
Roy Karl Potter
Examiner (ID: 13991, Phone: (571)272-1842 , Office: P/2822 )
| Most Active Art Unit | 2822 |
| Art Unit(s) | 2822, 2508, 2811, 3621 |
| Total Applications | 2584 |
| Issued Applications | 2409 |
| Pending Applications | 46 |
| Abandoned Applications | 141 |
Applications
| Application number | Title of the application | Filing Date | Status |
|---|---|---|---|
Array
(
[id] => 4423738
[patent_doc_number] => 06177722
[patent_country] => US
[patent_kind] => NA
[patent_issue_date] => 2001-01-23
[patent_title] => 'Leadless array package'
[patent_app_type] => 1
[patent_app_number] => 9/063817
[patent_app_country] => US
[patent_app_date] => 1998-04-21
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 2
[patent_figures_cnt] => 4
[patent_no_of_words] => 2107
[patent_no_of_claims] => 11
[patent_no_of_ind_claims] => 4
[patent_words_short_claim] => 144
[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => patent
[pdf_file] => patents/06/177/06177722.pdf
[firstpage_image] =>[orig_patent_app_number] => 063817
[rel_patent_id] =>[rel_patent_doc_number] =>) 09/063817 | Leadless array package | Apr 20, 1998 | Issued |
Array
(
[id] => 4362947
[patent_doc_number] => 06175159
[patent_country] => US
[patent_kind] => NA
[patent_issue_date] => 2001-01-16
[patent_title] => 'Semiconductor package'
[patent_app_type] => 1
[patent_app_number] => 9/062720
[patent_app_country] => US
[patent_app_date] => 1998-04-20
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 6
[patent_figures_cnt] => 11
[patent_no_of_words] => 5157
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[patent_words_short_claim] => 177
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[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => patent
[pdf_file] => patents/06/175/06175159.pdf
[firstpage_image] =>[orig_patent_app_number] => 062720
[rel_patent_id] =>[rel_patent_doc_number] =>) 09/062720 | Semiconductor package | Apr 19, 1998 | Issued |
Array
(
[id] => 4411029
[patent_doc_number] => 06232657
[patent_country] => US
[patent_kind] => NA
[patent_issue_date] => 2001-05-15
[patent_title] => 'Silicon nitride circuit board and semiconductor module'
[patent_app_type] => 1
[patent_app_number] => 9/051477
[patent_app_country] => US
[patent_app_date] => 1998-04-17
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 4
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[patent_no_of_words] => 18862
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[pdf_file] => patents/06/232/06232657.pdf
[firstpage_image] =>[orig_patent_app_number] => 051477
[rel_patent_id] =>[rel_patent_doc_number] =>) 09/051477 | Silicon nitride circuit board and semiconductor module | Apr 16, 1998 | Issued |
Array
(
[id] => 4161808
[patent_doc_number] => 06104086
[patent_country] => US
[patent_kind] => NA
[patent_issue_date] => 2000-08-15
[patent_title] => 'Semiconductor device having lead terminals bent in J-shape'
[patent_app_type] => 1
[patent_app_number] => 9/059316
[patent_app_country] => US
[patent_app_date] => 1998-04-13
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 7
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[patent_no_of_words] => 4523
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[patent_no_of_assignments] => 0
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[pdf_file] => patents/06/104/06104086.pdf
[firstpage_image] =>[orig_patent_app_number] => 059316
[rel_patent_id] =>[rel_patent_doc_number] =>) 09/059316 | Semiconductor device having lead terminals bent in J-shape | Apr 12, 1998 | Issued |
Array
(
[id] => 4325168
[patent_doc_number] => 06329275
[patent_country] => US
[patent_kind] => NA
[patent_issue_date] => 2001-12-11
[patent_title] => 'Interconnector line of thin film, sputter target for forming the wiring film and electronic component using the same'
[patent_app_type] => 1
[patent_app_number] => 9/051567
[patent_app_country] => US
[patent_app_date] => 1998-04-10
[patent_effective_date] => 0000-00-00
