Search

Roy Karl Potter

Examiner (ID: 13991, Phone: (571)272-1842 , Office: P/2822 )

Most Active Art Unit
2822
Art Unit(s)
2822, 2508, 2811, 3621
Total Applications
2584
Issued Applications
2409
Pending Applications
46
Abandoned Applications
141

Applications

Application numberTitle of the applicationFiling DateStatus
Array ( [id] => 4148078 [patent_doc_number] => 06031278 [patent_country] => US [patent_kind] => NA [patent_issue_date] => 2000-02-29 [patent_title] => 'IC card and manufacturing method thereof' [patent_app_type] => 1 [patent_app_number] => 8/954732 [patent_app_country] => US [patent_app_date] => 1997-10-20 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 14 [patent_figures_cnt] => 30 [patent_no_of_words] => 9523 [patent_no_of_claims] => 16 [patent_no_of_ind_claims] => 4 [patent_words_short_claim] => 142 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/06/031/06031278.pdf [firstpage_image] =>[orig_patent_app_number] => 954732 [rel_patent_id] =>[rel_patent_doc_number] =>)
08/954732
IC card and manufacturing method thereof Oct 19, 1997 Issued
Array ( [id] => 3929602 [patent_doc_number] => 05945729 [patent_country] => US [patent_kind] => NA [patent_issue_date] => 1999-08-31 [patent_title] => 'Technique for attaching die to leads' [patent_app_type] => 1 [patent_app_number] => 8/948290 [patent_app_country] => US [patent_app_date] => 1997-10-10 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 5 [patent_figures_cnt] => 8 [patent_no_of_words] => 4503 [patent_no_of_claims] => 41 [patent_no_of_ind_claims] => 6 [patent_words_short_claim] => 117 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/05/945/05945729.pdf [firstpage_image] =>[orig_patent_app_number] => 948290 [rel_patent_id] =>[rel_patent_doc_number] =>)
08/948290
Technique for attaching die to leads Oct 9, 1997 Issued
Array ( [id] => 4361436 [patent_doc_number] => 06201304 [patent_country] => US [patent_kind] => NA [patent_issue_date] => 2001-03-13 [patent_title] => 'Flip chip adaptor package for bare die' [patent_app_type] => 1 [patent_app_number] => 8/948936 [patent_app_country] => US [patent_app_date] => 1997-10-10 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 3 [patent_figures_cnt] => 5 [patent_no_of_words] => 2808 [patent_no_of_claims] => 12 [patent_no_of_ind_claims] => 5 [patent_words_short_claim] => 121 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/06/201/06201304.pdf [firstpage_image] =>[orig_patent_app_number] => 948936 [rel_patent_id] =>[rel_patent_doc_number] =>)
08/948936
Flip chip adaptor package for bare die Oct 9, 1997 Issued
Array ( [id] => 4412025 [patent_doc_number] => 06172424 [patent_country] => US [patent_kind] => NA [patent_issue_date] => 2001-01-09 [patent_title] => 'Resin sealing type semiconductor device' [patent_app_type] => 1 [patent_app_number] => 8/947866 [patent_app_country] => US [patent_app_date] => 1997-10-09 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 10 [patent_figures_cnt] => 23 [patent_no_of_words] => 3860 [patent_no_of_claims] => 14 [patent_no_of_ind_claims] => 2 [patent_words_short_claim] => 98 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/06/172/06172424.pdf [firstpage_image] =>[orig_patent_app_number] => 947866 [rel_patent_id] =>[rel_patent_doc_number] =>)
08/947866
Resin sealing type semiconductor device Oct 8, 1997 Issued
Array ( [id] => 4180235 [patent_doc_number] => 06084305 [patent_country] => US [patent_kind] => NA [patent_issue_date] => 2000-07-04 [patent_title] => 'Shaped etch-front for self-aligned contact' [patent_app_type] => 1 [patent_app_number] => 8/944463 [patent_app_country] => US [patent_app_date] => 1997-10-06 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 7 [patent_figures_cnt] => 7 [patent_no_of_words] => 3423 [patent_no_of_claims] => 16 [patent_no_of_ind_claims] => 2 [patent_words_short_claim] => 203 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/06/084/06084305.pdf [firstpage_image] =>[orig_patent_app_number] => 944463 [rel_patent_id] =>[rel_patent_doc_number] =>)
