Search

Roy Karl Potter

Examiner (ID: 13991, Phone: (571)272-1842 , Office: P/2822 )

Most Active Art Unit
2822
Art Unit(s)
2822, 2508, 2811, 3621
Total Applications
2584
Issued Applications
2409
Pending Applications
46
Abandoned Applications
141

Applications

Application numberTitle of the applicationFiling DateStatus
Array ( [id] => 4103330 [patent_doc_number] => 06049129 [patent_country] => US [patent_kind] => NA [patent_issue_date] => 2000-04-11 [patent_title] => 'Chip size integrated circuit package' [patent_app_type] => 1 [patent_app_number] => 8/994627 [patent_app_country] => US [patent_app_date] => 1997-12-19 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 2 [patent_figures_cnt] => 6 [patent_no_of_words] => 6001 [patent_no_of_claims] => 36 [patent_no_of_ind_claims] => 2 [patent_words_short_claim] => 129 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/06/049/06049129.pdf [firstpage_image] =>[orig_patent_app_number] => 994627 [rel_patent_id] =>[rel_patent_doc_number] =>)
08/994627
Chip size integrated circuit package Dec 18, 1997 Issued
Array ( [id] => 3985230 [patent_doc_number] => 05949135 [patent_country] => US [patent_kind] => NA [patent_issue_date] => 1999-09-07 [patent_title] => 'Module mounted with semiconductor device' [patent_app_type] => 1 [patent_app_number] => 8/991485 [patent_app_country] => US [patent_app_date] => 1997-12-16 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 10 [patent_figures_cnt] => 16 [patent_no_of_words] => 5803 [patent_no_of_claims] => 4 [patent_no_of_ind_claims] => 3 [patent_words_short_claim] => 136 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/05/949/05949135.pdf [firstpage_image] =>[orig_patent_app_number] => 991485 [rel_patent_id] =>[rel_patent_doc_number] =>)
08/991485
Module mounted with semiconductor device Dec 15, 1997 Issued
Array ( [id] => 4239362 [patent_doc_number] => 06075285 [patent_country] => US [patent_kind] => NA [patent_issue_date] => 2000-06-13 [patent_title] => 'Semiconductor package substrate with power die' [patent_app_type] => 1 [patent_app_number] => 8/990705 [patent_app_country] => US [patent_app_date] => 1997-12-15 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 6 [patent_figures_cnt] => 7 [patent_no_of_words] => 2880 [patent_no_of_claims] => 8 [patent_no_of_ind_claims] => 2 [patent_words_short_claim] => 348 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/06/075/06075285.pdf [firstpage_image] =>[orig_patent_app_number] => 990705 [rel_patent_id] =>[rel_patent_doc_number] =>)
08/990705
Semiconductor package substrate with power die Dec 14, 1997 Issued
Array ( [id] => 3961376 [patent_doc_number] => 05936304 [patent_country] => US [patent_kind] => NA [patent_issue_date] => 1999-08-10 [patent_title] => 'C4 package die backside coating' [patent_app_type] => 1 [patent_app_number] => 8/988506 [patent_app_country] => US [patent_app_date] => 1997-12-10 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 7 [patent_figures_cnt] => 17 [patent_no_of_words] => 2945 [patent_no_of_claims] => 28 [patent_no_of_ind_claims] => 4 [patent_words_short_claim] => 44 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/05/936/05936304.pdf [firstpage_image] =>[orig_patent_app_number] => 988506 [rel_patent_id] =>[rel_patent_doc_number] =>)
08/988506
C4 package die backside coating Dec 9, 1997 Issued
Array ( [id] => 4038401 [patent_doc_number] => 05994772 [patent_country] => US [patent_kind] => NA [patent_issue_date] => 1999-11-30 [patent_title] => 'Semiconductor package' [patent_app_type] => 1 [patent_app_number] => 8/986146 [patent_app_country] => US [patent_app_date] => 1997-12-08 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 7 [patent_figures_cnt] => 13 [patent_no_of_words] => 2285 [patent_no_of_claims] => 11 [patent_no_of_ind_claims] => 1 [patent_words_short_claim] => 95 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/05/994/05994772.pdf [firstpage_image] =>[orig_patent_app_number] => 986146 [rel_patent_id] =>[rel_patent_doc_number] =>)
