Search

Roy Karl Potter

Examiner (ID: 13991, Phone: (571)272-1842 , Office: P/2822 )

Most Active Art Unit
2822
Art Unit(s)
2822, 2508, 2811, 3621
Total Applications
2584
Issued Applications
2409
Pending Applications
46
Abandoned Applications
141

Applications

Application numberTitle of the applicationFiling DateStatus
Array ( [id] => 4180310 [patent_doc_number] => 06084309 [patent_country] => US [patent_kind] => NA [patent_issue_date] => 2000-07-04 [patent_title] => 'Semiconductor device and semiconductor device mounting structure' [patent_app_type] => 1 [patent_app_number] => 8/889107 [patent_app_country] => US [patent_app_date] => 1997-07-07 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 39 [patent_figures_cnt] => 73 [patent_no_of_words] => 19736 [patent_no_of_claims] => 19 [patent_no_of_ind_claims] => 13 [patent_words_short_claim] => 115 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/06/084/06084309.pdf [firstpage_image] =>[orig_patent_app_number] => 889107 [rel_patent_id] =>[rel_patent_doc_number] =>)
08/889107
Semiconductor device and semiconductor device mounting structure Jul 6, 1997 Issued
Array ( [id] => 3909232 [patent_doc_number] => 05898213 [patent_country] => US [patent_kind] => NA [patent_issue_date] => 1999-04-27 [patent_title] => 'Semiconductor package bond post configuration' [patent_app_type] => 1 [patent_app_number] => 8/888392 [patent_app_country] => US [patent_app_date] => 1997-07-07 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 5 [patent_figures_cnt] => 7 [patent_no_of_words] => 3385 [patent_no_of_claims] => 21 [patent_no_of_ind_claims] => 3 [patent_words_short_claim] => 86 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/05/898/05898213.pdf [firstpage_image] =>[orig_patent_app_number] => 888392 [rel_patent_id] =>[rel_patent_doc_number] =>)
08/888392
Semiconductor package bond post configuration Jul 6, 1997 Issued
Array ( [id] => 4041728 [patent_doc_number] => 05856687 [patent_country] => US [patent_kind] => NA [patent_issue_date] => 1999-01-05 [patent_title] => 'Semiconductor device with connected source electrode pads at diagonal corners' [patent_app_type] => 1 [patent_app_number] => 8/889052 [patent_app_country] => US [patent_app_date] => 1997-07-07 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 5 [patent_figures_cnt] => 5 [patent_no_of_words] => 2006 [patent_no_of_claims] => 9 [patent_no_of_ind_claims] => 1 [patent_words_short_claim] => 92 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/05/856/05856687.pdf [firstpage_image] =>[orig_patent_app_number] => 889052 [rel_patent_id] =>[rel_patent_doc_number] =>)
08/889052
Semiconductor device with connected source electrode pads at diagonal corners Jul 6, 1997 Issued
Array ( [id] => 4277261 [patent_doc_number] => 06246106 [patent_country] => US [patent_kind] => NA [patent_issue_date] => 2001-06-12 [patent_title] => 'Lead frame' [patent_app_type] => 1 [patent_app_number] => 8/886976 [patent_app_country] => US [patent_app_date] => 1997-07-03 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 2 [patent_figures_cnt] => 3 [patent_no_of_words] => 1638 [patent_no_of_claims] => 2 [patent_no_of_ind_claims] => 2 [patent_words_short_claim] => 95 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/06/246/06246106.pdf [firstpage_image] =>[orig_patent_app_number] => 886976 [rel_patent_id] =>[rel_patent_doc_number] =>)
08/886976
Lead frame Jul 2, 1997 Issued
Array ( [id] => 3954740 [patent_doc_number] => 05955777 [patent_country] => US [patent_kind] => NA [patent_issue_date] => 1999-09-21 [patent_title] => 'Lead frame assemblies with voltage reference plane and IC packages including same' [patent_app_type] => 1 [patent_app_number] => 8/888336 [patent_app_country] => US [patent_app_date] => 1997-07-02 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 2 [patent_figures_cnt] => 6 [patent_no_of_words] => 4446 [patent_no_of_claims] => 88 [patent_no_of_ind_claims] => 4 [patent_words_short_claim] => 107 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/05/955/05955777.pdf [firstpage_image] =>[orig_patent_app_number] => 888336 [rel_patent_id] =>[rel_patent_doc_number] =>)
