Search

Sheila V. Clark

Examiner (ID: 7169, Phone: (571)272-1725 , Office: P/2896 )

Most Active Art Unit
2815
Art Unit(s)
2607, 2896, 2891, 2504, 2503, 2508, 2815, 2823
Total Applications
3274
Issued Applications
2860
Pending Applications
49
Abandoned Applications
366

Applications

Application numberTitle of the applicationFiling DateStatus
Array ( [id] => 10350914 [patent_doc_number] => 20150235919 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2015-08-20 [patent_title] => 'OPTOELECTRONIC SEMICONDUCTOR COMPONENT HAVING AN ELECTRICALLY INSULATING ELEMENT' [patent_app_type] => utility [patent_app_number] => 14/413748 [patent_app_country] => US [patent_app_date] => 2013-07-16 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 5 [patent_figures_cnt] => 5 [patent_no_of_words] => 8420 [patent_no_of_claims] => 18 [patent_no_of_ind_claims] => 3 [patent_words_short_claim] => 0 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 14413748 [rel_patent_id] =>[rel_patent_doc_number] =>)
14/413748
Optoelectronic semiconductor component having an electrically insulating element Jul 15, 2013 Issued
Array ( [id] => 11246488 [patent_doc_number] => 09472538 [patent_country] => US [patent_kind] => B2 [patent_issue_date] => 2016-10-18 [patent_title] => 'Semiconductor device manufacturing method and semiconductor device' [patent_app_type] => utility [patent_app_number] => 14/785314 [patent_app_country] => US [patent_app_date] => 2013-07-04 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 37 [patent_figures_cnt] => 47 [patent_no_of_words] => 8193 [patent_no_of_claims] => 30 [patent_no_of_ind_claims] => 2 [patent_words_short_claim] => 94 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 14785314 [rel_patent_id] =>[rel_patent_doc_number] =>)
14/785314
Semiconductor device manufacturing method and semiconductor device Jul 3, 2013 Issued
Array ( [id] => 9524773 [patent_doc_number] => 08749050 [patent_country] => US [patent_kind] => B2 [patent_issue_date] => 2014-06-10 [patent_title] => 'Redistribution elements and semiconductor device packages including semiconductor devices and redistribution elements' [patent_app_type] => utility [patent_app_number] => 13/933294 [patent_app_country] => US [patent_app_date] => 2013-07-02 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 2 [patent_figures_cnt] => 9 [patent_no_of_words] => 3563 [patent_no_of_claims] => 20 [patent_no_of_ind_claims] => 2 [patent_words_short_claim] => 123 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 13933294 [rel_patent_id] =>[rel_patent_doc_number] =>)
13/933294
Redistribution elements and semiconductor device packages including semiconductor devices and redistribution elements Jul 1, 2013 Issued
Array ( [id] => 9923576 [patent_doc_number] => 08981545 [patent_country] => US [patent_kind] => B2 [patent_issue_date] => 2015-03-17 [patent_title] => 'Explosion-protected semiconductor module' [patent_app_type] => utility [patent_app_number] => 13/932531 [patent_app_country] => US [patent_app_date] => 2013-07-01 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 7 [patent_figures_cnt] => 18 [patent_no_of_words] => 8119 [patent_no_of_claims] => 29 [patent_no_of_ind_claims] => 1 [patent_words_short_claim] => 115 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 13932531 [rel_patent_id] =>[rel_patent_doc_number] =>)
13/932531
Explosion-protected semiconductor module Jun 30, 2013 Issued
Array ( [id] => 10079940 [patent_doc_number] => 09117793 [patent_country] => US [patent_kind] => B2 [patent_issue_date] => 2015-08-25 [patent_title] => 'Air cavity packages having high thermal conductivity base plates and methods of making' [patent_app_type] => utility [patent_app_number] => 13/930101 [patent_app_country] => US [patent_app_date] => 2013-06-28 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 4 [patent_figures_cnt] => 4 [patent_no_of_words] => 2179 [patent_no_of_claims] => 21 [patent_no_of_ind_claims] => 2 [patent_words_short_claim] => 21 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 13930101 [rel_patent_id] =>[rel_patent_doc_number] =>)
