
Samuel M. Heinrich
Examiner (ID: 5136, Phone: (571)272-1175 , Office: P/3742 )
| Most Active Art Unit | 3205 |
| Art Unit(s) | 3761, 3742, 1722, 1725, 1793, 3205, 2899, 3202, 1754, 1775 |
| Total Applications | 3466 |
| Issued Applications | 2884 |
| Pending Applications | 81 |
| Abandoned Applications | 502 |
Applications
| Application number | Title of the application | Filing Date | Status |
|---|---|---|---|
Array
(
[id] => 2751655
[patent_doc_number] => 05005757
[patent_country] => US
[patent_kind] => NA
[patent_issue_date] => 1991-04-09
[patent_title] => 'Bonded segmented cylindrical magnet assembly'
[patent_app_type] => 1
[patent_app_number] => 7/522825
[patent_app_country] => US
[patent_app_date] => 1990-05-14
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 1
[patent_figures_cnt] => 2
[patent_no_of_words] => 1792
[patent_no_of_claims] => 11
[patent_no_of_ind_claims] => 2
[patent_words_short_claim] => 77
[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => patent
[pdf_file] => patents/05/005/05005757.pdf
[firstpage_image] =>[orig_patent_app_number] => 522825
[rel_patent_id] =>[rel_patent_doc_number] =>) 07/522825 | Bonded segmented cylindrical magnet assembly | May 13, 1990 | Issued |
Array
(
[id] => 2672141
[patent_doc_number] => 05048744
[patent_country] => US
[patent_kind] => NA
[patent_issue_date] => 1991-09-17
[patent_title] => 'Palladium enhanced fluxless soldering and bonding of semiconductor device contacts'
[patent_app_type] => 1
[patent_app_number] => 7/522473
[patent_app_country] => US
[patent_app_date] => 1990-05-14
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 4
[patent_figures_cnt] => 11
[patent_no_of_words] => 3715
[patent_no_of_claims] => 19
[patent_no_of_ind_claims] => 5
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[patent_maintenance] => 1
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[patent_current_assignee] =>[type] => patent
[pdf_file] => patents/05/048/05048744.pdf
[firstpage_image] =>[orig_patent_app_number] => 522473
[rel_patent_id] =>[rel_patent_doc_number] =>) 07/522473 | Palladium enhanced fluxless soldering and bonding of semiconductor device contacts | May 13, 1990 | Issued |
Array
(
[id] => 2711400
[patent_doc_number] => 05024367
[patent_country] => US
[patent_kind] => NA
[patent_issue_date] => 1991-06-18
[patent_title] => 'Wire bonding method'
[patent_app_type] => 1
[patent_app_number] => 7/523007
[patent_app_country] => US
[patent_app_date] => 1990-05-14
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 2
[patent_figures_cnt] => 4
[patent_no_of_words] => 1085
[patent_no_of_claims] => 2
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[patent_maintenance] => 1
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[patent_current_assignee] =>[type] => patent
[pdf_file] => patents/05/024/05024367.pdf
[firstpage_image] =>[orig_patent_app_number] => 523007
[rel_patent_id] =>[rel_patent_doc_number] =>) 07/523007 | Wire bonding method | May 13, 1990 | Issued |
Array
(
[id] => 2743442
[patent_doc_number] => 05058797
[patent_country] => US
[patent_kind] => NA
[patent_issue_date] => 1991-10-22
[patent_title] => 'Detection method for wire bonding failures'
[patent_app_type] => 1
[patent_app_number] => 7/523668
[patent_app_country] => US
[patent_app_date] => 1990-05-14
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 4
[patent_figures_cnt] => 16
[patent_no_of_words] => 1988
[patent_no_of_claims] => 2
[patent_no_of_ind_claims] => 2
[patent_words_short_claim] => 90
[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => patent
[pdf_file] => patents/05/058/05058797.pdf
[firstpage_image] =>[orig_patent_app_number] => 523668
[rel_patent_id] =>[rel_patent_doc_number] =>) 07/523668 | Detection method for wire bonding failures | May 13, 1990 | Issued |
Array
(
[id] => 2737156
[patent_doc_number] => 05071053
[patent_country] => US
[patent_kind] => NA
[patent_issue_date] => 1991-12-10
[patent_title] => 'Method and device for joining well tubulars'
[patent_app_type] => 1
[patent_app_number] => 7/521716
[patent_app_country] => US
[patent_app_date] => 1990-05-11
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 2
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[patent_no_of_words] => 3682
[patent_no_of_claims] => 23
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[patent_current_assignee] =>[type] => patent
[pdf_file] => patents/05/071/05071053.pdf
[firstpage_image] =>[orig_patent_app_number] => 521716
[rel_patent_id] =>[rel_patent_doc_number] =>) 07/521716 | Method and device for joining well tubulars | May 10, 1990 | Issued |
Array
(
[id] => 2729583
[patent_doc_number] => 05011062
[patent_country] => US
[patent_kind] => NA
[patent_issue_date] => 1991-04-30
[patent_title] => 'Ultrasonic welding mask'
[patent_app_type] => 1
[patent_app_number] => 7/520907
[patent_app_country] => US
