
Samuel M. Heinrich
Examiner (ID: 5136, Phone: (571)272-1175 , Office: P/3742 )
| Most Active Art Unit | 3205 |
| Art Unit(s) | 3761, 3742, 1722, 1725, 1793, 3205, 2899, 3202, 1754, 1775 |
| Total Applications | 3466 |
| Issued Applications | 2884 |
| Pending Applications | 81 |
| Abandoned Applications | 502 |
Applications
| Application number | Title of the application | Filing Date | Status |
|---|---|---|---|
Array
(
[id] => 2516477
[patent_doc_number] => 04887761
[patent_country] => US
[patent_kind] => NA
[patent_issue_date] => 1989-12-19
[patent_title] => 'Method of making explosively bunded multi-laminar composite metal plate'
[patent_app_type] => 1
[patent_app_number] => 7/276350
[patent_app_country] => US
[patent_app_date] => 1988-11-25
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 2
[patent_figures_cnt] => 5
[patent_no_of_words] => 3920
[patent_no_of_claims] => 9
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[patent_words_short_claim] => 209
[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => patent
[pdf_file] => patents/04/887/04887761.pdf
[firstpage_image] =>[orig_patent_app_number] => 276350
[rel_patent_id] =>[rel_patent_doc_number] =>) 07/276350 | Method of making explosively bunded multi-laminar composite metal plate | Nov 24, 1988 | Issued |
Array
(
[id] => 2641942
[patent_doc_number] => 04928869
[patent_country] => US
[patent_kind] => NA
[patent_issue_date] => 1990-05-29
[patent_title] => 'Solder leveller'
[patent_app_type] => 1
[patent_app_number] => 7/282313
[patent_app_country] => US
[patent_app_date] => 1988-11-25
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 4
[patent_figures_cnt] => 4
[patent_no_of_words] => 3704
[patent_no_of_claims] => 25
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[patent_words_short_claim] => 180
[patent_maintenance] => 1
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[patent_current_assignee] =>[type] => patent
[pdf_file] => patents/04/928/04928869.pdf
[firstpage_image] =>[orig_patent_app_number] => 282313
[rel_patent_id] =>[rel_patent_doc_number] =>) 07/282313 | Solder leveller | Nov 24, 1988 | Issued |
Array
(
[id] => 2511063
[patent_doc_number] => 04884738
[patent_country] => US
[patent_kind] => NA
[patent_issue_date] => 1989-12-05
[patent_title] => 'Method and apparatus for brazing surface components onto a printed circuit board'
[patent_app_type] => 1
[patent_app_number] => 7/275419
[patent_app_country] => US
[patent_app_date] => 1988-11-23
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 1
[patent_figures_cnt] => 1
[patent_no_of_words] => 3730
[patent_no_of_claims] => 6
[patent_no_of_ind_claims] => 2
[patent_words_short_claim] => 125
[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => patent
[pdf_file] => patents/04/884/04884738.pdf
[firstpage_image] =>[orig_patent_app_number] => 275419
[rel_patent_id] =>[rel_patent_doc_number] =>) 07/275419 | Method and apparatus for brazing surface components onto a printed circuit board | Nov 22, 1988 | Issued |
Array
(
[id] => 2512083
[patent_doc_number] => 04877173
[patent_country] => US
[patent_kind] => NA
[patent_issue_date] => 1989-10-31
[patent_title] => 'Wire bonding apparatus'
[patent_app_type] => 1
[patent_app_number] => 7/275604
[patent_app_country] => US
[patent_app_date] => 1988-11-23
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 1
[patent_figures_cnt] => 3
[patent_no_of_words] => 1649
[patent_no_of_claims] => 7
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[pdf_file] => patents/04/877/04877173.pdf
[firstpage_image] =>[orig_patent_app_number] => 275604
[rel_patent_id] =>[rel_patent_doc_number] =>) 07/275604 | Wire bonding apparatus | Nov 22, 1988 | Issued |
Array
(
[id] => 2691751
[patent_doc_number] => 05000369
[patent_country] => US
[patent_kind] => NA
[patent_issue_date] => 1991-03-19
[patent_title] => 'Method and apparatus for manufacturing plastic-lined pipe'
[patent_app_type] => 1
[patent_app_number] => 7/275010
[patent_app_country] => US
[patent_app_date] => 1988-11-22
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 2
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[patent_no_of_words] => 3092
[patent_no_of_claims] => 16
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[patent_current_assignee] =>[type] => patent
[pdf_file] => patents/05/000/05000369.pdf
[firstpage_image] =>[orig_patent_app_number] => 275010
[rel_patent_id] =>[rel_patent_doc_number] =>) 07/275010 | Method and apparatus for manufacturing plastic-lined pipe | Nov 21, 1988 | Issued |
Array
(
[id] => 2625834
[patent_doc_number] => 04898320
[patent_country] => US
[patent_kind] => NA
[patent_issue_date] => 1990-02-06
[patent_title] => 'Method of manufacturing a high-yield solder bumped semiconductor wafer'
[patent_app_type] => 1