13/930101
Air cavity packages having high thermal conductivity base plates and methods of making Jun 27, 2013 Issued
Array ( [id] => 10826069 [patent_doc_number] => 20160172237 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2016-06-16 [patent_title] => 'NON-LITHOGRAPHICALLY PATTERNED DIRECTED SELF ASSEMBLY ALIGNMENT PROMOTION LAYERS' [patent_app_type] => utility [patent_app_number] => 14/778562 [patent_app_country] => US [patent_app_date] => 2013-06-27 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 14 [patent_figures_cnt] => 14 [patent_no_of_words] => 13787 [patent_no_of_claims] => 25 [patent_no_of_ind_claims] => 3 [patent_words_short_claim] => 0 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 14778562 [rel_patent_id] =>[rel_patent_doc_number] =>)
14/778562
Non-lithographically patterned directed self assembly alignment promotion layers Jun 26, 2013 Issued
Array ( [id] => 9118340 [patent_doc_number] => 20130285262 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2013-10-31 [patent_title] => 'DICING TAPE-INTEGRATED WAFER BACK SURFACE PROTECTIVE FILM' [patent_app_type] => utility [patent_app_number] => 13/927408 [patent_app_country] => US [patent_app_date] => 2013-06-26 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 3 [patent_figures_cnt] => 3 [patent_no_of_words] => 17628 [patent_no_of_claims] => 5 [patent_no_of_ind_claims] => 1 [patent_words_short_claim] => 0 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 13927408 [rel_patent_id] =>[rel_patent_doc_number] =>)
13/927408
Dicing tape-integrated wafer back surface protective film Jun 25, 2013 Issued
Array ( [id] => 10057077 [patent_doc_number] => 09096421 [patent_country] => US [patent_kind] => B2 [patent_issue_date] => 2015-08-04 [patent_title] => 'Stacked assembly of a MEMS integrated device having a reduced thickness' [patent_app_type] => utility [patent_app_number] => 13/922577 [patent_app_country] => US [patent_app_date] => 2013-06-20 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 8 [patent_figures_cnt] => 16 [patent_no_of_words] => 5637 [patent_no_of_claims] => 20 [patent_no_of_ind_claims] => 2 [patent_words_short_claim] => 129 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 13922577 [rel_patent_id] =>[rel_patent_doc_number] =>)
13/922577
Stacked assembly of a MEMS integrated device having a reduced thickness Jun 19, 2013 Issued
Array ( [id] => 11180727 [patent_doc_number] => 09412723 [patent_country] => US [patent_kind] => B2 [patent_issue_date] => 2016-08-09 [patent_title] => 'Package on-package structures and methods for forming the same' [patent_app_type] => utility [patent_app_number] => 13/922117 [patent_app_country] => US [patent_app_date] => 2013-06-19 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 7 [patent_figures_cnt] => 7 [patent_no_of_words] => 2721 [patent_no_of_claims] => 20 [patent_no_of_ind_claims] => 3 [patent_words_short_claim] => 131 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 13922117 [rel_patent_id] =>[rel_patent_doc_number] =>)
13/922117
Package on-package structures and methods for forming the same Jun 18, 2013 Issued
Array ( [id] => 9682712 [patent_doc_number] => 20140239475 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2014-08-28 [patent_title] => 'PACKAGING SUBSTRATE, SEMICONDUCTOR PACKAGE AND FABRICATION METHODS THEREOF' [patent_app_type] => utility [patent_app_number] => 13/919161 [patent_app_country] => US [patent_app_date] => 2013-06-17 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 5 [patent_figures_cnt] => 5 [patent_no_of_words] => 3799 [patent_no_of_claims] => 34 [patent_no_of_ind_claims] => 4 [patent_words_short_claim] => 0 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 13919161 [rel_patent_id] =>[rel_patent_doc_number] =>)
13/919161