08/944463
Shaped etch-front for self-aligned contact Oct 5, 1997 Issued
Array ( [id] => 4277379 [patent_doc_number] => 06246114 [patent_country] => US [patent_kind] => NA [patent_issue_date] => 2001-06-12 [patent_title] => 'Semiconductor device and resin film' [patent_app_type] => 1 [patent_app_number] => 8/944891 [patent_app_country] => US [patent_app_date] => 1997-10-06 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 20 [patent_figures_cnt] => 46 [patent_no_of_words] => 16568 [patent_no_of_claims] => 22 [patent_no_of_ind_claims] => 6 [patent_words_short_claim] => 123 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/06/246/06246114.pdf [firstpage_image] =>[orig_patent_app_number] => 944891 [rel_patent_id] =>[rel_patent_doc_number] =>)
08/944891
Semiconductor device and resin film Oct 5, 1997 Issued
Array ( [id] => 4191008 [patent_doc_number] => 06093963 [patent_country] => US [patent_kind] => NA [patent_issue_date] => 2000-07-25 [patent_title] => 'Dual landing pad structure including dielectric pocket' [patent_app_type] => 1 [patent_app_number] => 8/943382 [patent_app_country] => US [patent_app_date] => 1997-10-02 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 5 [patent_figures_cnt] => 12 [patent_no_of_words] => 5228 [patent_no_of_claims] => 20 [patent_no_of_ind_claims] => 3 [patent_words_short_claim] => 169 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/06/093/06093963.pdf [firstpage_image] =>[orig_patent_app_number] => 943382 [rel_patent_id] =>[rel_patent_doc_number] =>)
08/943382
Dual landing pad structure including dielectric pocket Oct 1, 1997 Issued
Array ( [id] => 4145504 [patent_doc_number] => 06060769 [patent_country] => US [patent_kind] => NA [patent_issue_date] => 2000-05-09 [patent_title] => 'Flip-chip on leads devices' [patent_app_type] => 1 [patent_app_number] => 8/940306 [patent_app_country] => US [patent_app_date] => 1997-09-30 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 3 [patent_figures_cnt] => 6 [patent_no_of_words] => 4517 [patent_no_of_claims] => 15 [patent_no_of_ind_claims] => 2 [patent_words_short_claim] => 209 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/06/060/06060769.pdf [firstpage_image] =>[orig_patent_app_number] => 940306 [rel_patent_id] =>[rel_patent_doc_number] =>)
08/940306
Flip-chip on leads devices Sep 29, 1997 Issued
Array ( [id] => 4163377 [patent_doc_number] => 06114750 [patent_country] => US [patent_kind] => NA [patent_issue_date] => 2000-09-05 [patent_title] => 'Surface mount TO-220 package and process for the manufacture thereof' [patent_app_type] => 1 [patent_app_number] => 8/940230 [patent_app_country] => US [patent_app_date] => 1997-09-30 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 4 [patent_figures_cnt] => 11 [patent_no_of_words] => 1625 [patent_no_of_claims] => 13 [patent_no_of_ind_claims] => 6 [patent_words_short_claim] => 137 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/06/114/06114750.pdf [firstpage_image] =>[orig_patent_app_number] => 940230 [rel_patent_id] =>[rel_patent_doc_number] =>)
08/940230
Surface mount TO-220 package and process for the manufacture thereof Sep 29, 1997 Issued
Array ( [id] => 3954186 [patent_doc_number] => 05977621 [patent_country] => US [patent_kind] => NA [patent_issue_date] => 1999-11-02 [patent_title] => 'Power semiconductor module' [patent_app_type] => 1 [patent_app_number] => 8/935110 [patent_app_country] => US [patent_app_date] => 1997-09-29 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 1 [patent_figures_cnt] => 2 [patent_no_of_words] => 1288 [patent_no_of_claims] => 18 [patent_no_of_ind_claims] => 3 [patent_words_short_claim] => 23 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/05/977/05977621.pdf [firstpage_image] =>[orig_patent_app_number] => 935110 [rel_patent_id] =>[rel_patent_doc_number] =>)
