Search

Roy Karl Potter

Examiner (ID: 13991, Phone: (571)272-1842 , Office: P/2822 )

Most Active Art Unit
2822
Art Unit(s)
2822, 2508, 2811, 3621
Total Applications
2584
Issued Applications
2409
Pending Applications
46
Abandoned Applications
141

Applications

Application numberTitle of the applicationFiling DateStatus
Array ( [id] => 4212605 [patent_doc_number] => 06028357 [patent_country] => US [patent_kind] => NA [patent_issue_date] => 2000-02-22 [patent_title] => 'Semiconductor device with a solder bump over a pillar form' [patent_app_type] => 1 [patent_app_number] => 8/826045 [patent_app_country] => US [patent_app_date] => 1997-03-28 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 2 [patent_figures_cnt] => 7 [patent_no_of_words] => 2777 [patent_no_of_claims] => 4 [patent_no_of_ind_claims] => 1 [patent_words_short_claim] => 93 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/06/028/06028357.pdf [firstpage_image] =>[orig_patent_app_number] => 826045 [rel_patent_id] =>[rel_patent_doc_number] =>)
08/826045
Semiconductor device with a solder bump over a pillar form Mar 27, 1997 Issued
08/822933 SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF Mar 20, 1997 Abandoned
Array ( [id] => 3933281 [patent_doc_number] => 05877545 [patent_country] => US [patent_kind] => NA [patent_issue_date] => 1999-03-02 [patent_title] => 'Encapsulated printed circuit assembly and method and manufacturing the same' [patent_app_type] => 1 [patent_app_number] => 8/822428 [patent_app_country] => US [patent_app_date] => 1997-03-21 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 2 [patent_figures_cnt] => 7 [patent_no_of_words] => 3525 [patent_no_of_claims] => 6 [patent_no_of_ind_claims] => 2 [patent_words_short_claim] => 126 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/05/877/05877545.pdf [firstpage_image] =>[orig_patent_app_number] => 822428 [rel_patent_id] =>[rel_patent_doc_number] =>)
08/822428
Encapsulated printed circuit assembly and method and manufacturing the same Mar 20, 1997 Issued
Array ( [id] => 3940667 [patent_doc_number] => 05929516 [patent_country] => US [patent_kind] => NA [patent_issue_date] => 1999-07-27 [patent_title] => 'Polymer stud grid array' [patent_app_type] => 1 [patent_app_number] => 8/809030 [patent_app_country] => US [patent_app_date] => 1997-03-21 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 3 [patent_figures_cnt] => 5 [patent_no_of_words] => 2188 [patent_no_of_claims] => 10 [patent_no_of_ind_claims] => 2 [patent_words_short_claim] => 146 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/05/929/05929516.pdf [firstpage_image] =>[orig_patent_app_number] => 809030 [rel_patent_id] =>[rel_patent_doc_number] =>)
08/809030
Polymer stud grid array Mar 20, 1997 Issued
Array ( [id] => 3987783 [patent_doc_number] => 05861667 [patent_country] => US [patent_kind] => NA [patent_issue_date] => 1999-01-19 [patent_title] => 'Single end in out arrangement' [patent_app_type] => 1 [patent_app_number] => 8/840126 [patent_app_country] => US [patent_app_date] => 1997-03-11 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 3 [patent_figures_cnt] => 5 [patent_no_of_words] => 1708 [patent_no_of_claims] => 5 [patent_no_of_ind_claims] => 1 [patent_words_short_claim] => 69 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/05/861/05861667.pdf [firstpage_image] =>[orig_patent_app_number] => 840126 [rel_patent_id] =>[rel_patent_doc_number] =>)
08/840126
Single end in out arrangement Mar 10, 1997 Issued
Array ( [id] => 4010278 [patent_doc_number] => 05859473 [patent_country] => US [patent_kind] => NA [patent_issue_date] => 1999-01-12 [patent_title] => 'Duplexer package' [patent_app_type] => 1 [patent_app_number] => 8/812282 [patent_app_country] => US [patent_app_date] => 1997-03-06 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 17 [patent_figures_cnt] => 19 [patent_no_of_words] => 5024 [patent_no_of_claims] => 11 [patent_no_of_ind_claims] => 1 [patent_words_short_claim] => 89 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/05/859/05859473.pdf [firstpage_image] =>[orig_patent_app_number] => 812282 [rel_patent_id] =>[rel_patent_doc_number] =>)
