| Application number | Title of the application | Filing Date | Status |
|---|
Array
(
[id] => 2466691
[patent_doc_number] => 04875615
[patent_country] => US
[patent_kind] => NA
[patent_issue_date] => 1989-10-24
[patent_title] => 'Vapor plug for temporarily sealing or plugging a pipeline'
[patent_app_type] => 1
[patent_app_number] => 7/319169
[patent_app_country] => US
[patent_app_date] => 1989-03-06
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[pdf_file] => patents/04/875/04875615.pdf
[firstpage_image] =>[orig_patent_app_number] => 319169
[rel_patent_id] =>[rel_patent_doc_number] =>) 07/319169 | Vapor plug for temporarily sealing or plugging a pipeline | Mar 5, 1989 | Issued |
Array
(
[id] => 2544842
[patent_doc_number] => 04896812
[patent_country] => US
[patent_kind] => NA
[patent_issue_date] => 1990-01-30
[patent_title] => 'Double downhill pipe welder'
[patent_app_type] => 1
[patent_app_number] => 7/319061
[patent_app_country] => US
[patent_app_date] => 1989-03-06
[patent_effective_date] => 0000-00-00
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[pdf_file] => patents/04/896/04896812.pdf
[firstpage_image] =>[orig_patent_app_number] => 319061
[rel_patent_id] =>[rel_patent_doc_number] =>) 07/319061 | Double downhill pipe welder | Mar 5, 1989 | Issued |
| 07/319413 | METALLIZED CERAMIC SUBSTRATE AND METHOD THEREFOR | Mar 2, 1989 | Abandoned |
Array
(
[id] => 2599383
[patent_doc_number] => 04924033
[patent_country] => US
[patent_kind] => NA
[patent_issue_date] => 1990-05-08
[patent_title] => 'Brazing paste for bonding metal and ceramic'
[patent_app_type] => 1
[patent_app_number] => 7/318331
[patent_app_country] => US
[patent_app_date] => 1989-03-03
[patent_effective_date] => 0000-00-00
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[pdf_file] => patents/04/924/04924033.pdf
[firstpage_image] =>[orig_patent_app_number] => 318331
[rel_patent_id] =>[rel_patent_doc_number] =>) 07/318331 | Brazing paste for bonding metal and ceramic | Mar 2, 1989 | Issued |
Array
(
[id] => 2583596
[patent_doc_number] => 04964560
[patent_country] => US
[patent_kind] => NA
[patent_issue_date] => 1990-10-23
[patent_title] => 'Non-dedicated pallet assembly for wave soldering packaged integrated circuits'
[patent_app_type] => 1
[patent_app_number] => 7/319143
[patent_app_country] => US
[patent_app_date] => 1989-03-03
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 5
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[pdf_file] => patents/04/964/04964560.pdf
[firstpage_image] =>[orig_patent_app_number] => 319143
[rel_patent_id] =>[rel_patent_doc_number] =>) 07/319143 | Non-dedicated pallet assembly for wave soldering packaged integrated circuits | Mar 2, 1989 | Issued |
Array
(
[id] => 2574390
[patent_doc_number] => 04962876
[patent_country] => US
[patent_kind] => NA
[patent_issue_date] => 1990-10-16
[patent_title] => 'Method of producing a movable part of a wire-dot print head'
[patent_app_type] => 1
[patent_app_number] => 7/318312
[patent_app_country] => US
[patent_app_date] => 1989-03-03
[patent_effective_date] => 0000-00-00
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[pdf_file] => patents/04/962/04962876.pdf
[firstpage_image] =>[orig_patent_app_number] => 318312
[rel_patent_id] =>[rel_patent_doc_number] =>) 07/318312 | Method of producing a movable part of a wire-dot print head | Mar 2, 1989 | Issued |
Array
(
[id] => 2680091
[patent_doc_number] => 04989773
[patent_country] => US
[patent_kind] => NA
[patent_issue_date] => 1991-02-05
[patent_title] => 'Method of joining graphite and metallic material with a material comprising titanium, nickel and copper'
[patent_app_type] => 1
[patent_app_number] => 7/312973
[patent_app_country] => US
[patent_app_date] => 1989-02-21
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[firstpage_image] =>[orig_patent_app_number] => 312973
[rel_patent_id] =>[rel_patent_doc_number] =>) 07/312973 | Method of joining graphite and metallic material with a material comprising titanium, nickel and copper | Feb 20, 1989 | Issued |
Array
(
[id] => 2622208
[patent_doc_number] => 04909430
[patent_country] => US
[patent_kind] => NA
[patent_issue_date] => 1990-03-20
[patent_title] => 'Reflow soldering method and the apparatus thereof'
[patent_app_type] => 1
[patent_app_number] => 7/312715
[patent_app_country] => US
[patent_app_date] => 1989-02-21
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 10
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[pdf_file] => patents/04/909/04909430.pdf
[firstpage_image] =>[orig_patent_app_number] => 312715
[rel_patent_id] =>[rel_patent_doc_number] =>) 07/312715 | Reflow soldering method and the apparatus thereof | Feb 20, 1989 | Issued |
| 07/311162 | METHOD OF FORMING A HEAT EXCHANGER WITH COMPONENTS COMPRISING AN ALUMINUM ALLOY CONTAINING REDUCED AMOUNTS OF MAGNESIUM | Feb 14, 1989 | Abandoned |
