Search

Sheila V. Clark

Examiner (ID: 7169, Phone: (571)272-1725 , Office: P/2896 )

Most Active Art Unit
2815
Art Unit(s)
2607, 2896, 2891, 2504, 2503, 2508, 2815, 2823
Total Applications
3274
Issued Applications
2860
Pending Applications
49
Abandoned Applications
366

Applications

Application numberTitle of the applicationFiling DateStatus
Array ( [id] => 10127078 [patent_doc_number] => 09161456 [patent_country] => US [patent_kind] => B1 [patent_issue_date] => 2015-10-13 [patent_title] => 'Making imprinted micro-wire rib structure' [patent_app_type] => utility [patent_app_number] => 14/476059 [patent_app_country] => US [patent_app_date] => 2014-09-03 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 8 [patent_figures_cnt] => 8 [patent_no_of_words] => 7679 [patent_no_of_claims] => 19 [patent_no_of_ind_claims] => 1 [patent_words_short_claim] => 183 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 14476059 [rel_patent_id] =>[rel_patent_doc_number] =>)
14/476059
Making imprinted micro-wire rib structure Sep 2, 2014 Issued
Array ( [id] => 9905912 [patent_doc_number] => 20150061112 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2015-03-05 [patent_title] => 'Power semiconductor device and method for producing a power semiconductor device' [patent_app_type] => utility [patent_app_number] => 14/476299 [patent_app_country] => US [patent_app_date] => 2014-09-03 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 10 [patent_figures_cnt] => 10 [patent_no_of_words] => 5923 [patent_no_of_claims] => 15 [patent_no_of_ind_claims] => 2 [patent_words_short_claim] => 0 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 14476299 [rel_patent_id] =>[rel_patent_doc_number] =>)
14/476299
Power semiconductor device and method for producing a power semiconductor device Sep 2, 2014 Issued
Array ( [id] => 10954000 [patent_doc_number] => 20140357021 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2014-12-04 [patent_title] => 'MULTI-CHIP MODULE WITH STACKED FACE-DOWN CONNECTED DIES' [patent_app_type] => utility [patent_app_number] => 14/461919 [patent_app_country] => US [patent_app_date] => 2014-08-18 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 12 [patent_figures_cnt] => 12 [patent_no_of_words] => 10947 [patent_no_of_claims] => 5 [patent_no_of_ind_claims] => 1 [patent_words_short_claim] => 0 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 14461919 [rel_patent_id] =>[rel_patent_doc_number] =>)
14/461919
Multi-chip module with stacked face-down connected dies Aug 17, 2014 Issued
Array ( [id] => 10426172 [patent_doc_number] => 20150311182 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2015-10-29 [patent_title] => 'SEMICONDUCTOR PACKAGE AND METHOD FOR MANUFACTURING THE SAME' [patent_app_type] => utility [patent_app_number] => 14/461840 [patent_app_country] => US [patent_app_date] => 2014-08-18 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 21 [patent_figures_cnt] => 21 [patent_no_of_words] => 5676 [patent_no_of_claims] => 20 [patent_no_of_ind_claims] => 2 [patent_words_short_claim] => 0 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 14461840 [rel_patent_id] =>[rel_patent_doc_number] =>)
14/461840
Semiconductor package and method for manufacturing the same Aug 17, 2014 Issued
Array ( [id] => 10093127 [patent_doc_number] => 09129957 [patent_country] => US [patent_kind] => B1 [patent_issue_date] => 2015-09-08 [patent_title] => 'Method of forming a metal bump' [patent_app_type] => utility [patent_app_number] => 14/461703 [patent_app_country] => US [patent_app_date] => 2014-08-18 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 5 [patent_figures_cnt] => 5 [patent_no_of_words] => 2225 [patent_no_of_claims] => 8 [patent_no_of_ind_claims] => 1 [patent_words_short_claim] => 151 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 14461703 [rel_patent_id] =>[rel_patent_doc_number] =>)
14/461703
Method of forming a metal bump Aug 17, 2014 Issued
Array ( [id] => 10331044 [patent_doc_number] => 20150216048 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2015-07-30 [patent_title] => 'PACKAGE SUBSTRATE' [patent_app_type] => utility [patent_app_number] => 14/460909 [patent_app_country] => US [patent_app_date] => 2014-08-15 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 4 [patent_figures_cnt] => 4 [patent_no_of_words] => 3469 [patent_no_of_claims] => 18 [patent_no_of_ind_claims] => 2 [patent_words_short_claim] => 0 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 14460909 [rel_patent_id] =>[rel_patent_doc_number] =>)
14/460909
Package substrate Aug 14, 2014 Issued
Array ( [id] => 10047301 [patent_doc_number] => 09087703 [patent_country] => US [patent_kind] => B1 [patent_issue_date] => 2015-07-21 [patent_title] => 'Touch panel and a bonding structure and method thereof' [patent_app_type] => utility [patent_app_number] => 14/461062 [patent_app_country] => US [patent_app_date] => 2014-08-15 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 4 [patent_figures_cnt] => 7 [patent_no_of_words] => 1886 [patent_no_of_claims] => 14 [patent_no_of_ind_claims] => 4 [patent_words_short_claim] => 164 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 14461062 [rel_patent_id] =>[rel_patent_doc_number] =>)
