Sheila V. Clark

Array ( [id] => 10631460 [patent_doc_number] => 09349616 [patent_country] => US [patent_kind] => B2 [patent_issue_date] => 2016-05-24 [patent_title] => 'Semiconductor device and method of forming WLCSP with semiconductor die embedded within interconnect structure' [patent_app_type] => utility [patent_app_number] => 13/801294 [patent_app_country] => US [patent_app_date] => 2013-03-13 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 16 [patent_figures_cnt] => 49 [patent_no_of_words] => 12638 [patent_no_of_claims] => 15 [patent_no_of_ind_claims] => 3 [patent_words_short_claim] => 104 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 13801294 [rel_patent_id] =>[rel_patent_doc_number] =>)

Array ( [id] => 9662114 [patent_doc_number] => 08809088 [patent_country] => US [patent_kind] => B2 [patent_issue_date] => 2014-08-19 [patent_title] => 'Structure of stacking chips and method for manufacturing the same' [patent_app_type] => utility [patent_app_number] => 13/801255 [patent_app_country] => US [patent_app_date] => 2013-03-13 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 11 [patent_figures_cnt] => 11 [patent_no_of_words] => 2658 [patent_no_of_claims] => 5 [patent_no_of_ind_claims] => 1 [patent_words_short_claim] => 141 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 13801255 [rel_patent_id] =>[rel_patent_doc_number] =>)

Array ( [id] => 9335109 [patent_doc_number] => 20140061891 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2014-03-06 [patent_title] => 'SEMICONDUCTOR CHIP PACKAGE AND MANUFACTURING METHOD THEREOF' [patent_app_type] => utility [patent_app_number] => 13/800662 [patent_app_country] => US [patent_app_date] => 2013-03-13 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 6 [patent_figures_cnt] => 6 [patent_no_of_words] => 2677 [patent_no_of_claims] => 12 [patent_no_of_ind_claims] => 2 [patent_words_short_claim] => 0 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 13800662 [rel_patent_id] =>[rel_patent_doc_number] =>)

Array ( [id] => 10563511 [patent_doc_number] => 09287192 [patent_country] => US [patent_kind] => B2 [patent_issue_date] => 2016-03-15 [patent_title] => 'Semiconductor device and method for manufacturing semiconductor device' [patent_app_type] => utility [patent_app_number] => 13/775718 [patent_app_country] => US [patent_app_date] => 2013-02-25 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 6 [patent_figures_cnt] => 13 [patent_no_of_words] => 4464 [patent_no_of_claims] => 7 [patent_no_of_ind_claims] => 1 [patent_words_short_claim] => 221 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 13775718 [rel_patent_id] =>[rel_patent_doc_number] =>)

Array ( [id] => 8987123 [patent_doc_number] => 20130214404 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2013-08-22 [patent_title] => 'SEMICONDUCTOR MODULE' [patent_app_type] => utility [patent_app_number] => 13/773443 [patent_app_country] => US [patent_app_date] => 2013-02-21 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 8 [patent_figures_cnt] => 8 [patent_no_of_words] => 14640 [patent_no_of_claims] => 4 [patent_no_of_ind_claims] => 1 [patent_words_short_claim] => 0 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 13773443 [rel_patent_id] =>[rel_patent_doc_number] =>)

Array ( [id] => 9013943 [patent_doc_number] => 20130228907 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2013-09-05 [patent_title] => 'SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME' [patent_app_type] => utility [patent_app_number] => 13/768509 [patent_app_country] => US [patent_app_date] => 2013-02-15 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 24 [patent_figures_cnt] => 24 [patent_no_of_words] => 12764 [patent_no_of_claims] => 18 [patent_no_of_ind_claims] => 4 [patent_words_short_claim] => 0 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 13768509 [rel_patent_id] =>[rel_patent_doc_number] =>)

Array ( [id] => 10525570 [patent_doc_number] => 09252090 [patent_country] => US [patent_kind] => B2 [patent_issue_date] => 2016-02-02 [patent_title] => 'Resin package' [patent_app_type] => utility [patent_app_number] => 13/980336 [patent_app_country] => US [patent_app_date] => 2013-02-14 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 13 [patent_figures_cnt] => 13 [patent_no_of_words] => 7851 [patent_no_of_claims] => 9 [patent_no_of_ind_claims] => 1 [patent_words_short_claim] => 133 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 13980336 [rel_patent_id] =>[rel_patent_doc_number] =>)

