Search

Selam T. Gebriel

Examiner (ID: 6495, Phone: (571)270-1652 , Office: P/2661 )

Most Active Art Unit
2661
Art Unit(s)
2661, 2622, 2696
Total Applications
527
Issued Applications
406
Pending Applications
0
Abandoned Applications
122

Applications

Application numberTitle of the applicationFiling DateStatus
Array ( [id] => 3727290 [patent_doc_number] => 05670432 [patent_country] => US [patent_kind] => NA [patent_issue_date] => 1997-09-23 [patent_title] => 'Thermal treatment to form a void free aluminum metal layer for a semiconductor device' [patent_app_type] => 1 [patent_app_number] => 8/691079 [patent_app_country] => US [patent_app_date] => 1996-08-01 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 3 [patent_figures_cnt] => 5 [patent_no_of_words] => 2867 [patent_no_of_claims] => 25 [patent_no_of_ind_claims] => 6 [patent_words_short_claim] => 96 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/05/670/05670432.pdf [firstpage_image] =>[orig_patent_app_number] => 691079 [rel_patent_id] =>[rel_patent_doc_number] =>)
08/691079
Thermal treatment to form a void free aluminum metal layer for a semiconductor device Jul 31, 1996 Issued
Array ( [id] => 3876758 [patent_doc_number] => 05728602 [patent_country] => US [patent_kind] => NA [patent_issue_date] => 1998-03-17 [patent_title] => 'Semiconductor wafer manufacturing process with high-flow-rate low-pressure purge cycles' [patent_app_type] => 1 [patent_app_number] => 8/657148 [patent_app_country] => US [patent_app_date] => 1996-06-03 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 2 [patent_figures_cnt] => 2 [patent_no_of_words] => 2926 [patent_no_of_claims] => 5 [patent_no_of_ind_claims] => 1 [patent_words_short_claim] => 120 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/05/728/05728602.pdf [firstpage_image] =>[orig_patent_app_number] => 657148 [rel_patent_id] =>[rel_patent_doc_number] =>)
08/657148
Semiconductor wafer manufacturing process with high-flow-rate low-pressure purge cycles Jun 2, 1996 Issued
Array ( [id] => 3660749 [patent_doc_number] => 05656553 [patent_country] => US [patent_kind] => NA [patent_issue_date] => 1997-08-12 [patent_title] => 'Method for forming a monolithic electronic module by dicing wafer stacks' [patent_app_type] => 1 [patent_app_number] => 8/655529 [patent_app_country] => US [patent_app_date] => 1996-05-30 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 6 [patent_figures_cnt] => 10 [patent_no_of_words] => 4498 [patent_no_of_claims] => 16 [patent_no_of_ind_claims] => 1 [patent_words_short_claim] => 83 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/05/656/05656553.pdf [firstpage_image] =>[orig_patent_app_number] => 655529 [rel_patent_id] =>[rel_patent_doc_number] =>)
08/655529
Method for forming a monolithic electronic module by dicing wafer stacks May 29, 1996 Issued
Array ( [id] => 3885895 [patent_doc_number] => 05714406 [patent_country] => US [patent_kind] => NA [patent_issue_date] => 1998-02-03 [patent_title] => 'Method for forming film on semiconductor substrate by thermal CVD method' [patent_app_type] => 1 [patent_app_number] => 8/640257 [patent_app_country] => US [patent_app_date] => 1996-04-30 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 3 [patent_figures_cnt] => 10 [patent_no_of_words] => 2589 [patent_no_of_claims] => 10 [patent_no_of_ind_claims] => 3 [patent_words_short_claim] => 87 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/05/714/05714406.pdf [firstpage_image] =>[orig_patent_app_number] => 640257 [rel_patent_id] =>[rel_patent_doc_number] =>)
08/640257
Method for forming film on semiconductor substrate by thermal CVD method Apr 29, 1996 Issued
Array ( [id] => 3731381 [patent_doc_number] => 05665658 [patent_country] => US [patent_kind] => NA [patent_issue_date] => 1997-09-09 [patent_title] => 'Method of forming a dielectric layer structure' [patent_app_type] => 1 [patent_app_number] => 8/620688 [patent_app_country] => US [patent_app_date] => 1996-03-21 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 2 [patent_figures_cnt] => 5 [patent_no_of_words] => 3057 [patent_no_of_claims] => 23 [patent_no_of_ind_claims] => 3 [patent_words_short_claim] => 96 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/05/665/05665658.pdf [firstpage_image] =>[orig_patent_app_number] => 620688 [rel_patent_id] =>[rel_patent_doc_number] =>)
08/620688
Method of forming a dielectric layer structure Mar 20, 1996 Issued
