
Roy Karl Potter
Examiner (ID: 13991, Phone: (571)272-1842 , Office: P/2822 )
| Most Active Art Unit | 2822 |
| Art Unit(s) | 2822, 2508, 2811, 3621 |
| Total Applications | 2584 |
| Issued Applications | 2409 |
| Pending Applications | 46 |
| Abandoned Applications | 141 |
Applications
| Application number | Title of the application | Filing Date | Status |
|---|---|---|---|
Array
(
[id] => 4180310
[patent_doc_number] => 06084309
[patent_country] => US
[patent_kind] => NA
[patent_issue_date] => 2000-07-04
[patent_title] => 'Semiconductor device and semiconductor device mounting structure'
[patent_app_type] => 1
[patent_app_number] => 8/889107
[patent_app_country] => US
[patent_app_date] => 1997-07-07
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 39
[patent_figures_cnt] => 73
[patent_no_of_words] => 19736
[patent_no_of_claims] => 19
[patent_no_of_ind_claims] => 13
[patent_words_short_claim] => 115
[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => patent
[pdf_file] => patents/06/084/06084309.pdf
[firstpage_image] =>[orig_patent_app_number] => 889107
[rel_patent_id] =>[rel_patent_doc_number] =>) 08/889107 | Semiconductor device and semiconductor device mounting structure | Jul 6, 1997 | Issued |
Array
(
[id] => 3909232
[patent_doc_number] => 05898213
[patent_country] => US
[patent_kind] => NA
[patent_issue_date] => 1999-04-27
[patent_title] => 'Semiconductor package bond post configuration'
[patent_app_type] => 1
[patent_app_number] => 8/888392
[patent_app_country] => US
[patent_app_date] => 1997-07-07
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 5
[patent_figures_cnt] => 7
[patent_no_of_words] => 3385
[patent_no_of_claims] => 21
[patent_no_of_ind_claims] => 3
[patent_words_short_claim] => 86
[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => patent
[pdf_file] => patents/05/898/05898213.pdf
[firstpage_image] =>[orig_patent_app_number] => 888392
[rel_patent_id] =>[rel_patent_doc_number] =>) 08/888392 | Semiconductor package bond post configuration | Jul 6, 1997 | Issued |
Array
(
[id] => 4041728
[patent_doc_number] => 05856687
[patent_country] => US
[patent_kind] => NA
[patent_issue_date] => 1999-01-05
[patent_title] => 'Semiconductor device with connected source electrode pads at diagonal corners'
[patent_app_type] => 1
[patent_app_number] => 8/889052
[patent_app_country] => US
[patent_app_date] => 1997-07-07
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 5
[patent_figures_cnt] => 5
[patent_no_of_words] => 2006
[patent_no_of_claims] => 9
[patent_no_of_ind_claims] => 1
[patent_words_short_claim] => 92
[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => patent
[pdf_file] => patents/05/856/05856687.pdf
[firstpage_image] =>[orig_patent_app_number] => 889052
[rel_patent_id] =>[rel_patent_doc_number] =>) 08/889052 | Semiconductor device with connected source electrode pads at diagonal corners | Jul 6, 1997 | Issued |
Array
(
[id] => 4277261
[patent_doc_number] => 06246106
[patent_country] => US
[patent_kind] => NA
[patent_issue_date] => 2001-06-12
[patent_title] => 'Lead frame'
[patent_app_type] => 1
[patent_app_number] => 8/886976
[patent_app_country] => US
[patent_app_date] => 1997-07-03
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 2
[patent_figures_cnt] => 3
[patent_no_of_words] => 1638
[patent_no_of_claims] => 2
[patent_no_of_ind_claims] => 2
[patent_words_short_claim] => 95
[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => patent
[pdf_file] => patents/06/246/06246106.pdf
[firstpage_image] =>[orig_patent_app_number] => 886976
[rel_patent_id] =>[rel_patent_doc_number] =>) 08/886976 | Lead frame | Jul 2, 1997 | Issued |
Array
(
[id] => 3954740
[patent_doc_number] => 05955777
[patent_country] => US
[patent_kind] => NA
[patent_issue_date] => 1999-09-21
