| Application number | Title of the application | Filing Date | Status |
|---|
Array
(
[id] => 3464551
[patent_doc_number] => 05431328
[patent_country] => US
[patent_kind] => NA
[patent_issue_date] => 1995-07-11
[patent_title] => 'Composite bump flip chip bonding'
[patent_app_type] => 1
[patent_app_number] => 8/239380
[patent_app_country] => US
[patent_app_date] => 1994-05-06
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 4
[patent_figures_cnt] => 8
[patent_no_of_words] => 2999
[patent_no_of_claims] => 12
[patent_no_of_ind_claims] => 2
[patent_words_short_claim] => 157
[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => patent
[pdf_file] => patents/05/431/05431328.pdf
[firstpage_image] =>[orig_patent_app_number] => 239380
[rel_patent_id] =>[rel_patent_doc_number] =>) 08/239380 | Composite bump flip chip bonding | May 5, 1994 | Issued |
Array
(
[id] => 3478597
[patent_doc_number] => 05425495
[patent_country] => US
[patent_kind] => NA
[patent_issue_date] => 1995-06-20
[patent_title] => 'Hot air circulation method for wave soldering machines'
[patent_app_type] => 1
[patent_app_number] => 8/239004
[patent_app_country] => US
[patent_app_date] => 1994-05-06
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 2
[patent_figures_cnt] => 2
[patent_no_of_words] => 1117
[patent_no_of_claims] => 4
[patent_no_of_ind_claims] => 2
[patent_words_short_claim] => 81
[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => patent
[pdf_file] => patents/05/425/05425495.pdf
[firstpage_image] =>[orig_patent_app_number] => 239004
[rel_patent_id] =>[rel_patent_doc_number] =>) 08/239004 | Hot air circulation method for wave soldering machines | May 5, 1994 | Issued |
Array
(
[id] => 3414770
[patent_doc_number] => 05415338
[patent_country] => US
[patent_kind] => NA
[patent_issue_date] => 1995-05-16
[patent_title] => 'Solder marking device and method of marking solder'
[patent_app_type] => 1
[patent_app_number] => 8/237294
[patent_app_country] => US
[patent_app_date] => 1994-05-03
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 8
[patent_figures_cnt] => 15
[patent_no_of_words] => 3835
[patent_no_of_claims] => 20
[patent_no_of_ind_claims] => 2
[patent_words_short_claim] => 44
[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => patent
[pdf_file] => patents/05/415/05415338.pdf
[firstpage_image] =>[orig_patent_app_number] => 237294
[rel_patent_id] =>[rel_patent_doc_number] =>) 08/237294 | Solder marking device and method of marking solder | May 2, 1994 | Issued |
Array
(
[id] => 3577638
[patent_doc_number] => 05516031
[patent_country] => US
[patent_kind] => NA
[patent_issue_date] => 1996-05-14
[patent_title] => 'Soldering method and apparatus for use in connecting electronic circuit devices'
[patent_app_type] => 1
[patent_app_number] => 8/235909
[patent_app_country] => US
[patent_app_date] => 1994-05-02
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 11
[patent_figures_cnt] => 18
[patent_no_of_words] => 5494
[patent_no_of_claims] => 27
[patent_no_of_ind_claims] => 2
[patent_words_short_claim] => 109
[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => patent
[pdf_file] => patents/05/516/05516031.pdf
[firstpage_image] =>[orig_patent_app_number] => 235909
[rel_patent_id] =>[rel_patent_doc_number] =>) 08/235909 | Soldering method and apparatus for use in connecting electronic circuit devices | May 1, 1994 | Issued |
Array
(
[id] => 3514760
[patent_doc_number] => 05540379
[patent_country] => US
[patent_kind] => NA
[patent_issue_date] => 1996-07-30
[patent_title] => 'Soldering process'
[patent_app_type] => 1
[patent_app_number] => 8/236611
[patent_app_country] => US
[patent_app_date] => 1994-05-02
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 4
[patent_figures_cnt] => 6
[patent_no_of_words] => 3557
[patent_no_of_claims] => 22
[patent_no_of_ind_claims] => 5
[patent_words_short_claim] => 70
