
Sheila V. Clark
Examiner (ID: 7169, Phone: (571)272-1725 , Office: P/2896 )
| Most Active Art Unit | 2815 |
| Art Unit(s) | 2607, 2896, 2891, 2504, 2503, 2508, 2815, 2823 |
| Total Applications | 3274 |
| Issued Applications | 2860 |
| Pending Applications | 49 |
| Abandoned Applications | 366 |
Applications
| Application number | Title of the application | Filing Date | Status |
|---|---|---|---|
Array
(
[id] => 10350914
[patent_doc_number] => 20150235919
[patent_country] => US
[patent_kind] => A1
[patent_issue_date] => 2015-08-20
[patent_title] => 'OPTOELECTRONIC SEMICONDUCTOR COMPONENT HAVING AN ELECTRICALLY INSULATING ELEMENT'
[patent_app_type] => utility
[patent_app_number] => 14/413748
[patent_app_country] => US
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[patent_effective_date] => 0000-00-00
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Array
(
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[patent_issue_date] => 2016-10-18
[patent_title] => 'Semiconductor device manufacturing method and semiconductor device'
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Array
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[patent_title] => 'Redistribution elements and semiconductor device packages including semiconductor devices and redistribution elements'
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Array
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[patent_title] => 'Explosion-protected semiconductor module'
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Array
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[patent_title] => 'Air cavity packages having high thermal conductivity base plates and methods of making'
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Array
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[patent_doc_number] => 20160172237
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[patent_issue_date] => 2016-06-16
[patent_title] => 'NON-LITHOGRAPHICALLY PATTERNED DIRECTED SELF ASSEMBLY ALIGNMENT PROMOTION LAYERS'
[patent_app_type] => utility
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[rel_patent_id] =>[rel_patent_doc_number] =>) 14/778562 | Non-lithographically patterned directed self assembly alignment promotion layers | Jun 26, 2013 | Issued |
Array
(
[id] => 9118340
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[patent_issue_date] => 2013-10-31
[patent_title] => 'DICING TAPE-INTEGRATED WAFER BACK SURFACE PROTECTIVE FILM'
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[rel_patent_id] =>[rel_patent_doc_number] =>) 13/927408 | Dicing tape-integrated wafer back surface protective film | Jun 25, 2013 | Issued |
Array
(
[id] => 10057077
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[patent_title] => 'Stacked assembly of a MEMS integrated device having a reduced thickness'
[patent_app_type] => utility
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[rel_patent_id] =>[rel_patent_doc_number] =>) 13/922577 | Stacked assembly of a MEMS integrated device having a reduced thickness | Jun 19, 2013 | Issued |
Array
(
[id] => 11180727
[patent_doc_number] => 09412723
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[patent_issue_date] => 2016-08-09
[patent_title] => 'Package on-package structures and methods for forming the same'
[patent_app_type] => utility
[patent_app_number] => 13/922117
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Array
(
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[patent_title] => 'PACKAGING SUBSTRATE, SEMICONDUCTOR PACKAGE AND FABRICATION METHODS THEREOF'
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Array
(
[id] => 9649315
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[patent_title] => 'Integrated circuit structure having dies with connectors'
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[rel_patent_id] =>[rel_patent_doc_number] =>) 13/901360 | Integrated circuit structure having dies with connectors | May 22, 2013 | Issued |
Array
(
[id] => 10937879
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[patent_title] => 'STABILIZATION STRUCTURE INCLUDING SHEAR RELEASE POSTS'
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Array
(
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Array
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Array
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Array
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Array
(
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[patent_title] => 'METHOD FOR PRODUCING AT LEAST ONE PAD ASSEMBLY ON A SUPPORT FOR THE SELF-ASSEMBLY OF AN INTEGRATED CIRCUIT CHIP ON THE SUPPORT BY THE FORMATION OF A FLUORINATED MATERIAL SURROUNDING THE PAD AND EXPOSURE OF THE PAD AND THE FLUORINATED MATERIAL TO AN ULTRAVIOLET TREATMENT IN THE PRESENCE OF OZONE'
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Array
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