[patent_title] => 'Lead frame assemblies with voltage reference plane and IC packages including same'
[patent_app_type] => 1
[patent_app_number] => 8/888336
[patent_app_country] => US
[patent_app_date] => 1997-07-02
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 2
[patent_figures_cnt] => 6
[patent_no_of_words] => 4446
[patent_no_of_claims] => 88
[patent_no_of_ind_claims] => 4
[patent_words_short_claim] => 107
[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => patent
[pdf_file] => patents/05/955/05955777.pdf
[firstpage_image] =>[orig_patent_app_number] => 888336
[rel_patent_id] =>[rel_patent_doc_number] =>) 08/888336 | Lead frame assemblies with voltage reference plane and IC packages including same | Jul 1, 1997 | Issued |
Array
(
[id] => 3964667
[patent_doc_number] => 05900669
[patent_country] => US
[patent_kind] => NA
[patent_issue_date] => 1999-05-04
[patent_title] => 'Semiconductor component'
[patent_app_type] => 1
[patent_app_number] => 8/886100
[patent_app_country] => US
[patent_app_date] => 1997-06-30
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 2
[patent_figures_cnt] => 3
[patent_no_of_words] => 1764
[patent_no_of_claims] => 14
[patent_no_of_ind_claims] => 2
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[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => patent
[pdf_file] => patents/05/900/05900669.pdf
[firstpage_image] =>[orig_patent_app_number] => 886100
[rel_patent_id] =>[rel_patent_doc_number] =>) 08/886100 | Semiconductor component | Jun 29, 1997 | Issued |
Array
(
[id] => 4239274
[patent_doc_number] => 06075279
[patent_country] => US
[patent_kind] => NA
[patent_issue_date] => 2000-06-13
[patent_title] => 'Semiconductor device'
[patent_app_type] => 1
[patent_app_number] => 8/881356
[patent_app_country] => US
[patent_app_date] => 1997-06-24
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 17
[patent_figures_cnt] => 19
[patent_no_of_words] => 9331
[patent_no_of_claims] => 17
[patent_no_of_ind_claims] => 5
[patent_words_short_claim] => 157
[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => patent
[pdf_file] => patents/06/075/06075279.pdf
[firstpage_image] =>[orig_patent_app_number] => 881356
[rel_patent_id] =>[rel_patent_doc_number] =>) 08/881356 | Semiconductor device | Jun 23, 1997 | Issued |
Array
(
[id] => 4070735
[patent_doc_number] => 06008536
[patent_country] => US
[patent_kind] => NA
[patent_issue_date] => 1999-12-28
[patent_title] => 'Grid array device package including advanced heat transfer mechanisms'
[patent_app_type] => 1
[patent_app_number] => 8/880784
[patent_app_country] => US
[patent_app_date] => 1997-06-23
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 3
[patent_figures_cnt] => 4
[patent_no_of_words] => 5161
[patent_no_of_claims] => 16
[patent_no_of_ind_claims] => 2
[patent_words_short_claim] => 119
[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => patent
[pdf_file] => patents/06/008/06008536.pdf
[firstpage_image] =>[orig_patent_app_number] => 880784
[rel_patent_id] =>[rel_patent_doc_number] =>) 08/880784 | Grid array device package including advanced heat transfer mechanisms | Jun 22, 1997 | Issued |
Array
(
[id] => 3998518
[patent_doc_number] => 05892277
[patent_country] => US
[patent_kind] => NA
[patent_issue_date] => 1999-04-06
[patent_title] => 'Tab tape and semiconductor device using the tab tape'
[patent_app_type] => 1
[patent_app_number] => 8/879304
[patent_app_country] => US
[patent_app_date] => 1997-06-19
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 4
[patent_figures_cnt] => 10
[patent_no_of_words] => 1691
[patent_no_of_claims] => 11
[patent_no_of_ind_claims] => 3
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[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => patent
[pdf_file] => patents/05/892/05892277.pdf
