Search

Samuel M. Heinrich

Examiner (ID: 5136, Phone: (571)272-1175 , Office: P/3742 )

Most Active Art Unit
3205
Art Unit(s)
3761, 3742, 1722, 1725, 1793, 3205, 2899, 3202, 1754, 1775
Total Applications
3466
Issued Applications
2884
Pending Applications
81
Abandoned Applications
502

Applications

Application numberTitle of the applicationFiling DateStatus
Array ( [id] => 3464551 [patent_doc_number] => 05431328 [patent_country] => US [patent_kind] => NA [patent_issue_date] => 1995-07-11 [patent_title] => 'Composite bump flip chip bonding' [patent_app_type] => 1 [patent_app_number] => 8/239380 [patent_app_country] => US [patent_app_date] => 1994-05-06 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 4 [patent_figures_cnt] => 8 [patent_no_of_words] => 2999 [patent_no_of_claims] => 12 [patent_no_of_ind_claims] => 2 [patent_words_short_claim] => 157 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/05/431/05431328.pdf [firstpage_image] =>[orig_patent_app_number] => 239380 [rel_patent_id] =>[rel_patent_doc_number] =>)
08/239380
Composite bump flip chip bonding May 5, 1994 Issued
Array ( [id] => 3478597 [patent_doc_number] => 05425495 [patent_country] => US [patent_kind] => NA [patent_issue_date] => 1995-06-20 [patent_title] => 'Hot air circulation method for wave soldering machines' [patent_app_type] => 1 [patent_app_number] => 8/239004 [patent_app_country] => US [patent_app_date] => 1994-05-06 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 2 [patent_figures_cnt] => 2 [patent_no_of_words] => 1117 [patent_no_of_claims] => 4 [patent_no_of_ind_claims] => 2 [patent_words_short_claim] => 81 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/05/425/05425495.pdf [firstpage_image] =>[orig_patent_app_number] => 239004 [rel_patent_id] =>[rel_patent_doc_number] =>)
08/239004
Hot air circulation method for wave soldering machines May 5, 1994 Issued
Array ( [id] => 3414770 [patent_doc_number] => 05415338 [patent_country] => US [patent_kind] => NA [patent_issue_date] => 1995-05-16 [patent_title] => 'Solder marking device and method of marking solder' [patent_app_type] => 1 [patent_app_number] => 8/237294 [patent_app_country] => US [patent_app_date] => 1994-05-03 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 8 [patent_figures_cnt] => 15 [patent_no_of_words] => 3835 [patent_no_of_claims] => 20 [patent_no_of_ind_claims] => 2 [patent_words_short_claim] => 44 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/05/415/05415338.pdf [firstpage_image] =>[orig_patent_app_number] => 237294 [rel_patent_id] =>[rel_patent_doc_number] =>)
08/237294
Solder marking device and method of marking solder May 2, 1994 Issued
Array ( [id] => 3577638 [patent_doc_number] => 05516031 [patent_country] => US [patent_kind] => NA [patent_issue_date] => 1996-05-14 [patent_title] => 'Soldering method and apparatus for use in connecting electronic circuit devices' [patent_app_type] => 1 [patent_app_number] => 8/235909 [patent_app_country] => US [patent_app_date] => 1994-05-02 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 11 [patent_figures_cnt] => 18 [patent_no_of_words] => 5494 [patent_no_of_claims] => 27 [patent_no_of_ind_claims] => 2 [patent_words_short_claim] => 109 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/05/516/05516031.pdf [firstpage_image] =>[orig_patent_app_number] => 235909 [rel_patent_id] =>[rel_patent_doc_number] =>)
08/235909
Soldering method and apparatus for use in connecting electronic circuit devices May 1, 1994 Issued
