Samuel M. Heinrich

Array ( [id] => 3614342 [patent_doc_number] => 05685476 [patent_country] => US [patent_kind] => NA [patent_issue_date] => 1997-11-11 [patent_title] => 'Wire guiding apparatus, wire guiding method and a wire bonder equipped with said apparatus' [patent_app_type] => 1 [patent_app_number] => 8/583429 [patent_app_country] => US [patent_app_date] => 1996-01-05 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 5 [patent_figures_cnt] => 5 [patent_no_of_words] => 7349 [patent_no_of_claims] => 15 [patent_no_of_ind_claims] => 7 [patent_words_short_claim] => 59 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/05/685/05685476.pdf [firstpage_image] =>[orig_patent_app_number] => 583429 [rel_patent_id] =>[rel_patent_doc_number] =>)

Array ( [id] => 3914320 [patent_doc_number] => 05938102 [patent_country] => US [patent_kind] => NA [patent_issue_date] => 1999-08-17 [patent_title] => 'High speed jet soldering system' [patent_app_type] => 1 [patent_app_number] => 8/583641 [patent_app_country] => US [patent_app_date] => 1996-01-05 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 3 [patent_figures_cnt] => 5 [patent_no_of_words] => 4309 [patent_no_of_claims] => 22 [patent_no_of_ind_claims] => 2 [patent_words_short_claim] => 124 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/05/938/05938102.pdf [firstpage_image] =>[orig_patent_app_number] => 583641 [rel_patent_id] =>[rel_patent_doc_number] =>)

Array ( [id] => 3979195 [patent_doc_number] => 05918794 [patent_country] => US [patent_kind] => NA [patent_issue_date] => 1999-07-06 [patent_title] => 'Solder bonding of dense arrays of microminiature contact pads' [patent_app_type] => 1 [patent_app_number] => 8/581299 [patent_app_country] => US [patent_app_date] => 1995-12-28 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 5 [patent_figures_cnt] => 8 [patent_no_of_words] => 4241 [patent_no_of_claims] => 11 [patent_no_of_ind_claims] => 2 [patent_words_short_claim] => 129 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/05/918/05918794.pdf [firstpage_image] =>[orig_patent_app_number] => 581299 [rel_patent_id] =>[rel_patent_doc_number] =>)

Array ( [id] => 3713879 [patent_doc_number] => 05699951 [patent_country] => US [patent_kind] => NA [patent_issue_date] => 1997-12-23 [patent_title] => 'Wire bonder and a bonding tool and bonding arm' [patent_app_type] => 1 [patent_app_number] => 8/577157 [patent_app_country] => US [patent_app_date] => 1995-12-22 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 18 [patent_figures_cnt] => 29 [patent_no_of_words] => 12821 [patent_no_of_claims] => 12 [patent_no_of_ind_claims] => 1 [patent_words_short_claim] => 94 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/05/699/05699951.pdf [firstpage_image] =>[orig_patent_app_number] => 577157 [rel_patent_id] =>[rel_patent_doc_number] =>)

Array ( [id] => 3756624 [patent_doc_number] => 05806753 [patent_country] => US [patent_kind] => NA [patent_issue_date] => 1998-09-15 [patent_title] => 'Application of low temperature metallurgical paste to form a bond structure to attach an electronic component to a carrier' [patent_app_type] => 1 [patent_app_number] => 8/577586 [patent_app_country] => US [patent_app_date] => 1995-12-22 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 7 [patent_figures_cnt] => 14 [patent_no_of_words] => 4217 [patent_no_of_claims] => 24 [patent_no_of_ind_claims] => 2 [patent_words_short_claim] => 105 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/05/806/05806753.pdf [firstpage_image] =>[orig_patent_app_number] => 577586 [rel_patent_id] =>[rel_patent_doc_number] =>)

Array ( [id] => 3809782 [patent_doc_number] => 05782399 [patent_country] => US [patent_kind] => NA [patent_issue_date] => 1998-07-21 [patent_title] => 'Method and apparatus for attaching spherical and/or non-spherical contacts to a substrate' [patent_app_type] => 1 [patent_app_number] => 8/577494 [patent_app_country] => US [patent_app_date] => 1995-12-22 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 10 [patent_figures_cnt] => 14 [patent_no_of_words] => 4494 [patent_no_of_claims] => 10 [patent_no_of_ind_claims] => 2 [patent_words_short_claim] => 298 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/05/782/05782399.pdf [firstpage_image] =>[orig_patent_app_number] => 577494 [rel_patent_id] =>[rel_patent_doc_number] =>)

Array ( [id] => 3758215 [patent_doc_number] => 05816473 [patent_country] => US [patent_kind] => NA [patent_issue_date] => 1998-10-06 [patent_title] => 'Method of fabricating electronic circuit device and apparatus for performing the same method' [patent_app_type] => 1 [patent_app_number] => 8/578054 [patent_app_country] => US [patent_app_date] => 1995-12-22 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 13 [patent_figures_cnt] => 49 [patent_no_of_words] => 6767 [patent_no_of_claims] => 45 [patent_no_of_ind_claims] => 13 [patent_words_short_claim] => 25 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/05/816/05816473.pdf [firstpage_image] =>[orig_patent_app_number] => 578054 [rel_patent_id] =>[rel_patent_doc_number] =>)

