Saad A. Waqas

Array ( [id] => 18653183 [patent_doc_number] => 20230299023 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2023-09-21 [patent_title] => SEMICONDUCTOR DEVICE WITH COMPOSITE CONDUCTIVE FEATURES AND METHOD FOR FABRICATING THE SAME [patent_app_type] => utility [patent_app_number] => 17/698545 [patent_app_country] => US [patent_app_date] => 2022-03-18 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 0 [patent_figures_cnt] => 0 [patent_no_of_words] => 11448 [patent_no_of_claims] => 0 [patent_no_of_ind_claims] => -18 [patent_words_short_claim] => 106 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 17698545 [rel_patent_id] =>[rel_patent_doc_number] =>)

Array ( [id] => 18967488 [patent_doc_number] => 11901269 [patent_country] => US [patent_kind] => B2 [patent_issue_date] => 2024-02-13 [patent_title] => Semiconductor package [patent_app_type] => utility [patent_app_number] => 17/687072 [patent_app_country] => US [patent_app_date] => 2022-03-04 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 16 [patent_figures_cnt] => 19 [patent_no_of_words] => 10472 [patent_no_of_claims] => 20 [patent_no_of_ind_claims] => 3 [patent_words_short_claim] => 97 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 17687072 [rel_patent_id] =>[rel_patent_doc_number] =>)

Array ( [id] => 17949282 [patent_doc_number] => 20220336301 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2022-10-20 [patent_title] => POWER SEMICONDUCTOR DEVICE, METHOD FOR MANUFACTURING POWER SEMICONDUCTOR DEVICE, AND POWER CONVERSION APPARATUS [patent_app_type] => utility [patent_app_number] => 17/683002 [patent_app_country] => US [patent_app_date] => 2022-02-28 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 0 [patent_figures_cnt] => 0 [patent_no_of_words] => 10567 [patent_no_of_claims] => 0 [patent_no_of_ind_claims] => -8 [patent_words_short_claim] => 115 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 17683002 [rel_patent_id] =>[rel_patent_doc_number] =>)

Array ( [id] => 18840158 [patent_doc_number] => 11848237 [patent_country] => US [patent_kind] => B2 [patent_issue_date] => 2023-12-19 [patent_title] => Composite wafer, semiconductor device and electronic component [patent_app_type] => utility [patent_app_number] => 17/678619 [patent_app_country] => US [patent_app_date] => 2022-02-23 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 26 [patent_figures_cnt] => 57 [patent_no_of_words] => 16808 [patent_no_of_claims] => 10 [patent_no_of_ind_claims] => 2 [patent_words_short_claim] => 149 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 17678619 [rel_patent_id] =>[rel_patent_doc_number] =>)

Array ( [id] => 18142342 [patent_doc_number] => 20230016186 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2023-01-19 [patent_title] => SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING THE SAME [patent_app_type] => utility [patent_app_number] => 17/678392 [patent_app_country] => US [patent_app_date] => 2022-02-23 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 0 [patent_figures_cnt] => 0 [patent_no_of_words] => 9269 [patent_no_of_claims] => 0 [patent_no_of_ind_claims] => -17 [patent_words_short_claim] => 150 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 17678392 [rel_patent_id] =>[rel_patent_doc_number] =>)

Array ( [id] => 19138070 [patent_doc_number] => 11973045 [patent_country] => US [patent_kind] => B2 [patent_issue_date] => 2024-04-30 [patent_title] => Semiconductor structure and method for forming same [patent_app_type] => utility [patent_app_number] => 17/650796 [patent_app_country] => US [patent_app_date] => 2022-02-11 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 21 [patent_figures_cnt] => 21 [patent_no_of_words] => 5093 [patent_no_of_claims] => 16 [patent_no_of_ind_claims] => 2 [patent_words_short_claim] => 204 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 17650796 [rel_patent_id] =>[rel_patent_doc_number] =>)

Array ( [id] => 18284384 [patent_doc_number] => 20230099856 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2023-03-30 [patent_title] => INTEGRATED CIRCUIT PACKAGE MODULE INCLUDING A BONDING SYSTEM [patent_app_type] => utility [patent_app_number] => 17/665749 [patent_app_country] => US [patent_app_date] => 2022-02-07 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 0 [patent_figures_cnt] => 0 [patent_no_of_words] => 9877 [patent_no_of_claims] => 0 [patent_no_of_ind_claims] => -23 [patent_words_short_claim] => 108 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 17665749 [rel_patent_id] =>[rel_patent_doc_number] =>)

