
Roy Karl Potter
Examiner (ID: 13991, Phone: (571)272-1842 , Office: P/2822 )
| Most Active Art Unit | 2822 |
| Art Unit(s) | 2822, 2508, 2811, 3621 |
| Total Applications | 2584 |
| Issued Applications | 2409 |
| Pending Applications | 46 |
| Abandoned Applications | 141 |
Applications
| Application number | Title of the application | Filing Date | Status |
|---|---|---|---|
Array
(
[id] => 4103330
[patent_doc_number] => 06049129
[patent_country] => US
[patent_kind] => NA
[patent_issue_date] => 2000-04-11
[patent_title] => 'Chip size integrated circuit package'
[patent_app_type] => 1
[patent_app_number] => 8/994627
[patent_app_country] => US
[patent_app_date] => 1997-12-19
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 2
[patent_figures_cnt] => 6
[patent_no_of_words] => 6001
[patent_no_of_claims] => 36
[patent_no_of_ind_claims] => 2
[patent_words_short_claim] => 129
[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => patent
[pdf_file] => patents/06/049/06049129.pdf
[firstpage_image] =>[orig_patent_app_number] => 994627
[rel_patent_id] =>[rel_patent_doc_number] =>) 08/994627 | Chip size integrated circuit package | Dec 18, 1997 | Issued |
Array
(
[id] => 3985230
[patent_doc_number] => 05949135
[patent_country] => US
[patent_kind] => NA
[patent_issue_date] => 1999-09-07
[patent_title] => 'Module mounted with semiconductor device'
[patent_app_type] => 1
[patent_app_number] => 8/991485
[patent_app_country] => US
[patent_app_date] => 1997-12-16
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 10
[patent_figures_cnt] => 16
[patent_no_of_words] => 5803
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[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => patent
[pdf_file] => patents/05/949/05949135.pdf
[firstpage_image] =>[orig_patent_app_number] => 991485
[rel_patent_id] =>[rel_patent_doc_number] =>) 08/991485 | Module mounted with semiconductor device | Dec 15, 1997 | Issued |
Array
(
[id] => 4239362
[patent_doc_number] => 06075285
[patent_country] => US
[patent_kind] => NA
[patent_issue_date] => 2000-06-13
[patent_title] => 'Semiconductor package substrate with power die'
[patent_app_type] => 1
[patent_app_number] => 8/990705
[patent_app_country] => US
[patent_app_date] => 1997-12-15
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 6
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[patent_no_of_words] => 2880
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[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => patent
[pdf_file] => patents/06/075/06075285.pdf
[firstpage_image] =>[orig_patent_app_number] => 990705
[rel_patent_id] =>[rel_patent_doc_number] =>) 08/990705 | Semiconductor package substrate with power die | Dec 14, 1997 | Issued |
Array
(
[id] => 3961376
[patent_doc_number] => 05936304
[patent_country] => US
[patent_kind] => NA
[patent_issue_date] => 1999-08-10
[patent_title] => 'C4 package die backside coating'
[patent_app_type] => 1
[patent_app_number] => 8/988506
[patent_app_country] => US
[patent_app_date] => 1997-12-10
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 7
[patent_figures_cnt] => 17
[patent_no_of_words] => 2945
[patent_no_of_claims] => 28
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[patent_current_assignee] =>[type] => patent
[pdf_file] => patents/05/936/05936304.pdf
[firstpage_image] =>[orig_patent_app_number] => 988506
[rel_patent_id] =>[rel_patent_doc_number] =>) 08/988506 | C4 package die backside coating | Dec 9, 1997 | Issued |
Array
(
[id] => 4038401
[patent_doc_number] => 05994772
[patent_country] => US
[patent_kind] => NA
[patent_issue_date] => 1999-11-30
[patent_title] => 'Semiconductor package'
[patent_app_type] => 1
[patent_app_number] => 8/986146
[patent_app_country] => US
[patent_app_date] => 1997-12-08
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 7
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[patent_no_of_words] => 2285
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[patent_current_assignee] =>[type] => patent
[pdf_file] => patents/05/994/05994772.pdf
[firstpage_image] =>[orig_patent_app_number] => 986146
[rel_patent_id] =>[rel_patent_doc_number] =>) 08/986146 | Semiconductor package | Dec 7, 1997 | Issued |
