Roy Karl Potter

Array ( [id] => 1580456 [patent_doc_number] => 06448662 [patent_country] => US [patent_kind] => B1 [patent_issue_date] => 2002-09-10 [patent_title] => 'Arrangement for accessing region of a flip chip die' [patent_app_type] => B1 [patent_app_number] => 09/090447 [patent_app_country] => US [patent_app_date] => 1998-06-05 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 2 [patent_figures_cnt] => 5 [patent_no_of_words] => 3180 [patent_no_of_claims] => 10 [patent_no_of_ind_claims] => 2 [patent_words_short_claim] => 71 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/06/448/06448662.pdf [firstpage_image] =>[orig_patent_app_number] => 09090447 [rel_patent_id] =>[rel_patent_doc_number] =>)

Array ( [id] => 4413000 [patent_doc_number] => 06239481 [patent_country] => US [patent_kind] => NA [patent_issue_date] => 2001-05-29 [patent_title] => 'Device for removing a flip chip die from packaging' [patent_app_type] => 1 [patent_app_number] => 9/092154 [patent_app_country] => US [patent_app_date] => 1998-06-05 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 2 [patent_figures_cnt] => 12 [patent_no_of_words] => 2948 [patent_no_of_claims] => 20 [patent_no_of_ind_claims] => 4 [patent_words_short_claim] => 70 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/06/239/06239481.pdf [firstpage_image] =>[orig_patent_app_number] => 092154 [rel_patent_id] =>[rel_patent_doc_number] =>)

Array ( [id] => 4324930 [patent_doc_number] => 06249041 [patent_country] => US [patent_kind] => NA [patent_issue_date] => 2001-06-19 [patent_title] => 'IC chip package with directly connected leads' [patent_app_type] => 1 [patent_app_number] => 9/089310 [patent_app_country] => US [patent_app_date] => 1998-06-02 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 8 [patent_figures_cnt] => 21 [patent_no_of_words] => 6241 [patent_no_of_claims] => 13 [patent_no_of_ind_claims] => 4 [patent_words_short_claim] => 166 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/06/249/06249041.pdf [firstpage_image] =>[orig_patent_app_number] => 089310 [rel_patent_id] =>[rel_patent_doc_number] =>)

Array ( [id] => 3954368 [patent_doc_number] => 05977633 [patent_country] => US [patent_kind] => NA [patent_issue_date] => 1999-11-02 [patent_title] => 'Semiconductor device with metal base substrate having hollows' [patent_app_type] => 1 [patent_app_number] => 9/086600 [patent_app_country] => US [patent_app_date] => 1998-05-29 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 6 [patent_figures_cnt] => 14 [patent_no_of_words] => 4584 [patent_no_of_claims] => 20 [patent_no_of_ind_claims] => 2 [patent_words_short_claim] => 108 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/05/977/05977633.pdf [firstpage_image] =>[orig_patent_app_number] => 086600 [rel_patent_id] =>[rel_patent_doc_number] =>)

Array ( [id] => 4300213 [patent_doc_number] => 06181006 [patent_country] => US [patent_kind] => NA [patent_issue_date] => 2001-01-30 [patent_title] => 'Thermally conductive mounting arrangement for securing an integrated circuit package to a heat sink' [patent_app_type] => 1 [patent_app_number] => 9/086667 [patent_app_country] => US [patent_app_date] => 1998-05-28 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 3 [patent_figures_cnt] => 8 [patent_no_of_words] => 2910 [patent_no_of_claims] => 16 [patent_no_of_ind_claims] => 3 [patent_words_short_claim] => 94 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/06/181/06181006.pdf [firstpage_image] =>[orig_patent_app_number] => 086667 [rel_patent_id] =>[rel_patent_doc_number] =>)

Array ( [id] => 1497148 [patent_doc_number] => 06404049 [patent_country] => US [patent_kind] => B1 [patent_issue_date] => 2002-06-11 [patent_title] => 'Semiconductor device, manufacturing method thereof and mounting board' [patent_app_type] => B1 [patent_app_number] => 09/077190 [patent_app_country] => US [patent_app_date] => 1998-05-26 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 17 [patent_figures_cnt] => 30 [patent_no_of_words] => 6602 [patent_no_of_claims] => 30 [patent_no_of_ind_claims] => 12 [patent_words_short_claim] => 136 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/06/404/06404049.pdf [firstpage_image] =>[orig_patent_app_number] => 09077190 [rel_patent_id] =>[rel_patent_doc_number] =>)

Array ( [id] => 1442020 [patent_doc_number] => 06335564 [patent_country] => US [patent_kind] => B1 [patent_issue_date] => 2002-01-01 [patent_title] => 'Single Paddle having a semiconductor device and a passive electronic component' [patent_app_type] => B1 [patent_app_number] => 09/083474 [patent_app_country] => US [patent_app_date] => 1998-05-22 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 9 [patent_figures_cnt] => 12 [patent_no_of_words] => 4072 [patent_no_of_claims] => 16 [patent_no_of_ind_claims] => 3 [patent_words_short_claim] => 57 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/06/335/06335564.pdf [firstpage_image] =>[orig_patent_app_number] => 09083474 [rel_patent_id] =>[rel_patent_doc_number] =>)