08/986146
Semiconductor package Dec 7, 1997 Issued
Array ( [id] => 4139518 [patent_doc_number] => 06121646 [patent_country] => US [patent_kind] => NA [patent_issue_date] => 2000-09-19 [patent_title] => 'Semiconductor integrated circuit' [patent_app_type] => 1 [patent_app_number] => 8/913407 [patent_app_country] => US [patent_app_date] => 1997-12-05 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 19 [patent_figures_cnt] => 26 [patent_no_of_words] => 11833 [patent_no_of_claims] => 16 [patent_no_of_ind_claims] => 9 [patent_words_short_claim] => 112 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/06/121/06121646.pdf [firstpage_image] =>[orig_patent_app_number] => 913407 [rel_patent_id] =>[rel_patent_doc_number] =>)
08/913407
Semiconductor integrated circuit Dec 4, 1997 Issued
Array ( [id] => 4152336 [patent_doc_number] => 06064117 [patent_country] => US [patent_kind] => NA [patent_issue_date] => 2000-05-16 [patent_title] => 'Plastic ball grid array assembly' [patent_app_type] => 1 [patent_app_number] => 8/986275 [patent_app_country] => US [patent_app_date] => 1997-12-05 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 5 [patent_figures_cnt] => 9 [patent_no_of_words] => 2039 [patent_no_of_claims] => 10 [patent_no_of_ind_claims] => 3 [patent_words_short_claim] => 56 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/06/064/06064117.pdf [firstpage_image] =>[orig_patent_app_number] => 986275 [rel_patent_id] =>[rel_patent_doc_number] =>)
08/986275
Plastic ball grid array assembly Dec 4, 1997 Issued
Array ( [id] => 4253505 [patent_doc_number] => 06137166 [patent_country] => US [patent_kind] => NA [patent_issue_date] => 2000-10-24 [patent_title] => 'Semiconductor device' [patent_app_type] => 1 [patent_app_number] => 8/984049 [patent_app_country] => US [patent_app_date] => 1997-12-03 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 7 [patent_figures_cnt] => 17 [patent_no_of_words] => 5521 [patent_no_of_claims] => 16 [patent_no_of_ind_claims] => 7 [patent_words_short_claim] => 125 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/06/137/06137166.pdf [firstpage_image] =>[orig_patent_app_number] => 984049 [rel_patent_id] =>[rel_patent_doc_number] =>)
08/984049
Semiconductor device Dec 2, 1997 Issued
Array ( [id] => 4137272 [patent_doc_number] => 06034421 [patent_country] => US [patent_kind] => NA [patent_issue_date] => 2000-03-07 [patent_title] => 'Semiconductor device including molded IC fixed to casing' [patent_app_type] => 1 [patent_app_number] => 8/982034 [patent_app_country] => US [patent_app_date] => 1997-12-01 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 7 [patent_figures_cnt] => 9 [patent_no_of_words] => 2899 [patent_no_of_claims] => 25 [patent_no_of_ind_claims] => 3 [patent_words_short_claim] => 93 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/06/034/06034421.pdf [firstpage_image] =>[orig_patent_app_number] => 982034 [rel_patent_id] =>[rel_patent_doc_number] =>)
08/982034
Semiconductor device including molded IC fixed to casing Nov 30, 1997 Issued
Array ( [id] => 4351191 [patent_doc_number] => 06285078 [patent_country] => US [patent_kind] => NA [patent_issue_date] => 2001-09-04 [patent_title] => 'Thermal spreader cap and grease containment structure for semiconductor device' [patent_app_type] => 1 [patent_app_number] => 8/977557 [patent_app_country] => US [patent_app_date] => 1997-11-25 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 4 [patent_figures_cnt] => 4 [patent_no_of_words] => 2650 [patent_no_of_claims] => 21 [patent_no_of_ind_claims] => 3 [patent_words_short_claim] => 88 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/06/285/06285078.pdf [firstpage_image] =>[orig_patent_app_number] => 977557 [rel_patent_id] =>[rel_patent_doc_number] =>)
08/977557
Thermal spreader cap and grease containment structure for semiconductor device Nov 24, 1997 Issued