[firstpage_image] =>[orig_patent_app_number] => 879304
[rel_patent_id] =>[rel_patent_doc_number] =>) 08/879304 | Tab tape and semiconductor device using the tab tape | Jun 18, 1997 | Issued |
Array
(
[id] => 3939133
[patent_doc_number] => 05939774
[patent_country] => US
[patent_kind] => NA
[patent_issue_date] => 1999-08-17
[patent_title] => 'Semiconductor lead frame'
[patent_app_type] => 1
[patent_app_number] => 8/877348
[patent_app_country] => US
[patent_app_date] => 1997-06-17
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 8
[patent_figures_cnt] => 31
[patent_no_of_words] => 8748
[patent_no_of_claims] => 3
[patent_no_of_ind_claims] => 1
[patent_words_short_claim] => 174
[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => patent
[pdf_file] => patents/05/939/05939774.pdf
[firstpage_image] =>[orig_patent_app_number] => 877348
[rel_patent_id] =>[rel_patent_doc_number] =>) 08/877348 | Semiconductor lead frame | Jun 16, 1997 | Issued |
Array
(
[id] => 4013627
[patent_doc_number] => 05889321
[patent_country] => US
[patent_kind] => NA
[patent_issue_date] => 1999-03-30
[patent_title] => 'Stiffeners with improved adhesion to flexible substrates'
[patent_app_type] => 1
[patent_app_number] => 8/877538
[patent_app_country] => US
[patent_app_date] => 1997-06-17
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 3
[patent_figures_cnt] => 15
[patent_no_of_words] => 2942
[patent_no_of_claims] => 7
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[patent_current_assignee] =>[type] => patent
[pdf_file] => patents/05/889/05889321.pdf
[firstpage_image] =>[orig_patent_app_number] => 877538
[rel_patent_id] =>[rel_patent_doc_number] =>) 08/877538 | Stiffeners with improved adhesion to flexible substrates | Jun 16, 1997 | Issued |
Array
(
[id] => 3990400
[patent_doc_number] => 05910682
[patent_country] => US
[patent_kind] => NA
[patent_issue_date] => 1999-06-08
[patent_title] => 'Semiconductor chip stack package'
[patent_app_type] => 1
[patent_app_number] => 8/876436
[patent_app_country] => US
[patent_app_date] => 1997-06-16
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 4
[patent_figures_cnt] => 11
[patent_no_of_words] => 1731
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[patent_current_assignee] =>[type] => patent
[pdf_file] => patents/05/910/05910682.pdf
[firstpage_image] =>[orig_patent_app_number] => 876436
[rel_patent_id] =>[rel_patent_doc_number] =>) 08/876436 | Semiconductor chip stack package | Jun 15, 1997 | Issued |
Array
(
[id] => 4161405
[patent_doc_number] => 06107675
[patent_country] => US
[patent_kind] => NA
[patent_issue_date] => 2000-08-22
[patent_title] => 'Lead frame'
[patent_app_type] => 1
[patent_app_number] => 8/873704
[patent_app_country] => US
[patent_app_date] => 1997-06-12
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 13
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[pdf_file] => patents/06/107/06107675.pdf
[firstpage_image] =>[orig_patent_app_number] => 873704
[rel_patent_id] =>[rel_patent_doc_number] =>) 08/873704 | Lead frame | Jun 11, 1997 | Issued |
Array
(
[id] => 3980723
[patent_doc_number] => 05905303
[patent_country] => US
[patent_kind] => NA
[patent_issue_date] => 1999-05-18
[patent_title] => 'Method for manufacturing bump leaded film carrier type semiconductor device'
[patent_app_type] => 1
[patent_app_number] => 8/873593
[patent_app_country] => US
[patent_app_date] => 1997-06-12
[patent_effective_date] => 0000-00-00
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[patent_current_assignee] =>[type] => patent
[pdf_file] => patents/05/905/05905303.pdf
[firstpage_image] =>[orig_patent_app_number] => 873593
[rel_patent_id] =>[rel_patent_doc_number] =>) 08/873593 | Method for manufacturing bump leaded film carrier type semiconductor device | Jun 11, 1997 | Issued |