PACKAGING SUBSTRATE, SEMICONDUCTOR PACKAGE AND FABRICATION METHODS THEREOF Jun 16, 2013 Abandoned
Array ( [id] => 9649315 [patent_doc_number] => 08803337 [patent_country] => US [patent_kind] => B1 [patent_issue_date] => 2014-08-12 [patent_title] => 'Integrated circuit structure having dies with connectors' [patent_app_type] => utility [patent_app_number] => 13/901360 [patent_app_country] => US [patent_app_date] => 2013-05-23 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 3 [patent_figures_cnt] => 4 [patent_no_of_words] => 3488 [patent_no_of_claims] => 20 [patent_no_of_ind_claims] => 3 [patent_words_short_claim] => 71 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 13901360 [rel_patent_id] =>[rel_patent_doc_number] =>)
13/901360
Integrated circuit structure having dies with connectors May 22, 2013 Issued
Array ( [id] => 10937879 [patent_doc_number] => 20140340900 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2014-11-20 [patent_title] => 'STABILIZATION STRUCTURE INCLUDING SHEAR RELEASE POSTS' [patent_app_type] => utility [patent_app_number] => 13/894332 [patent_app_country] => US [patent_app_date] => 2013-05-14 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 21 [patent_figures_cnt] => 21 [patent_no_of_words] => 13747 [patent_no_of_claims] => 30 [patent_no_of_ind_claims] => 3 [patent_words_short_claim] => 0 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 13894332 [rel_patent_id] =>[rel_patent_doc_number] =>)
13/894332
Stabilization structure including shear release posts May 13, 2013 Issued
Array ( [id] => 10645344 [patent_doc_number] => 09362219 [patent_country] => US [patent_kind] => B2 [patent_issue_date] => 2016-06-07 [patent_title] => 'Semiconductor module and semiconductor device' [patent_app_type] => utility [patent_app_number] => 14/787103 [patent_app_country] => US [patent_app_date] => 2013-05-09 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 14 [patent_figures_cnt] => 27 [patent_no_of_words] => 5192 [patent_no_of_claims] => 20 [patent_no_of_ind_claims] => 2 [patent_words_short_claim] => 119 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 14787103 [rel_patent_id] =>[rel_patent_doc_number] =>)
14/787103
Semiconductor module and semiconductor device May 8, 2013 Issued
Array ( [id] => 9013830 [patent_doc_number] => 20130228794 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2013-09-05 [patent_title] => 'Stacked Half-Bridge Package with a Common Leadframe' [patent_app_type] => utility [patent_app_number] => 13/866744 [patent_app_country] => US [patent_app_date] => 2013-04-19 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 6 [patent_figures_cnt] => 6 [patent_no_of_words] => 4050 [patent_no_of_claims] => 21 [patent_no_of_ind_claims] => 3 [patent_words_short_claim] => 0 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 13866744 [rel_patent_id] =>[rel_patent_doc_number] =>)
13/866744
Stacked half-bridge package with a common leadframe Apr 18, 2013 Issued
Array ( [id] => 12380658 [patent_doc_number] => 09961798 [patent_country] => US [patent_kind] => B2 [patent_issue_date] => 2018-05-01 [patent_title] => Package and a method of manufacturing the same [patent_app_type] => utility [patent_app_number] => 13/856455 [patent_app_country] => US [patent_app_date] => 2013-04-04 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 14 [patent_figures_cnt] => 14 [patent_no_of_words] => 6739 [patent_no_of_claims] => 10 [patent_no_of_ind_claims] => 2 [patent_words_short_claim] => 66 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 13856455 [rel_patent_id] =>[rel_patent_doc_number] =>)
13/856455
Package and a method of manufacturing the same Apr 3, 2013 Issued
