
Sam Silverberg
Examiner (ID: 4104)
| Most Active Art Unit | 1502 |
| Art Unit(s) | 1308, 1309, 1101, 1742, 1502, 1311, 1733, 1102, 1305, 1304 |
| Total Applications | 1075 |
| Issued Applications | 889 |
| Pending Applications | 40 |
| Abandoned Applications | 146 |
Applications
| Application number | Title of the application | Filing Date | Status |
|---|---|---|---|
Array
(
[id] => 7480134
[patent_doc_number] => 20110248391
[patent_country] => US
[patent_kind] => A1
[patent_issue_date] => 2011-10-13
[patent_title] => 'INTEGRATED CIRCUIT PACKAGE STACKING SYSTEM WITH LEAD OVERLAP AND METHOD OF MANUFACTURE THEREOF'
[patent_app_type] => utility
[patent_app_number] => 12/782164
[patent_app_country] => US
[patent_app_date] => 2010-05-18
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 4
[patent_figures_cnt] => 4
[patent_no_of_words] => 3504
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[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => publication
[pdf_file] => publications/A1/0248/20110248391.pdf
[firstpage_image] =>[orig_patent_app_number] => 12782164
[rel_patent_id] =>[rel_patent_doc_number] =>) 12/782164 | INTEGRATED CIRCUIT PACKAGE STACKING SYSTEM WITH LEAD OVERLAP AND METHOD OF MANUFACTURE THEREOF | May 17, 2010 | Abandoned |
Array
(
[id] => 6256334
[patent_doc_number] => 20100295174
[patent_country] => US
[patent_kind] => A1
[patent_issue_date] => 2010-11-25
[patent_title] => 'WIRING SUBSTRATE AND SEMICONDUCTOR DEVICE'
[patent_app_type] => utility
[patent_app_number] => 12/782054
[patent_app_country] => US
[patent_app_date] => 2010-05-18
[patent_effective_date] => 0000-00-00
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[pdf_file] => publications/A1/0295/20100295174.pdf
[firstpage_image] =>[orig_patent_app_number] => 12782054
[rel_patent_id] =>[rel_patent_doc_number] =>) 12/782054 | Wiring substrate and semiconductor device having connection pads formed in non-solder mask defined structure | May 17, 2010 | Issued |
Array
(
[id] => 6570813
[patent_doc_number] => 20100320542
[patent_country] => US
[patent_kind] => A1
[patent_issue_date] => 2010-12-23
[patent_title] => 'SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF'
[patent_app_type] => utility
[patent_app_number] => 12/782457
[patent_app_country] => US
[patent_app_date] => 2010-05-18
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 19
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[pdf_file] => publications/A1/0320/20100320542.pdf
[firstpage_image] =>[orig_patent_app_number] => 12782457
[rel_patent_id] =>[rel_patent_doc_number] =>) 12/782457 | SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF | May 17, 2010 | Abandoned |
Array
(
[id] => 8675953
[patent_doc_number] => 08384069
[patent_country] => US
[patent_kind] => B2
[patent_issue_date] => 2013-02-26
[patent_title] => 'Semiconductor structure having blocks connected by nanowires'
[patent_app_type] => utility
[patent_app_number] => 12/782364
[patent_app_country] => US
[patent_app_date] => 2010-05-18
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 5
[patent_figures_cnt] => 13
[patent_no_of_words] => 6808
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[patent_current_assignee] =>[type] => patent
[pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 12782364
[rel_patent_id] =>[rel_patent_doc_number] =>) 12/782364 | Semiconductor structure having blocks connected by nanowires | May 17, 2010 | Issued |
Array
(
[id] => 6114278
[patent_doc_number] => 20110073891
[patent_country] => US
[patent_kind] => A1
[patent_issue_date] => 2011-03-31
[patent_title] => 'AC DRIVEN LIGHT EMITTING DIODE LIGHT APPARATUS, AND ITS AC DRIVEN LIGHT EMITTING DIODE PACKAGE ELEMENT THEREIN'
[patent_app_type] => utility
[patent_app_number] => 12/781715
[patent_app_country] => US
[patent_app_date] => 2010-05-17
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 6
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[patent_current_assignee] =>[type] => publication
[pdf_file] => publications/A1/0073/20110073891.pdf