[patent_app_number] => 7/274207
[patent_app_country] => US
[patent_app_date] => 1988-11-21
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 10
[patent_figures_cnt] => 27
[patent_no_of_words] => 12340
[patent_no_of_claims] => 17
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[patent_current_assignee] =>[type] => patent
[pdf_file] => patents/04/898/04898320.pdf
[firstpage_image] =>[orig_patent_app_number] => 274207
[rel_patent_id] =>[rel_patent_doc_number] =>) 07/274207 | Method of manufacturing a high-yield solder bumped semiconductor wafer | Nov 20, 1988 | Issued |
Array
(
[id] => 2623446
[patent_doc_number] => 04892245
[patent_country] => US
[patent_kind] => NA
[patent_issue_date] => 1990-01-09
[patent_title] => 'Controlled compression furnace bonding'
[patent_app_type] => 1
[patent_app_number] => 7/274431
[patent_app_country] => US
[patent_app_date] => 1988-11-21
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 10
[patent_figures_cnt] => 27
[patent_no_of_words] => 12454
[patent_no_of_claims] => 19
[patent_no_of_ind_claims] => 2
[patent_words_short_claim] => 141
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[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => patent
[pdf_file] => patents/04/892/04892245.pdf
[firstpage_image] =>[orig_patent_app_number] => 274431
[rel_patent_id] =>[rel_patent_doc_number] =>) 07/274431 | Controlled compression furnace bonding | Nov 20, 1988 | Issued |
Array
(
[id] => 2589008
[patent_doc_number] => 04948032
[patent_country] => US
[patent_kind] => NA
[patent_issue_date] => 1990-08-14
[patent_title] => 'Fluxing agent'
[patent_app_type] => 1
[patent_app_number] => 7/274428
[patent_app_country] => US
[patent_app_date] => 1988-11-21
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 10
[patent_figures_cnt] => 27
[patent_no_of_words] => 12276
[patent_no_of_claims] => 12
[patent_no_of_ind_claims] => 3
[patent_words_short_claim] => 28
[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => patent
[pdf_file] => patents/04/948/04948032.pdf
[firstpage_image] =>[orig_patent_app_number] => 274428
[rel_patent_id] =>[rel_patent_doc_number] =>) 07/274428 | Fluxing agent | Nov 20, 1988 | Issued |
| 07/270890 | CONNECTION TO A COMPONENT FOR USE IN AN ELECTRONICS ASSEMBLY | Nov 13, 1988 | Abandoned |
Array
(
[id] => 2510619
[patent_doc_number] => 04860939
[patent_country] => US
[patent_kind] => NA
[patent_issue_date] => 1989-08-29
[patent_title] => 'Method for bonding a copper sheet to a substrate made of an electrically insulating material'
[patent_app_type] => 1
[patent_app_number] => 7/269394
[patent_app_country] => US
[patent_app_date] => 1988-11-10
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 1
[patent_figures_cnt] => 1
[patent_no_of_words] => 2065
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[patent_no_of_ind_claims] => 1
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[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => patent
[pdf_file] => patents/04/860/04860939.pdf
[firstpage_image] =>[orig_patent_app_number] => 269394
[rel_patent_id] =>[rel_patent_doc_number] =>) 07/269394 | Method for bonding a copper sheet to a substrate made of an electrically insulating material | Nov 9, 1988 | Issued |
Array
(
[id] => 2581648
[patent_doc_number] => 04923108
[patent_country] => US
[patent_kind] => NA
[patent_issue_date] => 1990-05-08
[patent_title] => 'Process for internally strengthening tubes'
[patent_app_type] => 1
[patent_app_number] => 7/268569
[patent_app_country] => US
[patent_app_date] => 1988-11-08
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 12
[patent_figures_cnt] => 14
[patent_no_of_words] => 3185
[patent_no_of_claims] => 6
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[pdf_file] => patents/04/923/04923108.pdf
[firstpage_image] =>[orig_patent_app_number] => 268569
[rel_patent_id] =>[rel_patent_doc_number] =>) 07/268569 | Process for internally strengthening tubes | Nov 7, 1988 | Issued |
Array
(
[id] => 2462052
[patent_doc_number] => 04886202
[patent_country] => US
[patent_kind] => NA
[patent_issue_date] => 1989-12-12
[patent_title] => 'Method of making metal matrix monotape ribbon and composite components of irregular shape'
[patent_app_type] => 1
[patent_app_number] => 7/268145
[patent_app_country] => US
[patent_app_date] => 1988-11-07
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 3
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[patent_current_assignee] =>[type] => patent
[pdf_file] => patents/04/886/04886202.pdf
[firstpage_image] =>[orig_patent_app_number] => 268145
[rel_patent_id] =>[rel_patent_doc_number] =>) 07/268145 | Method of making metal matrix monotape ribbon and composite components of irregular shape | Nov 6, 1988 | Issued |
Array
(
[id] => 2465207
[patent_doc_number] => 04889276
