
Samantha N. Wood
Examiner (ID: 6012, Phone: (571)272-6457 , Office: P/2915 )
| Most Active Art Unit | 2915 |
| Art Unit(s) | 2914, 2915 |
| Total Applications | 1312 |
| Issued Applications | 1235 |
| Pending Applications | 29 |
| Abandoned Applications | 58 |
Applications
| Application number | Title of the application | Filing Date | Status |
|---|---|---|---|
Array
(
[id] => 918381
[patent_doc_number] => 07323784
[patent_country] => US
[patent_kind] => B2
[patent_issue_date] => 2008-01-29
[patent_title] => 'Top via pattern for bond pad structure'
[patent_app_type] => utility
[patent_app_number] => 11/081704
[patent_app_country] => US
[patent_app_date] => 2005-03-17
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 2
[patent_figures_cnt] => 3
[patent_no_of_words] => 2858
[patent_no_of_claims] => 12
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[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => patent
[pdf_file] => patents/07/323/07323784.pdf
[firstpage_image] =>[orig_patent_app_number] => 11081704
[rel_patent_id] =>[rel_patent_doc_number] =>) 11/081704 | Top via pattern for bond pad structure | Mar 16, 2005 | Issued |
Array
(
[id] => 6942547
[patent_doc_number] => 20050194595
[patent_country] => US
[patent_kind] => A1
[patent_issue_date] => 2005-09-08
[patent_title] => 'Semiconductor device and method of manufacturing the same'
[patent_app_type] => utility
[patent_app_number] => 11/081564
[patent_app_country] => US
[patent_app_date] => 2005-03-17
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 15
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[pdf_file] => publications/A1/0194/20050194595.pdf
[firstpage_image] =>[orig_patent_app_number] => 11081564
[rel_patent_id] =>[rel_patent_doc_number] =>) 11/081564 | Semiconductor device and method of manufacturing the same | Mar 16, 2005 | Issued |
Array
(
[id] => 159226
[patent_doc_number] => 07674706
[patent_country] => US
[patent_kind] => B2
[patent_issue_date] => 2010-03-09
[patent_title] => 'System for modifying small structures using localized charge transfer mechanism to remove or deposit material'
[patent_app_type] => utility
[patent_app_number] => 11/081934
[patent_app_country] => US
[patent_app_date] => 2005-03-16
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 18
[patent_figures_cnt] => 38
[patent_no_of_words] => 7051
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[pdf_file] => patents/07/674/07674706.pdf
[firstpage_image] =>[orig_patent_app_number] => 11081934
[rel_patent_id] =>[rel_patent_doc_number] =>) 11/081934 | System for modifying small structures using localized charge transfer mechanism to remove or deposit material | Mar 15, 2005 | Issued |
Array
(
[id] => 6980379
[patent_doc_number] => 20050150447
[patent_country] => US
[patent_kind] => A1
[patent_issue_date] => 2005-07-14
[patent_title] => 'Recycling by mechanical means of a wafer comprising a multilayer structure after taking-off a thin layer thereof'
[patent_app_type] => utility
[patent_app_number] => 11/075323
[patent_app_country] => US
[patent_app_date] => 2005-03-07
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 2
[patent_figures_cnt] => 2
[patent_no_of_words] => 12229
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[pdf_file] => publications/A1/0150/20050150447.pdf
[firstpage_image] =>[orig_patent_app_number] => 11075323
[rel_patent_id] =>[rel_patent_doc_number] =>) 11/075323 | Recycling by mechanical means of a wafer comprising a multilayer structure after taking-off a thin layer thereof | Mar 6, 2005 | Issued |
Array
(
[id] => 442770
[patent_doc_number] => 07256075
[patent_country] => US
[patent_kind] => B2
[patent_issue_date] => 2007-08-14
[patent_title] => 'Recycling of a wafer comprising a multi-layer structure after taking-off a thin layer'
[patent_app_type] => utility
[patent_app_number] => 11/075273
[patent_app_country] => US
[patent_app_date] => 2005-03-07
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 3
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[patent_no_of_claims] => 30
