
Roy Karl Potter
Examiner (ID: 13991, Phone: (571)272-1842 , Office: P/2822 )
| Most Active Art Unit | 2822 |
| Art Unit(s) | 2822, 2508, 2811, 3621 |
| Total Applications | 2584 |
| Issued Applications | 2409 |
| Pending Applications | 46 |
| Abandoned Applications | 141 |
Applications
| Application number | Title of the application | Filing Date | Status |
|---|---|---|---|
Array
(
[id] => 4212605
[patent_doc_number] => 06028357
[patent_country] => US
[patent_kind] => NA
[patent_issue_date] => 2000-02-22
[patent_title] => 'Semiconductor device with a solder bump over a pillar form'
[patent_app_type] => 1
[patent_app_number] => 8/826045
[patent_app_country] => US
[patent_app_date] => 1997-03-28
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 2
[patent_figures_cnt] => 7
[patent_no_of_words] => 2777
[patent_no_of_claims] => 4
[patent_no_of_ind_claims] => 1
[patent_words_short_claim] => 93
[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => patent
[pdf_file] => patents/06/028/06028357.pdf
[firstpage_image] =>[orig_patent_app_number] => 826045
[rel_patent_id] =>[rel_patent_doc_number] =>) 08/826045 | Semiconductor device with a solder bump over a pillar form | Mar 27, 1997 | Issued |
| 08/822933 | SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF | Mar 20, 1997 | Abandoned |
Array
(
[id] => 3933281
[patent_doc_number] => 05877545
[patent_country] => US
[patent_kind] => NA
[patent_issue_date] => 1999-03-02
[patent_title] => 'Encapsulated printed circuit assembly and method and manufacturing the same'
[patent_app_type] => 1
[patent_app_number] => 8/822428
[patent_app_country] => US
[patent_app_date] => 1997-03-21
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 2
[patent_figures_cnt] => 7
[patent_no_of_words] => 3525
[patent_no_of_claims] => 6
[patent_no_of_ind_claims] => 2
[patent_words_short_claim] => 126
[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => patent
[pdf_file] => patents/05/877/05877545.pdf
[firstpage_image] =>[orig_patent_app_number] => 822428
[rel_patent_id] =>[rel_patent_doc_number] =>) 08/822428 | Encapsulated printed circuit assembly and method and manufacturing the same | Mar 20, 1997 | Issued |
Array
(
[id] => 3940667
[patent_doc_number] => 05929516
[patent_country] => US
[patent_kind] => NA
[patent_issue_date] => 1999-07-27
[patent_title] => 'Polymer stud grid array'
[patent_app_type] => 1
[patent_app_number] => 8/809030
[patent_app_country] => US
[patent_app_date] => 1997-03-21
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 3
[patent_figures_cnt] => 5
[patent_no_of_words] => 2188
[patent_no_of_claims] => 10
[patent_no_of_ind_claims] => 2
[patent_words_short_claim] => 146
[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => patent
[pdf_file] => patents/05/929/05929516.pdf
[firstpage_image] =>[orig_patent_app_number] => 809030
[rel_patent_id] =>[rel_patent_doc_number] =>) 08/809030 | Polymer stud grid array | Mar 20, 1997 | Issued |
Array
(
[id] => 3987783
[patent_doc_number] => 05861667
[patent_country] => US
[patent_kind] => NA
[patent_issue_date] => 1999-01-19
[patent_title] => 'Single end in out arrangement'
[patent_app_type] => 1
[patent_app_number] => 8/840126
[patent_app_country] => US
[patent_app_date] => 1997-03-11
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 3
[patent_figures_cnt] => 5
[patent_no_of_words] => 1708
[patent_no_of_claims] => 5
[patent_no_of_ind_claims] => 1
[patent_words_short_claim] => 69
[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => patent
[pdf_file] => patents/05/861/05861667.pdf
[firstpage_image] =>[orig_patent_app_number] => 840126
[rel_patent_id] =>[rel_patent_doc_number] =>) 08/840126 | Single end in out arrangement | Mar 10, 1997 | Issued |
Array
(
[id] => 4010278
[patent_doc_number] => 05859473
[patent_country] => US