[firstpage_image] =>[orig_patent_app_number] => 12781715
[rel_patent_id] =>[rel_patent_doc_number] =>) 12/781715 | AC DRIVEN LIGHT EMITTING DIODE LIGHT APPARATUS, AND ITS AC DRIVEN LIGHT EMITTING DIODE PACKAGE ELEMENT THEREIN | May 16, 2010 | Abandoned |
Array
(
[id] => 9300232
[patent_doc_number] => 08648463
[patent_country] => US
[patent_kind] => B2
[patent_issue_date] => 2014-02-11
[patent_title] => 'Assembly of multi-chip modules with proximity connectors using reflowable features'
[patent_app_type] => utility
[patent_app_number] => 12/781732
[patent_app_country] => US
[patent_app_date] => 2010-05-17
[patent_effective_date] => 0000-00-00
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[patent_current_assignee] =>[type] => patent
[pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 12781732
[rel_patent_id] =>[rel_patent_doc_number] =>) 12/781732 | Assembly of multi-chip modules with proximity connectors using reflowable features | May 16, 2010 | Issued |
Array
(
[id] => 10066789
[patent_doc_number] => 09105647
[patent_country] => US
[patent_kind] => B2
[patent_issue_date] => 2015-08-11
[patent_title] => 'Method of forming perforated opening in bottom substrate of flipchip pop assembly to reduce bleeding of underfill material'
[patent_app_type] => utility
[patent_app_number] => 12/781754
[patent_app_country] => US
[patent_app_date] => 2010-05-17
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 13
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[patent_no_of_words] => 4522
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[patent_current_assignee] =>[type] => patent
[pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 12781754
[rel_patent_id] =>[rel_patent_doc_number] =>) 12/781754 | Method of forming perforated opening in bottom substrate of flipchip pop assembly to reduce bleeding of underfill material | May 16, 2010 | Issued |
Array
(
[id] => 6177581
[patent_doc_number] => 20110121349
[patent_country] => US
[patent_kind] => A1
[patent_issue_date] => 2011-05-26
[patent_title] => 'LIGHT-EMITTING DIODE AND MANUFACTURING METHOD THEREOF'
[patent_app_type] => utility
[patent_app_number] => 12/781803
[patent_app_country] => US
[patent_app_date] => 2010-05-17
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 11
[patent_figures_cnt] => 11
[patent_no_of_words] => 2704
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[pdf_file] => publications/A1/0121/20110121349.pdf
[firstpage_image] =>[orig_patent_app_number] => 12781803
[rel_patent_id] =>[rel_patent_doc_number] =>) 12/781803 | LIGHT-EMITTING DIODE AND MANUFACTURING METHOD THEREOF | May 16, 2010 | Abandoned |
Array
(
[id] => 7584203
[patent_doc_number] => 20110278713
[patent_country] => US
[patent_kind] => A1
[patent_issue_date] => 2011-11-17
[patent_title] => 'EMBEDDED COMPONENT SUBSTRATE, SEMICONDUCTOR PACKAGE STRUCTURE USING THE SAME AND FABRICATION METHODS THEREOF'
[patent_app_type] => utility
[patent_app_number] => 12/781213
[patent_app_country] => US
[patent_app_date] => 2010-05-17
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 8
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[pdf_file] => publications/A1/0278/20110278713.pdf
[firstpage_image] =>[orig_patent_app_number] => 12781213
[rel_patent_id] =>[rel_patent_doc_number] =>) 12/781213 | Embedded component substrate, semiconductor package structure using the same and fabrication methods thereof | May 16, 2010 | Issued |
Array
(
[id] => 8621757
[patent_doc_number] => 08354671
[patent_country] => US
[patent_kind] => B1
[patent_issue_date] => 2013-01-15
[patent_title] => 'Integrated circuit with adaptive VGG setting'
[patent_app_type] => utility
[patent_app_number] => 12/781627
[patent_app_country] => US
[patent_app_date] => 2010-05-17
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 4
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[rel_patent_id] =>[rel_patent_doc_number] =>) 12/781627 | Integrated circuit with adaptive VGG setting | May 16, 2010 | Issued |
Array
(
[id] => 7584019
[patent_doc_number] => 20110278529
[patent_country] => US
