
Roy Karl Potter
Examiner (ID: 13991, Phone: (571)272-1842 , Office: P/2822 )
| Most Active Art Unit | 2822 |
| Art Unit(s) | 2822, 2508, 2811, 3621 |
| Total Applications | 2584 |
| Issued Applications | 2409 |
| Pending Applications | 46 |
| Abandoned Applications | 141 |
Applications
| Application number | Title of the application | Filing Date | Status |
|---|---|---|---|
Array
(
[id] => 3927111
[patent_doc_number] => 05914533
[patent_country] => US
[patent_kind] => NA
[patent_issue_date] => 1999-06-22
[patent_title] => 'Multilayer module with thinfilm redistribution area'
[patent_app_type] => 1
[patent_app_number] => 8/765989
[patent_app_country] => US
[patent_app_date] => 1997-01-10
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 4
[patent_figures_cnt] => 4
[patent_no_of_words] => 2898
[patent_no_of_claims] => 7
[patent_no_of_ind_claims] => 1
[patent_words_short_claim] => 98
[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => patent
[pdf_file] => patents/05/914/05914533.pdf
[firstpage_image] =>[orig_patent_app_number] => 765989
[rel_patent_id] =>[rel_patent_doc_number] =>) 08/765989 | Multilayer module with thinfilm redistribution area | Jan 9, 1997 | Issued |
Array
(
[id] => 3745386
[patent_doc_number] => 05753959
[patent_country] => US
[patent_kind] => NA
[patent_issue_date] => 1998-05-19
[patent_title] => 'Replacing semiconductor chips in a full-width chip array'
[patent_app_type] => 1
[patent_app_number] => 8/779045
[patent_app_country] => US
[patent_app_date] => 1997-01-06
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 6
[patent_figures_cnt] => 9
[patent_no_of_words] => 4401
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[patent_current_assignee] =>[type] => patent
[pdf_file] => patents/05/753/05753959.pdf
[firstpage_image] =>[orig_patent_app_number] => 779045
[rel_patent_id] =>[rel_patent_doc_number] =>) 08/779045 | Replacing semiconductor chips in a full-width chip array | Jan 5, 1997 | Issued |
Array
(
[id] => 4070087
[patent_doc_number] => 05866939
[patent_country] => US
[patent_kind] => NA
[patent_issue_date] => 1999-02-02
[patent_title] => 'Lead end grid array semiconductor package'
[patent_app_type] => 1
[patent_app_number] => 8/775839
[patent_app_country] => US
[patent_app_date] => 1996-12-31
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 17
[patent_figures_cnt] => 35
[patent_no_of_words] => 13484
[patent_no_of_claims] => 56
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[pdf_file] => patents/05/866/05866939.pdf
[firstpage_image] =>[orig_patent_app_number] => 775839
[rel_patent_id] =>[rel_patent_doc_number] =>) 08/775839 | Lead end grid array semiconductor package | Dec 30, 1996 | Issued |
Array
(
[id] => 3980949
[patent_doc_number] => 05917245
[patent_country] => US
[patent_kind] => NA
[patent_issue_date] => 1999-06-29
[patent_title] => 'Semiconductor device with brazing mount'
[patent_app_type] => 1
[patent_app_number] => 8/777944
[patent_app_country] => US
[patent_app_date] => 1996-12-23
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 3
[patent_figures_cnt] => 7
[patent_no_of_words] => 2172
[patent_no_of_claims] => 5
[patent_no_of_ind_claims] => 1
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[patent_current_assignee] =>[type] => patent
[pdf_file] => patents/05/917/05917245.pdf
[firstpage_image] =>[orig_patent_app_number] => 777944
[rel_patent_id] =>[rel_patent_doc_number] =>) 08/777944 | Semiconductor device with brazing mount | Dec 22, 1996 | Issued |
Array
(
[id] => 4067858
[patent_doc_number] => 05895961
[patent_country] => US
[patent_kind] => NA
[patent_issue_date] => 1999-04-20
[patent_title] => 'Semiconductor device with a planarized interconnect with poly-plug and self-aligned contacts'
[patent_app_type] => 1
[patent_app_number] => 8/780070
[patent_app_country] => US
[patent_app_date] => 1996-12-23
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 6
[patent_figures_cnt] => 18
[patent_no_of_words] => 3421
[patent_no_of_claims] => 27
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[pdf_file] => patents/05/895/05895961.pdf
[firstpage_image] =>[orig_patent_app_number] => 780070
[rel_patent_id] =>[rel_patent_doc_number] =>) 08/780070 | Semiconductor device with a planarized interconnect with poly-plug and self-aligned contacts | Dec 22, 1996 | Issued |
Array
(
[id] => 4087089
[patent_doc_number] => 06054760