[patent_kind] => NA
[patent_issue_date] => 1999-01-12
[patent_title] => 'Duplexer package'
[patent_app_type] => 1
[patent_app_number] => 8/812282
[patent_app_country] => US
[patent_app_date] => 1997-03-06
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 17
[patent_figures_cnt] => 19
[patent_no_of_words] => 5024
[patent_no_of_claims] => 11
[patent_no_of_ind_claims] => 1
[patent_words_short_claim] => 89
[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => patent
[pdf_file] => patents/05/859/05859473.pdf
[firstpage_image] =>[orig_patent_app_number] => 812282
[rel_patent_id] =>[rel_patent_doc_number] =>) 08/812282 | Duplexer package | Mar 5, 1997 | Issued |
Array
(
[id] => 4068011
[patent_doc_number] => 05895971
[patent_country] => US
[patent_kind] => NA
[patent_issue_date] => 1999-04-20
[patent_title] => 'Semiconductor device with electrical connection between semiconductor chip and substrate less breakable during shrinkage of adhesive compound'
[patent_app_type] => 1
[patent_app_number] => 8/813032
[patent_app_country] => US
[patent_app_date] => 1997-03-06
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 8
[patent_figures_cnt] => 15
[patent_no_of_words] => 3331
[patent_no_of_claims] => 15
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[patent_current_assignee] =>[type] => patent
[pdf_file] => patents/05/895/05895971.pdf
[firstpage_image] =>[orig_patent_app_number] => 813032
[rel_patent_id] =>[rel_patent_doc_number] =>) 08/813032 | Semiconductor device with electrical connection between semiconductor chip and substrate less breakable during shrinkage of adhesive compound | Mar 5, 1997 | Issued |
Array
(
[id] => 3932015
[patent_doc_number] => 05952710
[patent_country] => US
[patent_kind] => NA
[patent_issue_date] => 1999-09-14
[patent_title] => 'Semiconductor device and method of manufacturing same'
[patent_app_type] => 1
[patent_app_number] => 8/812932
[patent_app_country] => US
[patent_app_date] => 1997-03-04
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 5
[patent_figures_cnt] => 11
[patent_no_of_words] => 2006
[patent_no_of_claims] => 8
[patent_no_of_ind_claims] => 2
[patent_words_short_claim] => 116
[patent_maintenance] => 1
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[patent_current_assignee] =>[type] => patent
[pdf_file] => patents/05/952/05952710.pdf
[firstpage_image] =>[orig_patent_app_number] => 812932
[rel_patent_id] =>[rel_patent_doc_number] =>) 08/812932 | Semiconductor device and method of manufacturing same | Mar 3, 1997 | Issued |
Array
(
[id] => 3954063
[patent_doc_number] => 05977613
[patent_country] => US
[patent_kind] => NA
[patent_issue_date] => 1999-11-02
[patent_title] => 'Electronic component, method for making the same, and lead frame and mold assembly for use therein'
[patent_app_type] => 1
[patent_app_number] => 8/811606
[patent_app_country] => US
[patent_app_date] => 1997-03-04
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 18
[patent_figures_cnt] => 24
[patent_no_of_words] => 7406
[patent_no_of_claims] => 29
[patent_no_of_ind_claims] => 3
[patent_words_short_claim] => 93
[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => patent
[pdf_file] => patents/05/977/05977613.pdf
[firstpage_image] =>[orig_patent_app_number] => 811606
[rel_patent_id] =>[rel_patent_doc_number] =>) 08/811606 | Electronic component, method for making the same, and lead frame and mold assembly for use therein | Mar 3, 1997 | Issued |
Array
(
[id] => 3774427
[patent_doc_number] => 05734198
[patent_country] => US
[patent_kind] => NA
[patent_issue_date] => 1998-03-31
[patent_title] => 'Multi-layer lead frame for a semiconductor device'
[patent_app_type] => 1
[patent_app_number] => 8/811343
[patent_app_country] => US
[patent_app_date] => 1997-03-04
