Search

Sheila V. Clark

Examiner (ID: 7169, Phone: (571)272-1725 , Office: P/2896 )

Most Active Art Unit
2815
Art Unit(s)
2607, 2896, 2891, 2504, 2503, 2508, 2815, 2823
Total Applications
3274
Issued Applications
2860
Pending Applications
49
Abandoned Applications
366

Applications

Application numberTitle of the applicationFiling DateStatus
Array ( [id] => 9536043 [patent_doc_number] => 20140160688 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2014-06-12 [patent_title] => 'Methods and Apparatus for Package with Interposers' [patent_app_type] => utility [patent_app_number] => 13/706593 [patent_app_country] => US [patent_app_date] => 2012-12-06 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 5 [patent_figures_cnt] => 5 [patent_no_of_words] => 5451 [patent_no_of_claims] => 20 [patent_no_of_ind_claims] => 3 [patent_words_short_claim] => 0 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 13706593 [rel_patent_id] =>[rel_patent_doc_number] =>)
13/706593
Methods and apparatus for package with interposers Dec 5, 2012 Issued
Array ( [id] => 10086475 [patent_doc_number] => 09123830 [patent_country] => US [patent_kind] => B2 [patent_issue_date] => 2015-09-01 [patent_title] => 'Manufacturing method for semiconductor device' [patent_app_type] => utility [patent_app_number] => 14/356844 [patent_app_country] => US [patent_app_date] => 2012-11-12 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 20 [patent_figures_cnt] => 43 [patent_no_of_words] => 30476 [patent_no_of_claims] => 32 [patent_no_of_ind_claims] => 2 [patent_words_short_claim] => 645 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 14356844 [rel_patent_id] =>[rel_patent_doc_number] =>)
14/356844
Manufacturing method for semiconductor device Nov 11, 2012 Issued
Array ( [id] => 8647211 [patent_doc_number] => 20130032941 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2013-02-07 [patent_title] => 'ROUTING LAYER FOR MITIGATING STRESS IN A SEMICONDUCTOR DIE' [patent_app_type] => utility [patent_app_number] => 13/647052 [patent_app_country] => US [patent_app_date] => 2012-10-08 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 9 [patent_figures_cnt] => 9 [patent_no_of_words] => 6241 [patent_no_of_claims] => 22 [patent_no_of_ind_claims] => 4 [patent_words_short_claim] => 0 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 13647052 [rel_patent_id] =>[rel_patent_doc_number] =>)
13/647052
Routing layer for mitigating stress in a semiconductor die Oct 7, 2012 Issued
Array ( [id] => 9406292 [patent_doc_number] => 20140097544 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2014-04-10 [patent_title] => 'Side Stack Interconnection for Integrated Circuits and The Like' [patent_app_type] => utility [patent_app_number] => 13/645894 [patent_app_country] => US [patent_app_date] => 2012-10-05 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 7 [patent_figures_cnt] => 7 [patent_no_of_words] => 2687 [patent_no_of_claims] => 27 [patent_no_of_ind_claims] => 4 [patent_words_short_claim] => 0 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 13645894 [rel_patent_id] =>[rel_patent_doc_number] =>)
13/645894
Side Stack Interconnection for Integrated Circuits and The Like Oct 4, 2012 Abandoned
Array ( [id] => 9440831 [patent_doc_number] => 08709941 [patent_country] => US [patent_kind] => B2 [patent_issue_date] => 2014-04-29 [patent_title] => 'Method for forming contact in an integrated circuit' [patent_app_type] => utility [patent_app_number] => 13/633302 [patent_app_country] => US [patent_app_date] => 2012-10-02 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 3 [patent_figures_cnt] => 12 [patent_no_of_words] => 3342 [patent_no_of_claims] => 19 [patent_no_of_ind_claims] => 3 [patent_words_short_claim] => 65 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 13633302 [rel_patent_id] =>[rel_patent_doc_number] =>)