[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => patent
[pdf_file] => patents/05/540/05540379.pdf
[firstpage_image] =>[orig_patent_app_number] => 236611
[rel_patent_id] =>[rel_patent_doc_number] =>) 08/236611 | Soldering process | May 1, 1994 | Issued |
Array
(
[id] => 3508942
[patent_doc_number] => 05485949
[patent_country] => US
[patent_kind] => NA
[patent_issue_date] => 1996-01-23
[patent_title] => 'Capillary for a wire bonding apparatus and a method for forming an electric connection bump using the capillary'
[patent_app_type] => 1
[patent_app_number] => 8/233829
[patent_app_country] => US
[patent_app_date] => 1994-04-26
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 14
[patent_figures_cnt] => 49
[patent_no_of_words] => 8366
[patent_no_of_claims] => 19
[patent_no_of_ind_claims] => 3
[patent_words_short_claim] => 102
[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => patent
[pdf_file] => patents/05/485/05485949.pdf
[firstpage_image] =>[orig_patent_app_number] => 233829
[rel_patent_id] =>[rel_patent_doc_number] =>) 08/233829 | Capillary for a wire bonding apparatus and a method for forming an electric connection bump using the capillary | Apr 25, 1994 | Issued |
Array
(
[id] => 3098051
[patent_doc_number] => 05395038
[patent_country] => US
[patent_kind] => NA
[patent_issue_date] => 1995-03-07
[patent_title] => 'High placement accuracy wire bonder for joining small closely spaced wiring features'
[patent_app_type] => 1
[patent_app_number] => 8/233659
[patent_app_country] => US
[patent_app_date] => 1994-04-25
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 7
[patent_figures_cnt] => 7
[patent_no_of_words] => 2443
[patent_no_of_claims] => 9
[patent_no_of_ind_claims] => 3
[patent_words_short_claim] => 98
[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => patent
[pdf_file] => patents/05/395/05395038.pdf
[firstpage_image] =>[orig_patent_app_number] => 233659
[rel_patent_id] =>[rel_patent_doc_number] =>) 08/233659 | High placement accuracy wire bonder for joining small closely spaced wiring features | Apr 24, 1994 | Issued |
Array
(
[id] => 3090980
[patent_doc_number] => 05417363
[patent_country] => US
[patent_kind] => NA
[patent_issue_date] => 1995-05-23
[patent_title] => 'Process for bonding contacts to a contact base by hard soldering and semifinished product which can be obtained by this process'
[patent_app_type] => 1
[patent_app_number] => 8/232003
[patent_app_country] => US
[patent_app_date] => 1994-04-22
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 0
[patent_figures_cnt] => 0
[patent_no_of_words] => 1952
[patent_no_of_claims] => 13
[patent_no_of_ind_claims] => 3
[patent_words_short_claim] => 142
[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => patent
[pdf_file] => patents/05/417/05417363.pdf
[firstpage_image] =>[orig_patent_app_number] => 232003
[rel_patent_id] =>[rel_patent_doc_number] =>) 08/232003 | Process for bonding contacts to a contact base by hard soldering and semifinished product which can be obtained by this process | Apr 21, 1994 | Issued |
| 08/230034 | REFLOW PROCESS FOR MIXED TECHNOLOGY ON A PRINTED WIRING BOARD | Apr 18, 1994 | Abandoned |
Array
(
[id] => 3431214
[patent_doc_number] => 05465897
[patent_country] => US
[patent_kind] => NA
[patent_issue_date] => 1995-11-14
[patent_title] => 'Bonded ultrasonic transducer and method for making'
[patent_app_type] => 1
[patent_app_number] => 8/220306
[patent_app_country] => US
[patent_app_date] => 1994-03-29
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 4
[patent_figures_cnt] => 12
[patent_no_of_words] => 2440
[patent_no_of_claims] => 4
[patent_no_of_ind_claims] => 2
[patent_words_short_claim] => 87
[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => patent
[pdf_file] => patents/05/465/05465897.pdf
[firstpage_image] =>[orig_patent_app_number] => 220306
