Search

Roy Karl Potter

Examiner (ID: 13991, Phone: (571)272-1842 , Office: P/2822 )

Most Active Art Unit
2822
Art Unit(s)
2822, 2508, 2811, 3621
Total Applications
2584
Issued Applications
2409
Pending Applications
46
Abandoned Applications
141

Applications

Application numberTitle of the applicationFiling DateStatus
Array ( [id] => 4423738 [patent_doc_number] => 06177722 [patent_country] => US [patent_kind] => NA [patent_issue_date] => 2001-01-23 [patent_title] => 'Leadless array package' [patent_app_type] => 1 [patent_app_number] => 9/063817 [patent_app_country] => US [patent_app_date] => 1998-04-21 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 2 [patent_figures_cnt] => 4 [patent_no_of_words] => 2107 [patent_no_of_claims] => 11 [patent_no_of_ind_claims] => 4 [patent_words_short_claim] => 144 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/06/177/06177722.pdf [firstpage_image] =>[orig_patent_app_number] => 063817 [rel_patent_id] =>[rel_patent_doc_number] =>)
09/063817
Leadless array package Apr 20, 1998 Issued
Array ( [id] => 4362947 [patent_doc_number] => 06175159 [patent_country] => US [patent_kind] => NA [patent_issue_date] => 2001-01-16 [patent_title] => 'Semiconductor package' [patent_app_type] => 1 [patent_app_number] => 9/062720 [patent_app_country] => US [patent_app_date] => 1998-04-20 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 6 [patent_figures_cnt] => 11 [patent_no_of_words] => 5157 [patent_no_of_claims] => 8 [patent_no_of_ind_claims] => 2 [patent_words_short_claim] => 177 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/06/175/06175159.pdf [firstpage_image] =>[orig_patent_app_number] => 062720 [rel_patent_id] =>[rel_patent_doc_number] =>)
09/062720
Semiconductor package Apr 19, 1998 Issued
Array ( [id] => 4411029 [patent_doc_number] => 06232657 [patent_country] => US [patent_kind] => NA [patent_issue_date] => 2001-05-15 [patent_title] => 'Silicon nitride circuit board and semiconductor module' [patent_app_type] => 1 [patent_app_number] => 9/051477 [patent_app_country] => US [patent_app_date] => 1998-04-17 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 4 [patent_figures_cnt] => 10 [patent_no_of_words] => 18862 [patent_no_of_claims] => 24 [patent_no_of_ind_claims] => 4 [patent_words_short_claim] => 72 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/06/232/06232657.pdf [firstpage_image] =>[orig_patent_app_number] => 051477 [rel_patent_id] =>[rel_patent_doc_number] =>)
09/051477
Silicon nitride circuit board and semiconductor module Apr 16, 1998 Issued
Array ( [id] => 4161808 [patent_doc_number] => 06104086 [patent_country] => US [patent_kind] => NA [patent_issue_date] => 2000-08-15 [patent_title] => 'Semiconductor device having lead terminals bent in J-shape' [patent_app_type] => 1 [patent_app_number] => 9/059316 [patent_app_country] => US [patent_app_date] => 1998-04-13 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 7 [patent_figures_cnt] => 24 [patent_no_of_words] => 4523 [patent_no_of_claims] => 6 [patent_no_of_ind_claims] => 2 [patent_words_short_claim] => 216 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/06/104/06104086.pdf [firstpage_image] =>[orig_patent_app_number] => 059316 [rel_patent_id] =>[rel_patent_doc_number] =>)
09/059316
Semiconductor device having lead terminals bent in J-shape Apr 12, 1998 Issued
Array ( [id] => 4325168 [patent_doc_number] => 06329275 [patent_country] => US [patent_kind] => NA [patent_issue_date] => 2001-12-11 [patent_title] => 'Interconnector line of thin film, sputter target for forming the wiring film and electronic component using the same' [patent_app_type] => 1 [patent_app_number] => 9/051567 [patent_app_country] => US [patent_app_date] => 1998-04-10 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 5 [patent_figures_cnt] => 8 [patent_no_of_words] => 11429 [patent_no_of_claims] => 6 [patent_no_of_ind_claims] => 4 [patent_words_short_claim] => 50 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/06/329/06329275.pdf [firstpage_image] =>[orig_patent_app_number] => 051567 [rel_patent_id] =>[rel_patent_doc_number] =>)