Array
(
[id] => 4139518
[patent_doc_number] => 06121646
[patent_country] => US
[patent_kind] => NA
[patent_issue_date] => 2000-09-19
[patent_title] => 'Semiconductor integrated circuit'
[patent_app_type] => 1
[patent_app_number] => 8/913407
[patent_app_country] => US
[patent_app_date] => 1997-12-05
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 19
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[pdf_file] => patents/06/121/06121646.pdf
[firstpage_image] =>[orig_patent_app_number] => 913407
[rel_patent_id] =>[rel_patent_doc_number] =>) 08/913407 | Semiconductor integrated circuit | Dec 4, 1997 | Issued |
Array
(
[id] => 4152336
[patent_doc_number] => 06064117
[patent_country] => US
[patent_kind] => NA
[patent_issue_date] => 2000-05-16
[patent_title] => 'Plastic ball grid array assembly'
[patent_app_type] => 1
[patent_app_number] => 8/986275
[patent_app_country] => US
[patent_app_date] => 1997-12-05
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 5
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[patent_no_of_words] => 2039
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[patent_current_assignee] =>[type] => patent
[pdf_file] => patents/06/064/06064117.pdf
[firstpage_image] =>[orig_patent_app_number] => 986275
[rel_patent_id] =>[rel_patent_doc_number] =>) 08/986275 | Plastic ball grid array assembly | Dec 4, 1997 | Issued |
Array
(
[id] => 4253505
[patent_doc_number] => 06137166
[patent_country] => US
[patent_kind] => NA
[patent_issue_date] => 2000-10-24
[patent_title] => 'Semiconductor device'
[patent_app_type] => 1
[patent_app_number] => 8/984049
[patent_app_country] => US
[patent_app_date] => 1997-12-03
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 7
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[patent_no_of_words] => 5521
[patent_no_of_claims] => 16
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[pdf_file] => patents/06/137/06137166.pdf
[firstpage_image] =>[orig_patent_app_number] => 984049
[rel_patent_id] =>[rel_patent_doc_number] =>) 08/984049 | Semiconductor device | Dec 2, 1997 | Issued |
Array
(
[id] => 4137272
[patent_doc_number] => 06034421
[patent_country] => US
[patent_kind] => NA
[patent_issue_date] => 2000-03-07
[patent_title] => 'Semiconductor device including molded IC fixed to casing'
[patent_app_type] => 1
[patent_app_number] => 8/982034
[patent_app_country] => US
[patent_app_date] => 1997-12-01
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 7
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[patent_no_of_words] => 2899
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[pdf_file] => patents/06/034/06034421.pdf
[firstpage_image] =>[orig_patent_app_number] => 982034
[rel_patent_id] =>[rel_patent_doc_number] =>) 08/982034 | Semiconductor device including molded IC fixed to casing | Nov 30, 1997 | Issued |
Array
(
[id] => 4351191
[patent_doc_number] => 06285078
[patent_country] => US
[patent_kind] => NA
[patent_issue_date] => 2001-09-04
[patent_title] => 'Thermal spreader cap and grease containment structure for semiconductor device'
[patent_app_type] => 1
[patent_app_number] => 8/977557
[patent_app_country] => US
[patent_app_date] => 1997-11-25
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 4
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[patent_no_of_words] => 2650
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[patent_current_assignee] =>[type] => patent
[pdf_file] => patents/06/285/06285078.pdf
[firstpage_image] =>[orig_patent_app_number] => 977557
[rel_patent_id] =>[rel_patent_doc_number] =>) 08/977557 | Thermal spreader cap and grease containment structure for semiconductor device | Nov 24, 1997 | Issued |
Array
(
[id] => 4222769
[patent_doc_number] => 06087699
[patent_country] => US
[patent_kind] => NA
[patent_issue_date] => 2000-07-11
[patent_title] => 'Laminated gate mask ROM device'
[patent_app_type] => 1
[patent_app_number] => 8/978098
[patent_app_country] => US
[patent_app_date] => 1997-11-25
[patent_effective_date] => 0000-00-00
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[pdf_file] => patents/06/087/06087699.pdf
[firstpage_image] =>[orig_patent_app_number] => 978098