Array ( [id] => 4227794 [patent_doc_number] => 06011302 [patent_country] => US [patent_kind] => NA [patent_issue_date] => 2000-01-04 [patent_title] => 'Semiconductor device with reduced amount of sealing resin' [patent_app_type] => 1 [patent_app_number] => 9/082480 [patent_app_country] => US [patent_app_date] => 1998-05-21 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 5 [patent_figures_cnt] => 10 [patent_no_of_words] => 2909 [patent_no_of_claims] => 8 [patent_no_of_ind_claims] => 2 [patent_words_short_claim] => 207 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/06/011/06011302.pdf [firstpage_image] =>[orig_patent_app_number] => 082480 [rel_patent_id] =>[rel_patent_doc_number] =>)

Array ( [id] => 4161912 [patent_doc_number] => 06104093 [patent_country] => US [patent_kind] => NA [patent_issue_date] => 2000-08-15 [patent_title] => 'Thermally enhanced and mechanically balanced flip chip package and method of forming' [patent_app_type] => 1 [patent_app_number] => 9/080117 [patent_app_country] => US [patent_app_date] => 1998-05-15 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 3 [patent_figures_cnt] => 7 [patent_no_of_words] => 3913 [patent_no_of_claims] => 15 [patent_no_of_ind_claims] => 1 [patent_words_short_claim] => 104 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/06/104/06104093.pdf [firstpage_image] =>[orig_patent_app_number] => 080117 [rel_patent_id] =>[rel_patent_doc_number] =>)

Array ( [id] => 4108655 [patent_doc_number] => 06100585 [patent_country] => US [patent_kind] => NA [patent_issue_date] => 2000-08-08 [patent_title] => 'Structure for mounting device on circuit board' [patent_app_type] => 1 [patent_app_number] => 9/079327 [patent_app_country] => US [patent_app_date] => 1998-05-14 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 2 [patent_figures_cnt] => 4 [patent_no_of_words] => 1973 [patent_no_of_claims] => 4 [patent_no_of_ind_claims] => 1 [patent_words_short_claim] => 129 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/06/100/06100585.pdf [firstpage_image] =>[orig_patent_app_number] => 079327 [rel_patent_id] =>[rel_patent_doc_number] =>)

Array ( [id] => 4411922 [patent_doc_number] => 06172415 [patent_country] => US [patent_kind] => NA [patent_issue_date] => 2001-01-09 [patent_title] => 'Thin plate member for semiconductor package and manufacturing method therefor' [patent_app_type] => 1 [patent_app_number] => 9/076264 [patent_app_country] => US [patent_app_date] => 1998-05-12 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 2 [patent_figures_cnt] => 10 [patent_no_of_words] => 6145 [patent_no_of_claims] => 10 [patent_no_of_ind_claims] => 4 [patent_words_short_claim] => 126 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/06/172/06172415.pdf [firstpage_image] =>[orig_patent_app_number] => 076264 [rel_patent_id] =>[rel_patent_doc_number] =>)

Array ( [id] => 4161531 [patent_doc_number] => 06107683 [patent_country] => US [patent_kind] => NA [patent_issue_date] => 2000-08-22 [patent_title] => 'Sequentially built integrated circuit package' [patent_app_type] => 1 [patent_app_number] => 9/075286 [patent_app_country] => US [patent_app_date] => 1998-05-08 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 5 [patent_figures_cnt] => 21 [patent_no_of_words] => 4325 [patent_no_of_claims] => 12 [patent_no_of_ind_claims] => 1 [patent_words_short_claim] => 139 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/06/107/06107683.pdf [firstpage_image] =>[orig_patent_app_number] => 075286 [rel_patent_id] =>[rel_patent_doc_number] =>)

Array ( [id] => 4301433 [patent_doc_number] => 06184582 [patent_country] => US [patent_kind] => NA [patent_issue_date] => 2001-02-06 [patent_title] => 'Article comprising a standoff complaint metallization and a method for making same' [patent_app_type] => 1 [patent_app_number] => 9/069396 [patent_app_country] => US [patent_app_date] => 1998-04-29 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 4 [patent_figures_cnt] => 9 [patent_no_of_words] => 3135 [patent_no_of_claims] => 17 [patent_no_of_ind_claims] => 2 [patent_words_short_claim] => 90 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/06/184/06184582.pdf [firstpage_image] =>[orig_patent_app_number] => 069396 [rel_patent_id] =>[rel_patent_doc_number] =>)

