => 14
[patent_no_of_words] => 7445
[patent_no_of_claims] => 28
[patent_no_of_ind_claims] => 9
[patent_words_short_claim] => 17
[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => patent
[pdf_file] => patents/06/335/06335222.pdf
[firstpage_image] =>[orig_patent_app_number] => 09157047
[rel_patent_id] =>[rel_patent_doc_number] =>) 09/157047 | Microelectronic packages with solder interconnections | Sep 17, 1998 | Issued |
Array
(
[id] => 4180085
[patent_doc_number] => 06084295
[patent_country] => US
[patent_kind] => NA
[patent_issue_date] => 2000-07-04
[patent_title] => 'Semiconductor device and circuit board used therein'
[patent_app_type] => 1
[patent_app_number] => 9/148330
[patent_app_country] => US
[patent_app_date] => 1998-09-04
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 5
[patent_figures_cnt] => 12
[patent_no_of_words] => 4077
[patent_no_of_claims] => 13
[patent_no_of_ind_claims] => 3
[patent_words_short_claim] => 143
[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => patent
[pdf_file] => patents/06/084/06084295.pdf
[firstpage_image] =>[orig_patent_app_number] => 148330
[rel_patent_id] =>[rel_patent_doc_number] =>) 09/148330 | Semiconductor device and circuit board used therein | Sep 3, 1998 | Issued |
Array
(
[id] => 4297847
[patent_doc_number] => 06236116
[patent_country] => US
[patent_kind] => NA
[patent_issue_date] => 2001-05-22
[patent_title] => 'Semiconductor device having a built-in heat sink and process of manufacturing same'
[patent_app_type] => 1
[patent_app_number] => 9/146417
[patent_app_country] => US
[patent_app_date] => 1998-09-03
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 10
[patent_figures_cnt] => 12
[patent_no_of_words] => 2988
[patent_no_of_claims] => 21
[patent_no_of_ind_claims] => 2
[patent_words_short_claim] => 66
[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => patent
[pdf_file] => patents/06/236/06236116.pdf
[firstpage_image] =>[orig_patent_app_number] => 146417
[rel_patent_id] =>[rel_patent_doc_number] =>) 09/146417 | Semiconductor device having a built-in heat sink and process of manufacturing same | Sep 2, 1998 | Issued |
Array
(
[id] => 1461530
[patent_doc_number] => 06392296
[patent_country] => US
[patent_kind] => B1
[patent_issue_date] => 2002-05-21
[patent_title] => 'Silicon interposer with optical connections'
[patent_app_type] => B1
[patent_app_number] => 09/143880
[patent_app_country] => US
[patent_app_date] => 1998-08-31
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 13
[patent_figures_cnt] => 19
[patent_no_of_words] => 7551
[patent_no_of_claims] => 52
[patent_no_of_ind_claims] => 8
[patent_words_short_claim] => 136
[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => patent
[pdf_file] => patents/06/392/06392296.pdf
[firstpage_image] =>[orig_patent_app_number] => 09143880
[rel_patent_id] =>[rel_patent_doc_number] =>) 09/143880 | Silicon interposer with optical connections | Aug 30, 1998 | Issued |
Array
(
[id] => 4337006
[patent_doc_number] => 06313522
[patent_country] => US
[patent_kind] => NA
[patent_issue_date] => 2001-11-06
[patent_title] => 'Semiconductor structure having stacked semiconductor devices'
[patent_app_type] => 1
[patent_app_number] => 9/141690
[patent_app_country] => US
[patent_app_date] => 1998-08-28
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 6
[patent_figures_cnt] => 6
[patent_no_of_words] => 7651
[patent_no_of_claims] => 43
[patent_no_of_ind_claims] => 12
[patent_words_short_claim] => 76
[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => patent
[pdf_file] => patents/06/313/06313522.pdf
[firstpage_image] =>[orig_patent_app_number] => 141690
[rel_patent_id] =>[rel_patent_doc_number] =>) 09/141690 | Semiconductor structure having stacked semiconductor devices | Aug 27, 1998 | Issued |
| 09/139410 | SEMICONDUCTOR INTEGRATED CIRCUIT DEVICE AND FABRICATION PROCESS THEREOF | Aug 24, 1998 | Abandoned |
Array
(
[id] => 4413932
[patent_doc_number] => 06310394
[patent_country] => US
[patent_kind] => NA
[patent_issue_date] => 2001-10-30
[patent_title] => 'Reduced parasitic capacitance semiconductor devices'
[patent_app_type] => 1
[patent_app_number] => 9/139685
[patent_app_country] => US
[patent_app_date] => 1998-08-25
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 3
[patent_figures_cnt] => 4
[patent_no_of_words] => 2841
[patent_no_of_claims] => 14
[patent_no_of_ind_claims] => 2
[patent_words_short_claim] => 114
[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => patent
[pdf_file] => patents/06/310/06310394.pdf
[firstpage_image] =>[orig_patent_app_number] => 139685
[rel_patent_id] =>[rel_patent_doc_number] =>) 09/139685 | Reduced parasitic capacitance semiconductor devices | Aug 24, 1998 | Issued |
Array
(
[id] => 1505497
[patent_doc_number] => 06465880
[patent_country] => US
[patent_kind] => B1
[patent_issue_date] => 2002-10-15