09/051567
Interconnector line of thin film, sputter target for forming the wiring film and electronic component using the same Apr 9, 1998 Issued
Array ( [id] => 4108798 [patent_doc_number] => 06051888 [patent_country] => US [patent_kind] => NA [patent_issue_date] => 2000-04-18 [patent_title] => 'Semiconductor package and method for increased thermal dissipation of flip-chip semiconductor package' [patent_app_type] => 1 [patent_app_number] => 9/056570 [patent_app_country] => US [patent_app_date] => 1998-04-07 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 4 [patent_figures_cnt] => 6 [patent_no_of_words] => 1537 [patent_no_of_claims] => 3 [patent_no_of_ind_claims] => 3 [patent_words_short_claim] => 63 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/06/051/06051888.pdf [firstpage_image] =>[orig_patent_app_number] => 056570 [rel_patent_id] =>[rel_patent_doc_number] =>)
09/056570
Semiconductor package and method for increased thermal dissipation of flip-chip semiconductor package Apr 6, 1998 Issued
Array ( [id] => 1563174 [patent_doc_number] => 06362530 [patent_country] => US [patent_kind] => B1 [patent_issue_date] => 2002-03-26 [patent_title] => 'Manufacturing methods and construction for integrated circuit packages' [patent_app_type] => B1 [patent_app_number] => 09/056074 [patent_app_country] => US [patent_app_date] => 1998-04-06 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 2 [patent_figures_cnt] => 8 [patent_no_of_words] => 4547 [patent_no_of_claims] => 11 [patent_no_of_ind_claims] => 3 [patent_words_short_claim] => 225 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/06/362/06362530.pdf [firstpage_image] =>[orig_patent_app_number] => 09056074 [rel_patent_id] =>[rel_patent_doc_number] =>)
09/056074
Manufacturing methods and construction for integrated circuit packages Apr 5, 1998 Issued
Array ( [id] => 1330688 [patent_doc_number] => 06600215 [patent_country] => US [patent_kind] => B1 [patent_issue_date] => 2003-07-29 [patent_title] => 'Method and apparatus for coupling a semiconductor die to die terminals' [patent_app_type] => B1 [patent_app_number] => 09/054275 [patent_app_country] => US [patent_app_date] => 1998-04-02 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 8 [patent_figures_cnt] => 12 [patent_no_of_words] => 5948 [patent_no_of_claims] => 76 [patent_no_of_ind_claims] => 13 [patent_words_short_claim] => 85 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/06/600/06600215.pdf [firstpage_image] =>[orig_patent_app_number] => 09054275 [rel_patent_id] =>[rel_patent_doc_number] =>)
09/054275
Method and apparatus for coupling a semiconductor die to die terminals Apr 1, 1998 Issued
Array ( [id] => 4161898 [patent_doc_number] => 06104092 [patent_country] => US [patent_kind] => NA [patent_issue_date] => 2000-08-15 [patent_title] => 'Semiconductor device having amorphous carbon fluoride film of low dielectric constant as interlayer insulation material' [patent_app_type] => 1 [patent_app_number] => 9/052937 [patent_app_country] => US [patent_app_date] => 1998-04-01 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 11 [patent_figures_cnt] => 24 [patent_no_of_words] => 8965 [patent_no_of_claims] => 10 [patent_no_of_ind_claims] => 3 [patent_words_short_claim] => 51 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/06/104/06104092.pdf [firstpage_image] =>[orig_patent_app_number] => 052937 [rel_patent_id] =>[rel_patent_doc_number] =>)
09/052937
Semiconductor device having amorphous carbon fluoride film of low dielectric constant as interlayer insulation material Mar 31, 1998 Issued
Array ( [id] => 4361278 [patent_doc_number] => 06201292 [patent_country] => US [patent_kind] => NA [patent_issue_date] => 2001-03-13 [patent_title] => 'Resin-sealed semiconductor device, circuit member used therefor' [patent_app_type] => 1 [patent_app_number] => 9/052984 [patent_app_country] => US [patent_app_date] => 1998-04-01 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 17 [patent_figures_cnt] => 55 [patent_no_of_words] => 9657 [patent_no_of_claims] => 62 [patent_no_of_ind_claims] => 6 [patent_words_short_claim] => 66 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/06/201/06201292.pdf [firstpage_image] =>[orig_patent_app_number] => 052984 [rel_patent_id] =>[rel_patent_doc_number] =>)