[patent_kind] => A1
[patent_issue_date] => 2011-11-17
[patent_title] => 'MEMORY EMPLOYING DIAMOND-LIKE CARBON RESISTIVITY-SWITCHABLE MATERIAL AND METHODS OF FORMING THE SAME'
[patent_app_type] => utility
[patent_app_number] => 12/780564
[patent_app_country] => US
[patent_app_date] => 2010-05-14
[patent_effective_date] => 0000-00-00
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[rel_patent_id] =>[rel_patent_doc_number] =>) 12/780564 | MEMORY EMPLOYING DIAMOND-LIKE CARBON RESISTIVITY-SWITCHABLE MATERIAL AND METHODS OF FORMING THE SAME | May 13, 2010 | Abandoned |
Array
(
[id] => 6586016
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[patent_issue_date] => 2010-12-09
[patent_title] => 'Semiconductor Device and Method of Manufacturing the Same'
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Array
(
[id] => 8340600
[patent_doc_number] => 08242522
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[patent_issue_date] => 2012-08-14
[patent_title] => 'Optical device structure using non-polar GaN substrates and growth structures for laser applications in 481 nm'
[patent_app_type] => utility
[patent_app_number] => 12/778718
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[rel_patent_id] =>[rel_patent_doc_number] =>) 12/778718 | Optical device structure using non-polar GaN substrates and growth structures for laser applications in 481 nm | May 11, 2010 | Issued |
Array
(
[id] => 7558979
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[patent_kind] => A1
[patent_issue_date] => 2011-11-10
[patent_title] => 'STRUCTURE AND METHOD FOR AIR GAP INTERCONNECT INTEGRATION'
[patent_app_type] => utility
[patent_app_number] => 12/776885
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[rel_patent_id] =>[rel_patent_doc_number] =>) 12/776885 | Method for air gap interconnect integration using photo-patternable low k material | May 9, 2010 | Issued |
Array
(
[id] => 6570013
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[patent_issue_date] => 2010-10-28
[patent_title] => 'Electro- and Electroless Plating of Metal in the Manufacture of PCRAM Devices'
[patent_app_type] => utility
[patent_app_number] => 12/763430
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[firstpage_image] =>[orig_patent_app_number] => 12763430
[rel_patent_id] =>[rel_patent_doc_number] =>) 12/763430 | Methods of forming fast ion conductors and memory devices comprising diffused metal ions | Apr 19, 2010 | Issued |
Array
(
[id] => 6224842
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[patent_issue_date] => 2010-07-22
[patent_title] => 'SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF'
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[patent_app_number] => 12/750402
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[firstpage_image] =>[orig_patent_app_number] => 12750402
[rel_patent_id] =>[rel_patent_doc_number] =>) 12/750402 | Method of manufacturing semiconductor device having MIM capacitor | Mar 29, 2010 | Issued |
Array
(
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Array
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[rel_patent_id] =>[rel_patent_doc_number] =>) 12/709132 | Light emitting device package having light emitting device on inclined side surface and lighting system including the same | Feb 18, 2010 | Issued |
Array
(
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[patent_issue_date] => 2012-04-12
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[rel_patent_id] =>[rel_patent_doc_number] =>) 13/378154 | SUBSTRATE FOR DISPLAY PANEL, AND DISPLAY DEVICE | Feb 17, 2010 | Abandoned |
Array
(
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[patent_issue_date] => 2013-12-10
[patent_title] => 'Semiconductor device having conductive pads to prevent solder reflow'
[patent_app_type] => utility
[patent_app_number] => 12/708432
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[rel_patent_id] =>[rel_patent_doc_number] =>) 12/708432 | Semiconductor device having conductive pads to prevent solder reflow | Feb 17, 2010 | Issued |