Search

Samuel M. Heinrich

Examiner (ID: 5136, Phone: (571)272-1175 , Office: P/3742 )

Most Active Art Unit
3205
Art Unit(s)
3761, 3742, 1722, 1725, 1793, 3205, 2899, 3202, 1754, 1775
Total Applications
3466
Issued Applications
2884
Pending Applications
81
Abandoned Applications
502

Applications

Application numberTitle of the applicationFiling DateStatus
Array ( [id] => 2516477 [patent_doc_number] => 04887761 [patent_country] => US [patent_kind] => NA [patent_issue_date] => 1989-12-19 [patent_title] => 'Method of making explosively bunded multi-laminar composite metal plate' [patent_app_type] => 1 [patent_app_number] => 7/276350 [patent_app_country] => US [patent_app_date] => 1988-11-25 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 2 [patent_figures_cnt] => 5 [patent_no_of_words] => 3920 [patent_no_of_claims] => 9 [patent_no_of_ind_claims] => 1 [patent_words_short_claim] => 209 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/04/887/04887761.pdf [firstpage_image] =>[orig_patent_app_number] => 276350 [rel_patent_id] =>[rel_patent_doc_number] =>)
07/276350
Method of making explosively bunded multi-laminar composite metal plate Nov 24, 1988 Issued
Array ( [id] => 2641942 [patent_doc_number] => 04928869 [patent_country] => US [patent_kind] => NA [patent_issue_date] => 1990-05-29 [patent_title] => 'Solder leveller' [patent_app_type] => 1 [patent_app_number] => 7/282313 [patent_app_country] => US [patent_app_date] => 1988-11-25 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 4 [patent_figures_cnt] => 4 [patent_no_of_words] => 3704 [patent_no_of_claims] => 25 [patent_no_of_ind_claims] => 2 [patent_words_short_claim] => 180 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/04/928/04928869.pdf [firstpage_image] =>[orig_patent_app_number] => 282313 [rel_patent_id] =>[rel_patent_doc_number] =>)
07/282313
Solder leveller Nov 24, 1988 Issued
Array ( [id] => 2511063 [patent_doc_number] => 04884738 [patent_country] => US [patent_kind] => NA [patent_issue_date] => 1989-12-05 [patent_title] => 'Method and apparatus for brazing surface components onto a printed circuit board' [patent_app_type] => 1 [patent_app_number] => 7/275419 [patent_app_country] => US [patent_app_date] => 1988-11-23 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 1 [patent_figures_cnt] => 1 [patent_no_of_words] => 3730 [patent_no_of_claims] => 6 [patent_no_of_ind_claims] => 2 [patent_words_short_claim] => 125 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/04/884/04884738.pdf [firstpage_image] =>[orig_patent_app_number] => 275419 [rel_patent_id] =>[rel_patent_doc_number] =>)
07/275419
Method and apparatus for brazing surface components onto a printed circuit board Nov 22, 1988 Issued
Array ( [id] => 2512083 [patent_doc_number] => 04877173 [patent_country] => US [patent_kind] => NA [patent_issue_date] => 1989-10-31 [patent_title] => 'Wire bonding apparatus' [patent_app_type] => 1 [patent_app_number] => 7/275604 [patent_app_country] => US [patent_app_date] => 1988-11-23 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 1 [patent_figures_cnt] => 3 [patent_no_of_words] => 1649 [patent_no_of_claims] => 7 [patent_no_of_ind_claims] => 2 [patent_words_short_claim] => 217 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/04/877/04877173.pdf [firstpage_image] =>[orig_patent_app_number] => 275604 [rel_patent_id] =>[rel_patent_doc_number] =>)
07/275604
Wire bonding apparatus Nov 22, 1988 Issued
