
Said Bouziane
Examiner (ID: 974, Phone: (571)272-7592 , Office: P/2837 )
| Most Active Art Unit | 2846 |
| Art Unit(s) | 2837, 2846 |
| Total Applications | 698 |
| Issued Applications | 527 |
| Pending Applications | 60 |
| Abandoned Applications | 133 |
Applications
| Application number | Title of the application | Filing Date | Status |
|---|---|---|---|
Array
(
[id] => 2847117
[patent_doc_number] => 05161091
[patent_country] => US
[patent_kind] => NA
[patent_issue_date] => 1992-11-03
[patent_title] => 'Packaging unit for an electrical assembly'
[patent_app_type] => 1
[patent_app_number] => 7/811788
[patent_app_country] => US
[patent_app_date] => 1991-12-20
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 1
[patent_figures_cnt] => 6
[patent_no_of_words] => 3101
[patent_no_of_claims] => 10
[patent_no_of_ind_claims] => 2
[patent_words_short_claim] => 126
[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => patent
[pdf_file] => patents/05/161/05161091.pdf
[firstpage_image] =>[orig_patent_app_number] => 811788
[rel_patent_id] =>[rel_patent_doc_number] =>) 07/811788 | Packaging unit for an electrical assembly | Dec 19, 1991 | Issued |
| 07/809745 | EXTENDED ARCHITECTURE FOR FPGA | Dec 17, 1991 | Abandoned |
Array
(
[id] => 2948825
[patent_doc_number] => 05191514
[patent_country] => US
[patent_kind] => NA
[patent_issue_date] => 1993-03-02
[patent_title] => 'Printed circuit card guide with locking hook'
[patent_app_type] => 1
[patent_app_number] => 7/803848
[patent_app_country] => US
[patent_app_date] => 1991-12-09
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 3
[patent_figures_cnt] => 3
[patent_no_of_words] => 1075
[patent_no_of_claims] => 5
[patent_no_of_ind_claims] => 2
[patent_words_short_claim] => 79
[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => patent
[pdf_file] => patents/05/191/05191514.pdf
[firstpage_image] =>[orig_patent_app_number] => 803848
[rel_patent_id] =>[rel_patent_doc_number] =>) 07/803848 | Printed circuit card guide with locking hook | Dec 8, 1991 | Issued |
Array
(
[id] => 2948805
[patent_doc_number] => 05191513
[patent_country] => US
[patent_kind] => NA
[patent_issue_date] => 1993-03-02
[patent_title] => 'Securing device'
[patent_app_type] => 1
[patent_app_number] => 7/803102
[patent_app_country] => US
[patent_app_date] => 1991-12-05
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 9
[patent_figures_cnt] => 9
[patent_no_of_words] => 4183
[patent_no_of_claims] => 20
[patent_no_of_ind_claims] => 3
[patent_words_short_claim] => 213
[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => patent
[pdf_file] => patents/05/191/05191513.pdf
[firstpage_image] =>[orig_patent_app_number] => 803102
[rel_patent_id] =>[rel_patent_doc_number] =>) 07/803102 | Securing device | Dec 4, 1991 | Issued |
Array
(
[id] => 2988404
[patent_doc_number] => 05253146
[patent_country] => US
[patent_kind] => NA
[patent_issue_date] => 1993-10-12
[patent_title] => 'Earthed intermediate frame for circuit boards'
[patent_app_type] => 1
[patent_app_number] => 7/804226
[patent_app_country] => US
[patent_app_date] => 1991-12-05
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 2
[patent_figures_cnt] => 3
[patent_no_of_words] => 971
[patent_no_of_claims] => 8
[patent_no_of_ind_claims] => 2
[patent_words_short_claim] => 95
[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => patent
[pdf_file] => patents/05/253/05253146.pdf
[firstpage_image] =>[orig_patent_app_number] => 804226
[rel_patent_id] =>[rel_patent_doc_number] =>) 07/804226 | Earthed intermediate frame for circuit boards | Dec 4, 1991 | Issued |
Array
(
[id] => 2955439
[patent_doc_number] => 05181167
[patent_country] => US
[patent_kind] => NA