08/812282
Duplexer package Mar 5, 1997 Issued
Array ( [id] => 4068011 [patent_doc_number] => 05895971 [patent_country] => US [patent_kind] => NA [patent_issue_date] => 1999-04-20 [patent_title] => 'Semiconductor device with electrical connection between semiconductor chip and substrate less breakable during shrinkage of adhesive compound' [patent_app_type] => 1 [patent_app_number] => 8/813032 [patent_app_country] => US [patent_app_date] => 1997-03-06 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 8 [patent_figures_cnt] => 15 [patent_no_of_words] => 3331 [patent_no_of_claims] => 15 [patent_no_of_ind_claims] => 4 [patent_words_short_claim] => 124 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/05/895/05895971.pdf [firstpage_image] =>[orig_patent_app_number] => 813032 [rel_patent_id] =>[rel_patent_doc_number] =>)
08/813032
Semiconductor device with electrical connection between semiconductor chip and substrate less breakable during shrinkage of adhesive compound Mar 5, 1997 Issued
Array ( [id] => 3932015 [patent_doc_number] => 05952710 [patent_country] => US [patent_kind] => NA [patent_issue_date] => 1999-09-14 [patent_title] => 'Semiconductor device and method of manufacturing same' [patent_app_type] => 1 [patent_app_number] => 8/812932 [patent_app_country] => US [patent_app_date] => 1997-03-04 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 5 [patent_figures_cnt] => 11 [patent_no_of_words] => 2006 [patent_no_of_claims] => 8 [patent_no_of_ind_claims] => 2 [patent_words_short_claim] => 116 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/05/952/05952710.pdf [firstpage_image] =>[orig_patent_app_number] => 812932 [rel_patent_id] =>[rel_patent_doc_number] =>)
08/812932
Semiconductor device and method of manufacturing same Mar 3, 1997 Issued
Array ( [id] => 3954063 [patent_doc_number] => 05977613 [patent_country] => US [patent_kind] => NA [patent_issue_date] => 1999-11-02 [patent_title] => 'Electronic component, method for making the same, and lead frame and mold assembly for use therein' [patent_app_type] => 1 [patent_app_number] => 8/811606 [patent_app_country] => US [patent_app_date] => 1997-03-04 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 18 [patent_figures_cnt] => 24 [patent_no_of_words] => 7406 [patent_no_of_claims] => 29 [patent_no_of_ind_claims] => 3 [patent_words_short_claim] => 93 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/05/977/05977613.pdf [firstpage_image] =>[orig_patent_app_number] => 811606 [rel_patent_id] =>[rel_patent_doc_number] =>)
08/811606
Electronic component, method for making the same, and lead frame and mold assembly for use therein Mar 3, 1997 Issued
Array ( [id] => 3774427 [patent_doc_number] => 05734198 [patent_country] => US [patent_kind] => NA [patent_issue_date] => 1998-03-31 [patent_title] => 'Multi-layer lead frame for a semiconductor device' [patent_app_type] => 1 [patent_app_number] => 8/811343 [patent_app_country] => US [patent_app_date] => 1997-03-04 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 3 [patent_figures_cnt] => 3 [patent_no_of_words] => 2705 [patent_no_of_claims] => 19 [patent_no_of_ind_claims] => 2 [patent_words_short_claim] => 137 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/05/734/05734198.pdf [firstpage_image] =>[orig_patent_app_number] => 811343 [rel_patent_id] =>[rel_patent_doc_number] =>)
08/811343
Multi-layer lead frame for a semiconductor device Mar 3, 1997 Issued