08/888336
Lead frame assemblies with voltage reference plane and IC packages including same Jul 1, 1997 Issued
Array ( [id] => 3964667 [patent_doc_number] => 05900669 [patent_country] => US [patent_kind] => NA [patent_issue_date] => 1999-05-04 [patent_title] => 'Semiconductor component' [patent_app_type] => 1 [patent_app_number] => 8/886100 [patent_app_country] => US [patent_app_date] => 1997-06-30 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 2 [patent_figures_cnt] => 3 [patent_no_of_words] => 1764 [patent_no_of_claims] => 14 [patent_no_of_ind_claims] => 2 [patent_words_short_claim] => 44 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/05/900/05900669.pdf [firstpage_image] =>[orig_patent_app_number] => 886100 [rel_patent_id] =>[rel_patent_doc_number] =>)
08/886100
Semiconductor component Jun 29, 1997 Issued
Array ( [id] => 4239274 [patent_doc_number] => 06075279 [patent_country] => US [patent_kind] => NA [patent_issue_date] => 2000-06-13 [patent_title] => 'Semiconductor device' [patent_app_type] => 1 [patent_app_number] => 8/881356 [patent_app_country] => US [patent_app_date] => 1997-06-24 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 17 [patent_figures_cnt] => 19 [patent_no_of_words] => 9331 [patent_no_of_claims] => 17 [patent_no_of_ind_claims] => 5 [patent_words_short_claim] => 157 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/06/075/06075279.pdf [firstpage_image] =>[orig_patent_app_number] => 881356 [rel_patent_id] =>[rel_patent_doc_number] =>)
08/881356
Semiconductor device Jun 23, 1997 Issued
Array ( [id] => 4070735 [patent_doc_number] => 06008536 [patent_country] => US [patent_kind] => NA [patent_issue_date] => 1999-12-28 [patent_title] => 'Grid array device package including advanced heat transfer mechanisms' [patent_app_type] => 1 [patent_app_number] => 8/880784 [patent_app_country] => US [patent_app_date] => 1997-06-23 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 3 [patent_figures_cnt] => 4 [patent_no_of_words] => 5161 [patent_no_of_claims] => 16 [patent_no_of_ind_claims] => 2 [patent_words_short_claim] => 119 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/06/008/06008536.pdf [firstpage_image] =>[orig_patent_app_number] => 880784 [rel_patent_id] =>[rel_patent_doc_number] =>)
08/880784
Grid array device package including advanced heat transfer mechanisms Jun 22, 1997 Issued
Array ( [id] => 3998518 [patent_doc_number] => 05892277 [patent_country] => US [patent_kind] => NA [patent_issue_date] => 1999-04-06 [patent_title] => 'Tab tape and semiconductor device using the tab tape' [patent_app_type] => 1 [patent_app_number] => 8/879304 [patent_app_country] => US [patent_app_date] => 1997-06-19 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 4 [patent_figures_cnt] => 10 [patent_no_of_words] => 1691 [patent_no_of_claims] => 11 [patent_no_of_ind_claims] => 3 [patent_words_short_claim] => 59 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/05/892/05892277.pdf [firstpage_image] =>[orig_patent_app_number] => 879304 [rel_patent_id] =>[rel_patent_doc_number] =>)
08/879304
Tab tape and semiconductor device using the tab tape Jun 18, 1997 Issued
Array ( [id] => 3939133 [patent_doc_number] => 05939774 [patent_country] => US [patent_kind] => NA [patent_issue_date] => 1999-08-17 [patent_title] => 'Semiconductor lead frame' [patent_app_type] => 1 [patent_app_number] => 8/877348 [patent_app_country] => US [patent_app_date] => 1997-06-17 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 8 [patent_figures_cnt] => 31 [patent_no_of_words] => 8748 [patent_no_of_claims] => 3 [patent_no_of_ind_claims] => 1 [patent_words_short_claim] => 174 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/05/939/05939774.pdf [firstpage_image] =>[orig_patent_app_number] => 877348 [rel_patent_id] =>[rel_patent_doc_number] =>)