Array ( [id] => 3574693 [patent_doc_number] => 05549238 [patent_country] => US [patent_kind] => NA [patent_issue_date] => 1996-08-27 [patent_title] => 'Heat exchanger brazing tray' [patent_app_type] => 1 [patent_app_number] => 8/577069 [patent_app_country] => US [patent_app_date] => 1995-12-22 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 1 [patent_figures_cnt] => 4 [patent_no_of_words] => 2287 [patent_no_of_claims] => 12 [patent_no_of_ind_claims] => 3 [patent_words_short_claim] => 257 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/05/549/05549238.pdf [firstpage_image] =>[orig_patent_app_number] => 577069 [rel_patent_id] =>[rel_patent_doc_number] =>)

Array ( [id] => 3821587 [patent_doc_number] => 05711473 [patent_country] => US [patent_kind] => NA [patent_issue_date] => 1998-01-27 [patent_title] => 'Inert atmosphere soldering apparatus' [patent_app_type] => 1 [patent_app_number] => 8/577308 [patent_app_country] => US [patent_app_date] => 1995-12-22 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 6 [patent_figures_cnt] => 6 [patent_no_of_words] => 2044 [patent_no_of_claims] => 8 [patent_no_of_ind_claims] => 2 [patent_words_short_claim] => 178 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/05/711/05711473.pdf [firstpage_image] =>[orig_patent_app_number] => 577308 [rel_patent_id] =>[rel_patent_doc_number] =>)

Array ( [id] => 3818323 [patent_doc_number] => 05813590 [patent_country] => US [patent_kind] => NA [patent_issue_date] => 1998-09-29 [patent_title] => 'Extended travel wire bonding machine' [patent_app_type] => 1 [patent_app_number] => 8/574156 [patent_app_country] => US [patent_app_date] => 1995-12-18 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 2 [patent_figures_cnt] => 2 [patent_no_of_words] => 3169 [patent_no_of_claims] => 9 [patent_no_of_ind_claims] => 3 [patent_words_short_claim] => 97 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/05/813/05813590.pdf [firstpage_image] =>[orig_patent_app_number] => 574156 [rel_patent_id] =>[rel_patent_doc_number] =>)

Array ( [id] => 3872748 [patent_doc_number] => 05713506 [patent_country] => US [patent_kind] => NA [patent_issue_date] => 1998-02-03 [patent_title] => 'Vacuum holding rotary welding fixture' [patent_app_type] => 1 [patent_app_number] => 8/572337 [patent_app_country] => US [patent_app_date] => 1995-12-14 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 2 [patent_figures_cnt] => 3 [patent_no_of_words] => 2661 [patent_no_of_claims] => 10 [patent_no_of_ind_claims] => 1 [patent_words_short_claim] => 174 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/05/713/05713506.pdf [firstpage_image] =>[orig_patent_app_number] => 572337 [rel_patent_id] =>[rel_patent_doc_number] =>)

Array ( [id] => 3821600 [patent_doc_number] => 05711474 [patent_country] => US [patent_kind] => NA [patent_issue_date] => 1998-01-27 [patent_title] => 'Method and apparatus for welding tubular members' [patent_app_type] => 1 [patent_app_number] => 8/572112 [patent_app_country] => US [patent_app_date] => 1995-12-14 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 5 [patent_figures_cnt] => 6 [patent_no_of_words] => 5044 [patent_no_of_claims] => 5 [patent_no_of_ind_claims] => 2 [patent_words_short_claim] => 146 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/05/711/05711474.pdf [firstpage_image] =>[orig_patent_app_number] => 572112 [rel_patent_id] =>[rel_patent_doc_number] =>)

Array ( [id] => 3748808 [patent_doc_number] => 05740956 [patent_country] => US [patent_kind] => NA [patent_issue_date] => 1998-04-21 [patent_title] => 'Bonding method for semiconductor chips' [patent_app_type] => 1 [patent_app_number] => 8/570849 [patent_app_country] => US [patent_app_date] => 1995-12-12 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 3 [patent_figures_cnt] => 12 [patent_no_of_words] => 1683 [patent_no_of_claims] => 5 [patent_no_of_ind_claims] => 1 [patent_words_short_claim] => 155 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/05/740/05740956.pdf [firstpage_image] =>[orig_patent_app_number] => 570849 [rel_patent_id] =>[rel_patent_doc_number] =>)