[rel_patent_id] =>[rel_patent_doc_number] =>) 08/220306 | Bonded ultrasonic transducer and method for making | Mar 28, 1994 | Issued |
Array
(
[id] => 3492632
[patent_doc_number] => 05513791
[patent_country] => US
[patent_kind] => NA
[patent_issue_date] => 1996-05-07
[patent_title] => 'Strippable mask patterning of stop-off for diffusion bond processing'
[patent_app_type] => 1
[patent_app_number] => 8/218925
[patent_app_country] => US
[patent_app_date] => 1994-03-28
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 1
[patent_figures_cnt] => 4
[patent_no_of_words] => 3986
[patent_no_of_claims] => 11
[patent_no_of_ind_claims] => 3
[patent_words_short_claim] => 219
[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => patent
[pdf_file] => patents/05/513/05513791.pdf
[firstpage_image] =>[orig_patent_app_number] => 218925
[rel_patent_id] =>[rel_patent_doc_number] =>) 08/218925 | Strippable mask patterning of stop-off for diffusion bond processing | Mar 27, 1994 | Issued |
Array
(
[id] => 3105027
[patent_doc_number] => 05449108
[patent_country] => US
[patent_kind] => NA
[patent_issue_date] => 1995-09-12
[patent_title] => 'Method for forming a bump on a semiconductor device'
[patent_app_type] => 1
[patent_app_number] => 8/213430
[patent_app_country] => US
[patent_app_date] => 1994-03-15
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 4
[patent_figures_cnt] => 14
[patent_no_of_words] => 2027
[patent_no_of_claims] => 5
[patent_no_of_ind_claims] => 2
[patent_words_short_claim] => 195
[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => patent
[pdf_file] => patents/05/449/05449108.pdf
[firstpage_image] =>[orig_patent_app_number] => 213430
[rel_patent_id] =>[rel_patent_doc_number] =>) 08/213430 | Method for forming a bump on a semiconductor device | Mar 14, 1994 | Issued |
Array
(
[id] => 3531811
[patent_doc_number] => 05553770
[patent_country] => US
[patent_kind] => NA
[patent_issue_date] => 1996-09-10
[patent_title] => 'Heat exchanger assemblies-material for use therin, and a method of making the material'
[patent_app_type] => 1
[patent_app_number] => 8/207456
[patent_app_country] => US
[patent_app_date] => 1994-03-07
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 2
[patent_figures_cnt] => 6
[patent_no_of_words] => 2630
[patent_no_of_claims] => 11
[patent_no_of_ind_claims] => 2
[patent_words_short_claim] => 135
[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => patent
[pdf_file] => patents/05/553/05553770.pdf
[firstpage_image] =>[orig_patent_app_number] => 207456
[rel_patent_id] =>[rel_patent_doc_number] =>) 08/207456 | Heat exchanger assemblies-material for use therin, and a method of making the material | Mar 6, 1994 | Issued |
Array
(
[id] => 3400279
[patent_doc_number] => 05411199
[patent_country] => US
[patent_kind] => NA
[patent_issue_date] => 1995-05-02
[patent_title] => 'Method for attaching a shield'
[patent_app_type] => 1
[patent_app_number] => 8/206693
[patent_app_country] => US
[patent_app_date] => 1994-03-07
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 2
[patent_figures_cnt] => 4
[patent_no_of_words] => 1880
[patent_no_of_claims] => 13
[patent_no_of_ind_claims] => 3
[patent_words_short_claim] => 117
[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => patent
[pdf_file] => patents/05/411/05411199.pdf
[firstpage_image] =>[orig_patent_app_number] => 206693
[rel_patent_id] =>[rel_patent_doc_number] =>) 08/206693 | Method for attaching a shield | Mar 6, 1994 | Issued |
Array
(
[id] => 3400294
[patent_doc_number] => 05411200
[patent_country] => US
[patent_kind] => NA
[patent_issue_date] => 1995-05-02
[patent_title] => 'Process and apparatus for the wave soldering of circuit boards'
[patent_app_type] => 1
[patent_app_number] => 8/202489
[patent_app_country] => US
[patent_app_date] => 1994-02-28
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 6
[patent_figures_cnt] => 10
[patent_no_of_words] => 5914
[patent_no_of_claims] => 41