Array ( [id] => 9389969 [patent_doc_number] => 08686573 [patent_country] => US [patent_kind] => B2 [patent_issue_date] => 2014-04-01 [patent_title] => 'Semiconductor device' [patent_app_type] => utility [patent_app_number] => 13/767267 [patent_app_country] => US [patent_app_date] => 2013-02-14 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 26 [patent_figures_cnt] => 44 [patent_no_of_words] => 23988 [patent_no_of_claims] => 24 [patent_no_of_ind_claims] => 4 [patent_words_short_claim] => 195 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 13767267 [rel_patent_id] =>[rel_patent_doc_number] =>)

Array ( [id] => 8925575 [patent_doc_number] => 20130181335 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2013-07-18 [patent_title] => 'LEADFRAME AND SEMICONDUCTOR PACKAGE MADE USING THE LEADFRAME' [patent_app_type] => utility [patent_app_number] => 13/763690 [patent_app_country] => US [patent_app_date] => 2013-02-10 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 8 [patent_figures_cnt] => 8 [patent_no_of_words] => 6583 [patent_no_of_claims] => 21 [patent_no_of_ind_claims] => 4 [patent_words_short_claim] => 0 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 13763690 [rel_patent_id] =>[rel_patent_doc_number] =>)

Array ( [id] => 9184439 [patent_doc_number] => 08624377 [patent_country] => US [patent_kind] => B2 [patent_issue_date] => 2014-01-07 [patent_title] => 'Method of stacking flip-chip on wire-bonded chip' [patent_app_type] => utility [patent_app_number] => 13/763439 [patent_app_country] => US [patent_app_date] => 2013-02-08 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 16 [patent_figures_cnt] => 16 [patent_no_of_words] => 4126 [patent_no_of_claims] => 20 [patent_no_of_ind_claims] => 2 [patent_words_short_claim] => 205 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 13763439 [rel_patent_id] =>[rel_patent_doc_number] =>)

Array ( [id] => 9474423 [patent_doc_number] => 20140131886 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2014-05-15 [patent_title] => 'SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF' [patent_app_type] => utility [patent_app_number] => 13/758359 [patent_app_country] => US [patent_app_date] => 2013-02-04 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 16 [patent_figures_cnt] => 16 [patent_no_of_words] => 12479 [patent_no_of_claims] => 20 [patent_no_of_ind_claims] => 3 [patent_words_short_claim] => 0 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 13758359 [rel_patent_id] =>[rel_patent_doc_number] =>)

Array ( [id] => 9441522 [patent_doc_number] => 08710636 [patent_country] => US [patent_kind] => B1 [patent_issue_date] => 2014-04-29 [patent_title] => 'Lead frame array package with flip chip die attach' [patent_app_type] => utility [patent_app_number] => 13/758263 [patent_app_country] => US [patent_app_date] => 2013-02-04 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 8 [patent_figures_cnt] => 10 [patent_no_of_words] => 4301 [patent_no_of_claims] => 9 [patent_no_of_ind_claims] => 2 [patent_words_short_claim] => 124 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 13758263 [rel_patent_id] =>[rel_patent_doc_number] =>)

Array ( [id] => 8863313 [patent_doc_number] => 20130147016 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2013-06-13 [patent_title] => 'Semiconductor Package Having Internal Shunt and Solder Stop Dimples' [patent_app_type] => utility [patent_app_number] => 13/757640 [patent_app_country] => US [patent_app_date] => 2013-02-01 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 22 [patent_figures_cnt] => 22 [patent_no_of_words] => 5811 [patent_no_of_claims] => 22 [patent_no_of_ind_claims] => 4 [patent_words_short_claim] => 0 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 13757640 [rel_patent_id] =>[rel_patent_doc_number] =>)

