
Samantha N. Wood
Examiner (ID: 6012, Phone: (571)272-6457 , Office: P/2915 )
| Most Active Art Unit | 2915 |
| Art Unit(s) | 2914, 2915 |
| Total Applications | 1312 |
| Issued Applications | 1235 |
| Pending Applications | 29 |
| Abandoned Applications | 58 |
Applications
| Application number | Title of the application | Filing Date | Status |
|---|---|---|---|
Array
(
[id] => 823583
[patent_doc_number] => 07405138
[patent_country] => US
[patent_kind] => B2
[patent_issue_date] => 2008-07-29
[patent_title] => 'Manufacturing method of stack-type semiconductor device'
[patent_app_type] => utility
[patent_app_number] => 11/235354
[patent_app_country] => US
[patent_app_date] => 2005-09-27
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[pdf_file] => patents/07/405/07405138.pdf
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Array
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[patent_issue_date] => 2007-03-29
[patent_title] => 'Method for forming narrow structures in a semiconductor device'
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[rel_patent_id] =>[rel_patent_doc_number] =>) 11/235214 | Method for forming narrow structures in a semiconductor device | Sep 26, 2005 | Issued |
Array
(
[id] => 5171905
[patent_doc_number] => 20070072338
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[patent_kind] => A1
[patent_issue_date] => 2007-03-29
[patent_title] => 'Method for separating package of WLP'
[patent_app_type] => utility
[patent_app_number] => 11/235484
[patent_app_country] => US
[patent_app_date] => 2005-09-26
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 7
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[rel_patent_id] =>[rel_patent_doc_number] =>) 11/235484 | Method for separating package of WLP | Sep 25, 2005 | Abandoned |
Array
(
[id] => 5171911
[patent_doc_number] => 20070072344
[patent_country] => US
[patent_kind] => A1
[patent_issue_date] => 2007-03-29
[patent_title] => 'Gel package structural enhancement of compression system board connections'
[patent_app_type] => utility
[patent_app_number] => 11/234883
[patent_app_country] => US
[patent_app_date] => 2005-09-26
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 13
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[patent_no_of_words] => 4718
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[pdf_file] => publications/A1/0072/20070072344.pdf
[firstpage_image] =>[orig_patent_app_number] => 11234883
[rel_patent_id] =>[rel_patent_doc_number] =>) 11/234883 | Method for using gel package structure enhancing thermal dissipation between compressed printed circuit board and heat sink mechanical stiffener | Sep 25, 2005 | Issued |
Array
(
[id] => 5637534
[patent_doc_number] => 20060068507
[patent_country] => US
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[patent_issue_date] => 2006-03-30
[patent_title] => 'Methods of forming a material film, methods of forming a capacitor, and methods of forming a semiconductor memory device using the same'
[patent_app_type] => utility
[patent_app_number] => 11/233363
[patent_app_country] => US
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[pdf_file] => publications/A1/0068/20060068507.pdf
[firstpage_image] =>[orig_patent_app_number] => 11233363
[rel_patent_id] =>[rel_patent_doc_number] =>) 11/233363 | Methods of forming a material film, methods of forming a capacitor, and methods of forming a semiconductor memory device using the same | Sep 22, 2005 | Abandoned |
Array
(
[id] => 5637632
[patent_doc_number] => 20060068605
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[patent_kind] => A1
[patent_issue_date] => 2006-03-30
[patent_title] => 'Method of manufacturing oxide film and method of manufacturing semiconductor device'
[patent_app_type] => utility
[patent_app_number] => 11/233024
[patent_app_country] => US
[patent_app_date] => 2005-09-23
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Array
(
[id] => 5126001
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[patent_issue_date] => 2007-10-11
[patent_title] => 'Method of aligning carbon nanotubes and method of manufacturing field emission device using the same'
[patent_app_type] => utility
[patent_app_number] => 11/225174
[patent_app_country] => US
[patent_app_date] => 2005-09-14
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[patent_drawing_sheets_cnt] => 5
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[rel_patent_id] =>[rel_patent_doc_number] =>) 11/225174 | Method of aligning carbon nanotubes and method of manufacturing field emission device using the same | Sep 13, 2005 | Issued |
Array
(
[id] => 813693
[patent_doc_number] => 07413965
[patent_country] => US
[patent_kind] => B2
[patent_issue_date] => 2008-08-19
[patent_title] => 'Method of manufacturing a thin-film circuit substrate having penetrating structure, and protecting adhesive tape'
[patent_app_type] => utility
[patent_app_number] => 11/224924
[patent_app_country] => US
[patent_app_date] => 2005-09-14
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 0
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[patent_no_of_words] => 7644
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[pdf_file] => patents/07/413/07413965.pdf
[firstpage_image] =>[orig_patent_app_number] => 11224924
[rel_patent_id] =>[rel_patent_doc_number] =>) 11/224924 | Method of manufacturing a thin-film circuit substrate having penetrating structure, and protecting adhesive tape | Sep 13, 2005 | Issued |
Array
(
[id] => 5793707
[patent_doc_number] => 20060014388
[patent_country] => US
[patent_kind] => A1
[patent_issue_date] => 2006-01-19
[patent_title] => 'Wafer processing apparatus & methods for depositing cobalt silicide'
[patent_app_type] => utility
[patent_app_number] => 11/224863
[patent_app_country] => US
[patent_app_date] => 2005-09-12
[patent_effective_date] => 0000-00-00
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[rel_patent_id] =>[rel_patent_doc_number] =>) 11/224863 | Wafer processing apparatus & methods for depositing cobalt silicide | Sep 11, 2005 | Abandoned |
Array
(
[id] => 341553
[patent_doc_number] => 07501311
[patent_country] => US
[patent_kind] => B2
[patent_issue_date] => 2009-03-10
[patent_title] => 'Fabrication method of a wafer structure'
[patent_app_type] => utility
[patent_app_number] => 11/183833
[patent_app_country] => US
[patent_app_date] => 2005-07-19
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[firstpage_image] =>[orig_patent_app_number] => 11183833
[rel_patent_id] =>[rel_patent_doc_number] =>) 11/183833 | Fabrication method of a wafer structure | Jul 18, 2005 | Issued |
Array
(
[id] => 559300
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[patent_issue_date] => 2007-01-09
[patent_title] => 'Thin film transistor device and method of manufacturing the same'
[patent_app_type] => utility
[patent_app_number] => 11/183383
[patent_app_country] => US
[patent_app_date] => 2005-07-18
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[rel_patent_id] =>[rel_patent_doc_number] =>) 11/183383 | Thin film transistor device and method of manufacturing the same | Jul 17, 2005 | Issued |
Array
(
[id] => 5075368
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[patent_title] => 'Method for dicing a semiconductor wafer'
[patent_app_type] => utility
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[rel_patent_id] =>[rel_patent_doc_number] =>) 11/182794 | Method for dicing a semiconductor wafer | Jul 17, 2005 | Abandoned |
Array
(
[id] => 609440
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Array
(
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[patent_title] => 'Method of making group III-V nitride-based semiconductor crystal'
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Array
(
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Array
(
[id] => 5793692
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[patent_title] => 'Method for finishing metal line for semiconductor device'
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Array
(
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Array
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Array
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