[patent_country] => US
[patent_kind] => NA
[patent_issue_date] => 2000-04-25
[patent_title] => 'Surface-connectable semiconductor bridge elements and devices including the same'
[patent_app_type] => 1
[patent_app_number] => 8/771536
[patent_app_country] => US
[patent_app_date] => 1996-12-23
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 4
[patent_figures_cnt] => 15
[patent_no_of_words] => 6597
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[pdf_file] => patents/06/054/06054760.pdf
[firstpage_image] =>[orig_patent_app_number] => 771536
[rel_patent_id] =>[rel_patent_doc_number] =>) 08/771536 | Surface-connectable semiconductor bridge elements and devices including the same | Dec 22, 1996 | Issued |
Array
(
[id] => 3791145
[patent_doc_number] => 05736785
[patent_country] => US
[patent_kind] => NA
[patent_issue_date] => 1998-04-07
[patent_title] => 'Semiconductor package for improving the capability of spreading heat'
[patent_app_type] => 1
[patent_app_number] => 8/772670
[patent_app_country] => US
[patent_app_date] => 1996-12-20
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 9
[patent_figures_cnt] => 34
[patent_no_of_words] => 3961
[patent_no_of_claims] => 37
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[patent_current_assignee] =>[type] => patent
[pdf_file] => patents/05/736/05736785.pdf
[firstpage_image] =>[orig_patent_app_number] => 772670
[rel_patent_id] =>[rel_patent_doc_number] =>) 08/772670 | Semiconductor package for improving the capability of spreading heat | Dec 19, 1996 | Issued |
Array
(
[id] => 3885755
[patent_doc_number] => 05798564
[patent_country] => US
[patent_kind] => NA
[patent_issue_date] => 1998-08-25
[patent_title] => 'Multiple chip module apparatus having dual sided substrate'
[patent_app_type] => 1
[patent_app_number] => 8/770884
[patent_app_country] => US
[patent_app_date] => 1996-12-20
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 7
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[patent_no_of_words] => 1725
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[patent_current_assignee] =>[type] => patent
[pdf_file] => patents/05/798/05798564.pdf
[firstpage_image] =>[orig_patent_app_number] => 770884
[rel_patent_id] =>[rel_patent_doc_number] =>) 08/770884 | Multiple chip module apparatus having dual sided substrate | Dec 19, 1996 | Issued |
Array
(
[id] => 4184432
[patent_doc_number] => 06037661
[patent_country] => US
[patent_kind] => NA
[patent_issue_date] => 2000-03-14
[patent_title] => 'Multichip module'
[patent_app_type] => 1
[patent_app_number] => 8/771598
[patent_app_country] => US
[patent_app_date] => 1996-12-20
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 2
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[patent_no_of_words] => 2010
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[pdf_file] => patents/06/037/06037661.pdf
[firstpage_image] =>[orig_patent_app_number] => 771598
[rel_patent_id] =>[rel_patent_doc_number] =>) 08/771598 | Multichip module | Dec 19, 1996 | Issued |
Array
(
[id] => 3780417
[patent_doc_number] => 05757067
[patent_country] => US
[patent_kind] => NA
[patent_issue_date] => 1998-05-26
[patent_title] => 'Resin-sealed type semiconductor device'
[patent_app_type] => 1
[patent_app_number] => 8/770164
[patent_app_country] => US
[patent_app_date] => 1996-12-19
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 12
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[patent_no_of_words] => 5933
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[patent_current_assignee] =>[type] => patent
[pdf_file] => patents/05/757/05757067.pdf
[firstpage_image] =>[orig_patent_app_number] => 770164
[rel_patent_id] =>[rel_patent_doc_number] =>) 08/770164 | Resin-sealed type semiconductor device | Dec 18, 1996 | Issued |
Array
(
[id] => 3852493
[patent_doc_number] => 05719410
[patent_country] => US
[patent_kind] => NA
[patent_issue_date] => 1998-02-17
[patent_title] => 'Semiconductor device wiring or electrode'
[patent_app_type] => 1
[patent_app_number] => 8/767149
[patent_app_country] => US
[patent_app_date] => 1996-12-16
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 10
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[pdf_file] => patents/05/719/05719410.pdf
[firstpage_image] =>[orig_patent_app_number] => 767149
[rel_patent_id] =>[rel_patent_doc_number] =>) 08/767149 | Semiconductor device wiring or electrode | Dec 15, 1996 | Issued |
