Search

Samuel M. Heinrich

Examiner (ID: 5136, Phone: (571)272-1175 , Office: P/3742 )

Most Active Art Unit
3205
Art Unit(s)
3761, 3742, 1722, 1725, 1793, 3205, 2899, 3202, 1754, 1775
Total Applications
3466
Issued Applications
2884
Pending Applications
81
Abandoned Applications
502

Applications

Application numberTitle of the applicationFiling DateStatus
Array ( [id] => 2466691 [patent_doc_number] => 04875615 [patent_country] => US [patent_kind] => NA [patent_issue_date] => 1989-10-24 [patent_title] => 'Vapor plug for temporarily sealing or plugging a pipeline' [patent_app_type] => 1 [patent_app_number] => 7/319169 [patent_app_country] => US [patent_app_date] => 1989-03-06 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 5 [patent_figures_cnt] => 12 [patent_no_of_words] => 2824 [patent_no_of_claims] => 4 [patent_no_of_ind_claims] => 4 [patent_words_short_claim] => 192 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/04/875/04875615.pdf [firstpage_image] =>[orig_patent_app_number] => 319169 [rel_patent_id] =>[rel_patent_doc_number] =>)
07/319169
Vapor plug for temporarily sealing or plugging a pipeline Mar 5, 1989 Issued
Array ( [id] => 2544842 [patent_doc_number] => 04896812 [patent_country] => US [patent_kind] => NA [patent_issue_date] => 1990-01-30 [patent_title] => 'Double downhill pipe welder' [patent_app_type] => 1 [patent_app_number] => 7/319061 [patent_app_country] => US [patent_app_date] => 1989-03-06 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 6 [patent_figures_cnt] => 11 [patent_no_of_words] => 4209 [patent_no_of_claims] => 5 [patent_no_of_ind_claims] => 1 [patent_words_short_claim] => 204 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/04/896/04896812.pdf [firstpage_image] =>[orig_patent_app_number] => 319061 [rel_patent_id] =>[rel_patent_doc_number] =>)
07/319061
Double downhill pipe welder Mar 5, 1989 Issued
07/319413 METALLIZED CERAMIC SUBSTRATE AND METHOD THEREFOR Mar 2, 1989 Abandoned
Array ( [id] => 2599383 [patent_doc_number] => 04924033 [patent_country] => US [patent_kind] => NA [patent_issue_date] => 1990-05-08 [patent_title] => 'Brazing paste for bonding metal and ceramic' [patent_app_type] => 1 [patent_app_number] => 7/318331 [patent_app_country] => US [patent_app_date] => 1989-03-03 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 1 [patent_figures_cnt] => 2 [patent_no_of_words] => 3025 [patent_no_of_claims] => 9 [patent_no_of_ind_claims] => 1 [patent_words_short_claim] => 82 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/04/924/04924033.pdf [firstpage_image] =>[orig_patent_app_number] => 318331 [rel_patent_id] =>[rel_patent_doc_number] =>)
07/318331
Brazing paste for bonding metal and ceramic Mar 2, 1989 Issued
Array ( [id] => 2583596 [patent_doc_number] => 04964560 [patent_country] => US [patent_kind] => NA [patent_issue_date] => 1990-10-23 [patent_title] => 'Non-dedicated pallet assembly for wave soldering packaged integrated circuits' [patent_app_type] => 1 [patent_app_number] => 7/319143 [patent_app_country] => US [patent_app_date] => 1989-03-03 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 5 [patent_figures_cnt] => 11 [patent_no_of_words] => 7963 [patent_no_of_claims] => 16 [patent_no_of_ind_claims] => 2 [patent_words_short_claim] => 126 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/04/964/04964560.pdf [firstpage_image] =>[orig_patent_app_number] => 319143 [rel_patent_id] =>[rel_patent_doc_number] =>)
07/319143
Non-dedicated pallet assembly for wave soldering packaged integrated circuits Mar 2, 1989 Issued
Array ( [id] => 2574390 [patent_doc_number] => 04962876 [patent_country] => US [patent_kind] => NA [patent_issue_date] => 1990-10-16 [patent_title] => 'Method of producing a movable part of a wire-dot print head' [patent_app_type] => 1 [patent_app_number] => 7/318312 [patent_app_country] => US [patent_app_date] => 1989-03-03 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 4 [patent_figures_cnt] => 4 [patent_no_of_words] => 3177 [patent_no_of_claims] => 9 [patent_no_of_ind_claims] => 1 [patent_words_short_claim] => 119 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/04/962/04962876.pdf [firstpage_image] =>[orig_patent_app_number] => 318312 [rel_patent_id] =>[rel_patent_doc_number] =>)