13/633302
Method for forming contact in an integrated circuit Oct 1, 2012 Issued
Array ( [id] => 8615410 [patent_doc_number] => 20130020722 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2013-01-24 [patent_title] => 'SEMICONDUCTOR DEVICE, CIRCUIT SUBSTRATE, AND ELECTRONIC DEVICE' [patent_app_type] => utility [patent_app_number] => 13/625141 [patent_app_country] => US [patent_app_date] => 2012-09-24 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 12 [patent_figures_cnt] => 12 [patent_no_of_words] => 5844 [patent_no_of_claims] => 14 [patent_no_of_ind_claims] => 3 [patent_words_short_claim] => 0 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 13625141 [rel_patent_id] =>[rel_patent_doc_number] =>)
13/625141
Semiconductor device, circuit substrate, and electronic device Sep 23, 2012 Issued
Array ( [id] => 11194295 [patent_doc_number] => 09425113 [patent_country] => US [patent_kind] => B2 [patent_issue_date] => 2016-08-23 [patent_title] => 'Package for high frequency circuits' [patent_app_type] => utility [patent_app_number] => 14/346788 [patent_app_country] => US [patent_app_date] => 2012-09-19 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 7 [patent_figures_cnt] => 12 [patent_no_of_words] => 8875 [patent_no_of_claims] => 18 [patent_no_of_ind_claims] => 1 [patent_words_short_claim] => 117 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 14346788 [rel_patent_id] =>[rel_patent_doc_number] =>)
14/346788
Package for high frequency circuits Sep 18, 2012 Issued
Array ( [id] => 8920892 [patent_doc_number] => 08486825 [patent_country] => US [patent_kind] => B2 [patent_issue_date] => 2013-07-16 [patent_title] => 'Methods of forming semiconductor device packages including a semiconductor device and a redistribution element, methods of forming redistribution elements and methods for packaging semiconductor devices' [patent_app_type] => utility [patent_app_number] => 13/612333 [patent_app_country] => US [patent_app_date] => 2012-09-12 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 2 [patent_figures_cnt] => 9 [patent_no_of_words] => 3533 [patent_no_of_claims] => 19 [patent_no_of_ind_claims] => 3 [patent_words_short_claim] => 168 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 13612333 [rel_patent_id] =>[rel_patent_doc_number] =>)
13/612333
Methods of forming semiconductor device packages including a semiconductor device and a redistribution element, methods of forming redistribution elements and methods for packaging semiconductor devices Sep 11, 2012 Issued
Array ( [id] => 8563744 [patent_doc_number] => 20120326315 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2012-12-27 [patent_title] => 'METHOD OF MANUFACTURING A SEMICONDUCTOR DEVICE AND SEMICONDUCTOR DEVICE' [patent_app_type] => utility [patent_app_number] => 13/605020 [patent_app_country] => US [patent_app_date] => 2012-09-06 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 16 [patent_figures_cnt] => 16 [patent_no_of_words] => 4505 [patent_no_of_claims] => 8 [patent_no_of_ind_claims] => 1 [patent_words_short_claim] => 0 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 13605020 [rel_patent_id] =>[rel_patent_doc_number] =>)
13/605020
Method of manufacturing a semiconductor device and semiconductor device Sep 5, 2012 Issued
Array ( [id] => 9335145 [patent_doc_number] => 20140061927 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2014-03-06 [patent_title] => 'CHIP PACKAGE INCORPORATING INTERFACIAL ADHESION THROUGH CONDUCTOR SPUTTERING' [patent_app_type] => utility [patent_app_number] => 13/599411 [patent_app_country] => US [patent_app_date] => 2012-08-30 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 5 [patent_figures_cnt] => 5 [patent_no_of_words] => 4318 [patent_no_of_claims] => 14 [patent_no_of_ind_claims] => 2 [patent_words_short_claim] => 0 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 13599411 [rel_patent_id] =>[rel_patent_doc_number] =>)