[patent_issue_date] => 1993-01-19
[patent_title] => 'Stacking heatpipe for three dimensional electronic packaging'
[patent_app_type] => 1
[patent_app_number] => 7/801672
[patent_app_country] => US
[patent_app_date] => 1991-12-02
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 3
[patent_figures_cnt] => 5
[patent_no_of_words] => 3285
[patent_no_of_claims] => 17
[patent_no_of_ind_claims] => 2
[patent_words_short_claim] => 117
[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => patent
[pdf_file] => patents/05/181/05181167.pdf
[firstpage_image] =>[orig_patent_app_number] => 801672
[rel_patent_id] =>[rel_patent_doc_number] =>) 07/801672 | Stacking heatpipe for three dimensional electronic packaging | Dec 1, 1991 | Issued |
Array
(
[id] => 3082764
[patent_doc_number] => 05365402
[patent_country] => US
[patent_kind] => NA
[patent_issue_date] => 1994-11-15
[patent_title] => 'Cooling apparatus of electronic device'
[patent_app_type] => 1
[patent_app_number] => 7/800268
[patent_app_country] => US
[patent_app_date] => 1991-11-29
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 5
[patent_figures_cnt] => 11
[patent_no_of_words] => 2963
[patent_no_of_claims] => 15
[patent_no_of_ind_claims] => 3
[patent_words_short_claim] => 95
[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => patent
[pdf_file] => patents/05/365/05365402.pdf
[firstpage_image] =>[orig_patent_app_number] => 800268
[rel_patent_id] =>[rel_patent_doc_number] =>) 07/800268 | Cooling apparatus of electronic device | Nov 28, 1991 | Issued |
Array
(
[id] => 3013226
[patent_doc_number] => 05375042
[patent_country] => US
[patent_kind] => NA
[patent_issue_date] => 1994-12-20
[patent_title] => 'Semiconductor package employing substrate assembly having a pair of thin film circuits disposed one on each of oppositely facing surfaces of a thick film circuit'
[patent_app_type] => 1
[patent_app_number] => 7/799950
[patent_app_country] => US
[patent_app_date] => 1991-11-29
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 8
[patent_figures_cnt] => 11
[patent_no_of_words] => 5118
[patent_no_of_claims] => 29
[patent_no_of_ind_claims] => 4
[patent_words_short_claim] => 109
[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => patent
[pdf_file] => patents/05/375/05375042.pdf
[firstpage_image] =>[orig_patent_app_number] => 799950
[rel_patent_id] =>[rel_patent_doc_number] =>) 07/799950 | Semiconductor package employing substrate assembly having a pair of thin film circuits disposed one on each of oppositely facing surfaces of a thick film circuit | Nov 28, 1991 | Issued |
Array
(
[id] => 2994785
[patent_doc_number] => 05251107
[patent_country] => US
[patent_kind] => NA
[patent_issue_date] => 1993-10-05
[patent_title] => 'Semiconductor package'
[patent_app_type] => 1
[patent_app_number] => 7/798737
[patent_app_country] => US
[patent_app_date] => 1991-11-27
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 3
[patent_figures_cnt] => 7
[patent_no_of_words] => 2256
[patent_no_of_claims] => 6
[patent_no_of_ind_claims] => 1
[patent_words_short_claim] => 166
[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => patent
[pdf_file] => patents/05/251/05251107.pdf
[firstpage_image] =>[orig_patent_app_number] => 798737
[rel_patent_id] =>[rel_patent_doc_number] =>) 07/798737 | Semiconductor package | Nov 26, 1991 | Issued |
Array
(
[id] => 2978290
[patent_doc_number] => 05258891
[patent_country] => US
[patent_kind] => NA
[patent_issue_date] => 1993-11-02
[patent_title] => 'Multichip module with multilayer wiring substrate'
[patent_app_type] => 1
[patent_app_number] => 7/797920
[patent_app_country] => US
[patent_app_date] => 1991-11-26
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 12
