
Russell Marc Kobert
Examiner (ID: 14392)
| Most Active Art Unit | 2858 |
| Art Unit(s) | 2858, 2829, 2213 |
| Total Applications | 684 |
| Issued Applications | 583 |
| Pending Applications | 38 |
| Abandoned Applications | 63 |
Applications
| Application number | Title of the application | Filing Date | Status |
|---|---|---|---|
Array
(
[id] => 958755
[patent_doc_number] => 06953700
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[patent_issue_date] => 2005-10-11
[patent_title] => 'Method for in-line testing of flip-chip semiconductor assemblies'
[patent_app_type] => utility
[patent_app_number] => 10/927546
[patent_app_country] => US
[patent_app_date] => 2004-08-25
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[pdf_file] => patents/06/953/06953700.pdf
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Array
(
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[patent_doc_number] => 07123037
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[patent_kind] => B2
[patent_issue_date] => 2006-10-17
[patent_title] => 'Integrated circuit temperature sensing device and method'
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[patent_app_date] => 2004-08-17
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[rel_patent_id] =>[rel_patent_doc_number] =>) 10/920531 | Integrated circuit temperature sensing device and method | Aug 16, 2004 | Issued |
Array
(
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[patent_doc_number] => 20050040840
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[patent_issue_date] => 2005-02-24
[patent_title] => 'METHOD FOR MONITORING QUALITY OF AN INSULATION LAYER'
[patent_app_type] => utility
[patent_app_number] => 10/710724
[patent_app_country] => US
[patent_app_date] => 2004-07-30
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[rel_patent_id] =>[rel_patent_doc_number] =>) 10/710724 | Method for monitoring quality of an insulation layer | Jul 29, 2004 | Issued |
Array
(
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[patent_issue_date] => 2006-02-28
[patent_title] => 'Method for in-line testing of flip-chip semiconductor assemblies'
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[rel_patent_id] =>[rel_patent_doc_number] =>) 10/900610 | Method for in-line testing of flip-chip semiconductor assemblies | Jul 26, 2004 | Issued |
Array
(
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[patent_title] => 'Method for in-line testing of flip-chip semiconductor assemblies'
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Array
(
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[patent_title] => 'Method for in-line testing of flip-chip semiconductor assemblies'
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Array
(
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[patent_title] => 'Method for in-line testing of flip-chip semiconductor assemblies'
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Array
(
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[patent_title] => 'Method for in-line testing of flip-chip semiconductor assemblies'
[patent_app_type] => utility
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[pdf_file] => patents/06/962/06962826.pdf
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[rel_patent_id] =>[rel_patent_doc_number] =>) 10/900771 | Method for in-line testing of flip-chip semiconductor assemblies | Jul 26, 2004 | Issued |
Array
(
[id] => 7126262
[patent_doc_number] => 20050058006
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[patent_issue_date] => 2005-03-17
[patent_title] => 'Semiconductor device, method for testing the same and IC card'
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[patent_app_number] => 10/897032
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[rel_patent_id] =>[rel_patent_doc_number] =>) 10/897032 | Semiconductor device, method for testing the same and IC card | Jul 22, 2004 | Issued |
Array
(
[id] => 944442
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[patent_issue_date] => 2005-11-22
[patent_title] => 'AC testing of leakage current in integrated circuits using RC time constant'
[patent_app_type] => utility
[patent_app_number] => 10/889417
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[rel_patent_id] =>[rel_patent_doc_number] =>) 10/889417 | AC testing of leakage current in integrated circuits using RC time constant | Jul 11, 2004 | Issued |
Array
(
[id] => 7086490
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[patent_title] => 'Spatial and temporal selective laser assisted fault localization'
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Array
(
[id] => 7087022
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[patent_title] => 'Probe card'
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[rel_patent_id] =>[rel_patent_doc_number] =>) 10/885721 | Probe card | Jul 7, 2004 | Abandoned |
Array
(
[id] => 1019008
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[patent_title] => 'System for probing, testing, burn-in, repairing and programming of integrated circuits'
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Array
(
[id] => 5766553
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[patent_title] => 'ATTACHABLE/DETACHABLE VARIABLE SPACING PROBING TIP SYSTEM'
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Array
(
[id] => 7175799
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[patent_title] => 'Test interconnect for bumped semiconductor components and method of fabrication'
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Array
(
[id] => 664423
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Array
(
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Array
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Array
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Array
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