Array ( [id] => 3514760 [patent_doc_number] => 05540379 [patent_country] => US [patent_kind] => NA [patent_issue_date] => 1996-07-30 [patent_title] => 'Soldering process' [patent_app_type] => 1 [patent_app_number] => 8/236611 [patent_app_country] => US [patent_app_date] => 1994-05-02 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 4 [patent_figures_cnt] => 6 [patent_no_of_words] => 3557 [patent_no_of_claims] => 22 [patent_no_of_ind_claims] => 5 [patent_words_short_claim] => 70 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/05/540/05540379.pdf [firstpage_image] =>[orig_patent_app_number] => 236611 [rel_patent_id] =>[rel_patent_doc_number] =>)
08/236611
Soldering process May 1, 1994 Issued
Array ( [id] => 3508942 [patent_doc_number] => 05485949 [patent_country] => US [patent_kind] => NA [patent_issue_date] => 1996-01-23 [patent_title] => 'Capillary for a wire bonding apparatus and a method for forming an electric connection bump using the capillary' [patent_app_type] => 1 [patent_app_number] => 8/233829 [patent_app_country] => US [patent_app_date] => 1994-04-26 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 14 [patent_figures_cnt] => 49 [patent_no_of_words] => 8366 [patent_no_of_claims] => 19 [patent_no_of_ind_claims] => 3 [patent_words_short_claim] => 102 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/05/485/05485949.pdf [firstpage_image] =>[orig_patent_app_number] => 233829 [rel_patent_id] =>[rel_patent_doc_number] =>)
08/233829
Capillary for a wire bonding apparatus and a method for forming an electric connection bump using the capillary Apr 25, 1994 Issued
Array ( [id] => 3098051 [patent_doc_number] => 05395038 [patent_country] => US [patent_kind] => NA [patent_issue_date] => 1995-03-07 [patent_title] => 'High placement accuracy wire bonder for joining small closely spaced wiring features' [patent_app_type] => 1 [patent_app_number] => 8/233659 [patent_app_country] => US [patent_app_date] => 1994-04-25 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 7 [patent_figures_cnt] => 7 [patent_no_of_words] => 2443 [patent_no_of_claims] => 9 [patent_no_of_ind_claims] => 3 [patent_words_short_claim] => 98 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/05/395/05395038.pdf [firstpage_image] =>[orig_patent_app_number] => 233659 [rel_patent_id] =>[rel_patent_doc_number] =>)
08/233659
High placement accuracy wire bonder for joining small closely spaced wiring features Apr 24, 1994 Issued
Array ( [id] => 3090980 [patent_doc_number] => 05417363 [patent_country] => US [patent_kind] => NA [patent_issue_date] => 1995-05-23 [patent_title] => 'Process for bonding contacts to a contact base by hard soldering and semifinished product which can be obtained by this process' [patent_app_type] => 1 [patent_app_number] => 8/232003 [patent_app_country] => US [patent_app_date] => 1994-04-22 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 0 [patent_figures_cnt] => 0 [patent_no_of_words] => 1952 [patent_no_of_claims] => 13 [patent_no_of_ind_claims] => 3 [patent_words_short_claim] => 142 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/05/417/05417363.pdf [firstpage_image] =>[orig_patent_app_number] => 232003 [rel_patent_id] =>[rel_patent_doc_number] =>)
08/232003
Process for bonding contacts to a contact base by hard soldering and semifinished product which can be obtained by this process Apr 21, 1994 Issued
08/230034 REFLOW PROCESS FOR MIXED TECHNOLOGY ON A PRINTED WIRING BOARD Apr 18, 1994 Abandoned
Array ( [id] => 3431214 [patent_doc_number] => 05465897 [patent_country] => US [patent_kind] => NA [patent_issue_date] => 1995-11-14 [patent_title] => 'Bonded ultrasonic transducer and method for making' [patent_app_type] => 1 [patent_app_number] => 8/220306 [patent_app_country] => US [patent_app_date] => 1994-03-29 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 4 [patent_figures_cnt] => 12 [patent_no_of_words] => 2440 [patent_no_of_claims] => 4 [patent_no_of_ind_claims] => 2 [patent_words_short_claim] => 87 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/05/465/05465897.pdf [firstpage_image] =>[orig_patent_app_number] => 220306 [rel_patent_id] =>[rel_patent_doc_number] =>)