Array ( [id] => 2691751 [patent_doc_number] => 05000369 [patent_country] => US [patent_kind] => NA [patent_issue_date] => 1991-03-19 [patent_title] => 'Method and apparatus for manufacturing plastic-lined pipe' [patent_app_type] => 1 [patent_app_number] => 7/275010 [patent_app_country] => US [patent_app_date] => 1988-11-22 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 2 [patent_figures_cnt] => 5 [patent_no_of_words] => 3092 [patent_no_of_claims] => 16 [patent_no_of_ind_claims] => 1 [patent_words_short_claim] => 219 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/05/000/05000369.pdf [firstpage_image] =>[orig_patent_app_number] => 275010 [rel_patent_id] =>[rel_patent_doc_number] =>)
07/275010
Method and apparatus for manufacturing plastic-lined pipe Nov 21, 1988 Issued
Array ( [id] => 2625834 [patent_doc_number] => 04898320 [patent_country] => US [patent_kind] => NA [patent_issue_date] => 1990-02-06 [patent_title] => 'Method of manufacturing a high-yield solder bumped semiconductor wafer' [patent_app_type] => 1 [patent_app_number] => 7/274207 [patent_app_country] => US [patent_app_date] => 1988-11-21 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 10 [patent_figures_cnt] => 27 [patent_no_of_words] => 12340 [patent_no_of_claims] => 17 [patent_no_of_ind_claims] => 5 [patent_words_short_claim] => 88 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/04/898/04898320.pdf [firstpage_image] =>[orig_patent_app_number] => 274207 [rel_patent_id] =>[rel_patent_doc_number] =>)
07/274207
Method of manufacturing a high-yield solder bumped semiconductor wafer Nov 20, 1988 Issued
Array ( [id] => 2623446 [patent_doc_number] => 04892245 [patent_country] => US [patent_kind] => NA [patent_issue_date] => 1990-01-09 [patent_title] => 'Controlled compression furnace bonding' [patent_app_type] => 1 [patent_app_number] => 7/274431 [patent_app_country] => US [patent_app_date] => 1988-11-21 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 10 [patent_figures_cnt] => 27 [patent_no_of_words] => 12454 [patent_no_of_claims] => 19 [patent_no_of_ind_claims] => 2 [patent_words_short_claim] => 141 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/04/892/04892245.pdf [firstpage_image] =>[orig_patent_app_number] => 274431 [rel_patent_id] =>[rel_patent_doc_number] =>)
07/274431
Controlled compression furnace bonding Nov 20, 1988 Issued
Array ( [id] => 2589008 [patent_doc_number] => 04948032 [patent_country] => US [patent_kind] => NA [patent_issue_date] => 1990-08-14 [patent_title] => 'Fluxing agent' [patent_app_type] => 1 [patent_app_number] => 7/274428 [patent_app_country] => US [patent_app_date] => 1988-11-21 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 10 [patent_figures_cnt] => 27 [patent_no_of_words] => 12276 [patent_no_of_claims] => 12 [patent_no_of_ind_claims] => 3 [patent_words_short_claim] => 28 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/04/948/04948032.pdf [firstpage_image] =>[orig_patent_app_number] => 274428 [rel_patent_id] =>[rel_patent_doc_number] =>)
07/274428
Fluxing agent Nov 20, 1988 Issued
07/270890 CONNECTION TO A COMPONENT FOR USE IN AN ELECTRONICS ASSEMBLY Nov 13, 1988 Abandoned
Array ( [id] => 2510619 [patent_doc_number] => 04860939 [patent_country] => US [patent_kind] => NA [patent_issue_date] => 1989-08-29 [patent_title] => 'Method for bonding a copper sheet to a substrate made of an electrically insulating material' [patent_app_type] => 1 [patent_app_number] => 7/269394 [patent_app_country] => US [patent_app_date] => 1988-11-10 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 1 [patent_figures_cnt] => 1 [patent_no_of_words] => 2065 [patent_no_of_claims] => 12 [patent_no_of_ind_claims] => 1 [patent_words_short_claim] => 193 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/04/860/04860939.pdf [firstpage_image] =>[orig_patent_app_number] => 269394 [rel_patent_id] =>[rel_patent_doc_number] =>)