[patent_figures_cnt] => 17
[patent_no_of_words] => 6934
[patent_no_of_claims] => 10
[patent_no_of_ind_claims] => 1
[patent_words_short_claim] => 99
[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => patent
[pdf_file] => patents/05/258/05258891.pdf
[firstpage_image] =>[orig_patent_app_number] => 797920
[rel_patent_id] =>[rel_patent_doc_number] =>) 07/797920 | Multichip module with multilayer wiring substrate | Nov 25, 1991 | Issued |
Array
(
[id] => 2927745
[patent_doc_number] => 05193050
[patent_country] => US
[patent_kind] => NA
[patent_issue_date] => 1993-03-09
[patent_title] => 'Enclosure for electronic subsystems in a data processing system'
[patent_app_type] => 1
[patent_app_number] => 7/794314
[patent_app_country] => US
[patent_app_date] => 1991-11-14
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 6
[patent_figures_cnt] => 7
[patent_no_of_words] => 2796
[patent_no_of_claims] => 21
[patent_no_of_ind_claims] => 3
[patent_words_short_claim] => 351
[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => patent
[pdf_file] => patents/05/193/05193050.pdf
[firstpage_image] =>[orig_patent_app_number] => 794314
[rel_patent_id] =>[rel_patent_doc_number] =>) 07/794314 | Enclosure for electronic subsystems in a data processing system | Nov 13, 1991 | Issued |
Array
(
[id] => 3074172
[patent_doc_number] => 05295045
[patent_country] => US
[patent_kind] => NA
[patent_issue_date] => 1994-03-15
[patent_title] => 'Plastic-molded-type semiconductor device and producing method therefor'
[patent_app_type] => 1
[patent_app_number] => 7/791551
[patent_app_country] => US
[patent_app_date] => 1991-11-14
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 7
[patent_figures_cnt] => 13
[patent_no_of_words] => 4258
[patent_no_of_claims] => 48
[patent_no_of_ind_claims] => 14
[patent_words_short_claim] => 27
[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => patent
[pdf_file] => patents/05/295/05295045.pdf
[firstpage_image] =>[orig_patent_app_number] => 791551
[rel_patent_id] =>[rel_patent_doc_number] =>) 07/791551 | Plastic-molded-type semiconductor device and producing method therefor | Nov 13, 1991 | Issued |
| 07/791174 | SEMICONDUCTOR DEVICE AND METHOD FOR MOUNTING SEMICONDUCTOR WAFER | Nov 12, 1991 | Abandoned |
| 07/790898 | HERMETIC SEALING OF FLEXPRINT ELECTRONIC BLANKET PACKAGES | Nov 11, 1991 | Abandoned |
Array
(
[id] => 3075265
[patent_doc_number] => 05311403
[patent_country] => US
[patent_kind] => NA
[patent_issue_date] => 1994-05-10
[patent_title] => 'Printed substrate for mounting high-power semiconductor chip thereon and driver component making use of the printed substrate'
[patent_app_type] => 1
[patent_app_number] => 7/788537
[patent_app_country] => US
[patent_app_date] => 1991-11-06
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 4
[patent_figures_cnt] => 6
[patent_no_of_words] => 2708
[patent_no_of_claims] => 5
[patent_no_of_ind_claims] => 3
[patent_words_short_claim] => 131
[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => patent
[pdf_file] => patents/05/311/05311403.pdf
[firstpage_image] =>[orig_patent_app_number] => 788537
[rel_patent_id] =>[rel_patent_doc_number] =>) 07/788537 | Printed substrate for mounting high-power semiconductor chip thereon and driver component making use of the printed substrate | Nov 5, 1991 | Issued |
Array
(
[id] => 2972510
[patent_doc_number] => 05264985
[patent_country] => US
[patent_kind] => NA
[patent_issue_date] => 1993-11-23
[patent_title] => 'Apparatus for increasing effective insulation between terminal plates'
[patent_app_type] => 1
[patent_app_number] => 7/787816
[patent_app_country] => US
[patent_app_date] => 1991-11-05
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 10