08/935110
Power semiconductor module Sep 28, 1997 Issued
Array ( [id] => 4244394 [patent_doc_number] => 06091139 [patent_country] => US [patent_kind] => NA [patent_issue_date] => 2000-07-18 [patent_title] => 'Semiconductor device' [patent_app_type] => 1 [patent_app_number] => 8/938998 [patent_app_country] => US [patent_app_date] => 1997-09-26 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 7 [patent_figures_cnt] => 12 [patent_no_of_words] => 4789 [patent_no_of_claims] => 10 [patent_no_of_ind_claims] => 2 [patent_words_short_claim] => 98 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/06/091/06091139.pdf [firstpage_image] =>[orig_patent_app_number] => 938998 [rel_patent_id] =>[rel_patent_doc_number] =>)
08/938998
Semiconductor device Sep 25, 1997 Issued
Array ( [id] => 4414314 [patent_doc_number] => 06265765 [patent_country] => US [patent_kind] => NA [patent_issue_date] => 2001-07-24 [patent_title] => 'Fan-out semiconductor chip assembly' [patent_app_type] => 1 [patent_app_number] => 8/935962 [patent_app_country] => US [patent_app_date] => 1997-09-23 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 6 [patent_figures_cnt] => 15 [patent_no_of_words] => 8634 [patent_no_of_claims] => 15 [patent_no_of_ind_claims] => 1 [patent_words_short_claim] => 210 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/06/265/06265765.pdf [firstpage_image] =>[orig_patent_app_number] => 935962 [rel_patent_id] =>[rel_patent_doc_number] =>)
08/935962
Fan-out semiconductor chip assembly Sep 22, 1997 Issued
Array ( [id] => 4244193 [patent_doc_number] => 06166434 [patent_country] => US [patent_kind] => NA [patent_issue_date] => 2000-12-26 [patent_title] => 'Die clip assembly for semiconductor package' [patent_app_type] => 1 [patent_app_number] => 8/935583 [patent_app_country] => US [patent_app_date] => 1997-09-23 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 3 [patent_figures_cnt] => 13 [patent_no_of_words] => 4576 [patent_no_of_claims] => 13 [patent_no_of_ind_claims] => 1 [patent_words_short_claim] => 249 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/06/166/06166434.pdf [firstpage_image] =>[orig_patent_app_number] => 935583 [rel_patent_id] =>[rel_patent_doc_number] =>)
08/935583
Die clip assembly for semiconductor package Sep 22, 1997 Issued
Array ( [id] => 3961159 [patent_doc_number] => 05936289 [patent_country] => US [patent_kind] => NA [patent_issue_date] => 1999-08-10 [patent_title] => 'Semiconductor device' [patent_app_type] => 1 [patent_app_number] => 8/935937 [patent_app_country] => US [patent_app_date] => 1997-09-23 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 17 [patent_figures_cnt] => 32 [patent_no_of_words] => 7696 [patent_no_of_claims] => 9 [patent_no_of_ind_claims] => 1 [patent_words_short_claim] => 111 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/05/936/05936289.pdf [firstpage_image] =>[orig_patent_app_number] => 935937 [rel_patent_id] =>[rel_patent_doc_number] =>)
08/935937
Semiconductor device Sep 22, 1997 Issued
Array ( [id] => 4090968 [patent_doc_number] => 06025642 [patent_country] => US [patent_kind] => NA [patent_issue_date] => 2000-02-15 [patent_title] => 'Ultra high density integrated circuit packages' [patent_app_type] => 1 [patent_app_number] => 8/937200 [patent_app_country] => US [patent_app_date] => 1997-09-22 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 25 [patent_figures_cnt] => 51 [patent_no_of_words] => 10598 [patent_no_of_claims] => 6 [patent_no_of_ind_claims] => 1 [patent_words_short_claim] => 147 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/06/025/06025642.pdf [firstpage_image] =>[orig_patent_app_number] => 937200 [rel_patent_id] =>[rel_patent_doc_number] =>)
08/937200
Ultra high density integrated circuit packages Sep 21, 1997 Issued