Array ( [id] => 1382804 [patent_doc_number] => 06559409 [patent_country] => US [patent_kind] => B1 [patent_issue_date] => 2003-05-06 [patent_title] => 'Method for marking integrated circuits with a laser' [patent_app_type] => B1 [patent_app_number] => 08/567950 [patent_app_country] => US [patent_app_date] => 1995-12-06 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 1 [patent_figures_cnt] => 2 [patent_no_of_words] => 4573 [patent_no_of_claims] => 14 [patent_no_of_ind_claims] => 2 [patent_words_short_claim] => 80 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/06/559/06559409.pdf [firstpage_image] =>[orig_patent_app_number] => 08567950 [rel_patent_id] =>[rel_patent_doc_number] =>)

Array ( [id] => 3754870 [patent_doc_number] => 05755374 [patent_country] => US [patent_kind] => NA [patent_issue_date] => 1998-05-26 [patent_title] => 'Method of brazing' [patent_app_type] => 1 [patent_app_number] => 8/557089 [patent_app_country] => US [patent_app_date] => 1995-12-06 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 4 [patent_figures_cnt] => 10 [patent_no_of_words] => 4043 [patent_no_of_claims] => 22 [patent_no_of_ind_claims] => 1 [patent_words_short_claim] => 139 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/05/755/05755374.pdf [firstpage_image] =>[orig_patent_app_number] => 557089 [rel_patent_id] =>[rel_patent_doc_number] =>)

Array ( [id] => 3683490 [patent_doc_number] => 05617991 [patent_country] => US [patent_kind] => NA [patent_issue_date] => 1997-04-08 [patent_title] => 'Method for electrically conductive metal-to-metal bonding' [patent_app_type] => 1 [patent_app_number] => 8/566070 [patent_app_country] => US [patent_app_date] => 1995-12-01 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 5 [patent_figures_cnt] => 11 [patent_no_of_words] => 4069 [patent_no_of_claims] => 22 [patent_no_of_ind_claims] => 4 [patent_words_short_claim] => 104 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/05/617/05617991.pdf [firstpage_image] =>[orig_patent_app_number] => 566070 [rel_patent_id] =>[rel_patent_doc_number] =>)

Array ( [id] => 3725782 [patent_doc_number] => 05785236 [patent_country] => US [patent_kind] => NA [patent_issue_date] => 1998-07-28 [patent_title] => 'Advanced copper interconnect system that is compatible with existing IC wire bonding technology' [patent_app_type] => 1 [patent_app_number] => 8/564695 [patent_app_country] => US [patent_app_date] => 1995-11-29 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 2 [patent_figures_cnt] => 8 [patent_no_of_words] => 2655 [patent_no_of_claims] => 22 [patent_no_of_ind_claims] => 2 [patent_words_short_claim] => 136 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/05/785/05785236.pdf [firstpage_image] =>[orig_patent_app_number] => 564695 [rel_patent_id] =>[rel_patent_doc_number] =>)

Array ( [id] => 3608703 [patent_doc_number] => 05593081 [patent_country] => US [patent_kind] => NA [patent_issue_date] => 1997-01-14 [patent_title] => 'Welding apparatus' [patent_app_type] => 1 [patent_app_number] => 8/563374 [patent_app_country] => US [patent_app_date] => 1995-11-28 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 2 [patent_figures_cnt] => 2 [patent_no_of_words] => 1835 [patent_no_of_claims] => 10 [patent_no_of_ind_claims] => 1 [patent_words_short_claim] => 109 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/05/593/05593081.pdf [firstpage_image] =>[orig_patent_app_number] => 563374 [rel_patent_id] =>[rel_patent_doc_number] =>)

Array ( [id] => 3610201 [patent_doc_number] => 05601229 [patent_country] => US [patent_kind] => NA [patent_issue_date] => 1997-02-11 [patent_title] => 'Conductive metal ball attaching apparatus and method, and bump forming method' [patent_app_type] => 1 [patent_app_number] => 8/562959 [patent_app_country] => US [patent_app_date] => 1995-11-27 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 9 [patent_figures_cnt] => 15 [patent_no_of_words] => 6196 [patent_no_of_claims] => 24 [patent_no_of_ind_claims] => 4 [patent_words_short_claim] => 163 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/05/601/05601229.pdf [firstpage_image] =>[orig_patent_app_number] => 562959 [rel_patent_id] =>[rel_patent_doc_number] =>)

Array ( [id] => 3673230 [patent_doc_number] => 05695109 [patent_country] => US [patent_kind] => NA [patent_issue_date] => 1997-12-09 [patent_title] => 'Solder paste inter-layer alignment apparatus for area-array on-board rework' [patent_app_type] => 1 [patent_app_number] => 8/562007 [patent_app_country] => US [patent_app_date] => 1995-11-22 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 5 [patent_figures_cnt] => 12 [patent_no_of_words] => 3902 [patent_no_of_claims] => 7 [patent_no_of_ind_claims] => 2 [patent_words_short_claim] => 109 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/05/695/05695109.pdf [firstpage_image] =>[orig_patent_app_number] => 562007 [rel_patent_id] =>[rel_patent_doc_number] =>)