Array ( [id] => 9677600 [patent_doc_number] => 08816514 [patent_country] => US [patent_kind] => B2 [patent_issue_date] => 2014-08-26 [patent_title] => 'Microelectronic assembly with joined bond elements having lowered inductance' [patent_app_type] => utility [patent_app_number] => 13/853268 [patent_app_country] => US [patent_app_date] => 2013-03-29 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 9 [patent_figures_cnt] => 15 [patent_no_of_words] => 10116 [patent_no_of_claims] => 13 [patent_no_of_ind_claims] => 1 [patent_words_short_claim] => 202 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 13853268 [rel_patent_id] =>[rel_patent_doc_number] =>)
13/853268
Microelectronic assembly with joined bond elements having lowered inductance Mar 28, 2013 Issued
Array ( [id] => 10402685 [patent_doc_number] => 20150287695 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2015-10-08 [patent_title] => 'METHOD FOR PRODUCING AT LEAST ONE PAD ASSEMBLY ON A SUPPORT FOR THE SELF-ASSEMBLY OF AN INTEGRATED CIRCUIT CHIP ON THE SUPPORT BY THE FORMATION OF A FLUORINATED MATERIAL SURROUNDING THE PAD AND EXPOSURE OF THE PAD AND THE FLUORINATED MATERIAL TO AN ULTRAVIOLET TREATMENT IN THE PRESENCE OF OZONE' [patent_app_type] => utility [patent_app_number] => 14/438668 [patent_app_country] => US [patent_app_date] => 2013-03-20 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 4 [patent_figures_cnt] => 4 [patent_no_of_words] => 4397 [patent_no_of_claims] => 16 [patent_no_of_ind_claims] => 2 [patent_words_short_claim] => 0 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 14438668 [rel_patent_id] =>[rel_patent_doc_number] =>)
14/438668
Method for producing at least one pad assembly on a support for the self-assembly of an integrated circuit chip on the support by the formation of a fluorinated material surrounding the pad and exposure of the pad and the fluorinated material to an ultraviolet treatment in the presence of ozone Mar 19, 2013 Issued
Array ( [id] => 9649291 [patent_doc_number] => 08803311 [patent_country] => US [patent_kind] => B2 [patent_issue_date] => 2014-08-12 [patent_title] => 'Wiring boards and semiconductor packages including the same' [patent_app_type] => utility [patent_app_number] => 13/836937 [patent_app_country] => US [patent_app_date] => 2013-03-15 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 8 [patent_figures_cnt] => 12 [patent_no_of_words] => 3964 [patent_no_of_claims] => 20 [patent_no_of_ind_claims] => 3 [patent_words_short_claim] => 88 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 13836937 [rel_patent_id] =>[rel_patent_doc_number] =>)
13/836937
Wiring boards and semiconductor packages including the same Mar 14, 2013 Issued
Array ( [id] => 9335147 [patent_doc_number] => 20140061929 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2014-03-06 [patent_title] => 'SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF' [patent_app_type] => utility [patent_app_number] => 13/836215 [patent_app_country] => US [patent_app_date] => 2013-03-15 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 6 [patent_figures_cnt] => 6 [patent_no_of_words] => 5587 [patent_no_of_claims] => 17 [patent_no_of_ind_claims] => 2 [patent_words_short_claim] => 0 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 13836215 [rel_patent_id] =>[rel_patent_doc_number] =>)
13/836215
Semiconductor device and manufacturing method thereof Mar 14, 2013 Issued
Array ( [id] => 9250732 [patent_doc_number] => 08614514 [patent_country] => US [patent_kind] => B1 [patent_issue_date] => 2013-12-24 [patent_title] => 'Micro-spring chip attachment using ribbon bonds' [patent_app_type] => utility [patent_app_number] => 13/802402 [patent_app_country] => US [patent_app_date] => 2013-03-13 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 4 [patent_figures_cnt] => 7 [patent_no_of_words] => 4245 [patent_no_of_claims] => 20 [patent_no_of_ind_claims] => 3 [patent_words_short_claim] => 168 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 13802402 [rel_patent_id] =>[rel_patent_doc_number] =>)
13/802402
Micro-spring chip attachment using ribbon bonds Mar 12, 2013 Issued
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