
Sheila V. Clark
Examiner (ID: 7169, Phone: (571)272-1725 , Office: P/2896 )
| Most Active Art Unit | 2815 |
| Art Unit(s) | 2607, 2896, 2891, 2504, 2503, 2508, 2815, 2823 |
| Total Applications | 3274 |
| Issued Applications | 2860 |
| Pending Applications | 49 |
| Abandoned Applications | 366 |
Applications
| Application number | Title of the application | Filing Date | Status |
|---|---|---|---|
Array
(
[id] => 10127078
[patent_doc_number] => 09161456
[patent_country] => US
[patent_kind] => B1
[patent_issue_date] => 2015-10-13
[patent_title] => 'Making imprinted micro-wire rib structure'
[patent_app_type] => utility
[patent_app_number] => 14/476059
[patent_app_country] => US
[patent_app_date] => 2014-09-03
[patent_effective_date] => 0000-00-00
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Array
(
[id] => 9905912
[patent_doc_number] => 20150061112
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[patent_issue_date] => 2015-03-05
[patent_title] => 'Power semiconductor device and method for producing a power semiconductor device'
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Array
(
[id] => 10954000
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[patent_kind] => A1
[patent_issue_date] => 2014-12-04
[patent_title] => 'MULTI-CHIP MODULE WITH STACKED FACE-DOWN CONNECTED DIES'
[patent_app_type] => utility
[patent_app_number] => 14/461919
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[patent_app_date] => 2014-08-18
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Array
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[patent_issue_date] => 2015-10-29
[patent_title] => 'SEMICONDUCTOR PACKAGE AND METHOD FOR MANUFACTURING THE SAME'
[patent_app_type] => utility
[patent_app_number] => 14/461840
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Array
(
[id] => 10093127
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[patent_issue_date] => 2015-09-08
[patent_title] => 'Method of forming a metal bump'
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Array
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Array
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[patent_title] => 'Touch panel and a bonding structure and method thereof'
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Array
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[id] => 10943651
[patent_doc_number] => 20140346672
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[patent_issue_date] => 2014-11-27
[patent_title] => 'Integrated Circuit Structure Having Dies with Connectors'
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[rel_patent_id] =>[rel_patent_doc_number] =>) 14/456463 | Integrated circuit structure having dies with connectors | Aug 10, 2014 | Issued |
Array
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[id] => 10165367
[patent_doc_number] => 09196597
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[patent_title] => 'Semiconductor package with single sided substrate design and manufacturing methods thereof'
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Array
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[id] => 10939487
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[patent_title] => 'HYBRID SUBSTRATES, SEMICONDUCTOR PACKAGES INCLUDING THE SAME AND METHODS FOR FABRICATING SEMICONDUCTOR PACKAGES'
[patent_app_type] => utility
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[rel_patent_id] =>[rel_patent_doc_number] =>) 14/451982 | Hybrid substrates, semiconductor packages including the same and methods for fabricating semiconductor packages | Aug 4, 2014 | Issued |
Array
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[id] => 10016137
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[patent_title] => 'Semiconductor device having under-bump metallization (UBM) structure and method of forming the same'
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Array
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[patent_title] => Light emitting apparatus and method for manufacturing the same
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Array
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Array
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Array
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Array
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