07/269394
Method for bonding a copper sheet to a substrate made of an electrically insulating material Nov 9, 1988 Issued
Array ( [id] => 2581648 [patent_doc_number] => 04923108 [patent_country] => US [patent_kind] => NA [patent_issue_date] => 1990-05-08 [patent_title] => 'Process for internally strengthening tubes' [patent_app_type] => 1 [patent_app_number] => 7/268569 [patent_app_country] => US [patent_app_date] => 1988-11-08 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 12 [patent_figures_cnt] => 14 [patent_no_of_words] => 3185 [patent_no_of_claims] => 6 [patent_no_of_ind_claims] => 5 [patent_words_short_claim] => 199 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/04/923/04923108.pdf [firstpage_image] =>[orig_patent_app_number] => 268569 [rel_patent_id] =>[rel_patent_doc_number] =>)
07/268569
Process for internally strengthening tubes Nov 7, 1988 Issued
Array ( [id] => 2462052 [patent_doc_number] => 04886202 [patent_country] => US [patent_kind] => NA [patent_issue_date] => 1989-12-12 [patent_title] => 'Method of making metal matrix monotape ribbon and composite components of irregular shape' [patent_app_type] => 1 [patent_app_number] => 7/268145 [patent_app_country] => US [patent_app_date] => 1988-11-07 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 3 [patent_figures_cnt] => 4 [patent_no_of_words] => 2226 [patent_no_of_claims] => 8 [patent_no_of_ind_claims] => 1 [patent_words_short_claim] => 143 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/04/886/04886202.pdf [firstpage_image] =>[orig_patent_app_number] => 268145 [rel_patent_id] =>[rel_patent_doc_number] =>)
07/268145
Method of making metal matrix monotape ribbon and composite components of irregular shape Nov 6, 1988 Issued
Array ( [id] => 2465207 [patent_doc_number] => 04889276 [patent_country] => US [patent_kind] => NA [patent_issue_date] => 1989-12-26 [patent_title] => 'Method and apparatus for forming and bonding metal assemblies' [patent_app_type] => 1 [patent_app_number] => 7/267999 [patent_app_country] => US [patent_app_date] => 1988-11-07 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 4 [patent_figures_cnt] => 9 [patent_no_of_words] => 2814 [patent_no_of_claims] => 16 [patent_no_of_ind_claims] => 2 [patent_words_short_claim] => 113 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/04/889/04889276.pdf [firstpage_image] =>[orig_patent_app_number] => 267999 [rel_patent_id] =>[rel_patent_doc_number] =>)
07/267999
Method and apparatus for forming and bonding metal assemblies Nov 6, 1988 Issued
07/266564 CONNECTOR/BEAM JOINING METHOD Nov 2, 1988 Abandoned
Array ( [id] => 2465188 [patent_doc_number] => 04889275 [patent_country] => US [patent_kind] => NA [patent_issue_date] => 1989-12-26 [patent_title] => 'Method for effecting solder interconnects' [patent_app_type] => 1 [patent_app_number] => 7/266470 [patent_app_country] => US [patent_app_date] => 1988-11-02 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 3 [patent_figures_cnt] => 9 [patent_no_of_words] => 993 [patent_no_of_claims] => 8 [patent_no_of_ind_claims] => 2 [patent_words_short_claim] => 78 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/04/889/04889275.pdf [firstpage_image] =>[orig_patent_app_number] => 266470 [rel_patent_id] =>[rel_patent_doc_number] =>)
07/266470
Method for effecting solder interconnects Nov 1, 1988 Issued