Array ( [id] => 4257733 [patent_doc_number] => 06208021 [patent_country] => US [patent_kind] => NA [patent_issue_date] => 2001-03-27 [patent_title] => 'Semiconductor device, manufacturing method thereof and aggregate type semiconductor device' [patent_app_type] => 1 [patent_app_number] => 8/806614 [patent_app_country] => US [patent_app_date] => 1997-02-26 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 6 [patent_figures_cnt] => 15 [patent_no_of_words] => 5064 [patent_no_of_claims] => 20 [patent_no_of_ind_claims] => 3 [patent_words_short_claim] => 142 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/06/208/06208021.pdf [firstpage_image] =>[orig_patent_app_number] => 806614 [rel_patent_id] =>[rel_patent_doc_number] =>)
08/806614
Semiconductor device, manufacturing method thereof and aggregate type semiconductor device Feb 25, 1997 Issued
Array ( [id] => 3932128 [patent_doc_number] => 05952718 [patent_country] => US [patent_kind] => NA [patent_issue_date] => 1999-09-14 [patent_title] => 'Semiconductor devices having protruding contacts' [patent_app_type] => 1 [patent_app_number] => 8/804968 [patent_app_country] => US [patent_app_date] => 1997-02-24 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 9 [patent_figures_cnt] => 22 [patent_no_of_words] => 7072 [patent_no_of_claims] => 15 [patent_no_of_ind_claims] => 5 [patent_words_short_claim] => 61 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/05/952/05952718.pdf [firstpage_image] =>[orig_patent_app_number] => 804968 [rel_patent_id] =>[rel_patent_doc_number] =>)
08/804968
Semiconductor devices having protruding contacts Feb 23, 1997 Issued
Array ( [id] => 4301817 [patent_doc_number] => 06198172 [patent_country] => US [patent_kind] => NA [patent_issue_date] => 2001-03-06 [patent_title] => 'Semiconductor chip package' [patent_app_type] => 1 [patent_app_number] => 9/026584 [patent_app_country] => US [patent_app_date] => 1997-02-20 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 4 [patent_figures_cnt] => 6 [patent_no_of_words] => 3716 [patent_no_of_claims] => 24 [patent_no_of_ind_claims] => 10 [patent_words_short_claim] => 46 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/06/198/06198172.pdf [firstpage_image] =>[orig_patent_app_number] => 026584 [rel_patent_id] =>[rel_patent_doc_number] =>)
09/026584
Semiconductor chip package Feb 19, 1997 Issued
Array ( [id] => 3980784 [patent_doc_number] => 05917233 [patent_country] => US [patent_kind] => NA [patent_issue_date] => 1999-06-29 [patent_title] => 'Integrated circuit having a parasitic resonance filter' [patent_app_type] => 1 [patent_app_number] => 8/801286 [patent_app_country] => US [patent_app_date] => 1997-02-18 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 3 [patent_figures_cnt] => 7 [patent_no_of_words] => 2474 [patent_no_of_claims] => 14 [patent_no_of_ind_claims] => 2 [patent_words_short_claim] => 76 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/05/917/05917233.pdf [firstpage_image] =>[orig_patent_app_number] => 801286 [rel_patent_id] =>[rel_patent_doc_number] =>)
08/801286
Integrated circuit having a parasitic resonance filter Feb 17, 1997 Issued
Array ( [id] => 3893113 [patent_doc_number] => 05723900 [patent_country] => US [patent_kind] => NA [patent_issue_date] => 1998-03-03 [patent_title] => 'Resin mold type semiconductor device' [patent_app_type] => 1 [patent_app_number] => 8/799497 [patent_app_country] => US [patent_app_date] => 1997-02-12 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 8 [patent_figures_cnt] => 19 [patent_no_of_words] => 3407 [patent_no_of_claims] => 16 [patent_no_of_ind_claims] => 3 [patent_words_short_claim] => 78 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/05/723/05723900.pdf [firstpage_image] =>[orig_patent_app_number] => 799497 [rel_patent_id] =>[rel_patent_doc_number] =>)
08/799497
Resin mold type semiconductor device Feb 11, 1997 Issued