14/461062
Touch panel and a bonding structure and method thereof Aug 14, 2014 Issued
Array ( [id] => 10943651 [patent_doc_number] => 20140346672 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2014-11-27 [patent_title] => 'Integrated Circuit Structure Having Dies with Connectors' [patent_app_type] => utility [patent_app_number] => 14/456463 [patent_app_country] => US [patent_app_date] => 2014-08-11 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 4 [patent_figures_cnt] => 4 [patent_no_of_words] => 3518 [patent_no_of_claims] => 20 [patent_no_of_ind_claims] => 3 [patent_words_short_claim] => 0 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 14456463 [rel_patent_id] =>[rel_patent_doc_number] =>)
14/456463
Integrated circuit structure having dies with connectors Aug 10, 2014 Issued
Array ( [id] => 10165367 [patent_doc_number] => 09196597 [patent_country] => US [patent_kind] => B2 [patent_issue_date] => 2015-11-24 [patent_title] => 'Semiconductor package with single sided substrate design and manufacturing methods thereof' [patent_app_type] => utility [patent_app_number] => 14/453139 [patent_app_country] => US [patent_app_date] => 2014-08-06 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 31 [patent_figures_cnt] => 61 [patent_no_of_words] => 14497 [patent_no_of_claims] => 18 [patent_no_of_ind_claims] => 6 [patent_words_short_claim] => 123 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 14453139 [rel_patent_id] =>[rel_patent_doc_number] =>)
14/453139
Semiconductor package with single sided substrate design and manufacturing methods thereof Aug 5, 2014 Issued
Array ( [id] => 10939487 [patent_doc_number] => 20140342508 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2014-11-20 [patent_title] => 'HYBRID SUBSTRATES, SEMICONDUCTOR PACKAGES INCLUDING THE SAME AND METHODS FOR FABRICATING SEMICONDUCTOR PACKAGES' [patent_app_type] => utility [patent_app_number] => 14/451982 [patent_app_country] => US [patent_app_date] => 2014-08-05 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 35 [patent_figures_cnt] => 35 [patent_no_of_words] => 9560 [patent_no_of_claims] => 9 [patent_no_of_ind_claims] => 1 [patent_words_short_claim] => 0 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 14451982 [rel_patent_id] =>[rel_patent_doc_number] =>)
14/451982
Hybrid substrates, semiconductor packages including the same and methods for fabricating semiconductor packages Aug 4, 2014 Issued
Array ( [id] => 10016137 [patent_doc_number] => 09059158 [patent_country] => US [patent_kind] => B2 [patent_issue_date] => 2015-06-16 [patent_title] => 'Semiconductor device having under-bump metallization (UBM) structure and method of forming the same' [patent_app_type] => utility [patent_app_number] => 14/335084 [patent_app_country] => US [patent_app_date] => 2014-07-18 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 6 [patent_figures_cnt] => 10 [patent_no_of_words] => 5084 [patent_no_of_claims] => 20 [patent_no_of_ind_claims] => 3 [patent_words_short_claim] => 83 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 14335084 [rel_patent_id] =>[rel_patent_doc_number] =>)
14/335084
Semiconductor device having under-bump metallization (UBM) structure and method of forming the same Jul 17, 2014 Issued
Array ( [id] => 15286679 [patent_doc_number] => 10516010 [patent_country] => US [patent_kind] => B2 [patent_issue_date] => 2019-12-24 [patent_title] => Light emitting apparatus and method for manufacturing the same [patent_app_type] => utility [patent_app_number] => 14/333078 [patent_app_country] => US [patent_app_date] => 2014-07-16 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 29 [patent_figures_cnt] => 55 [patent_no_of_words] => 14646 [patent_no_of_claims] => 11 [patent_no_of_ind_claims] => 4 [patent_words_short_claim] => 111 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 14333078 [rel_patent_id] =>[rel_patent_doc_number] =>)
14/333078
Light emitting apparatus and method for manufacturing the same Jul 15, 2014 Issued
Array ( [id] => 9802610 [patent_doc_number] => 20150014554 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2015-01-15 [patent_title] => 'PACKAGING FOR HIGH POWER INTEGRATED CIRCUITS AND INFRARED EMITTER ARRAYS' [patent_app_type] => utility [patent_app_number] => 14/327307 [patent_app_country] => US [patent_app_date] => 2014-07-09 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 9 [patent_figures_cnt] => 9 [patent_no_of_words] => 4058 [patent_no_of_claims] => 33 [patent_no_of_ind_claims] => 5 [patent_words_short_claim] => 0 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 14327307 [rel_patent_id] =>[rel_patent_doc_number] =>)
14/327307
Packaging for high power integrated circuits and infrared emitter arrays Jul 8, 2014 Issued