Array
(
[id] => 4049089
[patent_doc_number] => 05874778
[patent_country] => US
[patent_kind] => NA
[patent_issue_date] => 1999-02-23
[patent_title] => 'Embedded power and ground plane structure'
[patent_app_type] => 1
[patent_app_number] => 8/873102
[patent_app_country] => US
[patent_app_date] => 1997-06-11
[patent_effective_date] => 0000-00-00
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[pdf_file] => patents/05/874/05874778.pdf
[firstpage_image] =>[orig_patent_app_number] => 873102
[rel_patent_id] =>[rel_patent_doc_number] =>) 08/873102 | Embedded power and ground plane structure | Jun 10, 1997 | Issued |
Array
(
[id] => 3767054
[patent_doc_number] => 05844316
[patent_country] => US
[patent_kind] => NA
[patent_issue_date] => 1998-12-01
[patent_title] => 'Fixture for handling and attaching conductive spheres to a substrate'
[patent_app_type] => 1
[patent_app_number] => 8/873312
[patent_app_country] => US
[patent_app_date] => 1997-06-11
[patent_effective_date] => 0000-00-00
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[pdf_file] => patents/05/844/05844316.pdf
[firstpage_image] =>[orig_patent_app_number] => 873312
[rel_patent_id] =>[rel_patent_doc_number] =>) 08/873312 | Fixture for handling and attaching conductive spheres to a substrate | Jun 10, 1997 | Issued |
Array
(
[id] => 4095068
[patent_doc_number] => 06133631
[patent_country] => US
[patent_kind] => NA
[patent_issue_date] => 2000-10-17
[patent_title] => 'Semiconductor package lid with internal heat pipe'
[patent_app_type] => 1
[patent_app_number] => 8/866898
[patent_app_country] => US
[patent_app_date] => 1997-05-30
[patent_effective_date] => 0000-00-00
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[pdf_file] => patents/06/133/06133631.pdf
[firstpage_image] =>[orig_patent_app_number] => 866898
[rel_patent_id] =>[rel_patent_doc_number] =>) 08/866898 | Semiconductor package lid with internal heat pipe | May 29, 1997 | Issued |
Array
(
[id] => 3947719
[patent_doc_number] => 05982025
[patent_country] => US
[patent_kind] => NA
[patent_issue_date] => 1999-11-09
[patent_title] => 'Wire fixation structure'
[patent_app_type] => 1
[patent_app_number] => 8/864828
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[pdf_file] => patents/05/982/05982025.pdf
[firstpage_image] =>[orig_patent_app_number] => 864828
[rel_patent_id] =>[rel_patent_doc_number] =>) 08/864828 | Wire fixation structure | May 28, 1997 | Issued |
Array
(
[id] => 4176915
[patent_doc_number] => 06140702
[patent_country] => US
[patent_kind] => NA
[patent_issue_date] => 2000-10-31
[patent_title] => 'Plastic encapsulation for integrated circuits having plated copper top surface level interconnect'
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[patent_app_number] => 8/864386
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[pdf_file] => patents/06/140/06140702.pdf
[firstpage_image] =>[orig_patent_app_number] => 864386
[rel_patent_id] =>[rel_patent_doc_number] =>) 08/864386 | Plastic encapsulation for integrated circuits having plated copper top surface level interconnect | May 27, 1997 | Issued |
Array
(
[id] => 4102027
[patent_doc_number] => 06097088
[patent_country] => US
[patent_kind] => NA
[patent_issue_date] => 2000-08-01
[patent_title] => 'Thermoelectric element and cooling or heating device provided with the same'
[patent_app_type] => 1
[patent_app_number] => 8/836746
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[patent_current_assignee] =>[type] => patent
[pdf_file] => patents/06/097/06097088.pdf
[firstpage_image] =>[orig_patent_app_number] => 836746
[rel_patent_id] =>[rel_patent_doc_number] =>) 08/836746 | Thermoelectric element and cooling or heating device provided with the same | May 20, 1997 | Issued |