Array ( [id] => 9239816 [patent_doc_number] => 08604611 [patent_country] => US [patent_kind] => B2 [patent_issue_date] => 2013-12-10 [patent_title] => 'Semiconductor device assembly utilizing a DBC substrate' [patent_app_type] => utility [patent_app_number] => 13/756963 [patent_app_country] => US [patent_app_date] => 2013-02-01 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 21 [patent_figures_cnt] => 23 [patent_no_of_words] => 5842 [patent_no_of_claims] => 20 [patent_no_of_ind_claims] => 2 [patent_words_short_claim] => 95 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 13756963 [rel_patent_id] =>[rel_patent_doc_number] =>)

Array ( [id] => 9639455 [patent_doc_number] => 20140217566 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2014-08-07 [patent_title] => 'DOUBLE-SIDED PACKAGE' [patent_app_type] => utility [patent_app_number] => 13/757299 [patent_app_country] => US [patent_app_date] => 2013-02-01 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 21 [patent_figures_cnt] => 21 [patent_no_of_words] => 10351 [patent_no_of_claims] => 28 [patent_no_of_ind_claims] => 3 [patent_words_short_claim] => 0 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 13757299 [rel_patent_id] =>[rel_patent_doc_number] =>)

Array ( [id] => 9297894 [patent_doc_number] => RE044761 [patent_country] => US [patent_kind] => E1 [patent_issue_date] => 2014-02-11 [patent_title] => 'Solder joint flip chip interconnection having relief structure' [patent_app_type] => reissue [patent_app_number] => 13/756817 [patent_app_country] => US [patent_app_date] => 2013-02-01 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 3 [patent_figures_cnt] => 6 [patent_no_of_words] => 6439 [patent_no_of_claims] => 36 [patent_no_of_ind_claims] => 8 [patent_words_short_claim] => 86 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 13756817 [rel_patent_id] =>[rel_patent_doc_number] =>)

Array ( [id] => 9632002 [patent_doc_number] => 20140210110 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2014-07-31 [patent_title] => 'ATTACHMENT OF MICROELECTRONIC COMPONENTS' [patent_app_type] => utility [patent_app_number] => 13/755409 [patent_app_country] => US [patent_app_date] => 2013-01-31 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 11 [patent_figures_cnt] => 11 [patent_no_of_words] => 5134 [patent_no_of_claims] => 20 [patent_no_of_ind_claims] => 4 [patent_words_short_claim] => 0 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 13755409 [rel_patent_id] =>[rel_patent_doc_number] =>)

Array ( [id] => 10888666 [patent_doc_number] => 08912662 [patent_country] => US [patent_kind] => B2 [patent_issue_date] => 2014-12-16 [patent_title] => 'Wafer-level package and method of manufacturing the same' [patent_app_type] => utility [patent_app_number] => 13/753862 [patent_app_country] => US [patent_app_date] => 2013-01-30 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 7 [patent_figures_cnt] => 13 [patent_no_of_words] => 4775 [patent_no_of_claims] => 7 [patent_no_of_ind_claims] => 1 [patent_words_short_claim] => 113 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 13753862 [rel_patent_id] =>[rel_patent_doc_number] =>)

Array ( [id] => 8973826 [patent_doc_number] => 20130207256 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2013-08-15 [patent_title] => 'SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF' [patent_app_type] => utility [patent_app_number] => 13/754245 [patent_app_country] => US [patent_app_date] => 2013-01-30 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 24 [patent_figures_cnt] => 24 [patent_no_of_words] => 9856 [patent_no_of_claims] => 23 [patent_no_of_ind_claims] => 3 [patent_words_short_claim] => 0 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 13754245 [rel_patent_id] =>[rel_patent_doc_number] =>)

Array ( [id] => 9000394 [patent_doc_number] => 20130221519 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2013-08-29 [patent_title] => 'SEMICONDUCTOR DEVICES INCLUDING DUMMY SOLDER BUMPS' [patent_app_type] => utility [patent_app_number] => 13/753774 [patent_app_country] => US [patent_app_date] => 2013-01-30 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 10 [patent_figures_cnt] => 10 [patent_no_of_words] => 9669 [patent_no_of_claims] => 20 [patent_no_of_ind_claims] => 3 [patent_words_short_claim] => 0 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 13753774 [rel_patent_id] =>[rel_patent_doc_number] =>)