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 3
[patent_figures_cnt] => 3
[patent_no_of_words] => 2705
[patent_no_of_claims] => 19
[patent_no_of_ind_claims] => 2
[patent_words_short_claim] => 137
[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => patent
[pdf_file] => patents/05/734/05734198.pdf
[firstpage_image] =>[orig_patent_app_number] => 811343
[rel_patent_id] =>[rel_patent_doc_number] =>) 08/811343 | Multi-layer lead frame for a semiconductor device | Mar 3, 1997 | Issued |
Array
(
[id] => 4257733
[patent_doc_number] => 06208021
[patent_country] => US
[patent_kind] => NA
[patent_issue_date] => 2001-03-27
[patent_title] => 'Semiconductor device, manufacturing method thereof and aggregate type semiconductor device'
[patent_app_type] => 1
[patent_app_number] => 8/806614
[patent_app_country] => US
[patent_app_date] => 1997-02-26
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 6
[patent_figures_cnt] => 15
[patent_no_of_words] => 5064
[patent_no_of_claims] => 20
[patent_no_of_ind_claims] => 3
[patent_words_short_claim] => 142
[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => patent
[pdf_file] => patents/06/208/06208021.pdf
[firstpage_image] =>[orig_patent_app_number] => 806614
[rel_patent_id] =>[rel_patent_doc_number] =>) 08/806614 | Semiconductor device, manufacturing method thereof and aggregate type semiconductor device | Feb 25, 1997 | Issued |
Array
(
[id] => 3932128
[patent_doc_number] => 05952718
[patent_country] => US
[patent_kind] => NA
[patent_issue_date] => 1999-09-14
[patent_title] => 'Semiconductor devices having protruding contacts'
[patent_app_type] => 1
[patent_app_number] => 8/804968
[patent_app_country] => US
[patent_app_date] => 1997-02-24
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 9
[patent_figures_cnt] => 22
[patent_no_of_words] => 7072
[patent_no_of_claims] => 15
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[patent_words_short_claim] => 61
[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => patent
[pdf_file] => patents/05/952/05952718.pdf
[firstpage_image] =>[orig_patent_app_number] => 804968
[rel_patent_id] =>[rel_patent_doc_number] =>) 08/804968 | Semiconductor devices having protruding contacts | Feb 23, 1997 | Issued |
Array
(
[id] => 4301817
[patent_doc_number] => 06198172
[patent_country] => US
[patent_kind] => NA
[patent_issue_date] => 2001-03-06
[patent_title] => 'Semiconductor chip package'
[patent_app_type] => 1
[patent_app_number] => 9/026584
[patent_app_country] => US
[patent_app_date] => 1997-02-20
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 4
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[patent_maintenance] => 1
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[patent_current_assignee] =>[type] => patent
[pdf_file] => patents/06/198/06198172.pdf
[firstpage_image] =>[orig_patent_app_number] => 026584
[rel_patent_id] =>[rel_patent_doc_number] =>) 09/026584 | Semiconductor chip package | Feb 19, 1997 | Issued |
Array
(
[id] => 3980784
[patent_doc_number] => 05917233
[patent_country] => US
[patent_kind] => NA
[patent_issue_date] => 1999-06-29
[patent_title] => 'Integrated circuit having a parasitic resonance filter'
[patent_app_type] => 1
[patent_app_number] => 8/801286
[patent_app_country] => US
[patent_app_date] => 1997-02-18
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 3
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[patent_current_assignee] =>[type] => patent
[pdf_file] => patents/05/917/05917233.pdf
[firstpage_image] =>[orig_patent_app_number] => 801286
[rel_patent_id] =>[rel_patent_doc_number] =>) 08/801286 | Integrated circuit having a parasitic resonance filter | Feb 17, 1997 | Issued |
Array
(
[id] => 3893113
[patent_doc_number] => 05723900
[patent_country] => US
[patent_kind] => NA
[patent_issue_date] => 1998-03-03