09/052984
Resin-sealed semiconductor device, circuit member used therefor Mar 31, 1998 Issued
Array ( [id] => 4196659 [patent_doc_number] => 06130480 [patent_country] => US [patent_kind] => NA [patent_issue_date] => 2000-10-10 [patent_title] => 'Structure for packaging semiconductor chip' [patent_app_type] => 1 [patent_app_number] => 9/050971 [patent_app_country] => US [patent_app_date] => 1998-03-31 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 6 [patent_figures_cnt] => 13 [patent_no_of_words] => 4041 [patent_no_of_claims] => 12 [patent_no_of_ind_claims] => 7 [patent_words_short_claim] => 31 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/06/130/06130480.pdf [firstpage_image] =>[orig_patent_app_number] => 050971 [rel_patent_id] =>[rel_patent_doc_number] =>)
09/050971
Structure for packaging semiconductor chip Mar 30, 1998 Issued
Array ( [id] => 4232456 [patent_doc_number] => 06117705 [patent_country] => US [patent_kind] => NA [patent_issue_date] => 2000-09-12 [patent_title] => 'Method of making integrated circuit package having adhesive bead supporting planar lid above planar substrate' [patent_app_type] => 1 [patent_app_number] => 9/050666 [patent_app_country] => US [patent_app_date] => 1998-03-30 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 11 [patent_figures_cnt] => 14 [patent_no_of_words] => 12364 [patent_no_of_claims] => 38 [patent_no_of_ind_claims] => 3 [patent_words_short_claim] => 140 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/06/117/06117705.pdf [firstpage_image] =>[orig_patent_app_number] => 050666 [rel_patent_id] =>[rel_patent_doc_number] =>)
09/050666
Method of making integrated circuit package having adhesive bead supporting planar lid above planar substrate Mar 29, 1998 Issued
Array ( [id] => 4257746 [patent_doc_number] => 06208022 [patent_country] => US [patent_kind] => NA [patent_issue_date] => 2001-03-27 [patent_title] => 'Electronic-circuit assembly' [patent_app_type] => 1 [patent_app_number] => 9/048215 [patent_app_country] => US [patent_app_date] => 1998-03-26 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 12 [patent_figures_cnt] => 30 [patent_no_of_words] => 6124 [patent_no_of_claims] => 16 [patent_no_of_ind_claims] => 5 [patent_words_short_claim] => 95 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/06/208/06208022.pdf [firstpage_image] =>[orig_patent_app_number] => 048215 [rel_patent_id] =>[rel_patent_doc_number] =>)
09/048215
Electronic-circuit assembly Mar 25, 1998 Issued
Array ( [id] => 4195160 [patent_doc_number] => 06153925 [patent_country] => US [patent_kind] => NA [patent_issue_date] => 2000-11-28 [patent_title] => 'Film circuit' [patent_app_type] => 1 [patent_app_number] => 9/048550 [patent_app_country] => US [patent_app_date] => 1998-03-26 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 5 [patent_figures_cnt] => 20 [patent_no_of_words] => 3314 [patent_no_of_claims] => 8 [patent_no_of_ind_claims] => 2 [patent_words_short_claim] => 107 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/06/153/06153925.pdf [firstpage_image] =>[orig_patent_app_number] => 048550 [rel_patent_id] =>[rel_patent_doc_number] =>)
09/048550
Film circuit Mar 25, 1998 Issued
Array ( [id] => 4161926 [patent_doc_number] => 06104094 [patent_country] => US [patent_kind] => NA [patent_issue_date] => 2000-08-15 [patent_title] => 'Semiconductor device' [patent_app_type] => 1 [patent_app_number] => 9/042728 [patent_app_country] => US [patent_app_date] => 1998-03-17 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 5 [patent_figures_cnt] => 10 [patent_no_of_words] => 2908 [patent_no_of_claims] => 39 [patent_no_of_ind_claims] => 6 [patent_words_short_claim] => 71 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/06/104/06104094.pdf [firstpage_image] =>[orig_patent_app_number] => 042728 [rel_patent_id] =>[rel_patent_doc_number] =>)