[patent_app_date] => 1990-05-09
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 1
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[patent_no_of_words] => 1798
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[patent_current_assignee] =>[type] => patent
[pdf_file] => patents/05/011/05011062.pdf
[firstpage_image] =>[orig_patent_app_number] => 520907
[rel_patent_id] =>[rel_patent_doc_number] =>) 07/520907 | Ultrasonic welding mask | May 8, 1990 | Issued |
Array
(
[id] => 2711497
[patent_doc_number] => 05024372
[patent_country] => US
[patent_kind] => NA
[patent_issue_date] => 1991-06-18
[patent_title] => 'Method of making high density solder bumps and a substrate socket for high density solder bumps'
[patent_app_type] => 1
[patent_app_number] => 7/520995
[patent_app_country] => US
[patent_app_date] => 1990-05-09
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 3
[patent_figures_cnt] => 12
[patent_no_of_words] => 1625
[patent_no_of_claims] => 6
[patent_no_of_ind_claims] => 2
[patent_words_short_claim] => 26
[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => patent
[pdf_file] => patents/05/024/05024372.pdf
[firstpage_image] =>[orig_patent_app_number] => 520995
[rel_patent_id] =>[rel_patent_doc_number] =>) 07/520995 | Method of making high density solder bumps and a substrate socket for high density solder bumps | May 8, 1990 | Issued |
| 07/520826 | FLIP CHIP SOLDER BOND STRUCTURE FOR DEVICES WITH GOLD BASED METALLISATION | May 8, 1990 | Abandoned |
Array
(
[id] => 2700284
[patent_doc_number] => 05009359
[patent_country] => US
[patent_kind] => NA
[patent_issue_date] => 1991-04-23
[patent_title] => 'Process for joining workpieces of metal or ceramic by boundary surface diffusion'
[patent_app_type] => 1
[patent_app_number] => 7/521091
[patent_app_country] => US
[patent_app_date] => 1990-05-09
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 1
[patent_figures_cnt] => 6
[patent_no_of_words] => 2718
[patent_no_of_claims] => 1
[patent_no_of_ind_claims] => 1
[patent_words_short_claim] => 169
[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => patent
[pdf_file] => patents/05/009/05009359.pdf
[firstpage_image] =>[orig_patent_app_number] => 521091
[rel_patent_id] =>[rel_patent_doc_number] =>) 07/521091 | Process for joining workpieces of metal or ceramic by boundary surface diffusion | May 8, 1990 | Issued |
Array
(
[id] => 2646680
[patent_doc_number] => 04978051
[patent_country] => US
[patent_kind] => NA
[patent_issue_date] => 1990-12-18
[patent_title] => 'X-ray tube target'
[patent_app_type] => 1
[patent_app_number] => 7/520999
[patent_app_country] => US
[patent_app_date] => 1990-05-07
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 2
[patent_figures_cnt] => 3
[patent_no_of_words] => 2763
[patent_no_of_claims] => 16
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[patent_current_assignee] =>[type] => patent
[pdf_file] => patents/04/978/04978051.pdf
[firstpage_image] =>[orig_patent_app_number] => 520999
[rel_patent_id] =>[rel_patent_doc_number] =>) 07/520999 | X-ray tube target | May 6, 1990 | Issued |
Array
(
[id] => 2730890
[patent_doc_number] => 05022581
[patent_country] => US
[patent_kind] => NA
[patent_issue_date] => 1991-06-11
[patent_title] => 'Welding parts having different thermal expansions'
[patent_app_type] => 1
[patent_app_number] => 7/518930
[patent_app_country] => US
[patent_app_date] => 1990-05-04
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 2
[patent_figures_cnt] => 5
[patent_no_of_words] => 1428
[patent_no_of_claims] => 13
[patent_no_of_ind_claims] => 1
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[patent_maintenance] => 1
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[patent_current_assignee] =>[type] => patent
[pdf_file] => patents/05/022/05022581.pdf
[firstpage_image] =>[orig_patent_app_number] => 518930
[rel_patent_id] =>[rel_patent_doc_number] =>) 07/518930 | Welding parts having different thermal expansions | May 3, 1990 | Issued |
Array
(
[id] => 2746927
[patent_doc_number] => 04993620
[patent_country] => US
[patent_kind] => NA
[patent_issue_date] => 1991-02-19
[patent_title] => 'Solder-electroformed joint for particle beam drift tubes'
[patent_app_type] => 1
[patent_app_number] => 7/518441
[patent_app_country] => US
[patent_app_date] => 1990-05-03
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 1
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[patent_no_of_words] => 1730
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[patent_current_assignee] =>[type] => patent
[pdf_file] => patents/04/993/04993620.pdf
[firstpage_image] =>[orig_patent_app_number] => 518441
[rel_patent_id] =>[rel_patent_doc_number] =>) 07/518441 | Solder-electroformed joint for particle beam drift tubes | May 2, 1990 | Issued |
Array
(
[id] => 2681778
[patent_doc_number] => 04995551
[patent_country] => US