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[pdf_file] => patents/07/256/07256075.pdf
[firstpage_image] =>[orig_patent_app_number] => 11075273
[rel_patent_id] =>[rel_patent_doc_number] =>) 11/075273 | Recycling of a wafer comprising a multi-layer structure after taking-off a thin layer | Mar 6, 2005 | Issued |
Array
(
[id] => 7001531
[patent_doc_number] => 20050167002
[patent_country] => US
[patent_kind] => A1
[patent_issue_date] => 2005-08-04
[patent_title] => 'Recycling of a wafer comprising a multi-layer structure after taking-off a thin layer'
[patent_app_type] => utility
[patent_app_number] => 11/075324
[patent_app_country] => US
[patent_app_date] => 2005-03-07
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[pdf_file] => publications/A1/0167/20050167002.pdf
[firstpage_image] =>[orig_patent_app_number] => 11075324
[rel_patent_id] =>[rel_patent_doc_number] =>) 11/075324 | Recycling of a wafer comprising a multi-layer structure after taking-off a thin layer | Mar 6, 2005 | Abandoned |
Array
(
[id] => 5708068
[patent_doc_number] => 20060049412
[patent_country] => US
[patent_kind] => A1
[patent_issue_date] => 2006-03-09
[patent_title] => 'CMOS image sensor and method for fabricating the same'
[patent_app_type] => utility
[patent_app_number] => 11/072674
[patent_app_country] => US
[patent_app_date] => 2005-03-03
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 10
[patent_figures_cnt] => 10
[patent_no_of_words] => 3869
[patent_no_of_claims] => 20
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[pdf_file] => publications/A1/0049/20060049412.pdf
[firstpage_image] =>[orig_patent_app_number] => 11072674
[rel_patent_id] =>[rel_patent_doc_number] =>) 11/072674 | CMOS image sensor and method for fabricating the same | Mar 2, 2005 | Abandoned |
Array
(
[id] => 6942628
[patent_doc_number] => 20050194676
[patent_country] => US
[patent_kind] => A1
[patent_issue_date] => 2005-09-08
[patent_title] => 'Resin-encapsulated semiconductor device and lead frame, and method for manufacturing the same'
[patent_app_type] => utility
[patent_app_number] => 11/071343
[patent_app_country] => US
[patent_app_date] => 2005-03-03
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 19
[patent_figures_cnt] => 19
[patent_no_of_words] => 7836
[patent_no_of_claims] => 15
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[pdf_file] => publications/A1/0194/20050194676.pdf
[firstpage_image] =>[orig_patent_app_number] => 11071343
[rel_patent_id] =>[rel_patent_doc_number] =>) 11/071343 | Resin-encapsulated semiconductor device and lead frame, and method for manufacturing the same | Mar 2, 2005 | Issued |
Array
(
[id] => 370173
[patent_doc_number] => 07476948
[patent_country] => US
[patent_kind] => B2
[patent_issue_date] => 2009-01-13
[patent_title] => 'Microminiature moving device and method of making the same'
[patent_app_type] => utility
[patent_app_number] => 11/069184
[patent_app_country] => US
[patent_app_date] => 2005-02-28
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 20
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[patent_no_of_words] => 10990
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[pdf_file] => patents/07/476/07476948.pdf
[firstpage_image] =>[orig_patent_app_number] => 11069184
[rel_patent_id] =>[rel_patent_doc_number] =>) 11/069184 | Microminiature moving device and method of making the same | Feb 27, 2005 | Issued |
Array
(
[id] => 5903554
[patent_doc_number] => 20060046437
[patent_country] => US
[patent_kind] => A1
[patent_issue_date] => 2006-03-02
[patent_title] => 'Method for forming individual semi-conductor devices'
[patent_app_type] => utility
[patent_app_number] => 11/066313
[patent_app_country] => US
[patent_app_date] => 2005-02-28
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 6
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[pdf_file] => publications/A1/0046/20060046437.pdf
[firstpage_image] =>[orig_patent_app_number] => 11066313
[rel_patent_id] =>[rel_patent_doc_number] =>) 11/066313 | Method for forming individual semi-conductor devices | Feb 27, 2005 | Issued |