[rel_patent_id] =>[rel_patent_doc_number] =>) 08/978098 | Laminated gate mask ROM device | Nov 24, 1997 | Issued |
Array
(
[id] => 4091042
[patent_doc_number] => 06025647
[patent_country] => US
[patent_kind] => NA
[patent_issue_date] => 2000-02-15
[patent_title] => 'Apparatus for equalizing signal parameters in flip chip redistribution layers'
[patent_app_type] => 1
[patent_app_number] => 8/976564
[patent_app_country] => US
[patent_app_date] => 1997-11-24
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[pdf_file] => patents/06/025/06025647.pdf
[firstpage_image] =>[orig_patent_app_number] => 976564
[rel_patent_id] =>[rel_patent_doc_number] =>) 08/976564 | Apparatus for equalizing signal parameters in flip chip redistribution layers | Nov 23, 1997 | Issued |
Array
(
[id] => 4301422
[patent_doc_number] => 06184581
[patent_country] => US
[patent_kind] => NA
[patent_issue_date] => 2001-02-06
[patent_title] => 'Solder bump input/output pad for a surface mount circuit device'
[patent_app_type] => 1
[patent_app_number] => 8/977525
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[pdf_file] => patents/06/184/06184581.pdf
[firstpage_image] =>[orig_patent_app_number] => 977525
[rel_patent_id] =>[rel_patent_doc_number] =>) 08/977525 | Solder bump input/output pad for a surface mount circuit device | Nov 23, 1997 | Issued |
Array
(
[id] => 4038824
[patent_doc_number] => 05942798
[patent_country] => US
[patent_kind] => NA
[patent_issue_date] => 1999-08-24
[patent_title] => 'Apparatus and method for automating the underfill of flip-chip devices'
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[pdf_file] => patents/05/942/05942798.pdf
[firstpage_image] =>[orig_patent_app_number] => 977078
[rel_patent_id] =>[rel_patent_doc_number] =>) 08/977078 | Apparatus and method for automating the underfill of flip-chip devices | Nov 23, 1997 | Issued |
Array
(
[id] => 4424785
[patent_doc_number] => 06225686
[patent_country] => US
[patent_kind] => NA
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[patent_title] => 'Semiconductor device'
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Array
(
[id] => 4120219
[patent_doc_number] => 06046502
[patent_country] => US
[patent_kind] => NA
[patent_issue_date] => 2000-04-04
[patent_title] => 'Semiconductor device with improved adhesion between titanium-based metal layer and insulation film'
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[pdf_file] => patents/06/046/06046502.pdf
[firstpage_image] =>[orig_patent_app_number] => 969648
[rel_patent_id] =>[rel_patent_doc_number] =>) 08/969648 | Semiconductor device with improved adhesion between titanium-based metal layer and insulation film | Nov 12, 1997 | Issued |
Array
(
[id] => 3980789
[patent_doc_number] => 05905308
[patent_country] => US
[patent_kind] => NA
[patent_issue_date] => 1999-05-18
[patent_title] => 'Bond pad for integrated circuit'
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[patent_app_number] => 8/964517
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[firstpage_image] =>[orig_patent_app_number] => 964517
[rel_patent_id] =>[rel_patent_doc_number] =>) 08/964517 | Bond pad for integrated circuit | Nov 4, 1997 | Issued |
Array
(
[id] => 4102002
[patent_doc_number] => 06097087
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[patent_issue_date] => 2000-08-01
[patent_title] => 'Semiconductor package including flex circuit, interconnects and dense array external contacts'
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Array
(
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[firstpage_image] =>[orig_patent_app_number] => 959624
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Array
(
[id] => 3950686
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[patent_title] => 'Method and compositions for achieving a kinetically controlled solder bond'
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[pdf_file] => patents/05/990/05990560.pdf
[firstpage_image] =>[orig_patent_app_number] => 955686
[rel_patent_id] =>[rel_patent_doc_number] =>) 08/955686 | Method and compositions for achieving a kinetically controlled solder bond | Oct 21, 1997 | Issued |