08/220306
Bonded ultrasonic transducer and method for making Mar 28, 1994 Issued
Array ( [id] => 3492632 [patent_doc_number] => 05513791 [patent_country] => US [patent_kind] => NA [patent_issue_date] => 1996-05-07 [patent_title] => 'Strippable mask patterning of stop-off for diffusion bond processing' [patent_app_type] => 1 [patent_app_number] => 8/218925 [patent_app_country] => US [patent_app_date] => 1994-03-28 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 1 [patent_figures_cnt] => 4 [patent_no_of_words] => 3986 [patent_no_of_claims] => 11 [patent_no_of_ind_claims] => 3 [patent_words_short_claim] => 219 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/05/513/05513791.pdf [firstpage_image] =>[orig_patent_app_number] => 218925 [rel_patent_id] =>[rel_patent_doc_number] =>)
08/218925
Strippable mask patterning of stop-off for diffusion bond processing Mar 27, 1994 Issued
Array ( [id] => 3105027 [patent_doc_number] => 05449108 [patent_country] => US [patent_kind] => NA [patent_issue_date] => 1995-09-12 [patent_title] => 'Method for forming a bump on a semiconductor device' [patent_app_type] => 1 [patent_app_number] => 8/213430 [patent_app_country] => US [patent_app_date] => 1994-03-15 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 4 [patent_figures_cnt] => 14 [patent_no_of_words] => 2027 [patent_no_of_claims] => 5 [patent_no_of_ind_claims] => 2 [patent_words_short_claim] => 195 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/05/449/05449108.pdf [firstpage_image] =>[orig_patent_app_number] => 213430 [rel_patent_id] =>[rel_patent_doc_number] =>)
08/213430
Method for forming a bump on a semiconductor device Mar 14, 1994 Issued
Array ( [id] => 3531811 [patent_doc_number] => 05553770 [patent_country] => US [patent_kind] => NA [patent_issue_date] => 1996-09-10 [patent_title] => 'Heat exchanger assemblies-material for use therin, and a method of making the material' [patent_app_type] => 1 [patent_app_number] => 8/207456 [patent_app_country] => US [patent_app_date] => 1994-03-07 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 2 [patent_figures_cnt] => 6 [patent_no_of_words] => 2630 [patent_no_of_claims] => 11 [patent_no_of_ind_claims] => 2 [patent_words_short_claim] => 135 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/05/553/05553770.pdf [firstpage_image] =>[orig_patent_app_number] => 207456 [rel_patent_id] =>[rel_patent_doc_number] =>)
08/207456
Heat exchanger assemblies-material for use therin, and a method of making the material Mar 6, 1994 Issued
Array ( [id] => 3400279 [patent_doc_number] => 05411199 [patent_country] => US [patent_kind] => NA [patent_issue_date] => 1995-05-02 [patent_title] => 'Method for attaching a shield' [patent_app_type] => 1 [patent_app_number] => 8/206693 [patent_app_country] => US [patent_app_date] => 1994-03-07 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 2 [patent_figures_cnt] => 4 [patent_no_of_words] => 1880 [patent_no_of_claims] => 13 [patent_no_of_ind_claims] => 3 [patent_words_short_claim] => 117 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/05/411/05411199.pdf [firstpage_image] =>[orig_patent_app_number] => 206693 [rel_patent_id] =>[rel_patent_doc_number] =>)
08/206693
Method for attaching a shield Mar 6, 1994 Issued
Array ( [id] => 3400294 [patent_doc_number] => 05411200 [patent_country] => US [patent_kind] => NA [patent_issue_date] => 1995-05-02 [patent_title] => 'Process and apparatus for the wave soldering of circuit boards' [patent_app_type] => 1 [patent_app_number] => 8/202489 [patent_app_country] => US [patent_app_date] => 1994-02-28 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 6 [patent_figures_cnt] => 10 [patent_no_of_words] => 5914 [patent_no_of_claims] => 41 [patent_no_of_ind_claims] => 11 [patent_words_short_claim] => 70 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/05/411/05411200.pdf [firstpage_image] =>[orig_patent_app_number] => 202489 [rel_patent_id] =>[rel_patent_doc_number] =>)