08/877348
Semiconductor lead frame Jun 16, 1997 Issued
Array ( [id] => 4013627 [patent_doc_number] => 05889321 [patent_country] => US [patent_kind] => NA [patent_issue_date] => 1999-03-30 [patent_title] => 'Stiffeners with improved adhesion to flexible substrates' [patent_app_type] => 1 [patent_app_number] => 8/877538 [patent_app_country] => US [patent_app_date] => 1997-06-17 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 3 [patent_figures_cnt] => 15 [patent_no_of_words] => 2942 [patent_no_of_claims] => 7 [patent_no_of_ind_claims] => 5 [patent_words_short_claim] => 91 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/05/889/05889321.pdf [firstpage_image] =>[orig_patent_app_number] => 877538 [rel_patent_id] =>[rel_patent_doc_number] =>)
08/877538
Stiffeners with improved adhesion to flexible substrates Jun 16, 1997 Issued
Array ( [id] => 3990400 [patent_doc_number] => 05910682 [patent_country] => US [patent_kind] => NA [patent_issue_date] => 1999-06-08 [patent_title] => 'Semiconductor chip stack package' [patent_app_type] => 1 [patent_app_number] => 8/876436 [patent_app_country] => US [patent_app_date] => 1997-06-16 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 4 [patent_figures_cnt] => 11 [patent_no_of_words] => 1731 [patent_no_of_claims] => 19 [patent_no_of_ind_claims] => 3 [patent_words_short_claim] => 119 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/05/910/05910682.pdf [firstpage_image] =>[orig_patent_app_number] => 876436 [rel_patent_id] =>[rel_patent_doc_number] =>)
08/876436
Semiconductor chip stack package Jun 15, 1997 Issued
Array ( [id] => 4161405 [patent_doc_number] => 06107675 [patent_country] => US [patent_kind] => NA [patent_issue_date] => 2000-08-22 [patent_title] => 'Lead frame' [patent_app_type] => 1 [patent_app_number] => 8/873704 [patent_app_country] => US [patent_app_date] => 1997-06-12 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 13 [patent_figures_cnt] => 17 [patent_no_of_words] => 6279 [patent_no_of_claims] => 22 [patent_no_of_ind_claims] => 7 [patent_words_short_claim] => 89 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/06/107/06107675.pdf [firstpage_image] =>[orig_patent_app_number] => 873704 [rel_patent_id] =>[rel_patent_doc_number] =>)
08/873704
Lead frame Jun 11, 1997 Issued
Array ( [id] => 3980723 [patent_doc_number] => 05905303 [patent_country] => US [patent_kind] => NA [patent_issue_date] => 1999-05-18 [patent_title] => 'Method for manufacturing bump leaded film carrier type semiconductor device' [patent_app_type] => 1 [patent_app_number] => 8/873593 [patent_app_country] => US [patent_app_date] => 1997-06-12 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 22 [patent_figures_cnt] => 52 [patent_no_of_words] => 6247 [patent_no_of_claims] => 23 [patent_no_of_ind_claims] => 6 [patent_words_short_claim] => 96 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/05/905/05905303.pdf [firstpage_image] =>[orig_patent_app_number] => 873593 [rel_patent_id] =>[rel_patent_doc_number] =>)
08/873593
Method for manufacturing bump leaded film carrier type semiconductor device Jun 11, 1997 Issued
Array ( [id] => 4049089 [patent_doc_number] => 05874778 [patent_country] => US [patent_kind] => NA [patent_issue_date] => 1999-02-23 [patent_title] => 'Embedded power and ground plane structure' [patent_app_type] => 1 [patent_app_number] => 8/873102 [patent_app_country] => US [patent_app_date] => 1997-06-11 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 5 [patent_figures_cnt] => 13 [patent_no_of_words] => 3701 [patent_no_of_claims] => 18 [patent_no_of_ind_claims] => 4 [patent_words_short_claim] => 13 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/05/874/05874778.pdf [firstpage_image] =>[orig_patent_app_number] => 873102 [rel_patent_id] =>[rel_patent_doc_number] =>)
08/873102
Embedded power and ground plane structure Jun 10, 1997 Issued