[patent_title] => 'Resin mold type semiconductor device'
[patent_app_type] => 1
[patent_app_number] => 8/799497
[patent_app_country] => US
[patent_app_date] => 1997-02-12
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 8
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[patent_no_of_words] => 3407
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[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => patent
[pdf_file] => patents/05/723/05723900.pdf
[firstpage_image] =>[orig_patent_app_number] => 799497
[rel_patent_id] =>[rel_patent_doc_number] =>) 08/799497 | Resin mold type semiconductor device | Feb 11, 1997 | Issued |
Array
(
[id] => 3745564
[patent_doc_number] => 05753973
[patent_country] => US
[patent_kind] => NA
[patent_issue_date] => 1998-05-19
[patent_title] => 'Resin seal semiconductor package'
[patent_app_type] => 1
[patent_app_number] => 8/798954
[patent_app_country] => US
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[patent_effective_date] => 0000-00-00
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[pdf_file] => patents/05/753/05753973.pdf
[firstpage_image] =>[orig_patent_app_number] => 798954
[rel_patent_id] =>[rel_patent_doc_number] =>) 08/798954 | Resin seal semiconductor package | Feb 10, 1997 | Issued |
Array
(
[id] => 3980663
[patent_doc_number] => 05905299
[patent_country] => US
[patent_kind] => NA
[patent_issue_date] => 1999-05-18
[patent_title] => 'Thermally enhanced thin quad flatpack package'
[patent_app_type] => 1
[patent_app_number] => 8/796174
[patent_app_country] => US
[patent_app_date] => 1997-02-07
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 3
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[patent_current_assignee] =>[type] => patent
[pdf_file] => patents/05/905/05905299.pdf
[firstpage_image] =>[orig_patent_app_number] => 796174
[rel_patent_id] =>[rel_patent_doc_number] =>) 08/796174 | Thermally enhanced thin quad flatpack package | Feb 6, 1997 | Issued |
Array
(
[id] => 4057517
[patent_doc_number] => 05932926
[patent_country] => US
[patent_kind] => NA
[patent_issue_date] => 1999-08-03
[patent_title] => 'Microwave semiconductor integrated circuit'
[patent_app_type] => 1
[patent_app_number] => 8/795790
[patent_app_country] => US
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[patent_effective_date] => 0000-00-00
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[pdf_file] => patents/05/932/05932926.pdf
[firstpage_image] =>[orig_patent_app_number] => 795790
[rel_patent_id] =>[rel_patent_doc_number] =>) 08/795790 | Microwave semiconductor integrated circuit | Feb 4, 1997 | Issued |
Array
(
[id] => 4113594
[patent_doc_number] => 06057598
[patent_country] => US
[patent_kind] => NA
[patent_issue_date] => 2000-05-02
[patent_title] => 'Face on face flip chip integration'
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[patent_app_number] => 8/794272
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[pdf_file] => patents/06/057/06057598.pdf
[firstpage_image] =>[orig_patent_app_number] => 794272
[rel_patent_id] =>[rel_patent_doc_number] =>) 08/794272 | Face on face flip chip integration | Jan 30, 1997 | Issued |
Array
(
[id] => 3882876
[patent_doc_number] => 05804873
[patent_country] => US
[patent_kind] => NA
[patent_issue_date] => 1998-09-08
[patent_title] => 'Heatsink for surface mount device for circuit board mounting'
[patent_app_type] => 1
[patent_app_number] => 8/790842
[patent_app_country] => US
[patent_app_date] => 1997-01-30
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[pdf_file] => patents/05/804/05804873.pdf
[firstpage_image] =>[orig_patent_app_number] => 790842
[rel_patent_id] =>[rel_patent_doc_number] =>) 08/790842 | Heatsink for surface mount device for circuit board mounting | Jan 29, 1997 | Issued |