Array ( [id] => 4222769 [patent_doc_number] => 06087699 [patent_country] => US [patent_kind] => NA [patent_issue_date] => 2000-07-11 [patent_title] => 'Laminated gate mask ROM device' [patent_app_type] => 1 [patent_app_number] => 8/978098 [patent_app_country] => US [patent_app_date] => 1997-11-25 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 7 [patent_figures_cnt] => 15 [patent_no_of_words] => 3466 [patent_no_of_claims] => 21 [patent_no_of_ind_claims] => 3 [patent_words_short_claim] => 217 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/06/087/06087699.pdf [firstpage_image] =>[orig_patent_app_number] => 978098 [rel_patent_id] =>[rel_patent_doc_number] =>)
08/978098
Laminated gate mask ROM device Nov 24, 1997 Issued
Array ( [id] => 4091042 [patent_doc_number] => 06025647 [patent_country] => US [patent_kind] => NA [patent_issue_date] => 2000-02-15 [patent_title] => 'Apparatus for equalizing signal parameters in flip chip redistribution layers' [patent_app_type] => 1 [patent_app_number] => 8/976564 [patent_app_country] => US [patent_app_date] => 1997-11-24 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 9 [patent_figures_cnt] => 13 [patent_no_of_words] => 6301 [patent_no_of_claims] => 30 [patent_no_of_ind_claims] => 3 [patent_words_short_claim] => 191 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/06/025/06025647.pdf [firstpage_image] =>[orig_patent_app_number] => 976564 [rel_patent_id] =>[rel_patent_doc_number] =>)
08/976564
Apparatus for equalizing signal parameters in flip chip redistribution layers Nov 23, 1997 Issued
Array ( [id] => 4301422 [patent_doc_number] => 06184581 [patent_country] => US [patent_kind] => NA [patent_issue_date] => 2001-02-06 [patent_title] => 'Solder bump input/output pad for a surface mount circuit device' [patent_app_type] => 1 [patent_app_number] => 8/977525 [patent_app_country] => US [patent_app_date] => 1997-11-24 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 2 [patent_figures_cnt] => 6 [patent_no_of_words] => 3368 [patent_no_of_claims] => 11 [patent_no_of_ind_claims] => 1 [patent_words_short_claim] => 143 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/06/184/06184581.pdf [firstpage_image] =>[orig_patent_app_number] => 977525 [rel_patent_id] =>[rel_patent_doc_number] =>)
08/977525
Solder bump input/output pad for a surface mount circuit device Nov 23, 1997 Issued
Array ( [id] => 4038824 [patent_doc_number] => 05942798 [patent_country] => US [patent_kind] => NA [patent_issue_date] => 1999-08-24 [patent_title] => 'Apparatus and method for automating the underfill of flip-chip devices' [patent_app_type] => 1 [patent_app_number] => 8/977078 [patent_app_country] => US [patent_app_date] => 1997-11-24 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 3 [patent_figures_cnt] => 7 [patent_no_of_words] => 2572 [patent_no_of_claims] => 13 [patent_no_of_ind_claims] => 4 [patent_words_short_claim] => 45 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/05/942/05942798.pdf [firstpage_image] =>[orig_patent_app_number] => 977078 [rel_patent_id] =>[rel_patent_doc_number] =>)
08/977078
Apparatus and method for automating the underfill of flip-chip devices Nov 23, 1997 Issued
Array ( [id] => 4424785 [patent_doc_number] => 06225686 [patent_country] => US [patent_kind] => NA [patent_issue_date] => 2001-05-01 [patent_title] => 'Semiconductor device' [patent_app_type] => 1 [patent_app_number] => 8/974348 [patent_app_country] => US [patent_app_date] => 1997-11-19 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 11 [patent_figures_cnt] => 32 [patent_no_of_words] => 4615 [patent_no_of_claims] => 13 [patent_no_of_ind_claims] => 3 [patent_words_short_claim] => 185 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/06/225/06225686.pdf [firstpage_image] =>[orig_patent_app_number] => 974348 [rel_patent_id] =>[rel_patent_doc_number] =>)
08/974348
Semiconductor device Nov 18, 1997 Issued