Array ( [id] => 3767054 [patent_doc_number] => 05844316 [patent_country] => US [patent_kind] => NA [patent_issue_date] => 1998-12-01 [patent_title] => 'Fixture for handling and attaching conductive spheres to a substrate' [patent_app_type] => 1 [patent_app_number] => 8/873312 [patent_app_country] => US [patent_app_date] => 1997-06-11 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 3 [patent_figures_cnt] => 9 [patent_no_of_words] => 1807 [patent_no_of_claims] => 2 [patent_no_of_ind_claims] => 1 [patent_words_short_claim] => 78 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/05/844/05844316.pdf [firstpage_image] =>[orig_patent_app_number] => 873312 [rel_patent_id] =>[rel_patent_doc_number] =>)
08/873312
Fixture for handling and attaching conductive spheres to a substrate Jun 10, 1997 Issued
Array ( [id] => 4095068 [patent_doc_number] => 06133631 [patent_country] => US [patent_kind] => NA [patent_issue_date] => 2000-10-17 [patent_title] => 'Semiconductor package lid with internal heat pipe' [patent_app_type] => 1 [patent_app_number] => 8/866898 [patent_app_country] => US [patent_app_date] => 1997-05-30 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 4 [patent_figures_cnt] => 8 [patent_no_of_words] => 2380 [patent_no_of_claims] => 2 [patent_no_of_ind_claims] => 2 [patent_words_short_claim] => 91 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/06/133/06133631.pdf [firstpage_image] =>[orig_patent_app_number] => 866898 [rel_patent_id] =>[rel_patent_doc_number] =>)
08/866898
Semiconductor package lid with internal heat pipe May 29, 1997 Issued
Array ( [id] => 3947719 [patent_doc_number] => 05982025 [patent_country] => US [patent_kind] => NA [patent_issue_date] => 1999-11-09 [patent_title] => 'Wire fixation structure' [patent_app_type] => 1 [patent_app_number] => 8/864828 [patent_app_country] => US [patent_app_date] => 1997-05-29 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 10 [patent_figures_cnt] => 27 [patent_no_of_words] => 4187 [patent_no_of_claims] => 17 [patent_no_of_ind_claims] => 5 [patent_words_short_claim] => 60 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/05/982/05982025.pdf [firstpage_image] =>[orig_patent_app_number] => 864828 [rel_patent_id] =>[rel_patent_doc_number] =>)
08/864828
Wire fixation structure May 28, 1997 Issued
Array ( [id] => 4176915 [patent_doc_number] => 06140702 [patent_country] => US [patent_kind] => NA [patent_issue_date] => 2000-10-31 [patent_title] => 'Plastic encapsulation for integrated circuits having plated copper top surface level interconnect' [patent_app_type] => 1 [patent_app_number] => 8/864386 [patent_app_country] => US [patent_app_date] => 1997-05-28 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 1 [patent_figures_cnt] => 3 [patent_no_of_words] => 3366 [patent_no_of_claims] => 12 [patent_no_of_ind_claims] => 1 [patent_words_short_claim] => 75 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/06/140/06140702.pdf [firstpage_image] =>[orig_patent_app_number] => 864386 [rel_patent_id] =>[rel_patent_doc_number] =>)
08/864386
Plastic encapsulation for integrated circuits having plated copper top surface level interconnect May 27, 1997 Issued
Array ( [id] => 4102027 [patent_doc_number] => 06097088 [patent_country] => US [patent_kind] => NA [patent_issue_date] => 2000-08-01 [patent_title] => 'Thermoelectric element and cooling or heating device provided with the same' [patent_app_type] => 1 [patent_app_number] => 8/836746 [patent_app_country] => US [patent_app_date] => 1997-05-21 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 7 [patent_figures_cnt] => 27 [patent_no_of_words] => 5356 [patent_no_of_claims] => 12 [patent_no_of_ind_claims] => 7 [patent_words_short_claim] => 37 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/06/097/06097088.pdf [firstpage_image] =>[orig_patent_app_number] => 836746 [rel_patent_id] =>[rel_patent_doc_number] =>)
08/836746
Thermoelectric element and cooling or heating device provided with the same May 20, 1997 Issued
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