13/599411
Chip package incorporating interfacial adhesion through conductor sputtering Aug 29, 2012 Issued
Array ( [id] => 8743771 [patent_doc_number] => 20130083488 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2013-04-04 [patent_title] => 'SEMICONDUCTOR PACKAGE, WIRING BOARD UNIT, AND ELECTRONIC APPARATUS' [patent_app_type] => utility [patent_app_number] => 13/593733 [patent_app_country] => US [patent_app_date] => 2012-08-24 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 19 [patent_figures_cnt] => 19 [patent_no_of_words] => 8748 [patent_no_of_claims] => 11 [patent_no_of_ind_claims] => 3 [patent_words_short_claim] => 0 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 13593733 [rel_patent_id] =>[rel_patent_doc_number] =>)
13/593733
Semiconductor package, wiring board unit, and electronic apparatus Aug 23, 2012 Issued
Array ( [id] => 9158875 [patent_doc_number] => 20130307152 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2013-11-21 [patent_title] => 'SEMICONDUCTOR PACKAGE AND FABRICATION METHOD THEREOF' [patent_app_type] => utility [patent_app_number] => 13/588103 [patent_app_country] => US [patent_app_date] => 2012-08-17 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 6 [patent_figures_cnt] => 6 [patent_no_of_words] => 3108 [patent_no_of_claims] => 24 [patent_no_of_ind_claims] => 2 [patent_words_short_claim] => 0 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 13588103 [rel_patent_id] =>[rel_patent_doc_number] =>)
13/588103
Semiconductor package and fabrication method thereof Aug 16, 2012 Issued
Array ( [id] => 9074962 [patent_doc_number] => 08552542 [patent_country] => US [patent_kind] => B2 [patent_issue_date] => 2013-10-08 [patent_title] => 'Lead frame, semiconductor device, method of manufacturing lead frame, and method of manufacturing semiconductor device' [patent_app_type] => utility [patent_app_number] => 13/586301 [patent_app_country] => US [patent_app_date] => 2012-08-15 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 16 [patent_figures_cnt] => 38 [patent_no_of_words] => 7877 [patent_no_of_claims] => 23 [patent_no_of_ind_claims] => 3 [patent_words_short_claim] => 112 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 13586301 [rel_patent_id] =>[rel_patent_doc_number] =>)
13/586301
Lead frame, semiconductor device, method of manufacturing lead frame, and method of manufacturing semiconductor device Aug 14, 2012 Issued
Array ( [id] => 9316581 [patent_doc_number] => 20140048919 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2014-02-20 [patent_title] => 'INTEGRATED CIRCUIT PACKAGING SYSTEM WITH ARRAY CONTACTS AND METHOD OF MANUFACTURE THEREOF' [patent_app_type] => utility [patent_app_number] => 13/586178 [patent_app_country] => US [patent_app_date] => 2012-08-15 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 9 [patent_figures_cnt] => 9 [patent_no_of_words] => 4428 [patent_no_of_claims] => 20 [patent_no_of_ind_claims] => 3 [patent_words_short_claim] => 0 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 13586178 [rel_patent_id] =>[rel_patent_doc_number] =>)
13/586178
Integrated circuit packaging system with array contacts and method of manufacture thereof Aug 14, 2012 Issued
Array ( [id] => 9038440 [patent_doc_number] => 20130241078 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2013-09-19 [patent_title] => 'SEMICONDUCTOR CHIP AND STACKED SEMICONDUCTOR PACKAGE HAVING THE SAME' [patent_app_type] => utility [patent_app_number] => 13/586309 [patent_app_country] => US [patent_app_date] => 2012-08-15 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 8 [patent_figures_cnt] => 8 [patent_no_of_words] => 5874 [patent_no_of_claims] => 19 [patent_no_of_ind_claims] => 2 [patent_words_short_claim] => 0 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 13586309 [rel_patent_id] =>[rel_patent_doc_number] =>)