Array ( [id] => 10270267 [patent_doc_number] => 20150155264 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2015-06-04 [patent_title] => 'TECHNIQUES FOR ADHESIVE CONTROL BETWEEN A SUBSTRATE AND A DIE' [patent_app_type] => utility [patent_app_number] => 14/325573 [patent_app_country] => US [patent_app_date] => 2014-07-08 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 6 [patent_figures_cnt] => 6 [patent_no_of_words] => 3747 [patent_no_of_claims] => 24 [patent_no_of_ind_claims] => 2 [patent_words_short_claim] => 0 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 14325573 [rel_patent_id] =>[rel_patent_doc_number] =>)
14/325573
Techniques for adhesive control between a substrate and a die Jul 7, 2014 Issued
Array ( [id] => 10486957 [patent_doc_number] => 20150371977 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2015-12-24 [patent_title] => 'DISPLAY PANEL AND MANUFACTURING METHOD THEREOF' [patent_app_type] => utility [patent_app_number] => 14/391058 [patent_app_country] => US [patent_app_date] => 2014-06-30 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 5 [patent_figures_cnt] => 5 [patent_no_of_words] => 4675 [patent_no_of_claims] => 20 [patent_no_of_ind_claims] => 3 [patent_words_short_claim] => 0 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 14391058 [rel_patent_id] =>[rel_patent_doc_number] =>)
14/391058
Display panel and manufacturing method thereof Jun 29, 2014 Issued
Array ( [id] => 11883713 [patent_doc_number] => 09754894 [patent_country] => US [patent_kind] => B2 [patent_issue_date] => 2017-09-05 [patent_title] => 'Sheet for sealing and method for manufacturing semiconductor device using said sheet for sealing' [patent_app_type] => utility [patent_app_number] => 14/908687 [patent_app_country] => US [patent_app_date] => 2014-06-30 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 3 [patent_figures_cnt] => 11 [patent_no_of_words] => 10690 [patent_no_of_claims] => 3 [patent_no_of_ind_claims] => 2 [patent_words_short_claim] => 46 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 14908687 [rel_patent_id] =>[rel_patent_doc_number] =>)
14/908687
Sheet for sealing and method for manufacturing semiconductor device using said sheet for sealing Jun 29, 2014 Issued
Array ( [id] => 10905767 [patent_doc_number] => 20140308780 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2014-10-16 [patent_title] => 'FABRICATION METHOD OF SEMICONDUCTOR PACKAGE' [patent_app_type] => utility [patent_app_number] => 14/316011 [patent_app_country] => US [patent_app_date] => 2014-06-26 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 6 [patent_figures_cnt] => 6 [patent_no_of_words] => 3117 [patent_no_of_claims] => 14 [patent_no_of_ind_claims] => 2 [patent_words_short_claim] => 0 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 14316011 [rel_patent_id] =>[rel_patent_doc_number] =>)
14/316011
Fabrication method of semiconductor package Jun 25, 2014 Issued
Array ( [id] => 10960895 [patent_doc_number] => 20140363925 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2014-12-11 [patent_title] => 'Method for Producing a Semiconductor Module by Using an Adhesion Carrier' [patent_app_type] => utility [patent_app_number] => 14/295373 [patent_app_country] => US [patent_app_date] => 2014-06-04 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 6 [patent_figures_cnt] => 6 [patent_no_of_words] => 2936 [patent_no_of_claims] => 11 [patent_no_of_ind_claims] => 1 [patent_words_short_claim] => 0 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 14295373 [rel_patent_id] =>[rel_patent_doc_number] =>)
14/295373
Method for producing a semiconductor module by using an adhesion carrier Jun 3, 2014 Issued
Array ( [id] => 9737637 [patent_doc_number] => 20140273355 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2014-09-18 [patent_title] => 'METHOD OF MAKING PACKAGE WITH INTERPOSER FRAME' [patent_app_type] => utility [patent_app_number] => 14/291142 [patent_app_country] => US [patent_app_date] => 2014-05-30 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 14 [patent_figures_cnt] => 14 [patent_no_of_words] => 4848 [patent_no_of_claims] => 20 [patent_no_of_ind_claims] => 3 [patent_words_short_claim] => 0 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 14291142 [rel_patent_id] =>[rel_patent_doc_number] =>)
14/291142
Method of making package with interposer frame May 29, 2014 Issued
Array ( [id] => 10206162 [patent_doc_number] => 20150091150 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2015-04-02 [patent_title] => 'PACKAGE ON PACKAGE STRUCTURE AND FABRICATION METHOD THEREOF' [patent_app_type] => utility [patent_app_number] => 14/290145 [patent_app_country] => US [patent_app_date] => 2014-05-29 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 8 [patent_figures_cnt] => 8 [patent_no_of_words] => 2906 [patent_no_of_claims] => 13 [patent_no_of_ind_claims] => 2 [patent_words_short_claim] => 0 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 14290145 [rel_patent_id] =>[rel_patent_doc_number] =>)
14/290145
Package on package structure and fabrication method thereof May 28, 2014 Issued
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