[patent_country] => US
[patent_kind] => NA
[patent_issue_date] => 1989-12-26
[patent_title] => 'Method and apparatus for forming and bonding metal assemblies'
[patent_app_type] => 1
[patent_app_number] => 7/267999
[patent_app_country] => US
[patent_app_date] => 1988-11-07
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 4
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[pdf_file] => patents/04/889/04889276.pdf
[firstpage_image] =>[orig_patent_app_number] => 267999
[rel_patent_id] =>[rel_patent_doc_number] =>) 07/267999 | Method and apparatus for forming and bonding metal assemblies | Nov 6, 1988 | Issued |
| 07/266564 | CONNECTOR/BEAM JOINING METHOD | Nov 2, 1988 | Abandoned |
Array
(
[id] => 2465188
[patent_doc_number] => 04889275
[patent_country] => US
[patent_kind] => NA
[patent_issue_date] => 1989-12-26
[patent_title] => 'Method for effecting solder interconnects'
[patent_app_type] => 1
[patent_app_number] => 7/266470
[patent_app_country] => US
[patent_app_date] => 1988-11-02
[patent_effective_date] => 0000-00-00
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[pdf_file] => patents/04/889/04889275.pdf
[firstpage_image] =>[orig_patent_app_number] => 266470
[rel_patent_id] =>[rel_patent_doc_number] =>) 07/266470 | Method for effecting solder interconnects | Nov 1, 1988 | Issued |
Array
(
[id] => 2583598
[patent_doc_number] => 04921156
[patent_country] => US
[patent_kind] => NA
[patent_issue_date] => 1990-05-01
[patent_title] => 'Soldering apparatus'
[patent_app_type] => 1
[patent_app_number] => 7/265232
[patent_app_country] => US
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[patent_effective_date] => 0000-00-00
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[patent_current_assignee] =>[type] => patent
[pdf_file] => patents/04/921/04921156.pdf
[firstpage_image] =>[orig_patent_app_number] => 265232
[rel_patent_id] =>[rel_patent_doc_number] =>) 07/265232 | Soldering apparatus | Oct 30, 1988 | Issued |
Array
(
[id] => 2686501
[patent_doc_number] => 04988037
[patent_country] => US
[patent_kind] => NA
[patent_issue_date] => 1991-01-29
[patent_title] => 'Method and apparatus for superplastic forming and diffusion bonding of hollow parts'
[patent_app_type] => 1
[patent_app_number] => 7/264817
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[patent_app_date] => 1988-10-31
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[pdf_file] => patents/04/988/04988037.pdf
[firstpage_image] =>[orig_patent_app_number] => 264817
[rel_patent_id] =>[rel_patent_doc_number] =>) 07/264817 | Method and apparatus for superplastic forming and diffusion bonding of hollow parts | Oct 30, 1988 | Issued |
Array
(
[id] => 2466672
[patent_doc_number] => 04875614
[patent_country] => US
[patent_kind] => NA
[patent_issue_date] => 1989-10-24
[patent_title] => 'Alignment device'
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[patent_app_number] => 7/264713
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[patent_effective_date] => 0000-00-00
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[patent_current_assignee] =>[type] => patent
[pdf_file] => patents/04/875/04875614.pdf
[firstpage_image] =>[orig_patent_app_number] => 264713
[rel_patent_id] =>[rel_patent_doc_number] =>) 07/264713 | Alignment device | Oct 30, 1988 | Issued |
Array
(
[id] => 2574751
[patent_doc_number] => 04907734
[patent_country] => US
[patent_kind] => NA
[patent_issue_date] => 1990-03-13
[patent_title] => 'Method of bonding gold or gold alloy wire to lead tin solder'
[patent_app_type] => 1
[patent_app_number] => 7/263806
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[patent_app_date] => 1988-10-28
[patent_effective_date] => 0000-00-00
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[patent_current_assignee] =>[type] => patent
[pdf_file] => patents/04/907/04907734.pdf
[firstpage_image] =>[orig_patent_app_number] => 263806
[rel_patent_id] =>[rel_patent_doc_number] =>) 07/263806 | Method of bonding gold or gold alloy wire to lead tin solder | Oct 27, 1988 | Issued |
Array
(
[id] => 2464770
[patent_doc_number] => 04871106
[patent_country] => US
[patent_kind] => NA
[patent_issue_date] => 1989-10-03
[patent_title] => 'Non-dedicated pallet assembly for wave soldering packaged integrated circuits'
[patent_app_type] => 1
[patent_app_number] => 7/264453
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[patent_app_date] => 1988-10-28
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[patent_current_assignee] =>[type] => patent
[pdf_file] => patents/04/871/04871106.pdf
[firstpage_image] =>[orig_patent_app_number] => 264453
[rel_patent_id] =>[rel_patent_doc_number] =>) 07/264453 | Non-dedicated pallet assembly for wave soldering packaged integrated circuits | Oct 27, 1988 | Issued |