13/586309
Semiconductor chip and stacked semiconductor package having the same Aug 14, 2012 Issued
Array ( [id] => 9086942 [patent_doc_number] => 08558372 [patent_country] => US [patent_kind] => B2 [patent_issue_date] => 2013-10-15 [patent_title] => 'Semiconductor device' [patent_app_type] => utility [patent_app_number] => 13/584022 [patent_app_country] => US [patent_app_date] => 2012-08-13 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 7 [patent_figures_cnt] => 12 [patent_no_of_words] => 5471 [patent_no_of_claims] => 10 [patent_no_of_ind_claims] => 2 [patent_words_short_claim] => 115 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 13584022 [rel_patent_id] =>[rel_patent_doc_number] =>)
13/584022
Semiconductor device Aug 12, 2012 Issued
Array ( [id] => 9576045 [patent_doc_number] => 08766463 [patent_country] => US [patent_kind] => B2 [patent_issue_date] => 2014-07-01 [patent_title] => 'Package carrier' [patent_app_type] => utility [patent_app_number] => 13/584784 [patent_app_country] => US [patent_app_date] => 2012-08-13 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 6 [patent_figures_cnt] => 6 [patent_no_of_words] => 3132 [patent_no_of_claims] => 18 [patent_no_of_ind_claims] => 2 [patent_words_short_claim] => 78 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 13584784 [rel_patent_id] =>[rel_patent_doc_number] =>)
13/584784
Package carrier Aug 12, 2012 Issued
Array ( [id] => 10047431 [patent_doc_number] => 09087837 [patent_country] => US [patent_kind] => B2 [patent_issue_date] => 2015-07-21 [patent_title] => 'Semiconductor package and method of manufacturing the same' [patent_app_type] => utility [patent_app_number] => 13/572833 [patent_app_country] => US [patent_app_date] => 2012-08-13 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 7 [patent_figures_cnt] => 24 [patent_no_of_words] => 7305 [patent_no_of_claims] => 8 [patent_no_of_ind_claims] => 1 [patent_words_short_claim] => 130 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 13572833 [rel_patent_id] =>[rel_patent_doc_number] =>)
13/572833
Semiconductor package and method of manufacturing the same Aug 12, 2012 Issued
Array ( [id] => 8669057 [patent_doc_number] => 20130043594 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2013-02-21 [patent_title] => 'METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE AND SEMICONDUCTOR DEVICE' [patent_app_type] => utility [patent_app_number] => 13/572553 [patent_app_country] => US [patent_app_date] => 2012-08-10 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 6 [patent_figures_cnt] => 6 [patent_no_of_words] => 3297 [patent_no_of_claims] => 20 [patent_no_of_ind_claims] => 3 [patent_words_short_claim] => 0 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 13572553 [rel_patent_id] =>[rel_patent_doc_number] =>)
13/572553
METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE AND SEMICONDUCTOR DEVICE Aug 9, 2012 Abandoned
Array ( [id] => 10023924 [patent_doc_number] => 09066433 [patent_country] => US [patent_kind] => B2 [patent_issue_date] => 2015-06-23 [patent_title] => 'Power module substrate, power module substrate with heat sink, power module, and method of manufacturing power module substrate' [patent_app_type] => utility [patent_app_number] => 14/238097 [patent_app_country] => US [patent_app_date] => 2012-08-10 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 20 [patent_figures_cnt] => 26 [patent_no_of_words] => 18409 [patent_no_of_claims] => 16 [patent_no_of_ind_claims] => 2 [patent_words_short_claim] => 86 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 14238097 [rel_patent_id] =>[rel_patent_doc_number] =>)
14/238097
Power module substrate, power module substrate with heat sink, power module, and method of manufacturing power module substrate Aug 9, 2012 Issued
Menu