07/318312
Method of producing a movable part of a wire-dot print head Mar 2, 1989 Issued
Array ( [id] => 2680091 [patent_doc_number] => 04989773 [patent_country] => US [patent_kind] => NA [patent_issue_date] => 1991-02-05 [patent_title] => 'Method of joining graphite and metallic material with a material comprising titanium, nickel and copper' [patent_app_type] => 1 [patent_app_number] => 7/312973 [patent_app_country] => US [patent_app_date] => 1989-02-21 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 1 [patent_figures_cnt] => 2 [patent_no_of_words] => 1019 [patent_no_of_claims] => 5 [patent_no_of_ind_claims] => 2 [patent_words_short_claim] => 29 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/04/989/04989773.pdf [firstpage_image] =>[orig_patent_app_number] => 312973 [rel_patent_id] =>[rel_patent_doc_number] =>)
07/312973
Method of joining graphite and metallic material with a material comprising titanium, nickel and copper Feb 20, 1989 Issued
Array ( [id] => 2622208 [patent_doc_number] => 04909430 [patent_country] => US [patent_kind] => NA [patent_issue_date] => 1990-03-20 [patent_title] => 'Reflow soldering method and the apparatus thereof' [patent_app_type] => 1 [patent_app_number] => 7/312715 [patent_app_country] => US [patent_app_date] => 1989-02-21 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 10 [patent_figures_cnt] => 11 [patent_no_of_words] => 6983 [patent_no_of_claims] => 10 [patent_no_of_ind_claims] => 2 [patent_words_short_claim] => 154 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/04/909/04909430.pdf [firstpage_image] =>[orig_patent_app_number] => 312715 [rel_patent_id] =>[rel_patent_doc_number] =>)
07/312715
Reflow soldering method and the apparatus thereof Feb 20, 1989 Issued
07/311162 METHOD OF FORMING A HEAT EXCHANGER WITH COMPONENTS COMPRISING AN ALUMINUM ALLOY CONTAINING REDUCED AMOUNTS OF MAGNESIUM Feb 14, 1989 Abandoned
07/309983 WELDING WIRE STRAIGHTENING DEVICE AND WELDING TORCH Feb 8, 1989 Abandoned
Array ( [id] => 2605677 [patent_doc_number] => 04922322 [patent_country] => US [patent_kind] => NA [patent_issue_date] => 1990-05-01 [patent_title] => 'Bump structure for reflow bonding of IC devices' [patent_app_type] => 1 [patent_app_number] => 7/308704 [patent_app_country] => US [patent_app_date] => 1989-02-09 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 1 [patent_figures_cnt] => 6 [patent_no_of_words] => 2121 [patent_no_of_claims] => 1 [patent_no_of_ind_claims] => 1 [patent_words_short_claim] => 96 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/04/922/04922322.pdf [firstpage_image] =>[orig_patent_app_number] => 308704 [rel_patent_id] =>[rel_patent_doc_number] =>)
07/308704
Bump structure for reflow bonding of IC devices Feb 8, 1989 Issued
Array ( [id] => 2462300 [patent_doc_number] => 04878610 [patent_country] => US [patent_kind] => NA [patent_issue_date] => 1989-11-07 [patent_title] => 'Die bonding apparatus' [patent_app_type] => 1 [patent_app_number] => 7/307512 [patent_app_country] => US [patent_app_date] => 1989-02-08 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 5 [patent_figures_cnt] => 10 [patent_no_of_words] => 3048 [patent_no_of_claims] => 9 [patent_no_of_ind_claims] => 1 [patent_words_short_claim] => 103 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/04/878/04878610.pdf [firstpage_image] =>[orig_patent_app_number] => 307512 [rel_patent_id] =>[rel_patent_doc_number] =>)
07/307512
Die bonding apparatus Feb 7, 1989 Issued
07/308347 SOLDERING IRON TIP Feb 7, 1989 Abandoned