Array
(
[id] => 7176689
[patent_doc_number] => 20050189629
[patent_country] => US
[patent_kind] => A1
[patent_issue_date] => 2005-09-01
[patent_title] => 'Method of manufacturing a semiconductor device'
[patent_app_type] => utility
[patent_app_number] => 11/066174
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[patent_app_date] => 2005-02-28
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[firstpage_image] =>[orig_patent_app_number] => 11066174
[rel_patent_id] =>[rel_patent_doc_number] =>) 11/066174 | Method of manufacturing a semiconductor device | Feb 27, 2005 | Abandoned |
Array
(
[id] => 756366
[patent_doc_number] => 07019391
[patent_country] => US
[patent_kind] => B2
[patent_issue_date] => 2006-03-28
[patent_title] => 'NANO IC packaging'
[patent_app_type] => utility
[patent_app_number] => 11/064363
[patent_app_country] => US
[patent_app_date] => 2005-02-23
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[pdf_file] => patents/07/019/07019391.pdf
[firstpage_image] =>[orig_patent_app_number] => 11064363
[rel_patent_id] =>[rel_patent_doc_number] =>) 11/064363 | NANO IC packaging | Feb 22, 2005 | Issued |
Array
(
[id] => 7048479
[patent_doc_number] => 20050184366
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[patent_kind] => A1
[patent_issue_date] => 2005-08-25
[patent_title] => 'Lead frame and method for manufacturing semiconductor package with the same'
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[firstpage_image] =>[orig_patent_app_number] => 11063353
[rel_patent_id] =>[rel_patent_doc_number] =>) 11/063353 | Lead frame and method for manufacturing semiconductor package with the same | Feb 22, 2005 | Issued |
Array
(
[id] => 7036711
[patent_doc_number] => 20050156172
[patent_country] => US
[patent_kind] => A1
[patent_issue_date] => 2005-07-21
[patent_title] => 'Light emitting device and method of manufacturing the same'
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[patent_app_number] => 11/060763
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[patent_app_date] => 2005-02-18
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[rel_patent_id] =>[rel_patent_doc_number] =>) 11/060763 | Light emitting device and method of manufacturing the same | Feb 17, 2005 | Issued |
Array
(
[id] => 7132981
[patent_doc_number] => 20050179122
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[patent_kind] => A1
[patent_issue_date] => 2005-08-18
[patent_title] => 'IC card'
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[patent_app_number] => 11/060373
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[firstpage_image] =>[orig_patent_app_number] => 11060373
[rel_patent_id] =>[rel_patent_doc_number] =>) 11/060373 | IC card | Feb 16, 2005 | Abandoned |
Array
(
[id] => 476637
[patent_doc_number] => 07227247
[patent_country] => US
[patent_kind] => B2
[patent_issue_date] => 2007-06-05
[patent_title] => 'IC package with signal land pads'
[patent_app_type] => utility
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[firstpage_image] =>[orig_patent_app_number] => 11060104
[rel_patent_id] =>[rel_patent_doc_number] =>) 11/060104 | IC package with signal land pads | Feb 15, 2005 | Issued |
Array
(
[id] => 6910005
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[patent_title] => 'Semiconductor device'
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Array
(
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[rel_patent_id] =>[rel_patent_doc_number] =>) 11/054413 | Device mounting method and device transport apparatus | Feb 8, 2005 | Abandoned |
Array
(
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[rel_patent_id] =>[rel_patent_doc_number] =>) 11/053794 | Method of electroplating a substance over a semiconductor substrate | Feb 7, 2005 | Issued |
Array
(
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[firstpage_image] =>[orig_patent_app_number] => 11049054
[rel_patent_id] =>[rel_patent_doc_number] =>) 11/049054 | Method for fabricating semiconductor packages | Jan 31, 2005 | Issued |