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[pdf_file] => patents/06/329/06329275.pdf
[firstpage_image] =>[orig_patent_app_number] => 051567
[rel_patent_id] =>[rel_patent_doc_number] =>) 09/051567 | Interconnector line of thin film, sputter target for forming the wiring film and electronic component using the same | Apr 9, 1998 | Issued |
Array
(
[id] => 4108798
[patent_doc_number] => 06051888
[patent_country] => US
[patent_kind] => NA
[patent_issue_date] => 2000-04-18
[patent_title] => 'Semiconductor package and method for increased thermal dissipation of flip-chip semiconductor package'
[patent_app_type] => 1
[patent_app_number] => 9/056570
[patent_app_country] => US
[patent_app_date] => 1998-04-07
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 4
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[pdf_file] => patents/06/051/06051888.pdf
[firstpage_image] =>[orig_patent_app_number] => 056570
[rel_patent_id] =>[rel_patent_doc_number] =>) 09/056570 | Semiconductor package and method for increased thermal dissipation of flip-chip semiconductor package | Apr 6, 1998 | Issued |
Array
(
[id] => 1563174
[patent_doc_number] => 06362530
[patent_country] => US
[patent_kind] => B1
[patent_issue_date] => 2002-03-26
[patent_title] => 'Manufacturing methods and construction for integrated circuit packages'
[patent_app_type] => B1
[patent_app_number] => 09/056074
[patent_app_country] => US
[patent_app_date] => 1998-04-06
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 2
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[patent_no_of_words] => 4547
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[patent_current_assignee] =>[type] => patent
[pdf_file] => patents/06/362/06362530.pdf
[firstpage_image] =>[orig_patent_app_number] => 09056074
[rel_patent_id] =>[rel_patent_doc_number] =>) 09/056074 | Manufacturing methods and construction for integrated circuit packages | Apr 5, 1998 | Issued |
Array
(
[id] => 1330688
[patent_doc_number] => 06600215
[patent_country] => US
[patent_kind] => B1
[patent_issue_date] => 2003-07-29
[patent_title] => 'Method and apparatus for coupling a semiconductor die to die terminals'
[patent_app_type] => B1
[patent_app_number] => 09/054275
[patent_app_country] => US
[patent_app_date] => 1998-04-02
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 8
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[pdf_file] => patents/06/600/06600215.pdf
[firstpage_image] =>[orig_patent_app_number] => 09054275
[rel_patent_id] =>[rel_patent_doc_number] =>) 09/054275 | Method and apparatus for coupling a semiconductor die to die terminals | Apr 1, 1998 | Issued |
Array
(
[id] => 4161898
[patent_doc_number] => 06104092
[patent_country] => US
[patent_kind] => NA
[patent_issue_date] => 2000-08-15
[patent_title] => 'Semiconductor device having amorphous carbon fluoride film of low dielectric constant as interlayer insulation material'
[patent_app_type] => 1
[patent_app_number] => 9/052937
[patent_app_country] => US
[patent_app_date] => 1998-04-01
[patent_effective_date] => 0000-00-00
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[pdf_file] => patents/06/104/06104092.pdf
[firstpage_image] =>[orig_patent_app_number] => 052937
[rel_patent_id] =>[rel_patent_doc_number] =>) 09/052937 | Semiconductor device having amorphous carbon fluoride film of low dielectric constant as interlayer insulation material | Mar 31, 1998 | Issued |
Array
(
[id] => 4361278
[patent_doc_number] => 06201292
[patent_country] => US
[patent_kind] => NA
[patent_issue_date] => 2001-03-13
[patent_title] => 'Resin-sealed semiconductor device, circuit member used therefor'
[patent_app_type] => 1
[patent_app_number] => 9/052984
[patent_app_country] => US
[patent_app_date] => 1998-04-01
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 17
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[pdf_file] => patents/06/201/06201292.pdf
[firstpage_image] =>[orig_patent_app_number] => 052984