Array
(
[id] => 4049151
[patent_doc_number] => 05909053
[patent_country] => US
[patent_kind] => NA
[patent_issue_date] => 1999-06-01
[patent_title] => 'Lead frame and method for manufacturing same'
[patent_app_type] => 1
[patent_app_number] => 8/761360
[patent_app_country] => US
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[pdf_file] => patents/05/909/05909053.pdf
[firstpage_image] =>[orig_patent_app_number] => 761360
[rel_patent_id] =>[rel_patent_doc_number] =>) 08/761360 | Lead frame and method for manufacturing same | Dec 8, 1996 | Issued |
Array
(
[id] => 3788808
[patent_doc_number] => 05821615
[patent_country] => US
[patent_kind] => NA
[patent_issue_date] => 1998-10-13
[patent_title] => 'Semiconductor chip package having clip-type outlead and fabrication method of same'
[patent_app_type] => 1
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[firstpage_image] =>[orig_patent_app_number] => 759210
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Array
(
[id] => 3820926
[patent_doc_number] => 05789808
[patent_country] => US
[patent_kind] => NA
[patent_issue_date] => 1998-08-04
[patent_title] => 'Semiconductor device structured to be less susceptible to power supply noise'
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[patent_app_number] => 8/760008
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[pdf_file] => patents/05/789/05789808.pdf
[firstpage_image] =>[orig_patent_app_number] => 760008
[rel_patent_id] =>[rel_patent_doc_number] =>) 08/760008 | Semiconductor device structured to be less susceptible to power supply noise | Dec 2, 1996 | Issued |
Array
(
[id] => 3891646
[patent_doc_number] => 05714789
[patent_country] => US
[patent_kind] => NA
[patent_issue_date] => 1998-02-03
[patent_title] => 'Circuit board-mounted IC package cooling apparatus'
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[patent_app_country] => US
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[pdf_file] => patents/05/714/05714789.pdf
[firstpage_image] =>[orig_patent_app_number] => 755388
[rel_patent_id] =>[rel_patent_doc_number] =>) 08/755388 | Circuit board-mounted IC package cooling apparatus | Nov 21, 1996 | Issued |
Array
(
[id] => 3980709
[patent_doc_number] => 05905302
[patent_country] => US
[patent_kind] => NA
[patent_issue_date] => 1999-05-18
[patent_title] => 'Loadlock cassette with wafer support rails'
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[pdf_file] => patents/05/905/05905302.pdf
[firstpage_image] =>[orig_patent_app_number] => 752462
[rel_patent_id] =>[rel_patent_doc_number] =>) 08/752462 | Loadlock cassette with wafer support rails | Nov 17, 1996 | Issued |
Array
(
[id] => 3776095
[patent_doc_number] => 05850103
[patent_country] => US
[patent_kind] => NA
[patent_issue_date] => 1998-12-15
[patent_title] => 'IC card reading/writing device'
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[pdf_file] => patents/05/850/05850103.pdf
[firstpage_image] =>[orig_patent_app_number] => 748828
[rel_patent_id] =>[rel_patent_doc_number] =>) 08/748828 | IC card reading/writing device | Nov 13, 1996 | Issued |
Array
(
[id] => 3961464
[patent_doc_number] => 05936310
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[patent_issue_date] => 1999-08-10
[patent_title] => 'De-wetting material for glob top applications'
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[rel_patent_id] =>[rel_patent_doc_number] =>) 08/747229 | De-wetting material for glob top applications | Nov 11, 1996 | Issued |
Array
(
[id] => 3939294
[patent_doc_number] => 05939786
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[patent_issue_date] => 1999-08-17
[patent_title] => 'Uniform plating of dendrites'
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[firstpage_image] =>[orig_patent_app_number] => 748462
[rel_patent_id] =>[rel_patent_doc_number] =>) 08/748462 | Uniform plating of dendrites | Nov 7, 1996 | Issued |
Array
(
[id] => 3750845
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[patent_issue_date] => 1998-02-10
[patent_title] => 'Microcircuit via interconnect'
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[pdf_file] => patents/05/717/05717247.pdf
[firstpage_image] =>[orig_patent_app_number] => 751930
[rel_patent_id] =>[rel_patent_doc_number] =>) 08/751930 | Microcircuit via interconnect | Nov 4, 1996 | Issued |