| 07/309983 | WELDING WIRE STRAIGHTENING DEVICE AND WELDING TORCH | Feb 8, 1989 | Abandoned |
Array
(
[id] => 2605677
[patent_doc_number] => 04922322
[patent_country] => US
[patent_kind] => NA
[patent_issue_date] => 1990-05-01
[patent_title] => 'Bump structure for reflow bonding of IC devices'
[patent_app_type] => 1
[patent_app_number] => 7/308704
[patent_app_country] => US
[patent_app_date] => 1989-02-09
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 1
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[pdf_file] => patents/04/922/04922322.pdf
[firstpage_image] =>[orig_patent_app_number] => 308704
[rel_patent_id] =>[rel_patent_doc_number] =>) 07/308704 | Bump structure for reflow bonding of IC devices | Feb 8, 1989 | Issued |
Array
(
[id] => 2462300
[patent_doc_number] => 04878610
[patent_country] => US
[patent_kind] => NA
[patent_issue_date] => 1989-11-07
[patent_title] => 'Die bonding apparatus'
[patent_app_type] => 1
[patent_app_number] => 7/307512
[patent_app_country] => US
[patent_app_date] => 1989-02-08
[patent_effective_date] => 0000-00-00
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[pdf_file] => patents/04/878/04878610.pdf
[firstpage_image] =>[orig_patent_app_number] => 307512
[rel_patent_id] =>[rel_patent_doc_number] =>) 07/307512 | Die bonding apparatus | Feb 7, 1989 | Issued |
| 07/308347 | SOLDERING IRON TIP | Feb 7, 1989 | Abandoned |
Array
(
[id] => 2553269
[patent_doc_number] => 04899923
[patent_country] => US
[patent_kind] => NA
[patent_issue_date] => 1990-02-13
[patent_title] => 'High pressure bonding process'
[patent_app_type] => 1
[patent_app_number] => 7/307228
[patent_app_country] => US
[patent_app_date] => 1989-02-06
[patent_effective_date] => 0000-00-00
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[pdf_file] => patents/04/899/04899923.pdf
[firstpage_image] =>[orig_patent_app_number] => 307228
[rel_patent_id] =>[rel_patent_doc_number] =>) 07/307228 | High pressure bonding process | Feb 5, 1989 | Issued |
Array
(
[id] => 2622709
[patent_doc_number] => 04913336
[patent_country] => US
[patent_kind] => NA
[patent_issue_date] => 1990-04-03
[patent_title] => 'Method of tape bonding'
[patent_app_type] => 1
[patent_app_number] => 7/304784
[patent_app_country] => US
[patent_app_date] => 1989-01-31
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 2
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[pdf_file] => patents/04/913/04913336.pdf
[firstpage_image] =>[orig_patent_app_number] => 304784
[rel_patent_id] =>[rel_patent_doc_number] =>) 07/304784 | Method of tape bonding | Jan 30, 1989 | Issued |
Array
(
[id] => 2588970
[patent_doc_number] => 04948030
[patent_country] => US
[patent_kind] => NA
[patent_issue_date] => 1990-08-14
[patent_title] => 'Bond connection for components'
[patent_app_type] => 1
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[patent_app_date] => 1989-01-30
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[pdf_file] => patents/04/948/04948030.pdf
[firstpage_image] =>[orig_patent_app_number] => 304052
[rel_patent_id] =>[rel_patent_doc_number] =>) 07/304052 | Bond connection for components | Jan 29, 1989 | Issued |
Array
(
[id] => 2622674
[patent_doc_number] => 04913334
[patent_country] => US
[patent_kind] => NA
[patent_issue_date] => 1990-04-03
[patent_title] => 'Device for correcting warp of printed circuit boards in a carrierless soldering apparatus'
[patent_app_type] => 1
[patent_app_number] => 7/298163
[patent_app_country] => US
[patent_app_date] => 1989-01-18
[patent_effective_date] => 0000-00-00
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[pdf_file] => patents/04/913/04913334.pdf
[firstpage_image] =>[orig_patent_app_number] => 298163
[rel_patent_id] =>[rel_patent_doc_number] =>) 07/298163 | Device for correcting warp of printed circuit boards in a carrierless soldering apparatus | Jan 17, 1989 | Issued |
| 07/296837 | METHOD OF BONDING A CERAMIC COMPOSITE BODY TO A SECOND BODY AND ARTICLES PRODUCED THEREBY | Jan 12, 1989 | Abandoned |
| 07/292988 | METHOD OF MAKING HIGH DENSITY SOLDER BUMPS AND A SUBSTRATE SOCKET FOR HIGH DENSITY SOLDER BUMPS | Jan 2, 1989 | Abandoned |
Array
(
[id] => 2512119
[patent_doc_number] => 04877175
[patent_country] => US
[patent_kind] => NA
[patent_issue_date] => 1989-10-31
[patent_title] => 'Laser debridging of microelectronic solder joints'
[patent_app_type] => 1
[patent_app_number] => 7/292048
[patent_app_country] => US
[patent_app_date] => 1988-12-30
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 1
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[pdf_file] => patents/04/877/04877175.pdf
[firstpage_image] =>[orig_patent_app_number] => 292048
[rel_patent_id] =>[rel_patent_doc_number] =>) 07/292048 | Laser debridging of microelectronic solder joints | Dec 29, 1988 | Issued |