Array ( [id] => 19524016 [patent_doc_number] => 12125756 [patent_country] => US [patent_kind] => B2 [patent_issue_date] => 2024-10-22 [patent_title] => Semiconductor device [patent_app_type] => utility [patent_app_number] => 17/590289 [patent_app_country] => US [patent_app_date] => 2022-02-01 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 4 [patent_figures_cnt] => 8 [patent_no_of_words] => 10065 [patent_no_of_claims] => 8 [patent_no_of_ind_claims] => 1 [patent_words_short_claim] => 121 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 17590289 [rel_patent_id] =>[rel_patent_doc_number] =>)

Array ( [id] => 19414781 [patent_doc_number] => 12080618 [patent_country] => US [patent_kind] => B2 [patent_issue_date] => 2024-09-03 [patent_title] => Electronic package, heat dissipation structure and manufacturing method thereof [patent_app_type] => utility [patent_app_number] => 17/583946 [patent_app_country] => US [patent_app_date] => 2022-01-25 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 15 [patent_figures_cnt] => 41 [patent_no_of_words] => 8102 [patent_no_of_claims] => 27 [patent_no_of_ind_claims] => 2 [patent_words_short_claim] => 135 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 17583946 [rel_patent_id] =>[rel_patent_doc_number] =>)

Array ( [id] => 18112969 [patent_doc_number] => 20230005849 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2023-01-05 [patent_title] => SEMICONDUCTOR STRUCTURE AND MANUFACTURING METHOD THEREOF [patent_app_type] => utility [patent_app_number] => 17/648309 [patent_app_country] => US [patent_app_date] => 2022-01-19 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 0 [patent_figures_cnt] => 0 [patent_no_of_words] => 7204 [patent_no_of_claims] => 0 [patent_no_of_ind_claims] => -18 [patent_words_short_claim] => 288 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 17648309 [rel_patent_id] =>[rel_patent_doc_number] =>)

Array ( [id] => 17917566 [patent_doc_number] => 20220319962 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2022-10-06 [patent_title] => SEMICONDUCTOR DEVICE [patent_app_type] => utility [patent_app_number] => 17/577091 [patent_app_country] => US [patent_app_date] => 2022-01-17 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 0 [patent_figures_cnt] => 0 [patent_no_of_words] => 9793 [patent_no_of_claims] => 0 [patent_no_of_ind_claims] => -6 [patent_words_short_claim] => 245 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 17577091 [rel_patent_id] =>[rel_patent_doc_number] =>)

Array ( [id] => 17583041 [patent_doc_number] => 20220139896 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2022-05-05 [patent_title] => DISTRIBUTED SEMICONDUCTOR DIE AND PACKAGE ARCHITECTURE [patent_app_type] => utility [patent_app_number] => 17/574485 [patent_app_country] => US [patent_app_date] => 2022-01-12 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 0 [patent_figures_cnt] => 0 [patent_no_of_words] => 15663 [patent_no_of_claims] => 0 [patent_no_of_ind_claims] => -21 [patent_words_short_claim] => 180 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 17574485 [rel_patent_id] =>[rel_patent_doc_number] =>)

Array ( [id] => 18211297 [patent_doc_number] => 20230057560 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2023-02-23 [patent_title] => SEMICONDUCTOR DEVICE INCLUDING RE-DISTRIBUTION PADS DISPOSED AT DIFFERENT LEVELS AND A METHOD OF MANUFACTURING THE SAME [patent_app_type] => utility [patent_app_number] => 17/572033 [patent_app_country] => US [patent_app_date] => 2022-01-10 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 0 [patent_figures_cnt] => 0 [patent_no_of_words] => 4836 [patent_no_of_claims] => 0 [patent_no_of_ind_claims] => -16 [patent_words_short_claim] => 88 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 17572033 [rel_patent_id] =>[rel_patent_doc_number] =>)