[patent_figures_cnt] => 11
[patent_no_of_words] => 3430
[patent_no_of_claims] => 11
[patent_no_of_ind_claims] => 5
[patent_words_short_claim] => 121
[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => patent
[pdf_file] => patents/05/264/05264985.pdf
[firstpage_image] =>[orig_patent_app_number] => 787816
[rel_patent_id] =>[rel_patent_doc_number] =>) 07/787816 | Apparatus for increasing effective insulation between terminal plates | Nov 4, 1991 | Issued |
Array
(
[id] => 2984525
[patent_doc_number] => 05208733
[patent_country] => US
[patent_kind] => NA
[patent_issue_date] => 1993-05-04
[patent_title] => 'Enclosure and printed circuit card with heat sink'
[patent_app_type] => 1
[patent_app_number] => 7/785074
[patent_app_country] => US
[patent_app_date] => 1991-10-30
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 4
[patent_figures_cnt] => 6
[patent_no_of_words] => 2273
[patent_no_of_claims] => 7
[patent_no_of_ind_claims] => 1
[patent_words_short_claim] => 109
[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => patent
[pdf_file] => patents/05/208/05208733.pdf
[firstpage_image] =>[orig_patent_app_number] => 785074
[rel_patent_id] =>[rel_patent_doc_number] =>) 07/785074 | Enclosure and printed circuit card with heat sink | Oct 29, 1991 | Issued |
Array
(
[id] => 2898379
[patent_doc_number] => 05239448
[patent_country] => US
[patent_kind] => NA
[patent_issue_date] => 1993-08-24
[patent_title] => 'Formulation of multichip modules'
[patent_app_type] => 1
[patent_app_number] => 7/783644
[patent_app_country] => US
[patent_app_date] => 1991-10-28
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 6
[patent_figures_cnt] => 13
[patent_no_of_words] => 4374
[patent_no_of_claims] => 11
[patent_no_of_ind_claims] => 1
[patent_words_short_claim] => 115
[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => patent
[pdf_file] => patents/05/239/05239448.pdf
[firstpage_image] =>[orig_patent_app_number] => 783644
[rel_patent_id] =>[rel_patent_doc_number] =>) 07/783644 | Formulation of multichip modules | Oct 27, 1991 | Issued |
Array
(
[id] => 2964706
[patent_doc_number] => 05243496
[patent_country] => US
[patent_kind] => NA
[patent_issue_date] => 1993-09-07
[patent_title] => 'Molded case integrated circuit with a dynamic impedance reducing device'
[patent_app_type] => 1
[patent_app_number] => 7/781803
[patent_app_country] => US
[patent_app_date] => 1991-10-28
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 2
[patent_figures_cnt] => 4
[patent_no_of_words] => 1531
[patent_no_of_claims] => 18
[patent_no_of_ind_claims] => 2
[patent_words_short_claim] => 65
[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => patent
[pdf_file] => patents/05/243/05243496.pdf
[firstpage_image] =>[orig_patent_app_number] => 781803
[rel_patent_id] =>[rel_patent_doc_number] =>) 07/781803 | Molded case integrated circuit with a dynamic impedance reducing device | Oct 27, 1991 | Issued |
Array
(
[id] => 3019333
[patent_doc_number] => 05276590
[patent_country] => US
[patent_kind] => NA
[patent_issue_date] => 1994-01-04
[patent_title] => 'Flex circuit electronic cards'
[patent_app_type] => 1
[patent_app_number] => 7/782216
[patent_app_country] => US
[patent_app_date] => 1991-10-24
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 2
[patent_figures_cnt] => 2
[patent_no_of_words] => 1729
[patent_no_of_claims] => 15
[patent_no_of_ind_claims] => 3
[patent_words_short_claim] => 86
[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => patent
[pdf_file] => patents/05/276/05276590.pdf
[firstpage_image] =>[orig_patent_app_number] => 782216
[rel_patent_id] =>[rel_patent_doc_number] =>) 07/782216 | Flex circuit electronic cards | Oct 23, 1991 | Issued |