09/042728
Semiconductor device Mar 16, 1998 Issued
Array ( [id] => 4140765 [patent_doc_number] => 06016004 [patent_country] => US [patent_kind] => NA [patent_issue_date] => 2000-01-18 [patent_title] => 'Method and apparatus for epoxy loc die attachment' [patent_app_type] => 1 [patent_app_number] => 9/035320 [patent_app_country] => US [patent_app_date] => 1998-03-05 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 5 [patent_figures_cnt] => 11 [patent_no_of_words] => 5873 [patent_no_of_claims] => 14 [patent_no_of_ind_claims] => 3 [patent_words_short_claim] => 86 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/06/016/06016004.pdf [firstpage_image] =>[orig_patent_app_number] => 035320 [rel_patent_id] =>[rel_patent_doc_number] =>)
09/035320
Method and apparatus for epoxy loc die attachment Mar 4, 1998 Issued
Array ( [id] => 4108617 [patent_doc_number] => 06051875 [patent_country] => US [patent_kind] => NA [patent_issue_date] => 2000-04-18 [patent_title] => 'Semiconductor chip' [patent_app_type] => 1 [patent_app_number] => 9/035777 [patent_app_country] => US [patent_app_date] => 1998-03-04 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 8 [patent_figures_cnt] => 15 [patent_no_of_words] => 2581 [patent_no_of_claims] => 48 [patent_no_of_ind_claims] => 20 [patent_words_short_claim] => 44 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/06/051/06051875.pdf [firstpage_image] =>[orig_patent_app_number] => 035777 [rel_patent_id] =>[rel_patent_doc_number] =>)
09/035777
Semiconductor chip Mar 3, 1998 Issued
Array ( [id] => 4087046 [patent_doc_number] => 06054757 [patent_country] => US [patent_kind] => NA [patent_issue_date] => 2000-04-25 [patent_title] => 'Semiconductor apparatus, circuit board and combination thereof' [patent_app_type] => 1 [patent_app_number] => 9/030924 [patent_app_country] => US [patent_app_date] => 1998-02-26 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 6 [patent_figures_cnt] => 14 [patent_no_of_words] => 3511 [patent_no_of_claims] => 17 [patent_no_of_ind_claims] => 3 [patent_words_short_claim] => 123 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/06/054/06054757.pdf [firstpage_image] =>[orig_patent_app_number] => 030924 [rel_patent_id] =>[rel_patent_doc_number] =>)
09/030924
Semiconductor apparatus, circuit board and combination thereof Feb 25, 1998 Issued
Array ( [id] => 4239432 [patent_doc_number] => 06075290 [patent_country] => US [patent_kind] => NA [patent_issue_date] => 2000-06-13 [patent_title] => 'Surface mount die: wafer level chip-scale package and process for making the same' [patent_app_type] => 1 [patent_app_number] => 9/031167 [patent_app_country] => US [patent_app_date] => 1998-02-26 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 3 [patent_figures_cnt] => 5 [patent_no_of_words] => 5253 [patent_no_of_claims] => 18 [patent_no_of_ind_claims] => 2 [patent_words_short_claim] => 172 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/06/075/06075290.pdf [firstpage_image] =>[orig_patent_app_number] => 031167 [rel_patent_id] =>[rel_patent_doc_number] =>)
09/031167
Surface mount die: wafer level chip-scale package and process for making the same Feb 25, 1998 Issued
Array ( [id] => 4361345 [patent_doc_number] => 06201297 [patent_country] => US [patent_kind] => NA [patent_issue_date] => 2001-03-13 [patent_title] => 'Semiconductor device' [patent_app_type] => 1 [patent_app_number] => 9/030255 [patent_app_country] => US [patent_app_date] => 1998-02-25 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 25 [patent_figures_cnt] => 35 [patent_no_of_words] => 9348 [patent_no_of_claims] => 25 [patent_no_of_ind_claims] => 4 [patent_words_short_claim] => 190 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/06/201/06201297.pdf [firstpage_image] =>[orig_patent_app_number] => 030255 [rel_patent_id] =>[rel_patent_doc_number] =>)
09/030255
Semiconductor device Feb 24, 1998 Issued
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