Array ( [id] => 4161752 [patent_doc_number] => 06104082 [patent_country] => US [patent_kind] => NA [patent_issue_date] => 2000-08-15 [patent_title] => 'Metallization structure for altering connections' [patent_app_type] => 1 [patent_app_number] => 9/066147 [patent_app_country] => US [patent_app_date] => 1998-04-24 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 28 [patent_figures_cnt] => 30 [patent_no_of_words] => 5593 [patent_no_of_claims] => 22 [patent_no_of_ind_claims] => 1 [patent_words_short_claim] => 125 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/06/104/06104082.pdf [firstpage_image] =>[orig_patent_app_number] => 066147 [rel_patent_id] =>[rel_patent_doc_number] =>)

Array ( [id] => 1566323 [patent_doc_number] => 06339259 [patent_country] => US [patent_kind] => B1 [patent_issue_date] => 2002-01-15 [patent_title] => 'Adhesive composition for use in packaging applications' [patent_app_type] => B1 [patent_app_number] => 09/065944 [patent_app_country] => US [patent_app_date] => 1998-04-24 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 4 [patent_figures_cnt] => 16 [patent_no_of_words] => 10186 [patent_no_of_claims] => 31 [patent_no_of_ind_claims] => 5 [patent_words_short_claim] => 38 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/06/339/06339259.pdf [firstpage_image] =>[orig_patent_app_number] => 09065944 [rel_patent_id] =>[rel_patent_doc_number] =>)

Array ( [id] => 1566323 [patent_doc_number] => 06339259 [patent_country] => US [patent_kind] => B1 [patent_issue_date] => 2002-01-15 [patent_title] => 'Adhesive composition for use in packaging applications' [patent_app_type] => B1 [patent_app_number] => 09/065944 [patent_app_country] => US [patent_app_date] => 1998-04-24 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 4 [patent_figures_cnt] => 16 [patent_no_of_words] => 10186 [patent_no_of_claims] => 31 [patent_no_of_ind_claims] => 5 [patent_words_short_claim] => 38 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/06/339/06339259.pdf [firstpage_image] =>[orig_patent_app_number] => 09065944 [rel_patent_id] =>[rel_patent_doc_number] =>)

Array ( [id] => 1566323 [patent_doc_number] => 06339259 [patent_country] => US [patent_kind] => B1 [patent_issue_date] => 2002-01-15 [patent_title] => 'Adhesive composition for use in packaging applications' [patent_app_type] => B1 [patent_app_number] => 09/065944 [patent_app_country] => US [patent_app_date] => 1998-04-24 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 4 [patent_figures_cnt] => 16 [patent_no_of_words] => 10186 [patent_no_of_claims] => 31 [patent_no_of_ind_claims] => 5 [patent_words_short_claim] => 38 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/06/339/06339259.pdf [firstpage_image] =>[orig_patent_app_number] => 09065944 [rel_patent_id] =>[rel_patent_doc_number] =>)

Array ( [id] => 1566323 [patent_doc_number] => 06339259 [patent_country] => US [patent_kind] => B1 [patent_issue_date] => 2002-01-15 [patent_title] => 'Adhesive composition for use in packaging applications' [patent_app_type] => B1 [patent_app_number] => 09/065944 [patent_app_country] => US [patent_app_date] => 1998-04-24 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 4 [patent_figures_cnt] => 16 [patent_no_of_words] => 10186 [patent_no_of_claims] => 31 [patent_no_of_ind_claims] => 5 [patent_words_short_claim] => 38 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/06/339/06339259.pdf [firstpage_image] =>[orig_patent_app_number] => 09065944 [rel_patent_id] =>[rel_patent_doc_number] =>)

Array ( [id] => 4364988 [patent_doc_number] => 06191487 [patent_country] => US [patent_kind] => NA [patent_issue_date] => 2001-02-20 [patent_title] => 'Semiconductor and flip chip packages and method having a back-side connection' [patent_app_type] => 1 [patent_app_number] => 9/065677 [patent_app_country] => US [patent_app_date] => 1998-04-23 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 3 [patent_figures_cnt] => 5 [patent_no_of_words] => 4085 [patent_no_of_claims] => 21 [patent_no_of_ind_claims] => 3 [patent_words_short_claim] => 83 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/06/191/06191487.pdf [firstpage_image] =>[orig_patent_app_number] => 065677 [rel_patent_id] =>[rel_patent_doc_number] =>)

Array ( [id] => 3954785 [patent_doc_number] => 05955780 [patent_country] => US [patent_kind] => NA [patent_issue_date] => 1999-09-21 [patent_title] => 'Contact converting structure of semiconductor chip and process for manufacturing semiconductor chip having said contact converting structure' [patent_app_type] => 1 [patent_app_number] => 9/063270 [patent_app_country] => US [patent_app_date] => 1998-04-21 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 3 [patent_figures_cnt] => 10 [patent_no_of_words] => 3480 [patent_no_of_claims] => 4 [patent_no_of_ind_claims] => 1 [patent_words_short_claim] => 114 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/05/955/05955780.pdf [firstpage_image] =>[orig_patent_app_number] => 063270 [rel_patent_id] =>[rel_patent_doc_number] =>)