Array ( [id] => 4049429 [patent_doc_number] => 05912506 [patent_country] => US [patent_kind] => NA [patent_issue_date] => 1999-06-15 [patent_title] => 'Multi-layer metal sandwich with taper and reduced etch bias and method for forming same' [patent_app_type] => 1 [patent_app_number] => 8/937349 [patent_app_country] => US [patent_app_date] => 1997-09-20 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 3 [patent_figures_cnt] => 7 [patent_no_of_words] => 2470 [patent_no_of_claims] => 12 [patent_no_of_ind_claims] => 2 [patent_words_short_claim] => 100 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/05/912/05912506.pdf [firstpage_image] =>[orig_patent_app_number] => 937349 [rel_patent_id] =>[rel_patent_doc_number] =>)
08/937349
Multi-layer metal sandwich with taper and reduced etch bias and method for forming same Sep 19, 1997 Issued
Array ( [id] => 4067913 [patent_doc_number] => 05895965 [patent_country] => US [patent_kind] => NA [patent_issue_date] => 1999-04-20 [patent_title] => 'Semiconductor device' [patent_app_type] => 1 [patent_app_number] => 8/933056 [patent_app_country] => US [patent_app_date] => 1997-09-18 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 5 [patent_figures_cnt] => 12 [patent_no_of_words] => 6695 [patent_no_of_claims] => 3 [patent_no_of_ind_claims] => 3 [patent_words_short_claim] => 196 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/05/895/05895965.pdf [firstpage_image] =>[orig_patent_app_number] => 933056 [rel_patent_id] =>[rel_patent_doc_number] =>)
08/933056
Semiconductor device Sep 17, 1997 Issued
Array ( [id] => 4153786 [patent_doc_number] => 06103548 [patent_country] => US [patent_kind] => NA [patent_issue_date] => 2000-08-15 [patent_title] => 'Semiconductor device and method of manufacture' [patent_app_type] => 1 [patent_app_number] => 8/931982 [patent_app_country] => US [patent_app_date] => 1997-09-17 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 4 [patent_figures_cnt] => 6 [patent_no_of_words] => 5127 [patent_no_of_claims] => 9 [patent_no_of_ind_claims] => 2 [patent_words_short_claim] => 109 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/06/103/06103548.pdf [firstpage_image] =>[orig_patent_app_number] => 931982 [rel_patent_id] =>[rel_patent_doc_number] =>)
08/931982
Semiconductor device and method of manufacture Sep 16, 1997 Issued
Array ( [id] => 4253104 [patent_doc_number] => 06137137 [patent_country] => US [patent_kind] => NA [patent_issue_date] => 2000-10-24 [patent_title] => 'CMOS semiconductor device comprising graded N-LDD junctions with increased HCI lifetime' [patent_app_type] => 1 [patent_app_number] => 8/924644 [patent_app_country] => US [patent_app_date] => 1997-09-05 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 3 [patent_figures_cnt] => 4 [patent_no_of_words] => 3098 [patent_no_of_claims] => 11 [patent_no_of_ind_claims] => 1 [patent_words_short_claim] => 147 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/06/137/06137137.pdf [firstpage_image] =>[orig_patent_app_number] => 924644 [rel_patent_id] =>[rel_patent_doc_number] =>)
08/924644
CMOS semiconductor device comprising graded N-LDD junctions with increased HCI lifetime Sep 4, 1997 Issued
Array ( [id] => 4195279 [patent_doc_number] => 06153933 [patent_country] => US [patent_kind] => NA [patent_issue_date] => 2000-11-28 [patent_title] => 'Elimination of residual materials in a multiple-layer interconnect structure' [patent_app_type] => 1 [patent_app_number] => 8/925821 [patent_app_country] => US [patent_app_date] => 1997-09-05 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 4 [patent_figures_cnt] => 14 [patent_no_of_words] => 2674 [patent_no_of_claims] => 12 [patent_no_of_ind_claims] => 2 [patent_words_short_claim] => 118 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/06/153/06153933.pdf [firstpage_image] =>[orig_patent_app_number] => 925821 [rel_patent_id] =>[rel_patent_doc_number] =>)
08/925821
Elimination of residual materials in a multiple-layer interconnect structure Sep 4, 1997 Issued
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