Array ( [id] => 2583598 [patent_doc_number] => 04921156 [patent_country] => US [patent_kind] => NA [patent_issue_date] => 1990-05-01 [patent_title] => 'Soldering apparatus' [patent_app_type] => 1 [patent_app_number] => 7/265232 [patent_app_country] => US [patent_app_date] => 1988-10-31 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 3 [patent_figures_cnt] => 5 [patent_no_of_words] => 3720 [patent_no_of_claims] => 17 [patent_no_of_ind_claims] => 1 [patent_words_short_claim] => 268 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/04/921/04921156.pdf [firstpage_image] =>[orig_patent_app_number] => 265232 [rel_patent_id] =>[rel_patent_doc_number] =>)
07/265232
Soldering apparatus Oct 30, 1988 Issued
Array ( [id] => 2686501 [patent_doc_number] => 04988037 [patent_country] => US [patent_kind] => NA [patent_issue_date] => 1991-01-29 [patent_title] => 'Method and apparatus for superplastic forming and diffusion bonding of hollow parts' [patent_app_type] => 1 [patent_app_number] => 7/264817 [patent_app_country] => US [patent_app_date] => 1988-10-31 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 2 [patent_figures_cnt] => 4 [patent_no_of_words] => 2083 [patent_no_of_claims] => 6 [patent_no_of_ind_claims] => 2 [patent_words_short_claim] => 131 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/04/988/04988037.pdf [firstpage_image] =>[orig_patent_app_number] => 264817 [rel_patent_id] =>[rel_patent_doc_number] =>)
07/264817
Method and apparatus for superplastic forming and diffusion bonding of hollow parts Oct 30, 1988 Issued
Array ( [id] => 2466672 [patent_doc_number] => 04875614 [patent_country] => US [patent_kind] => NA [patent_issue_date] => 1989-10-24 [patent_title] => 'Alignment device' [patent_app_type] => 1 [patent_app_number] => 7/264713 [patent_app_country] => US [patent_app_date] => 1988-10-31 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 10 [patent_figures_cnt] => 13 [patent_no_of_words] => 5481 [patent_no_of_claims] => 28 [patent_no_of_ind_claims] => 6 [patent_words_short_claim] => 117 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/04/875/04875614.pdf [firstpage_image] =>[orig_patent_app_number] => 264713 [rel_patent_id] =>[rel_patent_doc_number] =>)
07/264713
Alignment device Oct 30, 1988 Issued
Array ( [id] => 2574751 [patent_doc_number] => 04907734 [patent_country] => US [patent_kind] => NA [patent_issue_date] => 1990-03-13 [patent_title] => 'Method of bonding gold or gold alloy wire to lead tin solder' [patent_app_type] => 1 [patent_app_number] => 7/263806 [patent_app_country] => US [patent_app_date] => 1988-10-28 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 1 [patent_figures_cnt] => 2 [patent_no_of_words] => 1742 [patent_no_of_claims] => 12 [patent_no_of_ind_claims] => 1 [patent_words_short_claim] => 137 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/04/907/04907734.pdf [firstpage_image] =>[orig_patent_app_number] => 263806 [rel_patent_id] =>[rel_patent_doc_number] =>)
07/263806
Method of bonding gold or gold alloy wire to lead tin solder Oct 27, 1988 Issued
Array ( [id] => 2464770 [patent_doc_number] => 04871106 [patent_country] => US [patent_kind] => NA [patent_issue_date] => 1989-10-03 [patent_title] => 'Non-dedicated pallet assembly for wave soldering packaged integrated circuits' [patent_app_type] => 1 [patent_app_number] => 7/264453 [patent_app_country] => US [patent_app_date] => 1988-10-28 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 5 [patent_figures_cnt] => 11 [patent_no_of_words] => 7961 [patent_no_of_claims] => 7 [patent_no_of_ind_claims] => 2 [patent_words_short_claim] => 100 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/04/871/04871106.pdf [firstpage_image] =>[orig_patent_app_number] => 264453 [rel_patent_id] =>[rel_patent_doc_number] =>)
07/264453
Non-dedicated pallet assembly for wave soldering packaged integrated circuits Oct 27, 1988 Issued
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