[patent_kind] => NA
[patent_issue_date] => 1991-02-26
[patent_title] => 'Bonding electrical leads to pads on electrical components'
[patent_app_type] => 1
[patent_app_number] => 7/513504
[patent_app_country] => US
[patent_app_date] => 1990-04-24
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 7
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[pdf_file] => patents/04/995/04995551.pdf
[firstpage_image] =>[orig_patent_app_number] => 513504
[rel_patent_id] =>[rel_patent_doc_number] =>) 07/513504 | Bonding electrical leads to pads on electrical components | Apr 23, 1990 | Issued |
Array
(
[id] => 2694155
[patent_doc_number] => 05060846
[patent_country] => US
[patent_kind] => NA
[patent_issue_date] => 1991-10-29
[patent_title] => 'Integrated load compensation device'
[patent_app_type] => 1
[patent_app_number] => 7/512722
[patent_app_country] => US
[patent_app_date] => 1990-04-23
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 2
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[pdf_file] => patents/05/060/05060846.pdf
[firstpage_image] =>[orig_patent_app_number] => 512722
[rel_patent_id] =>[rel_patent_doc_number] =>) 07/512722 | Integrated load compensation device | Apr 22, 1990 | Issued |
Array
(
[id] => 2743479
[patent_doc_number] => 05058799
[patent_country] => US
[patent_kind] => NA
[patent_issue_date] => 1991-10-22
[patent_title] => 'Metallized ceramic substrate and method therefor'
[patent_app_type] => 1
[patent_app_number] => 7/512893
[patent_app_country] => US
[patent_app_date] => 1990-04-23
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 11
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[patent_no_of_words] => 10599
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[patent_current_assignee] =>[type] => patent
[pdf_file] => patents/05/058/05058799.pdf
[firstpage_image] =>[orig_patent_app_number] => 512893
[rel_patent_id] =>[rel_patent_doc_number] =>) 07/512893 | Metallized ceramic substrate and method therefor | Apr 22, 1990 | Issued |
Array
(
[id] => 2802549
[patent_doc_number] => 05121871
[patent_country] => US
[patent_kind] => NA
[patent_issue_date] => 1992-06-16
[patent_title] => 'Solder extrusion pressure bonding process and bonded products produced thereby'
[patent_app_type] => 1
[patent_app_number] => 7/511684
[patent_app_country] => US
[patent_app_date] => 1990-04-20
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[pdf_file] => patents/05/121/05121871.pdf
[firstpage_image] =>[orig_patent_app_number] => 511684
[rel_patent_id] =>[rel_patent_doc_number] =>) 07/511684 | Solder extrusion pressure bonding process and bonded products produced thereby | Apr 19, 1990 | Issued |
Array
(
[id] => 2737208
[patent_doc_number] => 05071056
[patent_country] => US
[patent_kind] => NA
[patent_issue_date] => 1991-12-10
[patent_title] => 'Method of making brake shoes'
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[patent_app_number] => 7/510437
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[pdf_file] => patents/05/071/05071056.pdf
[firstpage_image] =>[orig_patent_app_number] => 510437
[rel_patent_id] =>[rel_patent_doc_number] =>) 07/510437 | Method of making brake shoes | Apr 17, 1990 | Issued |
Array
(
[id] => 2663608
[patent_doc_number] => 05044541
[patent_country] => US
[patent_kind] => NA
[patent_issue_date] => 1991-09-03
[patent_title] => 'Method and apparatus for assembling vehicle body'
[patent_app_type] => 1
[patent_app_number] => 7/510422
[patent_app_country] => US
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[pdf_file] => patents/05/044/05044541.pdf
[firstpage_image] =>[orig_patent_app_number] => 510422
[rel_patent_id] =>[rel_patent_doc_number] =>) 07/510422 | Method and apparatus for assembling vehicle body | Apr 17, 1990 | Issued |
Array
(
[id] => 2743461
[patent_doc_number] => 05058798
[patent_country] => US
[patent_kind] => NA
[patent_issue_date] => 1991-10-22
[patent_title] => 'Method for forming bump on semiconductor elements'
[patent_app_type] => 1
[patent_app_number] => 7/510152
[patent_app_country] => US
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[pdf_file] => patents/05/058/05058798.pdf
[firstpage_image] =>[orig_patent_app_number] => 510152
[rel_patent_id] =>[rel_patent_doc_number] =>) 07/510152 | Method for forming bump on semiconductor elements | Apr 15, 1990 | Issued |
Array
(
[id] => 2584400
[patent_doc_number] => 04974768
[patent_country] => US
[patent_kind] => NA
[patent_issue_date] => 1990-12-04
[patent_title] => 'Soldering iron tip'
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[patent_app_number] => 7/511948
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[pdf_file] => patents/04/974/04974768.pdf
[firstpage_image] =>[orig_patent_app_number] => 511948
[rel_patent_id] =>[rel_patent_doc_number] =>) 07/511948 | Soldering iron tip | Apr 15, 1990 | Issued |