
Sheila V. Clark
Examiner (ID: 7169, Phone: (571)272-1725 , Office: P/2896 )
| Most Active Art Unit | 2815 |
| Art Unit(s) | 2607, 2896, 2891, 2504, 2503, 2508, 2815, 2823 |
| Total Applications | 3274 |
| Issued Applications | 2860 |
| Pending Applications | 49 |
| Abandoned Applications | 366 |
Applications
| Application number | Title of the application | Filing Date | Status |
|---|---|---|---|
Array
(
[id] => 4605057
[patent_doc_number] => 07986038
[patent_country] => US
[patent_kind] => B2
[patent_issue_date] => 2011-07-26
[patent_title] => 'Electronic device and lid'
[patent_app_type] => utility
[patent_app_number] => 12/588687
[patent_app_country] => US
[patent_app_date] => 2009-10-23
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 6
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Array
(
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[patent_kind] => B2
[patent_issue_date] => 2012-07-24
[patent_title] => 'Routing layer for mitigating stress in a semiconductor die'
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Array
(
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[patent_country] => US
[patent_kind] => A1
[patent_issue_date] => 2010-04-29
[patent_title] => 'ZINC OXIDE BASED COMPOSITES AND METHODS FOR THEIR FABRICATION'
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[patent_app_number] => 12/605013
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[patent_app_date] => 2009-10-23
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Array
(
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[patent_app_date] => 2009-10-23
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Array
(
[id] => 4532606
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Array
(
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Array
(
[id] => 4518181
[patent_doc_number] => 07932617
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[patent_app_date] => 2009-10-21
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[pdf_file] => patents/07/932/07932617.pdf
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[rel_patent_id] =>[rel_patent_doc_number] =>) 12/603271 | Semiconductor package and manufacturing method thereof and encapsulating method thereof | Oct 20, 2009 | Issued |
Array
(
[id] => 6469443
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[patent_issue_date] => 2010-04-15
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[patent_app_country] => US
[patent_app_date] => 2009-10-14
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[rel_patent_id] =>[rel_patent_doc_number] =>) 12/579023 | PACKAGE, AND FABRICATION METHOD FOR THE PACKAGE | Oct 13, 2009 | Abandoned |
Array
(
[id] => 6304430
[patent_doc_number] => 20100109146
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Array
(
[id] => 4577443
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[patent_title] => 'Semiconductor memory device and semiconductor memory card'
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Array
(
[id] => 6545721
[patent_doc_number] => 20100044847
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[patent_title] => 'SEMICONDUCTOR CHIP INCLUDING A CHIP VIA PLUG PENETRATING A SUBSTRATE, A SEMICONDUCTOR STACK, A SEMICONDUCTOR DEVICE PACKAGE AND AN ELECTRONIC APPARATUS INCLUDING THE SEMICONDUCTOR CHIP'
[patent_app_type] => utility
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[rel_patent_id] =>[rel_patent_doc_number] =>) 12/545323 | Semiconductor chip including a chip via plug penetrating a substrate, a semiconductor stack, a semiconductor device package and an electronic apparatus including the semiconductor chip | Aug 20, 2009 | Issued |
Array
(
[id] => 4578848
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[patent_title] => 'Transducer package with transducer die unsupported by a substrate'
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Array
(
[id] => 6216076
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Array
(
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Array
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Array
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Array
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Array
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Array
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