Array ( [id] => 19168629 [patent_doc_number] => 11984545 [patent_country] => US [patent_kind] => B2 [patent_issue_date] => 2024-05-14 [patent_title] => Method of manufacturing a light emitting device [patent_app_type] => utility [patent_app_number] => 17/565020 [patent_app_country] => US [patent_app_date] => 2021-12-29 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 2 [patent_figures_cnt] => 4 [patent_no_of_words] => 6634 [patent_no_of_claims] => 5 [patent_no_of_ind_claims] => 1 [patent_words_short_claim] => 159 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 17565020 [rel_patent_id] =>[rel_patent_doc_number] =>)

Array ( [id] => 18473132 [patent_doc_number] => 20230207420 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2023-06-29 [patent_title] => INTEGRATED CIRCUIT HAVING AN IMPROVED THERMAL INTEGRATED CIRCUIT HAVING AN IMPROVED THERMAL PERFORMANCE [patent_app_type] => utility [patent_app_number] => 17/563789 [patent_app_country] => US [patent_app_date] => 2021-12-28 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 0 [patent_figures_cnt] => 0 [patent_no_of_words] => 2692 [patent_no_of_claims] => 0 [patent_no_of_ind_claims] => -17 [patent_words_short_claim] => 84 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 17563789 [rel_patent_id] =>[rel_patent_doc_number] =>)

Array ( [id] => 17536717 [patent_doc_number] => 20220115326 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2022-04-14 [patent_title] => SIZE AND EFFICIENCY OF DIES [patent_app_type] => utility [patent_app_number] => 17/555213 [patent_app_country] => US [patent_app_date] => 2021-12-17 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 0 [patent_figures_cnt] => 0 [patent_no_of_words] => 4449 [patent_no_of_claims] => 0 [patent_no_of_ind_claims] => -19 [patent_words_short_claim] => 183 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 17555213 [rel_patent_id] =>[rel_patent_doc_number] =>)

Array ( [id] => 17963691 [patent_doc_number] => 20220344272 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2022-10-27 [patent_title] => SEMICONDUCTOR DEVICE [patent_app_type] => utility [patent_app_number] => 17/644716 [patent_app_country] => US [patent_app_date] => 2021-12-16 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 0 [patent_figures_cnt] => 0 [patent_no_of_words] => 9388 [patent_no_of_claims] => 0 [patent_no_of_ind_claims] => -17 [patent_words_short_claim] => 2 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 17644716 [rel_patent_id] =>[rel_patent_doc_number] =>)

Array ( [id] => 18943558 [patent_doc_number] => 20240038697 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2024-02-01 [patent_title] => DISPLAY PANEL, METHOD OF MANUFACTURING DISPLAY PANEL, AND DISPLAY DEVICE [patent_app_type] => utility [patent_app_number] => 17/622229 [patent_app_country] => US [patent_app_date] => 2021-12-16 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 0 [patent_figures_cnt] => 0 [patent_no_of_words] => 6147 [patent_no_of_claims] => 0 [patent_no_of_ind_claims] => -18 [patent_words_short_claim] => 79 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 17622229 [rel_patent_id] =>[rel_patent_doc_number] =>)

Array ( [id] => 18068401 [patent_doc_number] => 20220399489 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2022-12-15 [patent_title] => STORAGE DEVICE [patent_app_type] => utility [patent_app_number] => 17/549236 [patent_app_country] => US [patent_app_date] => 2021-12-13 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 0 [patent_figures_cnt] => 0 [patent_no_of_words] => 7771 [patent_no_of_claims] => 0 [patent_no_of_ind_claims] => -16 [patent_words_short_claim] => 137 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 17549236 [rel_patent_id] =>[rel_patent_doc_number] =>)

Array ( [id] => 18797002 [patent_doc_number] => 11830837 [patent_country] => US [patent_kind] => B2 [patent_issue_date] => 2023-11-28 [patent_title] => Semiconductor package with air gap [patent_app_type] => utility [patent_app_number] => 17/524928 [patent_app_country] => US [patent_app_date] => 2021-11-12 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 22 [patent_figures_cnt] => 22 [patent_no_of_words] => 7854 [patent_no_of_claims] => 6 [patent_no_of_ind_claims] => 1 [patent_words_short_claim] => 130 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 17524928 [rel_patent_id] =>[rel_patent_doc_number] =>)