Array ( [id] => 3745564 [patent_doc_number] => 05753973 [patent_country] => US [patent_kind] => NA [patent_issue_date] => 1998-05-19 [patent_title] => 'Resin seal semiconductor package' [patent_app_type] => 1 [patent_app_number] => 8/798954 [patent_app_country] => US [patent_app_date] => 1997-02-11 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 67 [patent_figures_cnt] => 115 [patent_no_of_words] => 22787 [patent_no_of_claims] => 25 [patent_no_of_ind_claims] => 2 [patent_words_short_claim] => 113 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/05/753/05753973.pdf [firstpage_image] =>[orig_patent_app_number] => 798954 [rel_patent_id] =>[rel_patent_doc_number] =>)
08/798954
Resin seal semiconductor package Feb 10, 1997 Issued
Array ( [id] => 3980663 [patent_doc_number] => 05905299 [patent_country] => US [patent_kind] => NA [patent_issue_date] => 1999-05-18 [patent_title] => 'Thermally enhanced thin quad flatpack package' [patent_app_type] => 1 [patent_app_number] => 8/796174 [patent_app_country] => US [patent_app_date] => 1997-02-07 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 3 [patent_figures_cnt] => 8 [patent_no_of_words] => 5259 [patent_no_of_claims] => 16 [patent_no_of_ind_claims] => 6 [patent_words_short_claim] => 93 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/05/905/05905299.pdf [firstpage_image] =>[orig_patent_app_number] => 796174 [rel_patent_id] =>[rel_patent_doc_number] =>)
08/796174
Thermally enhanced thin quad flatpack package Feb 6, 1997 Issued
Array ( [id] => 4057517 [patent_doc_number] => 05932926 [patent_country] => US [patent_kind] => NA [patent_issue_date] => 1999-08-03 [patent_title] => 'Microwave semiconductor integrated circuit' [patent_app_type] => 1 [patent_app_number] => 8/795790 [patent_app_country] => US [patent_app_date] => 1997-02-05 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 9 [patent_figures_cnt] => 21 [patent_no_of_words] => 6336 [patent_no_of_claims] => 7 [patent_no_of_ind_claims] => 3 [patent_words_short_claim] => 99 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/05/932/05932926.pdf [firstpage_image] =>[orig_patent_app_number] => 795790 [rel_patent_id] =>[rel_patent_doc_number] =>)
08/795790
Microwave semiconductor integrated circuit Feb 4, 1997 Issued
Array ( [id] => 4113594 [patent_doc_number] => 06057598 [patent_country] => US [patent_kind] => NA [patent_issue_date] => 2000-05-02 [patent_title] => 'Face on face flip chip integration' [patent_app_type] => 1 [patent_app_number] => 8/794272 [patent_app_country] => US [patent_app_date] => 1997-01-31 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 4 [patent_figures_cnt] => 9 [patent_no_of_words] => 3627 [patent_no_of_claims] => 36 [patent_no_of_ind_claims] => 3 [patent_words_short_claim] => 153 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/06/057/06057598.pdf [firstpage_image] =>[orig_patent_app_number] => 794272 [rel_patent_id] =>[rel_patent_doc_number] =>)
08/794272
Face on face flip chip integration Jan 30, 1997 Issued
Array ( [id] => 3882876 [patent_doc_number] => 05804873 [patent_country] => US [patent_kind] => NA [patent_issue_date] => 1998-09-08 [patent_title] => 'Heatsink for surface mount device for circuit board mounting' [patent_app_type] => 1 [patent_app_number] => 8/790842 [patent_app_country] => US [patent_app_date] => 1997-01-30 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 1 [patent_figures_cnt] => 5 [patent_no_of_words] => 1461 [patent_no_of_claims] => 14 [patent_no_of_ind_claims] => 2 [patent_words_short_claim] => 122 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/05/804/05804873.pdf [firstpage_image] =>[orig_patent_app_number] => 790842 [rel_patent_id] =>[rel_patent_doc_number] =>)
08/790842
Heatsink for surface mount device for circuit board mounting Jan 29, 1997 Issued
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