Array ( [id] => 4120219 [patent_doc_number] => 06046502 [patent_country] => US [patent_kind] => NA [patent_issue_date] => 2000-04-04 [patent_title] => 'Semiconductor device with improved adhesion between titanium-based metal layer and insulation film' [patent_app_type] => 1 [patent_app_number] => 8/969648 [patent_app_country] => US [patent_app_date] => 1997-11-13 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 12 [patent_figures_cnt] => 34 [patent_no_of_words] => 10118 [patent_no_of_claims] => 9 [patent_no_of_ind_claims] => 3 [patent_words_short_claim] => 115 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/06/046/06046502.pdf [firstpage_image] =>[orig_patent_app_number] => 969648 [rel_patent_id] =>[rel_patent_doc_number] =>)
08/969648
Semiconductor device with improved adhesion between titanium-based metal layer and insulation film Nov 12, 1997 Issued
Array ( [id] => 3980789 [patent_doc_number] => 05905308 [patent_country] => US [patent_kind] => NA [patent_issue_date] => 1999-05-18 [patent_title] => 'Bond pad for integrated circuit' [patent_app_type] => 1 [patent_app_number] => 8/964517 [patent_app_country] => US [patent_app_date] => 1997-11-05 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 3 [patent_figures_cnt] => 6 [patent_no_of_words] => 2785 [patent_no_of_claims] => 18 [patent_no_of_ind_claims] => 2 [patent_words_short_claim] => 53 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/05/905/05905308.pdf [firstpage_image] =>[orig_patent_app_number] => 964517 [rel_patent_id] =>[rel_patent_doc_number] =>)
08/964517
Bond pad for integrated circuit Nov 4, 1997 Issued
Array ( [id] => 4102002 [patent_doc_number] => 06097087 [patent_country] => US [patent_kind] => NA [patent_issue_date] => 2000-08-01 [patent_title] => 'Semiconductor package including flex circuit, interconnects and dense array external contacts' [patent_app_type] => 1 [patent_app_number] => 8/961881 [patent_app_country] => US [patent_app_date] => 1997-10-31 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 4 [patent_figures_cnt] => 18 [patent_no_of_words] => 5273 [patent_no_of_claims] => 6 [patent_no_of_ind_claims] => 2 [patent_words_short_claim] => 137 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/06/097/06097087.pdf [firstpage_image] =>[orig_patent_app_number] => 961881 [rel_patent_id] =>[rel_patent_doc_number] =>)
08/961881
Semiconductor package including flex circuit, interconnects and dense array external contacts Oct 30, 1997 Issued
Array ( [id] => 4412036 [patent_doc_number] => 06172425 [patent_country] => US [patent_kind] => NA [patent_issue_date] => 2001-01-09 [patent_title] => 'Encapsulation of transmitter and receiver modules' [patent_app_type] => 1 [patent_app_number] => 8/959624 [patent_app_country] => US [patent_app_date] => 1997-10-28 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 3 [patent_figures_cnt] => 8 [patent_no_of_words] => 3834 [patent_no_of_claims] => 3 [patent_no_of_ind_claims] => 1 [patent_words_short_claim] => 353 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/06/172/06172425.pdf [firstpage_image] =>[orig_patent_app_number] => 959624 [rel_patent_id] =>[rel_patent_doc_number] =>)
08/959624
Encapsulation of transmitter and receiver modules Oct 27, 1997 Issued
Array ( [id] => 3950686 [patent_doc_number] => 05990560 [patent_country] => US [patent_kind] => NA [patent_issue_date] => 1999-11-23 [patent_title] => 'Method and compositions for achieving a kinetically controlled solder bond' [patent_app_type] => 1 [patent_app_number] => 8/955686 [patent_app_country] => US [patent_app_date] => 1997-10-22 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 6 [patent_figures_cnt] => 6 [patent_no_of_words] => 5990 [patent_no_of_claims] => 20 [patent_no_of_ind_claims] => 2 [patent_words_short_claim] => 138 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/05/990/05990560.pdf [firstpage_image] =>[orig_patent_app_number] => 955686 [rel_patent_id] =>[rel_patent_doc_number] =>)
08/955686
Method and compositions for achieving a kinetically controlled solder bond Oct 21, 1997 Issued
Menu