[rel_patent_id] =>[rel_patent_doc_number] =>) 09/052984 | Resin-sealed semiconductor device, circuit member used therefor | Mar 31, 1998 | Issued |
Array
(
[id] => 4196659
[patent_doc_number] => 06130480
[patent_country] => US
[patent_kind] => NA
[patent_issue_date] => 2000-10-10
[patent_title] => 'Structure for packaging semiconductor chip'
[patent_app_type] => 1
[patent_app_number] => 9/050971
[patent_app_country] => US
[patent_app_date] => 1998-03-31
[patent_effective_date] => 0000-00-00
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[pdf_file] => patents/06/130/06130480.pdf
[firstpage_image] =>[orig_patent_app_number] => 050971
[rel_patent_id] =>[rel_patent_doc_number] =>) 09/050971 | Structure for packaging semiconductor chip | Mar 30, 1998 | Issued |
Array
(
[id] => 4232456
[patent_doc_number] => 06117705
[patent_country] => US
[patent_kind] => NA
[patent_issue_date] => 2000-09-12
[patent_title] => 'Method of making integrated circuit package having adhesive bead supporting planar lid above planar substrate'
[patent_app_type] => 1
[patent_app_number] => 9/050666
[patent_app_country] => US
[patent_app_date] => 1998-03-30
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[rel_patent_id] =>[rel_patent_doc_number] =>) 09/050666 | Method of making integrated circuit package having adhesive bead supporting planar lid above planar substrate | Mar 29, 1998 | Issued |
Array
(
[id] => 4257746
[patent_doc_number] => 06208022
[patent_country] => US
[patent_kind] => NA
[patent_issue_date] => 2001-03-27
[patent_title] => 'Electronic-circuit assembly'
[patent_app_type] => 1
[patent_app_number] => 9/048215
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[pdf_file] => patents/06/208/06208022.pdf
[firstpage_image] =>[orig_patent_app_number] => 048215
[rel_patent_id] =>[rel_patent_doc_number] =>) 09/048215 | Electronic-circuit assembly | Mar 25, 1998 | Issued |
Array
(
[id] => 4195160
[patent_doc_number] => 06153925
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[patent_issue_date] => 2000-11-28
[patent_title] => 'Film circuit'
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[patent_app_country] => US
[patent_app_date] => 1998-03-26
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[pdf_file] => patents/06/153/06153925.pdf
[firstpage_image] =>[orig_patent_app_number] => 048550
[rel_patent_id] =>[rel_patent_doc_number] =>) 09/048550 | Film circuit | Mar 25, 1998 | Issued |
Array
(
[id] => 4161926
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[rel_patent_id] =>[rel_patent_doc_number] =>) 09/042728 | Semiconductor device | Mar 16, 1998 | Issued |
Array
(
[id] => 4140765
[patent_doc_number] => 06016004
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[patent_kind] => NA
[patent_issue_date] => 2000-01-18
[patent_title] => 'Method and apparatus for epoxy loc die attachment'
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[pdf_file] => patents/06/016/06016004.pdf
[firstpage_image] =>[orig_patent_app_number] => 035320
[rel_patent_id] =>[rel_patent_doc_number] =>) 09/035320 | Method and apparatus for epoxy loc die attachment | Mar 4, 1998 | Issued |
Array
(
[id] => 4108617
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[patent_title] => 'Semiconductor chip'
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[rel_patent_id] =>[rel_patent_doc_number] =>) 09/035777 | Semiconductor chip | Mar 3, 1998 | Issued |
Array
(
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[rel_patent_id] =>[rel_patent_doc_number] =>) 09/030924 | Semiconductor apparatus, circuit board and combination thereof | Feb 25, 1998 | Issued |
Array
(
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Array
(
[id] => 4361345
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[pdf_file] => patents/06/201/06201297.pdf
[firstpage_image] =>[orig_patent_app_number] => 030255
[rel_patent_id] =>[rel_patent_doc_number] =>) 09/030255 | Semiconductor device | Feb 24, 1998 | Issued |