[patent_title] => 'IC card indicating state of usage and system therefor'
[patent_app_type] => B1
[patent_app_number] => 09/138637
[patent_app_country] => US
[patent_app_date] => 1998-08-24
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 9
[patent_figures_cnt] => 23
[patent_no_of_words] => 8825
[patent_no_of_claims] => 25
[patent_no_of_ind_claims] => 12
[patent_words_short_claim] => 22
[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => patent
[pdf_file] => patents/06/465/06465880.pdf
[firstpage_image] =>[orig_patent_app_number] => 09138637
[rel_patent_id] =>[rel_patent_doc_number] =>) 09/138637 | IC card indicating state of usage and system therefor | Aug 23, 1998 | Issued |
Array
(
[id] => 4366338
[patent_doc_number] => 06255707
[patent_country] => US
[patent_kind] => NA
[patent_issue_date] => 2001-07-03
[patent_title] => 'Semiconductor laser reliability test structure and method'
[patent_app_type] => 1
[patent_app_number] => 9/138527
[patent_app_country] => US
[patent_app_date] => 1998-08-24
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 4
[patent_figures_cnt] => 7
[patent_no_of_words] => 4317
[patent_no_of_claims] => 34
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[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => patent
[pdf_file] => patents/06/255/06255707.pdf
[firstpage_image] =>[orig_patent_app_number] => 138527
[rel_patent_id] =>[rel_patent_doc_number] =>) 09/138527 | Semiconductor laser reliability test structure and method | Aug 23, 1998 | Issued |
Array
(
[id] => 1596988
[patent_doc_number] => 06384425
[patent_country] => US
[patent_kind] => B1
[patent_issue_date] => 2002-05-07
[patent_title] => 'Nonconductive substrate forming a strip or a panel on which a multiplicity of carrier elements is formed'
[patent_app_type] => B1
[patent_app_number] => 09/137924
[patent_app_country] => US
[patent_app_date] => 1998-08-20
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 2
[patent_figures_cnt] => 2
[patent_no_of_words] => 2685
[patent_no_of_claims] => 5
[patent_no_of_ind_claims] => 1
[patent_words_short_claim] => 130
[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => patent
[pdf_file] => patents/06/384/06384425.pdf
[firstpage_image] =>[orig_patent_app_number] => 09137924
[rel_patent_id] =>[rel_patent_doc_number] =>) 09/137924 | Nonconductive substrate forming a strip or a panel on which a multiplicity of carrier elements is formed | Aug 19, 1998 | Issued |
Array
(
[id] => 4414412
[patent_doc_number] => 06229201
[patent_country] => US
[patent_kind] => NA
[patent_issue_date] => 2001-05-08
[patent_title] => 'Integrated circuit having a parasitic resonance filter'
[patent_app_type] => 1
[patent_app_number] => 9/136857
[patent_app_country] => US
[patent_app_date] => 1998-08-20
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 5
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[patent_no_of_words] => 3992
[patent_no_of_claims] => 15
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[patent_current_assignee] =>[type] => patent
[pdf_file] => patents/06/229/06229201.pdf
[firstpage_image] =>[orig_patent_app_number] => 136857
[rel_patent_id] =>[rel_patent_doc_number] =>) 09/136857 | Integrated circuit having a parasitic resonance filter | Aug 19, 1998 | Issued |
Array
(
[id] => 4187376
[patent_doc_number] => 06020634
[patent_country] => US
[patent_kind] => NA
[patent_issue_date] => 2000-02-01
[patent_title] => 'Replaceable power module'
[patent_app_type] => 1
[patent_app_number] => 9/135197
[patent_app_country] => US
[patent_app_date] => 1998-08-17
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 3
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[patent_no_of_claims] => 20
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[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => patent
[pdf_file] => patents/06/020/06020634.pdf
[firstpage_image] =>[orig_patent_app_number] => 135197
[rel_patent_id] =>[rel_patent_doc_number] =>) 09/135197 | Replaceable power module | Aug 16, 1998 | Issued |
Array
(
[id] => 4204467
[patent_doc_number] => 06077726
[patent_country] => US
[patent_kind] => NA
[patent_issue_date] => 2000-06-20
[patent_title] => 'Method and apparatus for stress relief in solder bump formation on a semiconductor device'
[patent_app_type] => 1
[patent_app_number] => 9/124720
[patent_app_country] => US
[patent_app_date] => 1998-07-30
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 2
[patent_figures_cnt] => 3
[patent_no_of_words] => 2093
[patent_no_of_claims] => 13
[patent_no_of_ind_claims] => 1
[patent_words_short_claim] => 103
[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => patent
[pdf_file] => patents/06/077/06077726.pdf
[firstpage_image] =>[orig_patent_app_number] => 124720
[rel_patent_id] =>[rel_patent_doc_number] =>) 09/124720 | Method and apparatus for stress relief in solder bump formation on a semiconductor device | Jul 29, 1998 | Issued |