Array ( [id] => 2553269 [patent_doc_number] => 04899923 [patent_country] => US [patent_kind] => NA [patent_issue_date] => 1990-02-13 [patent_title] => 'High pressure bonding process' [patent_app_type] => 1 [patent_app_number] => 7/307228 [patent_app_country] => US [patent_app_date] => 1989-02-06 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 2 [patent_figures_cnt] => 9 [patent_no_of_words] => 1973 [patent_no_of_claims] => 4 [patent_no_of_ind_claims] => 1 [patent_words_short_claim] => 418 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/04/899/04899923.pdf [firstpage_image] =>[orig_patent_app_number] => 307228 [rel_patent_id] =>[rel_patent_doc_number] =>)
07/307228
High pressure bonding process Feb 5, 1989 Issued
Array ( [id] => 2622709 [patent_doc_number] => 04913336 [patent_country] => US [patent_kind] => NA [patent_issue_date] => 1990-04-03 [patent_title] => 'Method of tape bonding' [patent_app_type] => 1 [patent_app_number] => 7/304784 [patent_app_country] => US [patent_app_date] => 1989-01-31 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 2 [patent_figures_cnt] => 2 [patent_no_of_words] => 1244 [patent_no_of_claims] => 2 [patent_no_of_ind_claims] => 1 [patent_words_short_claim] => 77 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/04/913/04913336.pdf [firstpage_image] =>[orig_patent_app_number] => 304784 [rel_patent_id] =>[rel_patent_doc_number] =>)
07/304784
Method of tape bonding Jan 30, 1989 Issued
Array ( [id] => 2588970 [patent_doc_number] => 04948030 [patent_country] => US [patent_kind] => NA [patent_issue_date] => 1990-08-14 [patent_title] => 'Bond connection for components' [patent_app_type] => 1 [patent_app_number] => 7/304052 [patent_app_country] => US [patent_app_date] => 1989-01-30 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 1 [patent_figures_cnt] => 8 [patent_no_of_words] => 2303 [patent_no_of_claims] => 1 [patent_no_of_ind_claims] => 1 [patent_words_short_claim] => 103 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/04/948/04948030.pdf [firstpage_image] =>[orig_patent_app_number] => 304052 [rel_patent_id] =>[rel_patent_doc_number] =>)
07/304052
Bond connection for components Jan 29, 1989 Issued
Array ( [id] => 2622674 [patent_doc_number] => 04913334 [patent_country] => US [patent_kind] => NA [patent_issue_date] => 1990-04-03 [patent_title] => 'Device for correcting warp of printed circuit boards in a carrierless soldering apparatus' [patent_app_type] => 1 [patent_app_number] => 7/298163 [patent_app_country] => US [patent_app_date] => 1989-01-18 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 12 [patent_figures_cnt] => 18 [patent_no_of_words] => 5645 [patent_no_of_claims] => 6 [patent_no_of_ind_claims] => 2 [patent_words_short_claim] => 29 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/04/913/04913334.pdf [firstpage_image] =>[orig_patent_app_number] => 298163 [rel_patent_id] =>[rel_patent_doc_number] =>)
07/298163
Device for correcting warp of printed circuit boards in a carrierless soldering apparatus Jan 17, 1989 Issued
07/296837 METHOD OF BONDING A CERAMIC COMPOSITE BODY TO A SECOND BODY AND ARTICLES PRODUCED THEREBY Jan 12, 1989 Abandoned
07/292988 METHOD OF MAKING HIGH DENSITY SOLDER BUMPS AND A SUBSTRATE SOCKET FOR HIGH DENSITY SOLDER BUMPS Jan 2, 1989 Abandoned
Array ( [id] => 2512119 [patent_doc_number] => 04877175 [patent_country] => US [patent_kind] => NA [patent_issue_date] => 1989-10-31 [patent_title] => 'Laser debridging of microelectronic solder joints' [patent_app_type] => 1 [patent_app_number] => 7/292048 [patent_app_country] => US [patent_app_date] => 1988-12-30 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 1 [patent_figures_cnt] => 1 [patent_no_of_words] => 3465 [patent_no_of_claims] => 20 [patent_no_of_ind_claims] => 2 [patent_words_short_claim] => 71 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/04/877/04877175.pdf [firstpage_image] =>[orig_patent_app_number] => 292048 [rel_patent_id] =>[rel_patent_doc_number] =>)
07/292048
Laser debridging of microelectronic solder joints Dec 29, 1988 Issued
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