[patent_no_of_ind_claims] => 11
[patent_words_short_claim] => 70
[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => patent
[pdf_file] => patents/05/411/05411200.pdf
[firstpage_image] =>[orig_patent_app_number] => 202489
[rel_patent_id] =>[rel_patent_doc_number] =>) 08/202489 | Process and apparatus for the wave soldering of circuit boards | Feb 27, 1994 | Issued |
Array
(
[id] => 3093193
[patent_doc_number] => 05407123
[patent_country] => US
[patent_kind] => NA
[patent_issue_date] => 1995-04-18
[patent_title] => 'Brush auger machine'
[patent_app_type] => 1
[patent_app_number] => 8/199566
[patent_app_country] => US
[patent_app_date] => 1994-02-22
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 5
[patent_figures_cnt] => 6
[patent_no_of_words] => 2286
[patent_no_of_claims] => 15
[patent_no_of_ind_claims] => 3
[patent_words_short_claim] => 84
[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => patent
[pdf_file] => patents/05/407/05407123.pdf
[firstpage_image] =>[orig_patent_app_number] => 199566
[rel_patent_id] =>[rel_patent_doc_number] =>) 08/199566 | Brush auger machine | Feb 21, 1994 | Issued |
Array
(
[id] => 3445266
[patent_doc_number] => 05400950
[patent_country] => US
[patent_kind] => NA
[patent_issue_date] => 1995-03-28
[patent_title] => 'Method for controlling solder bump height for flip chip integrated circuit devices'
[patent_app_type] => 1
[patent_app_number] => 8/199869
[patent_app_country] => US
[patent_app_date] => 1994-02-22
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 1
[patent_figures_cnt] => 2
[patent_no_of_words] => 3987
[patent_no_of_claims] => 9
[patent_no_of_ind_claims] => 2
[patent_words_short_claim] => 169
[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => patent
[pdf_file] => patents/05/400/05400950.pdf
[firstpage_image] =>[orig_patent_app_number] => 199869
[rel_patent_id] =>[rel_patent_doc_number] =>) 08/199869 | Method for controlling solder bump height for flip chip integrated circuit devices | Feb 21, 1994 | Issued |
| 08/197166 | METHOD FOR JOINING CERAMIC AND METAL-CERAMIC HEATING ELEMENTS TO ELECTRICAL TERMINALS BY MICROPYRETIC SYNTHESIS, COMPOSITIONS FOR ELECTRICAL TERMINALS AND HEATERS COMPRISING THE SAME | Feb 15, 1994 | Abandoned |
Array
(
[id] => 3417979
[patent_doc_number] => 05454507
[patent_country] => US
[patent_kind] => NA
[patent_issue_date] => 1995-10-03
[patent_title] => 'Method for vacuum brazing aluminum members'
[patent_app_type] => 1
[patent_app_number] => 8/193856
[patent_app_country] => US
[patent_app_date] => 1994-02-09
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 11
[patent_figures_cnt] => 11
[patent_no_of_words] => 7162
[patent_no_of_claims] => 4
[patent_no_of_ind_claims] => 1
[patent_words_short_claim] => 145
[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => patent
[pdf_file] => patents/05/454/05454507.pdf
[firstpage_image] =>[orig_patent_app_number] => 193856
[rel_patent_id] =>[rel_patent_doc_number] =>) 08/193856 | Method for vacuum brazing aluminum members | Feb 8, 1994 | Issued |
Array
(
[id] => 3441808
[patent_doc_number] => 05385289
[patent_country] => US
[patent_kind] => NA
[patent_issue_date] => 1995-01-31
[patent_title] => 'Embedded features for registration measurement in electronics manufacturing'
[patent_app_type] => 1
[patent_app_number] => 8/193309
[patent_app_country] => US
[patent_app_date] => 1994-02-08
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 5
[patent_figures_cnt] => 19
[patent_no_of_words] => 4853
[patent_no_of_claims] => 22
[patent_no_of_ind_claims] => 4
[patent_words_short_claim] => 327
[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => patent
[pdf_file] => patents/05/385/05385289.pdf
[firstpage_image] =>[orig_patent_app_number] => 193309
[rel_patent_id] =>[rel_patent_doc_number] =>) 08/193309 | Embedded features for registration measurement in electronics manufacturing | Feb 7, 1994 | Issued |