08/202489
Process and apparatus for the wave soldering of circuit boards Feb 27, 1994 Issued
Array ( [id] => 3093193 [patent_doc_number] => 05407123 [patent_country] => US [patent_kind] => NA [patent_issue_date] => 1995-04-18 [patent_title] => 'Brush auger machine' [patent_app_type] => 1 [patent_app_number] => 8/199566 [patent_app_country] => US [patent_app_date] => 1994-02-22 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 5 [patent_figures_cnt] => 6 [patent_no_of_words] => 2286 [patent_no_of_claims] => 15 [patent_no_of_ind_claims] => 3 [patent_words_short_claim] => 84 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/05/407/05407123.pdf [firstpage_image] =>[orig_patent_app_number] => 199566 [rel_patent_id] =>[rel_patent_doc_number] =>)
08/199566
Brush auger machine Feb 21, 1994 Issued
Array ( [id] => 3445266 [patent_doc_number] => 05400950 [patent_country] => US [patent_kind] => NA [patent_issue_date] => 1995-03-28 [patent_title] => 'Method for controlling solder bump height for flip chip integrated circuit devices' [patent_app_type] => 1 [patent_app_number] => 8/199869 [patent_app_country] => US [patent_app_date] => 1994-02-22 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 1 [patent_figures_cnt] => 2 [patent_no_of_words] => 3987 [patent_no_of_claims] => 9 [patent_no_of_ind_claims] => 2 [patent_words_short_claim] => 169 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/05/400/05400950.pdf [firstpage_image] =>[orig_patent_app_number] => 199869 [rel_patent_id] =>[rel_patent_doc_number] =>)
08/199869
Method for controlling solder bump height for flip chip integrated circuit devices Feb 21, 1994 Issued
08/197166 METHOD FOR JOINING CERAMIC AND METAL-CERAMIC HEATING ELEMENTS TO ELECTRICAL TERMINALS BY MICROPYRETIC SYNTHESIS, COMPOSITIONS FOR ELECTRICAL TERMINALS AND HEATERS COMPRISING THE SAME Feb 15, 1994 Abandoned
Array ( [id] => 3417979 [patent_doc_number] => 05454507 [patent_country] => US [patent_kind] => NA [patent_issue_date] => 1995-10-03 [patent_title] => 'Method for vacuum brazing aluminum members' [patent_app_type] => 1 [patent_app_number] => 8/193856 [patent_app_country] => US [patent_app_date] => 1994-02-09 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 11 [patent_figures_cnt] => 11 [patent_no_of_words] => 7162 [patent_no_of_claims] => 4 [patent_no_of_ind_claims] => 1 [patent_words_short_claim] => 145 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/05/454/05454507.pdf [firstpage_image] =>[orig_patent_app_number] => 193856 [rel_patent_id] =>[rel_patent_doc_number] =>)
08/193856
Method for vacuum brazing aluminum members Feb 8, 1994 Issued
Array ( [id] => 3441808 [patent_doc_number] => 05385289 [patent_country] => US [patent_kind] => NA [patent_issue_date] => 1995-01-31 [patent_title] => 'Embedded features for registration measurement in electronics manufacturing' [patent_app_type] => 1 [patent_app_number] => 8/193309 [patent_app_country] => US [patent_app_date] => 1994-02-08 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 5 [patent_figures_cnt] => 19 [patent_no_of_words] => 4853 [patent_no_of_claims] => 22 [patent_no_of_ind_claims] => 4 [patent_words_short_claim] => 327 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/05/385/05385289.pdf [firstpage_image] =>[orig_patent_app_number] => 193309 [rel_patent_id] =>[rel_patent_doc_number] =>)
08/193309
Embedded features for registration measurement in electronics manufacturing Feb 7, 1994 Issued
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