Array ( [id] => 3730341 [patent_doc_number] => 05693579 [patent_country] => US [patent_kind] => NA [patent_issue_date] => 1997-12-02 [patent_title] => 'Semiconductor manufacturing method and semiconductor device manufacturing apparatus' [patent_app_type] => 1 [patent_app_number] => 8/615778 [patent_app_country] => US [patent_app_date] => 1996-03-14 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 3 [patent_figures_cnt] => 5 [patent_no_of_words] => 2707 [patent_no_of_claims] => 20 [patent_no_of_ind_claims] => 3 [patent_words_short_claim] => 102 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/05/693/05693579.pdf [firstpage_image] =>[orig_patent_app_number] => 615778 [rel_patent_id] =>[rel_patent_doc_number] =>)
08/615778
Semiconductor manufacturing method and semiconductor device manufacturing apparatus Mar 13, 1996 Issued
Array ( [id] => 3694812 [patent_doc_number] => 05618758 [patent_country] => US [patent_kind] => NA [patent_issue_date] => 1997-04-08 [patent_title] => 'Method for forming a thin semiconductor film and a plasma CVD apparatus to be used in the method' [patent_app_type] => 1 [patent_app_number] => 8/601990 [patent_app_country] => US [patent_app_date] => 1996-02-15 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 5 [patent_figures_cnt] => 6 [patent_no_of_words] => 4658 [patent_no_of_claims] => 5 [patent_no_of_ind_claims] => 1 [patent_words_short_claim] => 101 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/05/618/05618758.pdf [firstpage_image] =>[orig_patent_app_number] => 601990 [rel_patent_id] =>[rel_patent_doc_number] =>)
08/601990
Method for forming a thin semiconductor film and a plasma CVD apparatus to be used in the method Feb 14, 1996 Issued
Array ( [id] => 3633042 [patent_doc_number] => 05610103 [patent_country] => US [patent_kind] => NA [patent_issue_date] => 1997-03-11 [patent_title] => 'Ultrasonic wave assisted contact hole filling' [patent_app_type] => 1 [patent_app_number] => 8/570762 [patent_app_country] => US [patent_app_date] => 1995-12-12 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 2 [patent_figures_cnt] => 4 [patent_no_of_words] => 3157 [patent_no_of_claims] => 8 [patent_no_of_ind_claims] => 1 [patent_words_short_claim] => 123 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/05/610/05610103.pdf [firstpage_image] =>[orig_patent_app_number] => 570762 [rel_patent_id] =>[rel_patent_doc_number] =>)
08/570762
Ultrasonic wave assisted contact hole filling Dec 11, 1995 Issued
Array ( [id] => 3649506 [patent_doc_number] => 05605866 [patent_country] => US [patent_kind] => NA [patent_issue_date] => 1997-02-25 [patent_title] => 'Clamp with wafer release for semiconductor wafer processing equipment' [patent_app_type] => 1 [patent_app_number] => 8/565355 [patent_app_country] => US [patent_app_date] => 1995-11-30 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 6 [patent_figures_cnt] => 8 [patent_no_of_words] => 4620 [patent_no_of_claims] => 4 [patent_no_of_ind_claims] => 1 [patent_words_short_claim] => 87 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/05/605/05605866.pdf [firstpage_image] =>[orig_patent_app_number] => 565355 [rel_patent_id] =>[rel_patent_doc_number] =>)
08/565355
Clamp with wafer release for semiconductor wafer processing equipment Nov 29, 1995 Issued
Array ( [id] => 3812422 [patent_doc_number] => 05710065 [patent_country] => US [patent_kind] => NA [patent_issue_date] => 1998-01-20 [patent_title] => 'Method and apparatus for breaking and separating dies from a wafer' [patent_app_type] => 1 [patent_app_number] => 8/367970 [patent_app_country] => US [patent_app_date] => 1995-01-03 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 4 [patent_figures_cnt] => 15 [patent_no_of_words] => 2132 [patent_no_of_claims] => 17 [patent_no_of_ind_claims] => 5 [patent_words_short_claim] => 57 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/05/710/05710065.pdf [firstpage_image] =>[orig_patent_app_number] => 367970 [rel_patent_id] =>[rel_patent_doc_number] =>)
08/367970
Method and apparatus for breaking and separating dies from a wafer Jan 2, 1995 Issued
Array ( [id] => 3646113 [patent_doc_number] => 05637538 [patent_country] => US [patent_kind] => NA [patent_issue_date] => 1997-06-10 [patent_title] => 'Method and apparatus for processing a specimen' [patent_app_type] => 1 [patent_app_number] => 8/342743 [patent_app_country] => US [patent_app_date] => 1994-11-21 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 5 [patent_figures_cnt] => 8 [patent_no_of_words] => 1710 [patent_no_of_claims] => 4 [patent_no_of_ind_claims] => 1 [patent_words_short_claim] => 83 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/05/637/05637538.pdf [firstpage_image] =>[orig_patent_app_number] => 342743 [rel_patent_id] =>[rel_patent_doc_number] =>)
08/342743
Method and apparatus for processing a specimen Nov 20, 1994 Issued
08/339521 TITANIUM NITRIDE LAYERS DEPOSITED BY CHEMICAL VAPOR DEPOSITION AND METHOD OF MAKING Nov 13, 1994 Abandoned
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